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Z170M-E D3 Repair Guide ELF_XU GTSD 2015/08/28 BLOCK DIAGRAM POWER FLOW POWER ON SEQUENCE Timing Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except for body temp, all temperatures are measured with thermo couples inside solder joints, for better accuracy Primary Factors for Successful Rework: •Flux formulation and solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries and thermal solutions following the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel® BGA / Socket Rework Video (10 minutes in length): http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=1519232885001 MB Baking Time: 120〬C, hours BGA Baking Time: Voltage Measure Point Voltage Measure Point Station Net Name Diode resistance PU702 +3VSB_ATX 338 PL201 VCCGT 456 PQ605 +5VSB 495 PL704 VCCSA 500 PL301 VCCIO 453 EATX12V 12V_CPU 549 TPM +3VSB 313 PC550 VTT_DDR 427 EATXPWR +5VSB_ATX 593 PR750 +5VDUAL 513 EATXPWR +12V 1429 EATXPWR +5V 411 PQ403 +3V 319 10.Signal Measure Point Station SR120 SR121 NA PQ605 TPM SR80 SR80 O1R14 ESDC8 O1R11 NA NA O1R10 EATXPWR EATXPWR EATXPWR PQ403 NA O1R12 ESDC2 HR210 PR109 PC168 SQ6 TPM ESDC3 XC74 XC71 Sequence 3.1 7/4.2 7.1 8/4.1 10 11 12 13 14 15 16 17 18 19 Signal Measure Point Net Name Diode resistance S_RTCRST# 777 S_SRTCRST# 777 AC Power Switch ON NA +5VSB 495 +3VSB 313 S_DPWROK 22 O_RSMRST# 22 PWRBTN# 854 O_IOPWRBTN# 537 S_SLP_S3# 513 S_SLP_A# NA S_SLP_LAN# NA S_SLP_S4# 536 ATX_PSON#_R 555 12V 1429 5V 411 3V 319 P_PWROK_PS NA O_PWROK 36 H_CPUPWRGD 411 H_SVID_DATA 472 H_SVID_CLK 479 VCORE 416 P_VR_READY_10 469 S_PLTRST# 487 H_CPURST# 394 O_X1_RST# 590 O_X16_RST# 591 ...2 POWER FLOW POWER ON SEQUENCE Timing Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except... formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries and thermal solutions... the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel® BGA / Socket Rework Video (10 minutes in length): http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA