Asus PRIME b250 PLUS repair guide

PRIME B250-PLUS Repair Guide Kent 12/25 STANDARD APPEARANCE BLOCK DIAGRAM POWER FLOW POWER ON SEQUENCE Timing Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except for body temp, all temperatures are measured with thermo couples inside solder joints, for better accuracy Primary Factors for Successful Rework: •Flux formulation and solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries and thermal solutions following the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel®BGA / Socket Rework Video (10 minutes in length): http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=1519232885001 MB Baking Time: 120〬C, hours BGA Baking Time: 10.Voltage Measure Point Voltage Measure Point Station Net Name Diode resistance PU4001 +3VSB_ATX 528 PQ4002 +5VSB 868 PL1010 VCORE 600 OQ760 +3VSB 691 PL2011 VDDQ 281 EATXPWR +5VSB_ATX 1102 PQ4501 +5VSB_DUAL 732 EATXPWR +12V 1050 EATXPWR +5V 551 K1L51 +3V 17 11.Signal Measure Point Station SC59 SC605 NA PU4002 OQ760 NA O1R1 O1R14 O1R68 O1R11 NA NA O1R10 EATXR16 EATXPWR EATXPWR K1L51 NA O1R12 ESDC2 PR1025 PR1027 PL1010 SQ6 TPM ESDC3 NA 17 Signal Measure Point Net Name Diode resistance S_RTCRST# NA S_SRTCRST# NA AC Power Switch ON NA +5VSB 868 +3VSB 691 S_PWROK NA O_RSMRST# 17 O_PWRBTN#_R 1702 O_IOPWRBTN# 970 S_SLP_S3# 1112 S_SLP_A# NA S_SLP_LAN# NA S_SLP_S4# 1151 ATX_PSON#_R NA 12V 1050 5V 551 3V 17 P_PWROK_PS NA O_PWROK 34 H_CPUPWRGD 327 P_SVID_DATA 584 H_SVID_CLK 578 VCORE 567 P_VR_READY_10 454 S_PLTRST# 850 18 19 H_CPURST# O_X1_RST# Sequence 3.1 7/4.2 7.1 8/4.1 10 11 12 13 14 15 16 343 NA