| Tài liệu tham khảo |
Loại |
Chi tiết |
| [1] Zhang D., Arola D.D, “Applications of digital image correlation to biological tissues”, Journal of Biomedical Optics, vol. 9, 2004, pp. 691–699 |
Sách, tạp chí |
| Tiêu đề: |
Applications of digital image correlation to biological tissues”, "Journal of Biomedical Optics |
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| [2] Rossi M., Broggiato G.B., Papalini S, “Application of digital image correlation to the study of planar anisotropy of sheet metals at large strains” Meccanica, vol. 43, 2008, pp. 185–199 |
Sách, tạp chí |
| Tiêu đề: |
Application of digital image correlation tothe study of planar anisotropy of sheet metals at large strains” "Meccanica |
|
| [3] Chevalier L., Calloch S., Hild F., Marco Y, “Digital image correlation used to analyze the multiaxial behavior of rubber-like materials” European Journal of Mechanics A/Solid, vol. 20, 2005, pp. 169–187 |
Sách, tạp chí |
| Tiêu đề: |
Digital image correlation used toanalyze the multiaxial behavior of rubber-like materials” "European Journal ofMechanics A/Solid |
|
| [4] Wang L.L., Bornert M., Héripré E., Chanchole S., Tanguy A, “Full-field measurements on low-strained geomaterials using environmental scanning electron microscopy and digital image correlation: improved imaging conditions”, Strain, vol.50, 2014, pp. 370–380 |
Sách, tạp chí |
| Tiêu đề: |
Full-fieldmeasurements on low-strained geomaterials using environmental scanning electronmicroscopy and digital image correlation: improved imaging conditions”, "Strain |
|
| [5] Berfield T.A., Patel J.K., Shimmin R.G., Braun P.V., Lambros J., Sottos N.R,“Micro- and Nanoscale Deformation Measurement of Surface and Internal Planes via Digital Image Correlation”, Experimental Mechanics, vol. 45, 2007, pp. 51-62 |
Sách, tạp chí |
| Tiêu đề: |
Micro- and Nanoscale Deformation Measurement of Surface and Internal Planes viaDigital Image Correlation”, "Experimental Mechanics |
|
| [6] Q.B. Tao, L. Benabou, V.N. Le, H. Hwang, D.B. Luu, “Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni”, Journal of Alloys and Compound, vol. 694, 2017, pp.892-904 |
Sách, tạp chí |
| Tiêu đề: |
Viscoplasticcharacterization and post-rupture microanalysis of a novel lead-free solder with smalladditions of Bi, Sb and Ni”, "Journal of Alloys and |
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| [7] Hammad A.E., “Investigation of microstructure and mechanical properties of novelSn–0.5Ag–0.7Cu solders containing small amount of Ni”, Materials and Design, vol.50, 2013, pp. 108-116 |
Sách, tạp chí |
| Tiêu đề: |
Investigation of microstructure and mechanical properties of novelSn–0.5Ag–0.7Cu solders containing small amount of Ni”, "Materials and Design |
|
| [8] Cheng F., Nishikawa H., Takemoto T, “Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co”, Journal of Materials Science, vol. 43(10),, 2008, pp. 3643-3648 |
Sách, tạp chí |
| Tiêu đề: |
Microstructural and mechanical propertiesof Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co”, "Journal ofMaterials Science |
|
| [9] Yu D.Q., Zhao J., Wang L, “Improvement on the microstructure stability,mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements”, Journal of Alloys and Compound, vol. 376(1–2), 2004, pp. 170- 175 |
Sách, tạp chí |
| Tiêu đề: |
Improvement on the microstructure stability,mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition ofrare earth elements”, "Journal of Alloys and Compound |
|