Standard reflow wave solderprofil LF

This information is provided as a reference guideline only. Your temperature profile will depend upon many factors including customer requirements, component characteristics and restrictions, oven characteristics, board layout, etc. Ultimately, quality requirements should define the profile in use, not adherence to these guidelines. These reference guidelines follow the recommendations of the standards IPC7530 for Temperature Profiling for Mass Soldering Processes, IPC9502 PWB Assembly Soldering Process Guideline for Electronic Components, IPCEIA JSTD001 Requirements for Soldered Electrical and Electronic Assemblies and IPCJEDEC JSTD020C Requirements for Small to Very Large Bodied Components. Ideally, temperature profile measurements are to be collected on a populated assembly with the reflow profile recorded for each product being processed. IPC7050 provides guidelines for the construction of reflow profiling test vehicles and various techniques for reflow temperature profiling. It is common for the same profile settings to be used for multiple assemblies. It is recommended that profile data should be collected, analyzed and recorded for each assembly part number at the beginning of individual production runs for process verification and record keeping.

Solder profile for lead free Reflow Process Figure Classification Reflow Profile for SMT components refer to IPC/JEDEC J-STD-020E Table Classification Reflow Profiles Profile Feature Average Ramp-Up Rate (TSmax to TP) Preheat Temperature Min (TSmin) Temperature Max (TSmax) Time (tSmin to tSmax) Time maintained above Temperature (TL) Time (tL) Peak/Classification Temperature (TP) Time within 5°C of the specified Peak Temperature (tP) Ramp-Down Rate (TP to TL) Time 25°C to Peak Temperature Pb-Free Assembly 3°C / second max 150°C 200°C 60-120 seconds 217°C 60-150 seconds See Table 20-30 seconds (WE-GF: 10sec; TP=245°C) 6°C / second max minutes max refer to IPC/JEDEC J-STD-020E Table Package Classification Reflow Temperature Package Thickness Volume mm3 2000 < 1,6 mm 260°C 260°C 260°C 1,6 mm – 2,5 mm 260°C 250°C 245°C > 2,5 mm 250°C 245°C 245°C refer to IPC/JEDEC J-STD-020E Note: All temperatures refer to topside of the package, measured on the package body surface Recommended for all parts which are marked with the RoHS logo not otherwise specified in the latest revision of the product specification Solder profile for Wave Soldering Process Figure Classification wave soldering profile for THT components refer to EN61760-1:2006 Checked Supervisor Lab i.A approved Head of Total Quality Management Name TF TF TF Revision 10 Date 06.07.2017 16.09.2015 19.04.2013 ...Solder profile for Wave Soldering Process Figure Classification wave soldering profile for THT components refer to EN61760-1:2006 Checked