Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging v Contents Abstract iv Keywords iv 1. Introduction 1 2. Background on Technologies for Millimeter-Wave Passive Front-Ends 5 2.1 3D Integrated SOP Concept 5 2.2 LTCC Multilayer Technology 7 2.3 60 GHz Transmitter/Receiver Modules 8 3. Three-Dimensional Packaging in Multilayer Organic Substrates 11 3.1 Multilayer LCP Substrates 11 3.2 RF MEMS Packaging Using Multilayer LCP Substrates 12 3.2.1 Package Fabrication 13 3.2.2 RF MEMS Switch Performance with Packaged Cavities 13 3.2.3 Transmission Lines with Package Cavities 16 3.3 Active Device Packaging Using Multilayer LCP Substrates 16 3.3.1 Embedded MMIC Concept 17 3.3.2 MMIC Package Fabrication 18 3.3.3 MMIC Package Testing 18 3.4 Three-Dimensional Paper-Based Modules for RFID/Sensing Applications 21 4. Microstrip-Type Integrated Passives 23 4.1 Patch Resonator Filters and Duplexers 23 4.1.1 Single Patch Resonator 23 4.1.2 Three and Five-Pole Resonator Filters 27 4.2 Quasielliptic Filter 32 5. Cavity-Type Integrated Passives 37 5.1 Rectangular Cavity Resonator 37 5.2 Three-Pole Cavity Filters 39 5.3 Vertically Stacked Cavity Filters and Duplexers 47 5.3.1 Design of Cavity Resonator 47 5.3.2 Design of Three-Pole Cavity Bandpass Filter 48 vi THREE-DIMENSIONAL INTEGRATION 5.4 Cavity-Based Dual-Mode Filters 56 5.4.1 Dual-Mode Cavity Filters 57 5.4.1.1 Single Dual-Mode Cavity Resonator 57 5.4.1.2 Internal Coupling 59 5.4.1.3 External Coupling 59 5.4.1.4 Transmission Zero 61 5.4.1.5 Quasi-Elliptic Dual-Mode Cavity Filter 64 5.4.2 Multipole Dual-Mode Cavity Filters 67 5.4.2.1 Quasi-Elliptic Filter with a Rectangular Slot 70 5.4.2.2 Quasi-Elliptic Filter with a Cross Slot 72 6. Three-Dimensional Antenna Architectures 73 6.1 Patch Antenna Using a Soft-Surface Structure 73 6.1.1 Investigation of an Ideal Compact Soft Surface Structure 73 6.1.2 Implementation of the Soft-Surface Structure in LTCC 76 6.2 High-Gain Patch Antenna Using Soft-Surface Structure and Stacked Cavity 79 6.2.1 Antenna Structure Using a Soft-Surface and Stacked Cavity 79 6.2.2 Simulation and Measurement Results 81 6.3 Dual-Polarized Cross-Shaped Microstrip Antenna 83 6.3.1 Cross-Shaped Antenna Structure 84 6.3.2 Simulation and Measurement Results 85 6.4 Series-Fed Antenna Array 86 6.4.1 Antenna Array Structure 87 6.4.2 Simulation and Measurement Results 89 7. Fully Integrated Three-Dimensional Passive Front-Ends 91 7.1 Passive Front-Ends for 60 GHz Time-Division Duplexing (TDD) Applications 91 7.1.1 Topologies 91 7.1.2 Performance Discussion 91 7.2 Passive Front-Ends for 60 GHz Frequency-Division Duplexing Applications 92 7.2.1 Topologies 93 7.2.2 Performance Discussion 97 References 99 vii INTRODUCTION In recent years, great advancements have been made in understanding the mechanisms of the func- tioning of the human brain. Technological developments such as functional magnetic resonance imaging (f MRI), positron emission tomography (PET), and magnetoencephalography (MEG) have made possible the mapping of the images of cerebral activit y from hemodynamic, metabolic or elec- tromagnetic measurements. Among these brain imaging techniques, electroencephalograpy (EEG) is unique in terms of simplicity, accessibility, and temporal resolution, and has been viewed with renewed interest in recent years, thanks to the use of advanced methods of analysis and interpre- tation of its data. These methods are able to improve the spatial resolution of conventional EEG, making it possibleto address the analysis of thebrain activity in anoninvasive way using the temporal resolution of brain phenomena (of the order of milliseconds). With high-resolution EEG, it is now possible to obtain cortical activation maps describing the activity of the brain at the cortical level during the execution of a given experimental task. Simple imaging of regions of the brain activated during particular tasks does not, however, convey the information about how these regions communicate with each other for making the execu- tion of the task possible. The concept of brain connectivity is viewed as central to the understanding of the organized behavior of cortical regions, beyond the simple mapping of their activities [1,2]. Such behavior is thought to be based on the interaction between different cortical sites and differently specialized ones. Cortical connectivity estimation aims to describe these interactions in connectivity patterns, which hold the direction and strength of the information flow between cortical areas. To this purpose, several methods have been developed and applied to data gathered from hemodynamic and electromagnetic techniques [3–7]. Two main definitions of brain connectivity have been pro- posed during recent years: functional and effective connectivity [8]. Functional connectivity is defined as the temporal correlation between spatially remote neurophysiologic events. Effective connectivity is defined as the simplest brain circuit which would produce the same temporal relationship between cortical sites as observed experimentally. As for the functional connectivity, the methods proposed in literature typically involve esti- mation of some covariance properties between different time series. These properties are measured from different spatial sites during motor and cognitivetasks by EEG and fMRI techniques [4,5,7,9]. Structural equation modeling (SEM) is a technique that has been used recently to assess the connectivity between cortical areas in humans from hemodynamic and metabolic measurements [3,10–12]. The basicidea of SEM considers thecovariance structure of the data[10]. The estimation . Integrated Three-Dimensional Passive Front-Ends 91 7 .1 Passive Front-Ends for 60 GHz Time-Division Duplexing (TDD) Applications 91 7 .1. 1 Topologies 91 7 .1. 2 Performance Discussion 91 7.2 Passive. Package Cavities 16 3.3 Active Device Packaging Using Multilayer LCP Substrates 16 3.3 .1 Embedded MMIC Concept 17 3.3.2 MMIC Package Fabrication 18 3.3.3 MMIC Package Testing 18 3.4 Three-Dimensional. for RFID/Sensing Applications 21 4. Microstrip-Type Integrated Passives 23 4 .1 Patch Resonator Filters and Duplexers 23 4 .1. 1 Single Patch Resonator 23 4 .1. 2 Three and Five-Pole Resonator Filters