TROOPER B150 D3 Repair Guide ELF_XU GTSD 2015/09/23 BLOCK DIAGRAM POWER FLOW POWER ON SEQUENCE Timing Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except for body temp, all temperatures are measured with thermo couples inside solder joints, for better accuracy Primary Factors for Successful Rework: •Flux formulation and solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries and thermal solutions following the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel®BGA / Socket Rework Video (10 minutes in length): http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=1519232885001 MB Baking Time: 120〬C, hours BGA Baking Time: Voltage Measure Point Voltage Measure Point Station Net Name Diode resistance PU702 +3VSB_ATX 345 PQ605 +5VSB 364 UQ706 +5V_DUAL_USBKB 480 PC219 +VCCGT 440 PC748 +VCCSA 472 PC302 +VCCIO 472 EATX12V +12V_CPU 538 TPM +3VSB 310 PC550 +VTTDDR 411 PQ611 +5VSB_ATX 578 EATXPWR +12V 583 EATXPWR +5V 437 EATXPWR +3V 854 10.Signal Measure Point Station SR123 SR120 NA PQ605 TPM SR142 SR142 PANEL OR711 SD5 NA NA PQ532 EATXPWR EATXPWR EATXPWR EATXPWR EATXPWR SQ40 SR75 HR210 PR109 PC168 PQ805 TPM HQ8 XC71 XC73 XC72 Sequence 3.1 7/4.2 7.1 8/4.1 10 11 12 13 14 15 16 17 18 19 Signal Measure Point Net Name Diode resistance S_RTCRST# 778 S_SRTCRST# 778 AC Power Switch ON NA +5VSB 364 +3VSB 310 S_DPWROK 17 O_RSMRST# 17 O_PWRBTN#IN 612 O_PWRBTN# 467 S_SLPS3# 541 S_SLP_A# NA S_SLP_LAN# NA S_SLPS4# 546 O_PSON# 546 12V 583 5V 437 3V 854 B_ATX_PWROK 567 O_PWROK 540 H_PWRGD 488 H_VIDDATA 426 H_VIDCLK 426 +VCORE 414 P_VR_READY_10 497 S_PLTRST# 504 H_CPURST# 455 O_PCIRST#_PCIEX16_1 544 O_PCIRST#_PCIEX16_2 543 O_PCIRST#_PCIEX16_3 540