Intel ® X58 Express Chipset Thermal and Mechanical Design Guide pot

Intel® X58 Express Chipset Thermal and Mechanical Design Guide November 2009 Document Number: 320840-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT Intel products are not intended for use in medical, life saving, or life sustaining applications Intel may make changes to specifications and product descriptions at any time, without notice Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The Intel® X58 Express Chipset IOH may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Intel and the Intel logo are trademarks of Intel Corporation in the U.S and other countries * Other brands and names may be claimed as the property of others Copyright © 2008-2009, Intel Corporation Thermal and Mechanical Design Guide Contents Introduction 1.1 Design Flow 1.2 Definition of Terms 1.3 Reference Documents Packaging Technology 2.1 Non-Critical to Function Solder Joints 11 2.2 Package Mechanical Requirements 12 Thermal Specifications 13 3.1 Thermal Design Power (TDP) 13 3.2 Case Temperature 13 Thermal Metrology 15 4.1 Die Temperature Measurements 15 4.1.1 Zero Degree Angle Attach Methodology 15 4.2 Airflow Characterization 17 ATX Reference Thermal Solution 19 5.1 Operating Environment 19 5.2 Board-Level Components Keepout Dimensions 22 5.3 Reference Heatsink Thermal Solution Assembly 23 5.4 Mechanical Design Envelope 23 5.4.1 Extruded Heatsink Profiles 23 5.4.2 Heatsink Orientation 23 5.4.3 Thermal Interface Material 23 5.4.4 Heatsink Clip 24 5.4.5 Anchor 24 5.5 Reliability Guidelines 25 5.6 Alternate Heatsink Thermal Solution Assembly 25 5.7 Alternate Heatsink Mechanical Design Envelope 27 5.7.1 Extruded Heatsink Profiles 27 5.7.2 Heatsink Clip 27 5.7.3 Anchor 28 5.7.4 Ramp Retainer 28 5.7.5 Thermal Interface Material 28 A Thermal Solution Component Suppliers 29 B Mechanical Drawings for Package & Reference Thermal Solution 31 C Mechanical Drawings for Alternate Thermal Solution 35 Thermal and Mechanical Design Guide Figures 1-1 2-1 2-2 2-3 2-4 4-1 4-2 4-3 4-4 5-1 5-2 5-3 5-4 5-5 5-6 5-7 B-1 B-2 B-3 C-1 C-2 C-3 C-4 C-5 C-6 Thermal Design Process IOH Package Dimensions (Top View) IOH Package Dimensions (Side View) IOH Package Dimensions (Bottom View) 10 Non-Critical to Function Solder Joints 11 Thermal Solution Decision Flow Chart 16 Zero Degree Angle Attach Heatsink Modifications 16 Zero Degree Angle Attach Methodology (Top View) .17 Airflow and Temperature Measurement Locations 17 ATX Boundary Conditions 20 Side View of ATX Boundary Conditions 21 Heatsink Board Component Keepout 22 Reference Heatsink Assembly 23 Alternate Heatsink Assembly 25 Retention Mechanism Component Keepout Zones for Alternate Heatsink 26 Retention Mechanism Component Keepout Zones for Alternate Heatsink 27 IOH Package Drawing .32 Heatsink Extrusion Drawing .33 Z-Clip Wire .34 Heatsink Extrusion Drawing .36 Heat Sink Extrusion Detail .37 Anchor 38 Ramp Retainer - Page 39 Ramp Retainer - Page 40 Wire Preload Clip .41 Tables 3-1 3-2 5-1 5-2 5-3 A-1 A-2 A-3 B-1 C-1 Intel® X58 Express Chipset IOH Thermal Design Power 13 Intel® X58 Express ChipsetThermal Specification 13 IOH Thermal Solution Boundary Conditions 20 Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure 24 Reliability Guidelines 25 Reference Heatsink Enabled Components 29 Alternate Heatsink - Preload Wavesolder Heatsink (PWHS) Components 29 Supplier Contact Information .29 Mechanical Drawing List 31 Mechanical Drawing List 35 Thermal and Mechanical Design Guide Revision History Revision Number Description -001 • Initial release -002 • • Updated idle power Updated Reference Document link -003 • Updated idle power Date November 2008 March 2009 November 2009 § Thermal and Mechanical Design Guide Thermal and Mechanical Design Guide Introduction Introduction The goals of this document are to: • Outline the thermal and mechanical operating limits and specifications for the Intelđ X58 Express Chipset IOH ã Describe reference thermal solutions that meet the specifications of the Intel® X58 Express Chipset IOH Properly designed thermal solutions provide adequate cooling to maintain the Intel® X58 Express Chipset IOH case temperatures at or below thermal specifications This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance By maintaining the IOH case temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the IOH Operation outside the functional limits can cause data corruption or permanent damage to the component The simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise This document addresses thermal design and specifications for the Intel® X58 Express Chipset IOH component only For thermal design information on other chipset components, refer to the respective component TMDG For the ICH10, refer to the Intel® I/O Controller Hub 10 (ICH10) Thermal and Mechanical Design Guidelines Note: Unless otherwise specified, the term “IOH” refers to the Intel® X58 Express Chipset IOH 1.1 Design Flow To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer Figure 1-1 illustrates the design process implicit to this document and the tools appropriate for each step Figure 1-1 Thermal Design Process Step 1: Thermal Simulation  Thermal Model  Thermal Model User's Guide Step 2: Heatsink Selection  Thermal Reference  Mechanical Reference Step 3: Thermal Validation  Thermal Testing Software  Software User's Guide Thermal and Mechanical Design Guide Introduction 1.2 Definition of Terms Term Description FC-BGA Flip Chip Ball Grid Array A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style The primary electrical interface is an array of solder balls attached to the substrate opposite the die Note that the device arrives at the customer with solder balls attached BLT Intel® QuickPath Interconnect IOH Intel ICH10 Bond Line Thickness Final settled thickness of the thermal interface material after installation of heatsink The Physical layer of Intel® QuickPath interconnect is a link based interconnect specification for Intel processors, chipset and I/O bridge components Input Output Hub The IO Controller Hub component that contains the Intel® QuickPath Interface to the processor, and PCI Express* interface It communicates with the ICH10 over a proprietary interconnect called the Direct Media Interface (DMI) I/O Controller Hub 10 Tcase_max TDP 1.3 Die temperature allowed This temperature is measured at the geometric center of the top of the die Thermal design power Thermal solutions should be designed to dissipate this target power level TDP is not the maximum power that the IOH can dissipate Reference Documents The reader of this specification should also be familiar with material and concepts presented in the following documents Title Location Intel® X58 Express Chipset Datasheet http://www.intel.com/Assets/ PDF/datasheet/320839.pdf Intel® I/O Controller Hub ICH10 Thermal Mechanical Design Guidelines http://www.intel.com/design/ chipsets/ designex/319975.pdf § Thermal and Mechanical Design Guide Packaging Technology Packaging Technology The IOH uses a 37.5 mm, 8-layer flip chip ball grid array (FC-BGA) package (see Figure 2-1, Figure 2-2, and Figure 2-3) The complete package drawing can be found at Figure B-1 For information on the ICH10 package, refer to the Intel® I/O Controller Hub 10 (ICH10) Family Thermal and Mechanical Design Guidelines Figure 2-1 IOH Package Dimensions (Top View) Handling Exclusion Area 10.6 mm 13.8 mm Die 37.5 mm 37.5 mm Figure 2-2 IOH Package Dimensions (Side View) 2.48 ± 0.24 mm Substrate 1.98 ± 0.14 mm 0.82 ± 0.05 mm See note Die 0.20 0.20 0.5 ± 0.1 mm See Note -C- Seating Plane See note NOTES: Primary datum-C and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach) All dimensions and tolerances conform to ANSI Y14.5M-1994 BGA has a pre-SMT height of 0.5±0.10 mm Top of die above the motherboard after reflow is 2.36 ± 0.24 mm Shown before motherboard attach; FCBGA has a convex (dome shape) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow Thermal and Mechanical Design Guide Packaging Technology Figure 2-3 IOH Package Dimensions (Bottom View) AT AR AP AN AM 35.56 35X 1.016 AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 37.5 + 0.05 C 0.2 11 10 13 12 15 14 17 16 19 18 21 20 23 22 25 24 27 26 29 28 31 30 33 32 35 34 A 36 35x 1.016 35.56 B 37.5 + 0.05 C A 0.2 Notes: All dimensions are in millimeters All dimensions and tolerances conform to ANSI Y14.5M-1994 10 Thermal and Mechanical Design Guide ATX Reference Thermal Solution 5.7.3 Anchor For Intel® X58 Express Chipset based platforms the anchor from previous PWHS will be reused By using anchors that are separate from the extrusion, the solderability of the anchors is improved The elimination of the conduction path from pins in the extrusion reduces the chance for cold solder joints This design incorporates a 45° bent leads to increase the anchor attach reliability over time See Appendix A for the part number and supplier information See Appendix C for a mechanical drawings 5.7.4 Ramp Retainer The ramp retainer is a molded plastic component that is reused from previous PWHS designs It is integral to the ability of the design to shift the shock and vibration loads away from the IOH solder joints By assembling the heatsink extrusion, anchors and ramp retainer before wave solder the tolerances between the top of the IOH and the extrusion are absorbed as the board cools from the wave solder process.See Appendix A for the part number and supplier information See Appendix C for a mechanical drawings 5.7.5 Thermal Interface Material A thermal interface material (TIM) provides conductivity between the IHS and heat sink The reference thermal solution uses Honeywell PCM45 F*, 0.25 mm (0.010 in.) thick, 20 mm x 20 mm (0.79 in x 0.79 in.) square § 28 Thermal and Mechanical Design Guide Thermal Solution Component Suppliers A Thermal Solution Component Suppliers Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices This list and/or these devices may be subject to change without notice Table A-1 Reference Heatsink Enabled Components Item Intel PN AVC CCI Foxconn Heatsink Assembly (Extrusion, Clip & TIM) 1A013WV00 Anchor Table A-2 E16429-001 A13494-008 HB9703E-DW G2100C888-064H Alternate Heatsink - Preload Wavesolder Heatsink (PWHS) Components Item Intel PN AVC CCI Foxconn Heatsink & TIM D77030-001 C85370-001 P109000024 334C863501A 3EE77-002 Wire Clip D29082-001 A208000233 334I833301A 3KS02-155 Anchor C85376-001 Wieson S907C00002 Ramp Retainer Table A-3 Wieson 2Z802-015 G2100C888-143 Supplier Contact Information Supplier Contact Phone Email AVC (Asia Vital Corporation) +886-2-2299-6930 ext 7619 +886-2-2299-6930 ext 7630 david_chao@avc.com.tw raichel_hsi@avc.com.tw CCI(Chaun Choung Technology Monica Chih Harry Lin +886-2-2995-2666 (714) 739-5797 monica_chih@ccic.com.tw hlinack@aol.com Foxconn Jack Chen Wanchi Chen (408) 919-6121 (408) 919-6135 jack.chen@foxconn.com wanchi.chen@foxconn.com Wieson Note: David Chao Raichel Hsu Chary Lee Henry Liu +886-2-2647-1896 ext 6684 +886-2-2647-1896 ext.6330 chary@wieson.com henry@wieson.com The enabled components may not be currently available from all suppliers Contact the supplier directly to verify time of component availability § Thermal and Mechanical Design Guide 29 Thermal Solution Component Suppliers 30 Thermal and Mechanical Design Guide Mechanical Drawings for Package & Reference Thermal Solution B Mechanical Drawings for Package & Reference Thermal Solution Table B-1 lists the mechanical drawings included in this appendix Table B-1 Mechanical Drawing List Drawing Description Figure Number “IOH Package Drawing” Figure B-1 “Heatsink Extrusion Drawing” Figure B-2 “Z-Clip Wire” Figure B-3 Thermal and Mechanical Design Guide 31 Mechanical Drawings for Package & Reference Thermal Solution Figure B-1 32 IOH Package Drawing Thermal and Mechanical Design Guide Thermal and Mechanical Design Guide [ 118 ] R [ 012 ] C [ ,276 ] 20 [.787 ] 20 [ 787 ] 53 [2.110 ] 50 [2 00] [1 42] 0.1 [.003 ] 25 [.00 ] B C 12 HONEYWELL T IM-PCM45 F ∅ A R0 T O F ULL 15 X F ULL ROUND B [ 118 ] +/ - [ 118 +/ - 007 T OP PART NUMBER D29080 -001 THIRD ANG L E PRO J ECTIO N UNL ESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOL ERANCES IN ACCORDANCE WITH ASME Y M 1994 DIMENSIONS ARE IN MIL L IMETERS QTY ITEM NO 31 [ 232 ] PARTS LIST FINISH SEE NOT ES SEE NOT ES 09 /06 /05 DATE 09 /06 /05 09 /06 /05 DATE 08 /12 /05 DATE 08 /08 /05 DATE MATERIAL APPROVED BY CHECKED BY DRAW BY N DESIGNED BY HT SNK,EXT D BGA, 15,AL ,F DO NOT SCAL E DRAWING D29080 A SCAL :1 E: A1 SHEET OF 1 SIZE DRAW ING NUMBER BROADWATER MCH BTX HEAT SINK 2 0 M ISSION COL L EGE BL VD P.O BOX 1 CORP SANTA CL ARA , CA 5 1 -8 R REV TITL E T MI DEPARTMENT DESCRIPTION 11 REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMET ER OF PART SHARPNESS OF EDGES SUBJECT T O HANDLING ARE REQUIRED T O MEET UL1439 T EST 12 APPLY HONEYWELL T IM PCM45 F ( ST D SIZ E 20MM x 20 MM ) AT HEAT SINK BASE WIT H AN ASSEMBLY POSIT IONAL T OLERANCE OF ± 1.0MM T OLERANCE EDGES SHOWN AS SHARP R MAX T OOLING REQUIRED T O MAKE T HIS PART SHALL BE T HE PROPERT Y OF INT EL AND SHALL BE PERMANENT LY MARKED , WIT H INT EL'S NAME AND APPROPRIAT E PART NUMBER ALL SECONDARY UNIT DIMENSIONS ARE F OR REF ERENCE ONLY 10 ALL DIMENSIONS SHOWN SHALL BE MEASURED F OR F AI T HIS DRAWING T O BE USED IN CONJUNCT ION WIT H SUPPLIED3D DAT ABASE F ILE ALL DIMENSIONS AND T OLERANCES ON T HIS DRAWING T AKE PRECEDENCE OVER SUPPLIED F ILE AND ARE APPLICABLE AT PART F REE UNCONST RAINED ST AT E UNLESS , INDICAT ED OT HERWISE T OLERANCES ON DIMENSIONED AND UNDIMENSIONED F EAT URES UNLESS OT HERWISE SPECIF IED : DIMENSIONS ARE IN MILLIMET ERS T OLERANCES: LINEAR ± 25 ANGULAR ± ° MAT ERIAL: 6063 -T ALUMINUM F INISH NONE : MARK PART WIT H INT EL P N AND REVISION APPROX / WHERE SHOWN PER INT EL MARKING ST ANDARD164997 CRIT ICAL T O F UNCT ION DIMENSION NOT ES: Figure B-2 15 x [0.039 ] 14 Equal Spaces 44 [ 1.732 ] Mechanical Drawings for Package & Reference Thermal Solution Heatsink Extrusion Drawing 33 A Figure B-3 34 THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS INDICATED OTHERWISE TOLERANCES ON DIMENSIONED AND UNDIMENSIONED FEATURES UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MILLIMETERS TOLERANCES: LINEAR ± 0.25 ANGLES: ± 3° MATERIAL: TYPE: ASTM A228 MUSIC WIRE Ø1.8 ± 0.1MM PLATING: ELECTRO-LESS NICKEL OR EQUIVALENT UPON INTEL APPROVAL CRITICAL TO FUNCTION DIMENSION MARK WITH INTEL P/N AND REVISION PER INTEL MARKING STANDARD 164997; PER SEC 3.8 (POLYETHYLENE BAG) REMOVE ALL SHARP EDGES AND BURRS ALL DIMENSIONS SHOWN SHALL BE MEASURED FOR FAI ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY NOTES: Mechanical Drawings for Package & Reference Thermal Solution Z-Clip Wire § Thermal and Mechanical Design Guide Mechanical Drawings for Alternate Thermal Solution C Mechanical Drawings for Alternate Thermal Solution Table C-1 lists the mechanical drawings included in this appendix Table C-1 Mechanical Drawing List Drawing Description “Heatsink Extrusion Drawing” Figure Number Figure C-1 “Heat Sink Extrusion Detail” Figure C-2 “Anchor” Figure C-3 “Ramp Retainer - Page 1” Figure C-4 “Ramp Retainer - Page 2” Figure C-5 “Wire Preload Clip” Figure C-6 Thermal and Mechanical Design Guide 35 36 A B C D E F G H ALL FINS IN OUTER COLUMN MUST BE INLINE OR CONVEX TO MIDDLE FINS 4X EQUAL SPACING 2X 80 [ 3.150 ] 36 [ 1.417 ] 2X 48 0.15 [ 1.890 005 ] 47 [ 1.850 ] 2X 58.6 [ 2.307 ] 0.15 00 ] 0.15 005 ] 2X 2.7 0.15 [ 106 005 ] 3X 7.46 [ 29 2X 59.28 [ 2.334 [ 157 ] 6X EQUAL SPACING A 8X 1.2 0.15 [ 047 005 ] SEE DETAIL 8X FULL ROUND ALL FINS IN OUTER COLUMN MUST BE INLINE OR CONVEX TO MIDDLE FINS 4 35.5 [ 1.398 ] TOP ITEM NO PART NUMBER THIRD ANGLE PROJECTION A INITIAL RELEASE REV DWG NO REVISION HISTORY DESCRIPTION DATE 08/07/06 DATE KG TAN CHECKED BY DATE 08/17/06 FINISH SEE NOTES APPROVED BY FRED ANDERS MATERIAL SEE NOTES C BERMENSOLO 08/17/06 - 08/07/06 KG TAN DRAWN BY PARTS LIST DATE HSNK,EXTD,FBGA,8,AL SCALE: CORP R SHT RE - APPRO 2200 MISSION COLLEGE BLVD P.O BOX 58119 SANTA CLARA, CA 95052-8119 09/08/06 DATE D77030 D77030 DO NOT SCALE DRAWING DRAWING NUMBER SHEET OF HS, PWSHS, GUARDFISH BW, ATX PST A1 SIZE TITLE DEPARTMENT DESCRIPTION THIS DRAWING TO BE USED IN CONJUNCTION WITH THE SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY TOLERANCES SHALL BE CALCULATED FROM PRIMARY UNITS TO AVOID TRUNCATION ERRORS CRITICAL TO FUNCTION DIMENSION ANY TOOLING DESIGN SHALL BE SUBMITTED TO AND APPROVED BY INTEL ENGINEERING PRIOR TO CONSTRUCTION OF THE TOOLS MARK ASSEMBLY WITH PART NUMBER AND VENDOR IDENTIFICATION PER INTEL MARKING STANDARD 164997 APPROXIMATELY WHERE SHOWN REMOVE ALL BURRS OR SHARP EDGES AROUND PERIMETER OF PART BREAK ALL SHARP CORNERS, EDGES, AND BURRS TO 0.10MM MAX SHARPNESS OF EDGES SUBJECT TO HANDLING ARE REQUIRED TO MEET UL1439 TEST MATERIAL: 6063-T5 ALUMINUM UNLESS OTHERWISE NOTED, TOLERANCES ON DIMENSIONED AND UNDIMENSIONED FEATURES ARE AS FOLLOWS: DIMENSIONS ARE IN MILLIMETERS TOLERANCES: LINEAR 0.25 ANGULAR FINISH: CHEMICAL ETCH APPLY HONEYWELL TIM PCM45F (STD SIZE 20mm x 20mm) AT CENTER OF HEAT SINK BASE ZONE DESIGNED BY 10 NOTES: 30.5 [ 1.201 ] D77030-001 B UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS QTY SEE DETAIL 3.75 0.15 [ 148 005 ] 0.15 [ 118 005 ] Figure C-1 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION Mechanical Drawings for Alternate Thermal Solution Heatsink Extrusion Drawing Thermal and Mechanical Design Guide Thermal and Mechanical Design Guide A B C D E F G H 66 [ 2.598 ] 10 20 [ 787 ] BOTTOM VIEW 20 [ 787 ] 4X ALL AROUND 45 23 [ 906 ] 0.1 [.00] 13.5 [ 532 ] X [.039] TYP R [ 039 ] TYP DETAIL SCALE A 6.72 [ 265 3 PST DEPARTMENT NO BURR ALL AROUND 0.15 005 ] 4X R 0.5 [ 020 ] 1.5 0.15 [ 059 005 ] TYP 135 CORP R DETAIL SCALE 0.15 005 ] 2200 MISSION COLLEGE BLVD P.O BOX 58119 SANTA CLARA, CA 95052-8119 TYP 2.75 [ 108 TYP [ 157 ] SIZE A1 SCALE: B DRAWING NUMBER DWG NO DO NOT SCALE DRAWING D77030 2X 0.6 [ 024 ] SHT SHEET D77030 RE OF 2 Figure C-2 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION Mechanical Drawings for Alternate Thermal Solution Heat Sink Extrusion Detail 37 38 4X 7.83 0.12 [ 308 004 ] 5.21 12 [ 205 004 ] 5.08 12 [ 200 004 ] [ ] 12 004 ] -0.07 + 000 -.002 025 64 2X 10.13 [ 399 15 [ 098 005 ] 2X 0.5 0.05 [ 020 001 ] 2X 77 0.1 [ 030 003 ] [ ] 45 X M I N 2X 3.94 15 [ 155 005 ] 2X 45 -0.07 + 000 - 002 025 64 T HIS DRAW ING T O BE USED I N CO NJ UNCT I ON W IT H SUPPLI ED 3D DAT ABASE F ILE ALL DIM ENSIO NS AND T O LERANCES O N T HI S DRAW I NG T AKE PRECEDENCE O VER SUPPLIED F I LE AND ARE APPLI CABLE AT PART F REE, UNCO NST RAI NED ST AT E UNLESS I NDI CAT ED OT HERW I SE T OLERANCES O N DI MENSIO NED AND UNDI MENSIO NED F EAT URES UNLESS O THERW ISE SPECIF I ED: DI MENSIO NS ARE I N M ILLIM ETERS F O R F EAT URE SIZ ES < 10M M: LI NEAR 07 F O R F EAT URE SIZ ES > 10M M: LI NEAR 08 ANG LES: 0.5 M AT ERI ALS: I NSULAT O R: POLYCARBONAT E THERM OPLAST I C, UL 94V-0, BLACK (739) (REF G E LEXAN 3412R-739) CO NTACT : BRASS O R EQUI VALENT UPON INT EL APPRO VAL CO NTACT FI NISH: 000050u" MI N NI CKEL UNDER PLAT ING ; SO LDER T AILS, 000100" MI N T I N ONLY SOLDER (LEAD F REE) M ARK W IT H INT EL P/ N AND REVI SI ON PER INT EL MARKING ST ANDARD 164997; PER SEC (POLYET HYLENE BAG ) CRI T ICAL TO FUNCT IO N DI MENSI ON ALL DIM ENSI ONS SHO W N SHALL BE M EASURED F OR F AI NOT E REM O VED DEGAT E: F LUSH T O 35 BELOW ST RUCT URAL T HI CKNESS (G AT E W ELL O R G ATE RECESS ACCEPT ABLE) 10 F LASH: 0.15 M AX 11 SINK: 25 MAX 12 EJECT OR MARKS: F LUSH T O -0.25 13 PART ING LI NE M ISM AT CH NOT TO EXCEED 25 14 EJECT IO N PI N BO SSES, G ATI NG, AND T O O LING I NSERT S REQ UIRE INT EL'S APPROVAL PRI O R T O T OO L CONST RUCTI O N ALL EJECT I ON PI N BO SSES AND G AT E F EAT URES SHO W N ARE F OR REF ERENCE O NLY 15 EDG ES SHOW N AS SHARP R 0.1 MAX 16 T O OLI NG REQUI RED T O MAKE THI S PART SHALL BE T HE PRO PERT Y O F INT EL, AND SHALL BE PERMANENT LY M ARKED W IT H INT EL'S NAM E AND APPROPRIAT E PART NUM BER 17 ALL SECO NDARY UNIT DIM ENSI ONS ARE F OR REF ERENCE O NLY NOT ES: 2X CHAM F ER ALL ARO UND CO NT ACT T O I NSULATO R I NT ERF ACE AT SUPPLIERS OPT IO N Figure C-3 2X 75 [ 030 ] 2X [ 157 ] 7.62 15 [ 300 005 ] Mechanical Drawings for Alternate Thermal Solution Anchor Thermal and Mechanical Design Guide 2X 31 [ 225 ] Thermal and Mechanical Design Guide S E E DE T A IL 05 [ 079 001 ] A C 61.51 [ 422 ] 70 49 [ 775 ] T H I S D R A W I N G T O B E U S E D I N C O N J U N C T I O N W I T H S U P P LI E D 3D D A T A B A S E F I LE A LL D I M E N S I O N S A N D T O LE R A N C E S O N T H I S D R A W I NG T A K E P R E C E D E NC E O V E R S U P P LI E D F I LE A N D A R E A P P LI C A B LE A T P A R T F R E E , U N C O N S T R A I N E D S T A T E U N LE S S INDICA T E D O T HE RW IS E T O LE R A N C E S O N D I M E N S I O N E D A N D U N D I M E N S I O N E D F E A T U RE S U N LE S S O T H E R W I S E S P E C I F I E D : D I M E N S I O N S A R E I N M I LLI M E T E R S F O R F E A T U R E S I Z E S < 10M M : LI N E A R 07 F O R F E A T U R E S I Z E S B E T W E E N 10 A N D 25 M M : LI N E A R 08 F O R F E A T U R E S I Z E S B E T W E E N 25 A N D 50 M M : LI N E A R 10 F O R F E A T U R E S I Z E S > 50M M : LI N E A R 18 A N G LE S : M A T E RI A L: A ) T Y P E : E N V I R O N M E N T A LLY C O M P LI A N T T H E R M O P LA S T I C O R E Q U I V A LE N T U P O N I N T E L A P P R O V A L (R E F G E LE X A N 500E C R -739) B ) C R IT I C A L M E C H A N I C A L M A T E R I A L P R O P E R T I E S F O R E Q U I V A LE N T M A T E R I A L S E LE C T I O N : T E NS I LE Y I E LD S T R E N G T H (A S T M D 638) > 57 M P a T E NS I LE E LO N G A T I O N A T B R E A K (A S T M D 638) > = 46% F LE X U R A L M O D U LU S (A S T M D 638) 3116 M P a 10% S O F T E N I N G T E M P (V I C A T , R A T E B ): 154 C C ) C O LO R : A P P R O X I M A T I NG B LA C K , (R E F G E 739) D ) R E G R I N D : 25% P E R M I S S I B LE E ) V O LU M E - 73e+ 03 C U B I C -M M (R E F ) W E IG H T - 16 G R A M S (R E F ) M A RK P A RT W IT H INT E L P /N, RE V IS IO N, CA V IT Y NUM B E R A ND DAT E CO DE A P P RO X W HE RE S HO W N P E R INT E L M A RK ING S T A N D A R D 164997 C R I T I CA L T O F U N C T I O N DI M E N S I O N A LL D I M E N S I O N S S H O W N S H A LL B E M E A S U R E D F O R F A I N O T E RE M O V E D D E G A T E : F LU S H T O 35 B E LO W S T R U C T U R A L T H I C K N E S S (G A T E W E LL O R G A T E R E C E S S A C C E P T A B LE ) 10 F LA S H : 15 M A X 11 S I N K : 25 M A X 12 E J E C T O R M A R K S : F LU S H T O -0 25 13 P A R T IN G LI N E M I S M A T C H N O T T O E X C E E D 25 14 E J E C T I O N P I N B O S S E S , G A T I N G , A N D T O O LI NG I N S E R T S R E Q U I R E I N T E L'S A P P R O V A L P R I O R T O T O O L C O N S T R UC T I O N A LL E J E C T I O N P I N B O S S E S A N D G A T E F E A T U RE S S H O W N A R E F O R R E F E R E N C E O N LY 15 E D G E S S H O W N A S S H A R P R M A X 16 T O O LI N G R E Q U I R E D T O M A K E T H I S P A R T S H A LL B E T H E P R O P E R T Y O F I N T E L, A N D S H A LL B E P E R M A N E N T LY M A R K E D W I T H IN T E L'S N A M E A N D A P P R O P R I A T E P A R T N U M B E R 17 A LL S E C O N D A R Y U N I T D I M E N S I O N S A R E F O R R E F E R E N C E O N LY NO T E S : Figure C-4 2X 27 95 [ 100 ] [ 118 ] S E E DE T A IL Mechanical Drawings for Alternate Thermal Solution Ramp Retainer - Page 39 40 [ 118 ] 6.55 [ 258 ] B 2.75 [ 108 ] 15 [ 124 ] 6 0.5 [ 020 ] 2X DET AI L SCALE 20 1.75 [ 069 ] A 19 [ 047 ] SECT I ON B-B [ 157 ] 2X 5.76 [ 227 ] 6.4 [ 252 ] 2X [ 114 ] DET AIL C SCALE 10 Figure C-5 [ 205 ] 75 [ 187 ] B 5.56 [ 219 ] Mechanical Drawings for Alternate Thermal Solution Ramp Retainer - Page Thermal and Mechanical Design Guide 46.6 ±0.5 [1.835 ±.019] Thermal and Mechanical Design Guide 36.7 [1.445] 19.3 ± 0.5 [0.760± 019] A 128.6° ± 3° 2X 90° 64.3° 4X 1.8 R [.071] [.110] 2.8 ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY REMOVE ALL SHARP EDGES AND BURRS CRITICAL TO FUNCTION DIMENSION INTEL APPROVAL MATERIAL: TYPE: ASTM A228 MUSIC NICKEL OR EQUIVALENT UPON PLATING: ELECTRO-LESSWIRE Ø1.8 ± 0.1MM INDICATED OTHERWISE TOLERANCES ON DIMENSIONED AND UNDIMENSIONED FEATURES UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MILLIMETERS TOLERANCES: LINEAR ± 0.25 ANGLES: ± 3° APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE NOTES: Figure C-6 A 27.3±0.5 [1.075 ± 019] Mechanical Drawings for Alternate Thermal Solution Wire Preload Clip § 41 Mechanical Drawings for Alternate Thermal Solution 42 Thermal and Mechanical Design Guide ... B-3 Thermal and Mechanical Design Guide 31 Mechanical Drawings for Package & Reference Thermal Solution Figure B-1 32 IOH Package Drawing Thermal and Mechanical Design Guide Thermal and Mechanical. .. § Thermal and Mechanical Design Guide Thermal and Mechanical Design Guide Introduction Introduction The goals of this document are to: • Outline the thermal and mechanical operating limits and. .. Reference Thermal Solution” § Thermal and Mechanical Design Guide 13 Thermal Specifications 14 Thermal and Mechanical Design Guide Thermal Metrology Thermal Metrology The system designer must make temperature