| Tài liệu tham khảo |
Loại |
Chi tiết |
| [1] Zhang D., Arola D.D, “Applications of digital image correlation to biological tissues”, Journal of Biomedical Optics, vol. 9, 2004, pp. 691–699 |
Sách, tạp chí |
| Tiêu đề: |
Applications of digital image correlation to biological tissues”, "Journal of Biomedical Optics |
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| [2] Rossi M., Broggiato G.B., Papalini S, “Application of digital image correlation to the study of planar anisotropy of sheet metals at large strains” Meccanica, vol. 43, 2008, pp. 185–199 |
Sách, tạp chí |
| Tiêu đề: |
Application of digital image correlation tothe study of planar anisotropy of sheet metals at large strains” "Meccanica |
|
| [3] Chevalier L., Calloch S., Hild F., Marco Y, “Digital image correlation used to analyze the multiaxial behavior of rubber-like materials” European Journal of Mechanics A/Solid, vol. 20, 2005, pp. 169–187 |
Sách, tạp chí |
| Tiêu đề: |
Digital image correlation used toanalyze the multiaxial behavior of rubber-like materials” "European Journal ofMechanics A/Solid |
|
| [4] Wang L.L., Bornert M., Héripré E., Chanchole S., Tanguy A, “Full-field measurements on low-strained geomaterials using environmental scanning electron microscopy and digital image correlation: improved imaging conditions”, Strain, vol.50, 2014, pp. 370–380 |
Sách, tạp chí |
| Tiêu đề: |
Full-fieldmeasurements on low-strained geomaterials using environmental scanning electronmicroscopy and digital image correlation: improved imaging conditions”, "Strain |
|
| [5] Berfield T.A., Patel J.K., Shimmin R.G., Braun P.V., Lambros J., Sottos N.R,“Micro- and Nanoscale Deformation Measurement of Surface and Internal Planes via Digital Image Correlation”, Experimental Mechanics, vol. 45, 2007, pp. 51-62 |
Sách, tạp chí |
| Tiêu đề: |
Micro- and Nanoscale Deformation Measurement of Surface and Internal Planes viaDigital Image Correlation”, "Experimental Mechanics |
|
| [6] Q.B. Tao, L. Benabou, V.N. Le, H. Hwang, D.B. Luu, “Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni”, Journal of Alloys and Compound, vol. 694, 2017, pp.892-904 |
Sách, tạp chí |
| Tiêu đề: |
Viscoplasticcharacterization and post-rupture microanalysis of a novel lead-free solder with smalladditions of Bi, Sb and Ni”, "Journal of Alloys and |
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| [7] Hammad A.E., “Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni”, Materials and Design, vol.50, 2013, pp. 108-116 |
Sách, tạp chí |
| Tiêu đề: |
Investigation of microstructure and mechanical properties of novelSn–0.5Ag–0.7Cu solders containing small amount of Ni”, "Materials and Design |
|
| [8] Cheng F., Nishikawa H., Takemoto T, “Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co”, Journal of Materials Science, vol. 43(10),, 2008, pp. 3643-3648 |
Sách, tạp chí |
| Tiêu đề: |
Microstructural and mechanical propertiesof Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co”, "Journal ofMaterials Science |
|
| [9] Yu D.Q., Zhao J., Wang L, “Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements”, Journal of Alloys and Compound, vol. 376(1–2), 2004, pp. 170- 175 |
Sách, tạp chí |
| Tiêu đề: |
Improvement on the microstructure stability,mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition ofrare earth elements”, "Journal of Alloys and Compound |
|
| [11] El-Daly A.A., Hammad A.E., Fawzy A., Nasrallh D. A, “Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions”, Materials and Design, vol. 43, 2013, pp. 40-49 |
Sách, tạp chí |
| Tiêu đề: |
Microstructure,mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions”, "Materials and Design |
|
| [12] Sutton M.A., Wolters W.J., Peters W.H., Ranson W.F., McNeill S.R.,“Determination of displacements using an improved digital correlation method” |
Sách, tạp chí |
| Tiêu đề: |
Determination of displacements using an improved digital correlation method |
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| [13] Chu T.C., Ranson W.F., Sutton M.A., Peters W.H, “Applications of digital image correlation techniques to experimental mechanics”, Experimental Mechanics, vol.25,1985, pp. 232–244.[14] http://www.ncorr.com/ |
Sách, tạp chí |
| Tiêu đề: |
Applications of digital imagecorrelation techniques to experimental mechanics”, "Experimental Mechanics |
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