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PRIME Z270-AR Repair Guide Kent 11/25 STANDARD APPEARANCE BLOCK DIAGRAM POWER FLOW POWER ON SEQUENCE Timing Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except for body temp, all temperatures are measured with thermo couples inside solder joints, for better accuracy Primary Factors for Successful Rework: •Flux formulation and solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries and thermal solutions following the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel®BGA / Socket Rework Video (10 minutes in length): http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=1519232885001 MB Baking Time: 120〬C, hours BGA Baking Time: 10.Voltage Measure Point Voltage Measure Point Station Net Name Diode resistance PU4000 +3VSB_ATX 547 PQ4000 +5VSB 1045 PL1011 VCORE 567 PQ4001 +3VSB 553 PQ1600 VDDQ 306 EATXPWR +5VSB_ATX 841 PQ4510 +5DUAL 1143 APU1 +12V 920 EATXPWR +5V 560 EATXPWR +3V 669 11.Signal Measure Point Station SC59 SC605 NA PQ4000 PQ4002 NA O1R1 OR645 NA SD5 NA NA PQ5011 EATXR16 APU1 EATXPWR EATXPWR NA CR38 SR75 PR1025 PR1027 PL1011 NA OC502 HR3087 NA 17 Signal Measure Point Net Name Diode resistance S_RTCRST# NA S_SRTCRST# NA AC Power Switch ON NA +5VSB 1045 +3VSB 553 S_PWROK NA O_RSMRST# 17 O_PWRBTN# 692 O_IOPWRBTN# NA S_SLPS3# 1016 S_SLP_A# NA S_SLP_LAN# NA S_SLPS4# 1044 ATX_PSON#_R NA 12V 920 5V 560 3V 669 P_PWROK_PS NA O_PWROK 1256 H_CPUPWRGD NA P_SVID_DATA 257 H_SVID_CLK 274 VCORE 567 P_VR_READY_5 NA S_PLTRST# 950 18 19 H_CPURST# O_X1_RST# Sequence 3.1 7/4.2 7.1 8/4.1 10 11 12 13 14 15 16 281 NA ... for BGA & Chipset Except for body temp, all temperatures are measured with thermo couples inside solder joints, for better accuracy Primary Factors for Successful Rework: •Flux formulation and... solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries