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B150-PRO D3 Repair Guide ELF_XU GTSD 2015/09/06 BLOCK DIAGRAM POWER FLOW POWER ON SEQUENCE Timing Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except for body temp, all temperatures are measured with thermo couples inside solder joints, for better accuracy Primary Factors for Successful Rework: •Flux formulation and solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries and thermal solutions following the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel®BGA / Socket Rework Video (10 minutes in length): http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=1519232885001 MB Baking Time: 120〬C, hours BGA Baking Time: Voltage Measure Point Voltage Measure Point Station Net Name Diode resistance PU702 +3VSB_ATX 334 PQ605 +5VSB 375 PL201 VCCGT 484 HR61 VCCIO 504 PL704 VCCSA 503 EATX12V +12V_CPU 552 TPM +3VSB 319 PC550 VTT_DDR 425 EATXPWR +5VSB_ATX 585 PQ708 +5VDUAL 526 EATXPWR +12V 497 EATXPWR +5V 446 PQ403 +3V 320 10.Signal Measure Point Station SR120 SR121 NA PQ605 TPM SR80 SR80 O1R14 O1R18 SD5 NA NA O1R10 EATXPWR EATXPWR EATXPWR PQ403 EATXPWR O1R12 SR75 HR210 PR109 PC168 SQ6 TPM ESDC3 XC75 XC71 Sequence 3.1 7/4.2 7.1 8/4.1 10 11 12 13 14 15 16 17 18 19 Signal Measure Point Net Name Diode resistance S_RTCRST# 778 S_SRTCRST# 778 AC Power Switch ON NA +5VSB 375 +3VSB 319 S_DPWROK 18 O_RSMRST# 18 PWRBTN# 847 O_IOPWRBTN# 544 S_SLP_S3# 513 S_SLP_A# NA S_SLP_LAN# NA S_SLP_S4# 539 ATX_PSON#_R 548 12V 497 5V 446 3V 320 P_PWROK_PS NA O_PWROK 35 H_CPUPWRGD 447 H_SVID_DATA 504 H_SVID_CLK 508 VCORE 437 P_VR_READY_10 468 S_PLTRST# 488 H_CPURST# 435 O_ X1 RST# 592 O_ X16_RST# 588 ... Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except for body temp, all temperatures are measured... Rework: •Flux formulation and solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads)... Caution: Always remove batteries and thermal solutions following the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel®BGA / Socket Rework