IEC 62496 2 Edition 1 0 201 7 05 INTERNATIONAL STANDARD Optical circuit boards – Basic test and measurement procedures – Part 2 General guidance for definition of measurement conditions for optical ch[.]
I E C 62 49 6-2 ® Edition 201 7-05 I N TE RN ATI ON AL S TAN D ARD colour i n sid e Opti cal ci rcu i t board s – B as i c te s t an d m eas u rem en t proced u res – P art : G e n e ral g u i d an ce for d e fi n i ti on of m eas u rem en t d i ti on s for opti cal IEC 62496-2:201 7-05(en) ch aracteri s ti cs of opti cal ci rcu i t board s T H I S P U B L I C AT I O N I S C O P YRI G H T P RO T E C T E D C o p yri g h t © I E C , G e n e v a , S wi tz e rl a n d All rights reserved Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IEC's member National Committee in the country of the requester If you have any questions about I EC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local I EC member National Committee for further information IEC Central Office 3, rue de Varembé CH-1 21 Geneva 20 Switzerland Tel.: +41 22 91 02 1 Fax: +41 22 91 03 00 info@iec.ch www.iec.ch Ab ou t th e I E C The I nternational Electrotechnical Commission (I EC) is the leading global organization that prepares and publishes I nternational Standards for all electrical, electronic and related technologies Ab o u t I E C p u b l i ca ti o n s The technical content of IEC publications is kept under constant review by the IEC Please make sure that you have the latest edition, a corrigenda or an amendment might have been published I E C Catal og u e - webstore i ec ch /catal og u e The stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents Available for PC, Mac OS, Android Tablets and iPad I E C pu bl i cati on s s earch - www i ec ch /search pu b The advanced search enables to find IEC publications by a variety of criteria (reference number, text, technical committee,…) It also gives information on projects, replaced and withdrawn publications E l ectroped i a - www el ectroped i a org The world's leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and French, with equivalent terms in additional languages Also known as the International Electrotechnical Vocabulary (IEV) online I E C G l os sary - s td i ec ch /g l oss ary 65 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002 Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR I E C J u st Pu bl i s h ed - webstore i ec ch /j u stpu bl i sh ed Stay up to date on all new IEC publications Just Published details all new publications released Available online and also once a month by email I E C C u stom er S ervi ce C en tre - webstore i ec ch /csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csc@iec.ch I E C 62 49 6-2 ® Edition 201 7-05 I N TE RN ATI ON AL S TAN D ARD colour i n sid e Opti cal ci rcu i t board s – B as i c tes t an d m eas u re m en t proced u res – P art : G en e ral g u i d an ce for d e fi n i ti on of m e as u rem en t d i ti on s for opti cal ch aracte ri s ti cs of opti cal ci rcu i t board s INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 33.1 80.01 ISBN 978-2-8322-4404-3 Warn i n g ! M ake s u re th a t you ob tai n ed th i s p u b l i cati on from an au th ori zed d i stri b u tor ® Registered trademark of the International Electrotechnical Commission –2– I EC 62496-2: 201 I EC 201 CONTENTS FOREWORD I NTRODUCTI ON Scope Norm ative references Term s and definitions Measurement definition system for optical circuit boards General Measurement definition system requirem ents Accuracy 2 Accountability Efficiency 4 Convenience I ndependent Scalable Custom ised requirem ents Prioritised structure Measurement definition criteria General Source characteristics 1 3 Launch conditions 1 4 I nput coupling conditions 4 Output coupling conditions Capturing conditions 4 Launch and capturing position Launch and capture direction Measurement identification code General Measurement identification code construction General 2 AAA – Source characteristics BBB(b1 ) – Launch conditions CCC – I nput coupling conditions 20 5 DDD – Output coupling conditions 20 EEE – Capturing conditions 20 Extended m easurem ent identification code with customisation parameters 20 General 20 Custom isation param eters with placeholders 20 Reference m easurements 21 5 Coordinate table AAA – Source characteristics 21 5 Mandatory param eters 21 5 Custom isation param eters 21 Coordinate table BBB – Launch conditions 24 Mandatory param eter 24 Custom isation param eters 24 Coordinate table CCC – I nput coupling conditions 27 I EC 62496-2: 201 I EC 201 –3– Mandatory param eters 27 7 Custom isation param eters 27 Coordinate table DDD – Output coupling conditions 29 Mandatory param eters 29 Custom isation param eters 29 Coordinate table EEE – Capturing conditions 31 Mandatory param eters 31 Custom isation param eters 31 Exam ples of deploym ent 34 1 General 34 MI C-042-1 3(400)-001 -001 -1 (integrating sphere device details including supplier and model num ber) 34 MI C-072-1 23(205)-053(1 56, X,X)-001 -042 (integrating sphere device details including supplier and model number) 34 Fast polarisation axis: MI C-091 -072(1 50)-042(1 53, 25, -30)-051 -004; slow polarisation axis: MI C-091 -072(75)-042(1 53, 25, -1 20)-051 -004 35 Annex A (inform ative) State of the art in optical interconnect technologies 36 A Diversity of optical interconnect technologies 36 A Fibre-optic circuit laminates 36 A Polym er waveguides 36 A Planar glass waveguides 36 A Free space optics 37 A Target applications 37 Bibliograph y 38 Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Table Table Table Table Table Table – Optical circuit board varieties – Recomm ended test setup for single-mode fibre launch conditions 3 – Recomm ended test setup for m ultimode fibre launch conditions – Cross-sectional views of channel under test at input 5 – Cross-sectional views of the channel under test at output 6 – Measurem ent setup with collinear launch and capture direction 7 – Measurem ent setup with orthogonal launch and capture direction 8 – Measurem ent setup with oblique launch and capture direction – Measurem ent identification code construction – Reference measurements with the same MI C 21 – Recommended m odal launch profiles – AAA coordinate reference for source characteristics 22 – BBB coordinate reference for launch conditions 25 – CCC coordinate reference for input coupling conditions 28 – DDD coordinate reference for output coupling conditions 30 – EEE coordinate reference for capturing conditions 32 –4– I EC 62496-2: 201 I EC 201 INTERNATI ONAL ELECTROTECHNI CAL COMMISSI ON O P T I C AL C I RC U I T B O ARD S – B AS I C T E S T AN D M E AS U RE M E N T P RO C E D U RE S – P a rt : G e n e l g u i d a n c e fo r d e fi n i ti o n o f m e a s u re m e n t c o n d i ti o n s fo r o p t i c a l c h a c te ri s ti c s o f o p ti c a l c i rc u i t b o a rd s FOREWORD ) The I nternati on al Electrotech ni cal Comm ission (I EC) is a worl d wid e organization for stand ardization com prisin g all nati on al el ectrotechnical comm ittees (I EC Nation al Comm ittees) The object of I EC is to prom ote internati onal co-operation on all questions concerni ng standardi zati on in the electrical and electronic fields To this end and in ad dition to other activities, I EC publish es I nternational Stan dards, Techn ical Specifications, Technical Reports, Publicly Avail abl e Specifications (PAS) an d Gui des (hereafter referred to as "I EC Publication(s)") Thei r preparation is entrusted to tech nical comm ittees; any I EC Nati onal Comm ittee interested in the subj ect dealt with m ay participate i n this preparatory work I nternational, governm ental and nongovernm ental org ani zations li aising with the I EC also partici pate i n this preparati on I EC collaborates closel y with the I ntern ational Organization for Stand ardization (I SO) in accordance with ditions determ ined by agreem ent between th e two organi zati ons 2) The form al decisions or ag reem ents of I EC on tech nical m atters express, as nearly as possi ble, an international consensus of opin ion on the rel evant subjects since each technical com m ittee has representati on from all interested I EC N ational Com m ittees 3) I EC Publicati ons have the form of recom m endations for i ntern ational use an d are accepted by I EC N ational Com m ittees in that sense While all reasonable efforts are m ade to ensure that the tech nical content of I EC Publications is accurate, I EC cann ot be held responsibl e for th e way in which they are used or for an y m isinterpretation by an y en d u ser 4) I n ord er to prom ote internati onal u niform ity, I EC Nation al Com m ittees undertake to apply I EC Publ ications transparentl y to th e m axim um extent possibl e in thei r n ational an d regi onal pu blicati ons Any di vergence between an y I EC Publ ication and the correspondi ng n ational or regi on al pu blicati on shall be clearl y in dicated in the latter 5) I EC itself d oes n ot provid e an y attestati on of conform ity I n depend ent certificati on bod ies provi de conform ity assessm ent services an d, in som e areas, access to I EC m arks of conform ity I EC is not responsi ble for an y services carri ed out by ind ependent certification bodi es 6) All users shou ld ensure that th ey h ave the l atest editi on of thi s publicati on 7) No liability shall attach to I EC or its directors, em ployees, servants or ag ents includ ing i n divi du al experts and m em bers of its tech nical com m ittees and I EC Nati on al Com m ittees for an y person al i nju ry, property dam ag e or other dam age of an y nature whatsoever, whether di rect or indirect, or for costs (includi ng leg al fees) an d expenses arisi ng out of th e publ ication, use of, or rel ian ce upon, this I EC Publicati on or an y other I EC Publications 8) Attention is drawn to the Norm ative references cited i n this publ ication Use of the referenced publications is indispensable for the correct applicati on of this publication 9) Attention is drawn to th e possibility that som e of the elem ents of this I EC Publication m ay be the su bject of patent rig hts I EC shall not be held responsibl e for identifyi ng any or all such patent ri ghts I nternational Standard I EC 62496-2 has been prepared by I EC technical committee 86: Fibre optics The text of this document is based on the following documents: CDV Report on votin g 86/509/CDV 86/51 5/RVC Full inform ation on the voting for the approval of this I nternational Standard can be found in the report on voting indicated in the above table This docum ent has been drafted in accordance with the I SO/I EC Directives, Part I EC 62496-2: 201 I EC 201 –5– A list of all parts in the I EC 62496 series, published under the general title Optical boards – Basic test and measurement procedures , can be found on the I EC website circuit Future standards in this series will carry the new general title as cited above Titles of existing standards in this series will be updated at the time of the next edition The comm ittee has decided that the contents of this document will remain unchanged until the stability date indicated on the I EC website under "http: //webstore iec.ch" in the data related to the specific docum ent At this date, the docum ent will be • • • • reconfirm ed, withdrawn, replaced by a revised edition, or amended A bilingual version of this publication may be issued at a later date I M P O R T AN T th at it – Th e co n ta i n s u n d e rs t a n d i n g c o l o u r p ri n t e r of ' co l ou r c o l o u rs i ts in si de' wh i ch c o n te n ts l ogo a re U s e rs on th e cover c o n s i d e re d sh ou l d p ag e to t h e re fo re of th i s be p ri n t p u b l i cati on u s e fu l th i s fo r i n d i c a te s th e d ocu m en t c o rre c t u si n g a –6– I EC 62496-2: 201 I EC 201 I NTRODUCTI ON Bandwidth densities in m odern data comm unication system s are driven by interconnect speeds and scalable input/output (I /O) and will continue to increase over the com ing years, thereby severel y im pacting cost and performance in future data comm unication system s, bringing increased demands in term s of signal integrity and power consum ption The proj ected increase in capacity, processing power and bandwidth density in future information communication system s will need to be addressed by the migration of embedded optical interconnects into system enclosures I n particular, this would necessitate the deployment of optical circuit board technologies on some or all key system cards, such as the backplane, m otherboard and peripheral circuit boards Man y varieties of optical circuit board technolog y exist today, which differ strongly from each other in terms of their intrinsic waveguide technolog y As shown in Figure , these varieties include, but are not lim ited to: a) fibre-optic laminate, b) pol ym er waveguides and c) planar glass waveguides Annex A provides a detailed overview of the state of the art of such optical interconnect technologies IEC a ) F i b re -o p ti c l a m i n a te IEC b ) P o l ym e r wa ve g u i d e s IEC c) P l a n a r g l a s s wa ve g u i d e s F i g u re – O p ti c a l c i rc u i t b o a rd va ri e t i e s One important prerequisite to the comm ercial adoption of optical circuit boards is a reliable test and m easurem ent definition system that is agnostic to the type of waveguide system under test and, therefore, can be applied to different optical circuit board technologies as well as being adaptable to future variants A serious and comm on problem with the measurem ent of optical waveguide system s has been lack of proper definition of the m easurement conditions for a given test regime, and consequentl y strong inconsistencies ensue in the results of m easurem ents by different parties on the same test sam ple To date, no methodolog y has been established to ensure that test and measurement conditions for such optical waveguide systems are properl y identified This docum ent specifies a m ethod of capturing sufficient information about the measurement conditions for a given optical circuit board to ensure consistency of measurem ent results within an acceptable margin Given the substantial variety in properties and requirements for different optical circuit board types, some test environments and conditions are m ore appropriate than others for a given optical circuit board I t is, therefore, crucial that this m easurement identification standard encom pass a com prehensive range of test and measurem ent scenarios for all known types of optical circuit boards and their waveguide system s, while also being sufficientl y adaptable and extendable to accommodate future waveguide technologies I n addition, a degree of customisation is possible to account for arbitrary test parameters I EC 62496-2: 201 I EC 201 –7– O P T I C AL C I RC U I T B O ARD S – B AS I C TE S T AN D M E AS U RE M E N T P ROC E D U RE S – P a rt : G e n e l g u i d a n c e fo r d e fi n i ti o n o f m e a s u re m e n t c o n d i ti o n s fo r o p t i c a l c h a c te ri s ti c s o f o p ti c a l c i rc u i t b o a rd s S cop e This part of I EC 62496 specifies a m ethod of defining the conditions for m easurements of optical characteristics of optical circuit boards The method comprises the use of code reference look-up tables to identify different critical aspects of the m easurem ent environment The values extracted from the tables are used to construct a measurem ent identification code, which, in itself, captures sufficient inform ation about the measurement conditions, so as to ensure consistency of independently measured results within an acceptable margin Recommended m easurem ent conditions are specified to m inim ise further variation in independentl y measured results N o rm a t i ve re fe re n c e s The following docum ents are referred to in the text in such a way that some or all of their content constitutes requirem ents of this docum ent For dated references, onl y the edition cited applies For undated references, the latest edition of the referenced document (including an y amendments) applies I EC 61 300-1 , Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 1: General and guidance I EC 61 300-3-53, Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 3-53: Examinations and measurements – Encircled angular flux (EAF) measurement method based on two-dimensional far field data from step index multimode waveguide (including fibre) IEC 6261 4, attenuation Fibre optics – Launch condition requirements for measuring multimode IEC 62496-2-1 : 201 , and isolation Optical circuit boards – Part 2-1: Measurements – Optical attenuation T e rm s a n d d e fi n i t i o n s For the purposes of this document, the terms and definitions given in I EC 62496-2-1 and the following appl y I SO and I EC maintain terminological databases for use in standardization at the following addresses: • I EC Electropedia: available at http://www electropedia.org/ • I SO Online browsing platform: available at http://www iso org/obp –8– I EC 62496-2: 201 I EC 201 o p ti ca l ch an n e l m e a s u re m e n t i d e n t i fi c a t i o n co d e MIC num erical code used to capture sufficient information about the measurement conditions on a waveguide under test in an optical circuit board, such as to ensure independent repeatability of the m easurement and consistency of measured results on an identical sample o p ti ca l ch an n e l u n d er tes t optical circuit board channel subjected to test and m easurem ent regime 3 p a b o l i c p ro fi l e p a m e t e r parameter which describes the refractive index profile of waveguide according to the following equation g n1 − ∆ r n( r ) = a n1 − ∆ < a r > a r where g is the parabolic profile param eter; a is the core radius; r is the radial distance from core centre; n is the refractive index at r = 0; Δ ( ) is given by the relation ∆ = n1 − n2 / n1 , where n again is the refractive index at r = 0, i e at the axis, and n is the refractive index at the outer edge of the core, i e at r = a l au n ch d u i t structure or m echanism which guides light from the m easurem ent test source to the input facet of the optical channel under test Note to entry: Exam ples include optical fi bres, optical wavegui des or optical trai ns c a p t u ri n g co n d u i t structure or m echanism which guides light from the output facet of the optical channel under test to a measurement device to p i n p u t a xi s o f c h a n n e l u n d er test axis defined by the tester within the plane of the input facet used as a reference, against which the polarisation axis of the launch conduit can be defined to p o u u t a xi s o f ch a n n e l u n d e r te s t axis defined by the tester within the plane of the output facet used as a reference, against which the polarisation axis of the capturing conduit can be defined p o l a ri s a t i o n m a i n t a i n i n g o p t i c a l fi b re single-m ode optical fibre in which linearl y polarized light, if properly launched into the fibre, maintains a linear polarisation during propagation, exiting the fibre in a specific linear T a b l e – C C C c o o rd i n a t e re fe re n c e fo r i n p u t c o u p l i n g I n p u t fa c e t t r e a t m e n t Cou pl i n g → R e fra c t i v e i n d e x i n t e r fa c e U n tre a te d m a t e ri a l n appl i ed i n t e rf a c e w h e re c o n d i ti o n s R e fra c t i v e i n d e x i n t e r fa c e fi l m appl i ed w h e re n fi l m = c1 = c1 a rra n g e m e n t ↓ B u tt cou pl i n g Axial d isplacem ent = µ m 001 002 003 004 005 006 007 008 009 01 Axial d isplacem ent = µ m 01 01 01 01 01 01 01 01 01 020 Axial d isplacem ent = 50 µ m 021 022 023 024 025 026 027 028 029 030 Axial d isplacem ent = 00 µ m 031 032 033 034 035 036 037 038 039 040 Axial d isplacem ent = (c2) µ m 041 042 043 044 045 046 047 048 049 050 051 052 053 054 055 056 057 058 059 060 Len s cou p l i n g a rra n g e m e n t I m ag i n g – 28 – Source/l aunch cond uit onto input facet I EC 62496-2: 201 I EC 201 I EC 62496-2: 201 5.8 5.8.1 I EC 201 – 29 – Coordinate table DDD – Output coupling conditions Mandatory parameters There are no mandatory param eters 5.8.2 Customisation parameters The following custom isation param eters are defined for Table 5: • (d1 ) – refractive index of index matching m aterial (gel, oil or film ) applied to output facet • (d2) – axial distance between output facet and capturing conduit input facet • (d3) – angle between polarisation plane and top input axis of channel under test T a b l e – D D D c o o rd i n a t e re fe re n c e fo r o u t p u t c o u p l i n g O u t p u t fa c e t t r e a t m e n t Cou pl i n g → Re fra c t i v e i n d e x i n t e r fa c e U n t re a t e d m a t e ri a l n appl i ed i n t e rf a c e w h e re co n d i ti on s R e fra c t i v e i n d e x i n t e rfa c e fi l m appl i ed w h e re n fi l m = d1 = d1 a rra n g e m e n t ↓ B u tt cou pl i n g Axial d isplacem ent = µ m 001 002 003 004 005 006 007 008 009 01 Axial d isplacem ent = µ m 01 01 01 01 01 01 01 01 01 020 Axial d isplacem ent = 50 µ m 021 022 023 024 025 026 027 028 029 030 Axial d isplacem ent = 00 µ m 031 032 033 034 035 036 037 038 039 040 Axial d isplacem ent = (d2) µ m 041 042 043 044 045 046 047 048 049 050 051 052 053 054 055 056 057 058 059 060 Len s cou p l i n g a rra n g e m e n t Source/l aunch cond uit onto input facet – 30 – I m ag i n g I EC 62496-2: 201 I EC 201 I EC 62496-2: 201 5.9 I EC 201 – 31 – Coordinate table EEE – Capturing conditions 5.9.1 M andatory parameters There are no m andatory parameters 5.9.2 Customisation parameters The following custom isation param eters are defined for Table 6: • • • • (e1 ) (e2) (e3) (e4) – diam eter of fibre core in units of micrometres – numerical aperture of fibre – parabolic profile param eter of the fibre core – diam eter of spatial filter T a b l e – E E E c o o rd i n a t e re fe re n c e fo r c a p t u ri n g I n t e g t i n g C a p t u ri n g d e vi ce → L a rg e a re a L a rg e a re a p h o to d e te c to r p h o to d e te cto r L a rg e a re a P h o to d e te c to r s p h e re d e t e c to r p h o to d e te cto r d e te c to r c o u p l e d cou p l ed wi th to s p a ti a l c a p t u ri n g D i re c t c o u p l i n g wi th o u t ↓ fi l t e r Ø wi th c i rc u l a r s p a ti a l fi l t e r fi l t e r d u i t d u i t c i rc u l a r wi th o u t s p a ti a l t o c a p t u ri n g co n d u i t C a p t u ri n g co n d i ti o n s µm Ø(e 4) µ m 001 002 003 004 005 006 007 008 009 01 μm SMF (OS1 ) Ø9/1 25 μm BI SMF 01 01 01 01 01 01 01 01 01 020 021 022 023 024 025 026 027 028 029 030 Ø50/1 25 µ m 031 032 033 034 035 036 037 038 039 040 Ø62, 5/1 25 µ m 041 042 043 044 045 046 047 048 049 050 Ø1 05 µ m 051 052 053 054 055 056 057 058 059 060 Ø200 µ m 061 062 063 064 065 066 067 068 069 070 071 072 073 074 075 076 077 078 079 080 081 082 083 084 085 086 087 088 089 090 091 092 093 094 095 096 097 098 099 00 01 02 03 04 05 06 07 08 09 110 111 112 113 114 115 116 117 118 119 20 21 22 23 24 25 26 27 28 29 30 i n t e rm e d i a r y c o n d u i t G l ass fi b re S I Ø9/1 25 – 32 – G l ass fi b re G I Ø50/1 25 µ m OM5 M MF (non-bend insensitive) (bend i nsensiti ve) Ø50/1 25 µ m OM4 M MF (non-bend insensitive) Ø50/1 25 µ m OM4 BI M MF (bend i nsensiti ve) (non-bend insensitive) Ø50/1 25 µ m OM3 BI M MF (bend i nsensiti ve) I EC 201 Ø50/1 25 µ m OM3 M MF I EC 62496-2: 201 Ø50/1 25 µ m OM5 BI M MF C a p t u ri n g d e vi ce → L a rg e a re a L a rg e a re a p h o to d e te c to r p h o to d e te cto r L a rg e a re a s p h e re d e t e c to r p h o to d e te cto r d e te c to r c o u p l e d cou p l ed wi th to c a p t u ri n g s p a ti a l fi l t e r Ø wi th c i rc u l a r s p a ti a l fi l t e r fi l t e r co n d u i t d u i t C a p t u ri n g c i rc u l a r wi th o u t s p a ti a l t o c a p t u ri n g µm Ø(e 4) µ m d u i t ↓ 31 32 33 34 35 36 37 38 39 40 Ø62, 5/1 25 µ m (OM ) 41 42 43 44 45 46 47 48 49 50 Ø1 05 µ m , NA 0, 22 51 52 53 54 55 56 57 58 59 60 Ø200 µ m , NA 0, 39 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Ø50/1 25 µ m 81 82 83 84 85 86 87 88 89 90 Ø62, 5/1 25 µ m 91 92 93 94 95 96 97 98 99 200 Ø980/1 000 µ m (A4) 201 202 203 204 205 206 207 208 209 21 21 21 21 21 21 21 21 21 21 220 221 222 223 224 225 226 227 228 229 230 H a rd p o l ym e r c l a d d i n g I EC 201 Ø50/1 25 µ m (OM2) I EC 62496-2: 201 I n t e g t i n g P h o to d e te c to r fi b re (H PCF ) Ø200/230 µ m A3 P l a s ti c o p ti ca l fi b re S I Ø (b2) µ m , NA (b3), profil e param eter (b4) S p e c i a l i s t g l a s s fi b r e G I Ø25 µ m , NA – 33 – C u s tom – 34 – 5 I EC 62496-2: 201 I EC 201 E xa m p l e s o f d e p l o y m e n t G e n e l The following exam ples are presented of the use of the MI C to capture a comprehensive amount of information on the test and m easurem ent conditions for an optical circuit board channel M I C - - 1 ( 0 ) - 0 - 0 - 1 ( i n t e g t i n g s u pp l i er an d m od el s p h e re d e v i c e d e t a i l s i n c l u d i n g n u m b e r) A m ultimode 850 nm VCSEL test source with a narrow spectral width of nm is connected to a non-bend insensitive OM3 50/1 25 µm glass fibre M ode filtering elem ents are arranged such that the spatial and angular power distribution of output of the fibre into the input facet of the optical channel under test is compliant with the template profiles for EF and EAF defined in I EC 61 300-1 and I EC 61 300-3-53, respectivel y, for non-bend insensitive OM 50/1 25 µm glass fibres The total optical power measured at the launch facet is 400 µ W The output fibre facet is butt-coupled to the input facet of the optical channel under test with an axial distance of µm and is thus touching the input facet The input facet is untreated The output facet of the optical channel under test is untreated and butt-coupled with an axial displacem ent of µm to a non-bend insensitive OM3 50/1 25 µm glass fibre The capturing fibre is coupled directl y to an integrating sphere detector The supplier nam e, model number and an y other inform ation required to identify the measurement apparatus used is preferabl y explicitl y stated after the MI C code This m easurem ent setup would be recomm ended to evaluate the optical circuit board for applications requiring m ultimode fibre-to-board connectivity with repeatable mating M I C -0 - ( ) - ( , i n cl u d i n g su pp l i e r an d X , X) - 0 - ( i n t e g t i n g m od el s p h e re d e v i c e d e t a i l s n u m b e r) A m ultimode 060 nm test source with a narrow spectral width between nm and nm is connected to a bend insensitive OM3 50/1 25 µ m glass fibre Mode filtering elem ents are arranged such that the spatial and angular power distribution of output of the fibre into the input facet of the optical channel under test is compliant with the tem plate profiles for EF and EAF requirements defined in I EC 6261 and I EC 61 300-3-53, respectivel y, for bend insensitive OM3 50/1 25 µm glass fibres The total optical power measured at the launch facet is 205 µW The launch fibre facet is im aged onto the input facet of the optical channel under test with a lens arrangem ent The input facet is treated with a thin film with a refractive index of ,56 The output facet of the optical channel under test is untreated and butt-coupled with an axial displacement of µm to a step index glass capturing fibre with core diameter 62, µm The capturing fibre is coupled directly to an integrating sphere detector The supplier nam e, model num ber and an y other information required to identify the m easurem ent apparatus used is preferabl y explicitl y stated after the M I C code This measurem ent setup would be suitable to evaluate the optical circuit board for applications requiring free space im aging optics at the interfaces, such as expanded beam connectors I EC 62496-2: 201 I EC 201 F a s t p o l a ri s a t i o n p o l a ri s a t i o n a xi s : a xi s : – 35 – M I C -0 -0 ( ) -0 42 ( 53 , M I C -0 - ( ) -0 ( , 25, 5, -3 ) -0 -0 4; sl ow -1 ) -0 -0 A single-mode 31 nm test source with a spectral width lower than nm is connected to a 9, 2/1 25 µm graded index polarisation maintaining optical fibre The fibre is arranged such that output power distribution is compliant with the single-mode launch conditions defined in I EC 61 300-1 The total optical power measured at the launch facet from the fast polarisation axis is 50 µW The total optical power m easured at the launch facet from the slow polarisation axis is 75 µ W The launch fibre facet is oriented relative to the input facet of the channel under test such that the fast polarisation axis forms an angle of –30 ° to the designated top axis of the input channel under test (i e 30 ° moving anti-clockwise from the top axis of the input facet of the channel under test), and the slow polarisation axis forms an angle of –1 20 ° to the designated top axis of the input channel under test (i e 20 ° m oving anti-clockwise from the top axis of the input facet of the channel under test) The launch fibre facet is butt-coupled on to the input facet of the optical channel under test with an axial displacem ent of 25 µm The input facet is treated with a refractive index fluid with a refractive index of , 53 for a wavelength of 31 nm The output facet of the optical channel under test is untreated and imaged through an im aging lens assembl y to a large area photo-detector with a 75 µm spatial filter This measurement setup would be suitable to evaluate the polarization dependent performance of optical circuit boards for applications requiring polarization sensitive connectivity such as adiabatic waveguide coupling to photonic integrated circuits – 36 – I EC 62496-2: 201 I EC 201 An nex A (informative) State of the art in optical i ntercon nect technol ogies A Di versi ty of opti cal i n terconn ect technol og i es There are m an y varieties of system em bedded optical interconnect, which have em erged at different stages over the past 20 years and differ strongl y from each other in terms of their material composition, waveguide profile, channel and performance characteristics, fabrication process and com pliant technologies These varieties include, a) b) c) d) fibre-optic circuit laminates [1 ] , em bedded planar pol ym er waveguides [2], [3], em bedded planar glass waveguides [4], [5], and free space optics [6] A Fi bre-opti c ci rcui t l am i nates Lam inated fibre-optic circuits in which optical fibres are pressed and glued into place on a substrate benefit from the reliability of conventional optical fibre technolog y H owever, these circuits cannot accomm odate waveguide crossings in the sam e layer, i e fibres shall cross over each other and cannot cross through each other Moreover, with each additional fibre layer, backing substrates shall typicall y be added to hold the fibres in place, thus significantl y increasing the thickness of the circuit This would lim it the long-term usefulness of laminated fibre-optic circuits in PCB stack-ups At best, they can be glued or bolted onto the surface of a conventional circuit board A Pol ymer wavegui d es Pol ym er waveguides would be unsuited to convey certain operational wavelengths (1 31 nm or 550 nm ) over longer distances due to higher intrinsic absorption losses, though this can be m itigated in som e polymer form ulations [7] However, they would be suitable for very short reach, versatile, low cost links such as inter-chip connections on a board They would also be suitable for applications in which certain properties of the pol ym er such as therm o-optic, electro-optic or strain-optic coefficients could be used to support advanced devices such as Mach-Zehnder switches or long range plasmonic interconnects A Pl anar gl ass wavegui des Planar glass waveguide technology could combine som e of the perform ance benefits of optical fibres, such as lower material absorption at longer operational wavelengths and lower modal dispersion with the ability to fabricate dense com plex optical circuit layouts on single layers and integrate these into PCB stack-ups The Fraunhofer I nstitute of Reliability and Microintegration (Fraunhofer I ZM) in Germ an y are producers of planar glass waveguide based optical circuit boards _ Figu res in squ are brackets refer to the bibli og raph y This inform ation is gi ven for th e ven ience of users of this docum ent an d d oes n ot constitute an en dorsem ent by I EC I EC 62496-2: 201 A I EC 201 – 37 – Free space opti cs With the proliferation of expanded optical beam technologies, a free space optical interconnect represents a viable em erging solution for in-system interconnect applications, as the internal misalignm ent tolerances inherent to such system s can be more easil y accomm odated by expanded beam technologies Target applications include server backplane interconnectivity Even though free space optical system s not require a ph ysical circuit board substrate, in order to be purel y optical waveguide agnostic, the proposed measurem ent identification system in this document can be equall y applied to free space optical channels A Target appl i cati ons The target application also plays an im portant role as this defines the trade-off space constraining the selection of waveguide type For exam ple in data centre applications, cost would be the dom inant factor, while in high performance computers or supercom puters, emphasis is placed on performance optim isation – 38 – I EC 62496-2: 201 I EC 201 Bibliography [1 ] C Berger, M Kossel, C M enolfi, T M orf, T Toifl, and M Schmatz, "H igh-density optical interconnects within large-scale system s", Proc SPIE, vol 4942, no 2003, p 222-235, 2003 [2] R Pitwon, K Wang, J Graham -Jones, I Papakonstantinou, H Baghsiahi, B J Offrein, R Dangel, D Milward, and D R Selviah, "FirstLight: Pluggable optical interconnect technologies for pol ym eric electro-optical printed circuit boards in data centers", J Light Technol , vol 30, no 21 , p 331 6-3329, 201 [3] L Schares, J a Kash, F E Doan y, C L Schow, C Schuster, D M Kuchta, P K Pepeljugoski, J M Trewhella, C W Baks, R a John, L Shan, Y H Kwark, R a Budd, P Chiniwalla, F R Libsch, J Rosner, C K Tsang, C S Patel, J D Schaub, R Dangel, F H orst, B J Offrein, D Kucharski, D Guckenberger, S H egde, H N yikal, C K Lin, A Tandon, G R Trott, M N ystrom , D P Bour, M R T Tan, and D W Dolfi, "Terabus: Terabit/second-class card-level optical interconnect technologies", IEEE J Sel Top Quantum Electron , vol 2, no 5, p 032-1 043, 2006 [4] H Schroeder, L Brusberg, N Arndt-Staufenbiel, J H ofm ann, and S Marx, "Glass panel processing for electrical and optical packaging", 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) , p 625-633, 201 [5] R Pitwon, H Schröder, L Brusberg, J Graham -Jones, and K Wang, "Embedded planar glass waveguide optical interconnect for data centre applications", Optoelectron INTERCONNECTS XIII, Proc SPI E, vol 8630, no 0, p 86300Z, 201 [6] R Rachmani and S Arnon, "Wavelength Diversity Links", no 9, p 359-1 365, 201 [7] S Takenobu and T Okazoe, "H eat Resistant and Low-Loss Fluorinated Pol ym er Optical Waveguides at 31 0/1 550 nm for Optical I nterconnects", 37th Eur Conf Expo Opt Commun , vol , p We.1 P1 31 , 201 [8] I EC 60793-2, [9] I EC 60793-1 -43, Optical fibres – Part 1-43: Measurement methods and test procedures – Numerical aperture measurement [1 0] J Light Technol , vol 30, Optical fibres – Part 2: Product specifications – General Safety of laser products – Part 1: Equipment classification and I EC 60825-1 , requirements Fibre-optic communication subsystem test procedures – Part 4-1: Installed cable plant – Multimode attenuation measurement [1 ] I EC 61 280-4-1 , [1 2] I EC 61 745, End-face image analysis procedure for the calibration of optical fibre geometry test sets [1 3] I EC TR 62349, [1 4] I EC 62496-1 , [1 5] I EC 62496-2-4, Guidance of measurement methods and test procedures – Basic tests for polarization-maintaining optical fibres Optical circuit boards – Part 1: General Optical circuit boards – Basic test and measurement procedures – Part 2-4: Optical transmission test for optical circuit boards without input/output fibres I EC 62496-2: 201 I EC 201 – 39 – [1 6] I EC 62496-4-1 , Optical circuit boards – Interface standards – Part 4-1: Terminated waveguide OCB assembly using PMT connectors [1 7] I EC TR 62658, [1 8] I EC TS 62661 -2-1 , Optical backplanes – Product specification – Part 2-1: Optical backplane using optical fibre circuit boards and multi-core right angle optical connectors technologies Roadmap of optical circuit boards and their related packaging _ _ Und er preparati on Stag e at th e tim e of publicati on: I EC PCC 62496-4-1 : 201 INTERNATIONAL ELECTROTECHNICAL COMMISSI ON 3, rue de Varembé PO Box 31 CH-1 21 Geneva 20 Switzerland Tel: + 41 22 91 02 1 Fax: + 41 22 91 03 00 info@iec.ch www.iec.ch