Intel ® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide potx

Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT Intel products are not intended for use in medical, life saving, or life sustaining applications Intel may make changes to specifications and product descriptions at any time, without notice Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The Intel® Xeon® Processor C5500/C3500 Series and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order The code name “Picket Post" presented in this document are only for use by Intel to identify products, technologies, or services in development, that have not been made commercially available to the public, i.e., announced, launched or shipped They are not commercial names for products or services and are not intended to function as trademarks Intel and the Intel logo are trademarks of Intel Corporation in the U.S and other countries * Other brands and names may be claimed as the property of others Copyright â 2010, Intel Corporation Intelđ Xeonđ Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US Contents Introduction 1.1 Reference Documents 1.2 Definition of Terms Package Mechanical Specifications 11 2.1 Package Mechanical Specifications 11 2.1.1 Package Mechanical Drawing 12 2.1.2 Processor Component Keep-Out Zones 15 2.1.3 Package Loading Specifications 15 2.1.4 Package Handling Guidelines 15 2.1.5 Package Insertion Specifications 15 2.1.6 Processor Mass Specification 16 2.1.7 Processor Materials 16 2.1.8 Processor Markings 16 2.1.9 Processor Land Coordinates 17 LGA1366 Socket 18 3.1 Board Layout 20 3.2 Attachment to Motherboard 21 3.3 Socket Components 21 3.3.1 Socket Body Housing 21 3.3.2 Solder Balls 21 3.3.3 Contacts 22 3.3.4 Pick and Place Cover 22 3.4 Package Installation / Removal 23 3.4.1 Socket Standoffs and Package Seating Plane 23 3.5 Durability 24 3.6 Markings 24 3.7 Component Insertion Forces 24 3.8 Socket Size 24 3.9 LGA1366 Socket NCTF Solder Joints 24 Independent Loading Mechanism (ILM) 26 4.1 Design Concept 26 4.1.1 ILM Cover Assembly Design Overview 26 4.1.2 ILM Back Plate Design Overview 27 4.2 Assembly of ILM to a Motherboard 28 LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications 31 5.1 Component Mass 31 5.2 Package/Socket Stackup Height 31 5.3 Socket Maximum Temperature 31 5.4 Loading Specifications 33 5.4.1 Board Deflection Guidance 33 5.5 Electrical Requirements 34 5.6 Environmental Requirements 35 Thermal Specifications 36 6.1 Package Thermal Specifications 36 6.1.1 Thermal Specifications 36 6.1.2 Thermal Metrology 47 6.2 Processor Thermal Features 48 6.2.1 Processor Temperature 48 6.2.2 Adaptive Thermal Monitor 48 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 6.3 6.2.3 THERMTRIP# Signal 51 Platform Environment Control Interface (PECI) 51 6.3.1 Introduction 51 6.3.2 PECI Specifications 53 Thermal Solutions 54 7.1 Performance Targets 54 7.2 Heat Pipe Considerations 56 7.3 Assembly 57 7.3.1 Thermal Interface Material (TIM) 58 7.4 Structural Considerations 58 7.5 Thermal Design 59 7.5.1 Thermal Characterization Parameter 59 7.5.2 NEBS Thermal Profile 60 7.5.3 Power Thermal Utility 61 7.6 Thermal Features .61 7.6.1 Fan Speed Control 61 7.6.2 PECI Averaging and Catastrophic Thermal Management .62 7.6.3 Intel® Turbo Boost Technology 62 7.6.4 Absolute Processor Temperature .63 7.6.5 Custom Heat Sinks For UP ATCA .63 Quality and Reliability Requirements .66 8.1 Use Conditions 66 8.2 Intel Reference Component Validation 67 8.2.1 Board Functional Test Sequence .67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures .68 8.3 Material and Recycling Requirements 68 A Component Suppliers .70 B Mechanical Drawings .72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US Figures 1-1 2-1 2-2 2-3 2-4 2-5 3-1 3-2 3-3 3-4 3-5 3-6 3-7 4-1 4-2 4-3 4-4 5-1 5-2 6-1 6-2 6-3 6-4 6-5 6-6 6-7 6-8 6-9 7-1 7-2 7-3 7-4 7-5 7-6 7-7 7-8 7-9 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 Intel® Xeon® Processor C5500/C3500 Series Socket Stack-up Processor Package Assembly Sketch 11 Processor Package Drawing (Sheet of 2) 13 Processor Package Drawing (Sheet of 2) 14 Processor Top-Side Markings 16 Processor Land Coordinates and Quadrants, Bottom View 17 LGA1366 Socket with Pick and Place Cover Removed 18 LGA1366 Socket Contact Numbering (Top View of Socket) 19 LGA1366 Socket Land Pattern (Top View of Board) 20 Attachment to Motherboard 21 Pick and Place Cover 22 Package Installation / Removal Features 23 LGA1366 NCTF Solder Joints 25 ILM Cover Assembly 27 Back Plate 28 ILM Assembly 29 Pin1 and ILM Lever 30 Socket Temperature Measurement Location 32 Flow Chart of Knowledge-Based Reliability Evaluation Methodology 35 Intel® Xeon® Processor EC5549 and EC5509 Thermal Profile 37 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile 39 Intel® Xeon® Processor LC5528 Thermal Profile 40 Intel® Xeon® Processor LC5518 Thermal Profile 42 Intel® Celeron® Processor P1053 Thermal Profile 43 Intel® Xeon® Processor LC3528 Thermal Profile 44 Intel® Xeon® Processor LC3518 Thermal Profile 46 TTV Case Temperature (TCASE) Measurement Location 47 Frequency and Voltage Ordering 49 1U Heatsink Performance Curves 55 ATCA Heatsink Performance Curves 56 TTV Die Size and Orientation 57 1U Reference Heatsink Assembly 57 Processor Thermal Characterization Parameter Relationships 59 NEBS Thermal Profile 60 UP ATCA Thermal Solution 64 UP ATCA System Layout 64 UP ATCA Heat Sink Drawing 65 Board Keepin / Keepout Zones (Sheet of 4) 73 Board Keepin / Keepout Zones (Sheet of 4) 74 Board Keepin / Keepout Zones (Sheet of 4) 75 Board Keepin / Keepout Zones (Sheet of 4) 76 1U Reference Heatsink Assembly (Sheet of 2) 77 1U Reference Heatsink Assembly (Sheet of 2) 78 1U Reference Heatsink Fin and Base (Sheet of 2) 79 1U Reference Heatsink Fin and Base (Sheet of 2) 80 Heatsink Shoulder Screw (1U, 2U, and Tower) 81 Heatsink Compression Spring (1U, 2U, and Tower) 82 Heatsink Retaining Ring (1U, 2U, and Tower) 83 Heatsink Load Cup (1U, 2U, and Tower) 84 ATCA Reference Heatsink Assembly (Sheet of 2) 85 ATCA Reference Heatsink Assembly (Sheet of 2) 86 ATCA Reference Heatsink Fin and Base (Sheet of 2) 87 ATCA Reference Heatsink Fin and Base (Sheet of 2) 88 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide C-1 C-2 C-3 C-4 Socket Socket Socket Socket Mechanical Mechanical Mechanical Mechanical Drawing Drawing Drawing Drawing - (Sheet (Sheet (Sheet (Sheet of of of of 4) .90 4) .91 4) .92 4) .93 Tables 1-1 1-2 2-1 2-2 2-3 5-1 5-2 5-3 5-4 6-1 6-2 6-3 6-4 6-5 6-6 6-7 6-8 6-9 6-10 6-11 6-12 6-13 6-14 6-15 7-1 7-2 7-3 8-1 8-2 A-1 A-2 B-1 C-1 Reference Documents Terms and Descriptions Processor Loading Specifications .15 Package Handling Guidelines 15 Processor Materials 16 Socket Component Mass 31 1366-land Package and LGA1366 Socket Stackup Height .31 Socket and ILM Mechanical Specifications 33 Electrical Requirements for LGA1366 Socket .34 Intel® Xeon® Processor EC5549 and EC5509 Thermal Specifications .37 Intel® Xeon® Processor EC5549 and EC5509 Thermal Profile 38 Intel® Xeon® Processor EC3539 and EC5539 Thermal Specifications 38 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile .39 Intel® Xeon® Processor LC5528 Thermal Specifications .40 Intel® Xeon® Processor LC5528 Thermal Profile 41 Intel® Xeon® Processor LC5518 Thermal Specifications .41 Intel® Xeon® Processor LC5518 Thermal Profile 42 Intel® Celeron® Processor P1053 Thermal Specifications .43 Intel® Celeron® Processor P1053 Thermal Profile 43 Intel® Xeon® Processor LC3528 Thermal Specifications .44 Intel® Xeon® Processor LC3528 Thermal Profile 45 Intel® Xeon® Processor LC3518 Thermal Specifications .45 Intel® Xeon® Processor LC3518 Thermal Profile 46 GetTemp0() Error Codes 53 Boundary Conditions and Performance Targets 54 Fan Speed Control, TCONTROL and DTS Relationship 61 TCONTROL Guidance .62 Server Use Conditions Environment (System Level) 66 Server Use Conditions Environment (System Level) 67 Heatsinks and Thermal Interface Material 70 LGA1366 Socket and ILM Components .71 Mechanical Drawing List 72 Mechanical Drawing List 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US Revision History Revision Number Description Revision Date 002 Modified Table 5-3, Socket and ILM Mechanical Specifications Modified Section 7.6.1, Fan Speed Control August 2010 001 First release February 2010 ĐĐ August 2010 Order Number: 323107-002US Intelđ Xeonđ Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide Introduction Introduction This document provides guidelines for the design of thermal and mechanical solutions for processors in the Picket Post platform The components described in this document include: • The processor thermal solution (heatsink) and associated retention hardware • The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate Figure 1-1 Intel® Xeon® Processor C5500/C3500 Series Socket Stack-up Heatsink Socket and ILM Back Plate The goals of this document are: • To assist board and system thermal mechanical designers • To assist designers and suppliers of processor heatsinks Other processor specifications are provided in the Intel® Xeon® Processor C5500/ C3500 Series Datasheet August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide Introduction 1.1 Reference Documents Material and concepts in the following documents may be beneficial when reading this document Table 1-1 Reference Documents Document Document# European Blue Angel Recycling Standards Intel® Xeon® Notes Processor C5500/C3500 Series Datasheet, Volume 323103 Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 323317 Intel® 321326 321327 Xeon® Processor 5500 Series Mechanical Model Intel® Xeon® Processor 5500 Series Thermal Model Entry-level Electronics Bay Specification Notes: See http://developer.intel.com/design/intarch/xeon5000/documentation.htm See http://www.intel.com/p/en_US/products/server/processor/xeon5000/tools Available at http://www.blauer-engel.de Available at http://ssiforum.oaktree.com/ 1.2 Definition of Terms Table 1-2 Terms and Descriptions (Sheet of 2) Term Description Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature FSC Fan Speed Control IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package Component thermal solutions interface with the processor at the IHS surface ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land package onto the socket contacts IMON The current monitor input to the CPU The VRM tells the CPU how much current it is drawing LGA1366 socket The processor mates with the system board through this surface mount, 1366-land socket PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices ΨCA Case-to-ambient thermal characterization parameter (psi) A measure of thermal solution performance using total package power Defined as (TCASE – TLA) / Total Package Power Heat source should always be specified for Ψ measurements ΨCS Case-to-sink thermal characterization parameter A measure of thermal interface material performance using total package power Defined as (TCASE – TS) / Total Package Power ΨSA Sink-to-ambient thermal characterization parameter A measure of heatsink thermal performance using total package power Defined as (TS – TLA) / Total Package Power TCASE The case temperature of the processor, measured at the geometric center of the topside of the IHS TCASE_MAX The maximum case temperature as specified in a component specification Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US Introduction Table 1-2 Terms and Descriptions (Sheet of 2) Term Description TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits TCONTROL Tcontrol is a static value below TCC activation used as a trigger point for fan speed control TDP Thermal Design Power: Thermal solution must be designed to dissipate this target power level TDP is not the maximum power that the processor can dissipate Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature Thermal Profile Line that defines case temperature specification of a processor at a given power level TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink TLA The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink TSA The system ambient air temperature external to a system chassis This temperature is usually measured at the chassis air inlets U A unit of measure used to define server rack spacing height 1U is equal to 1.75 in, 2U equals 3.50 in, etc Đ August 2010 Order Number: 323107-002US Intelđ Xeonđ Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 10 Mechanical Drawings Figure B-7 1U Reference Heatsink Fin and Base (Sheet of 2) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 79 August 2010 Order Number: 323107-002US Mechanical Drawings Figure B-8 1U Reference Heatsink Fin and Base (Sheet of 2) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 80 Mechanical Drawings Figure B-9 Heatsink Shoulder Screw (1U, 2U, and Tower) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 81 August 2010 Order Number: 323107-002US Mechanical Drawings Figure B-10 Heatsink Compression Spring (1U, 2U, and Tower) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 82 Mechanical Drawings Figure B-11 Heatsink Retaining Ring (1U, 2U, and Tower) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 83 August 2010 Order Number: 323107-002US Mechanical Drawings Figure B-12 Heatsink Load Cup (1U, 2U, and Tower) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 84 Mechanical Drawings Figure B-13 ATCA Reference Heatsink Assembly (Sheet of 2) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 85 August 2010 Order Number: 323107-002US Mechanical Drawings Figure B-14 ATCA Reference Heatsink Assembly (Sheet of 2) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 86 Mechanical Drawings Figure B-15 ATCA Reference Heatsink Fin and Base (Sheet of 2) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 87 August 2010 Order Number: 323107-002US Mechanical Drawings Figure B-16 ATCA Reference Heatsink Fin and Base (Sheet of 2) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 88 Socket Mechanical Drawings C Socket Mechanical Drawings Table C-1 lists the mechanical drawings included in this appendix Table C-1 Mechanical Drawing List Drawing Description Figure Number “Socket Mechanical Drawing - (Sheet of 4)” Figure C-1 “Socket Mechanical Drawing - (Sheet of 4)” Figure C-2 “Socket Mechanical Drawing - (Sheet of 4)” Figure C-3 “Socket Mechanical Drawing - (Sheet of 4)” Figure C-4 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 89 Socket Mechanical Drawings Figure C-1 Socket Mechanical Drawing - (Sheet of 4) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 90 August 2010 Order Number: 323107-002US Socket Mechanical Drawings Figure C-2 Socket Mechanical Drawing - (Sheet of 4) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 91 Socket Mechanical Drawings Figure C-3 Socket Mechanical Drawing - (Sheet of 4) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 92 August 2010 Order Number: 323107-002US Socket Mechanical Drawings Figure C-4 Socket Mechanical Drawing - (Sheet of 4) § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 93 ... Specifications Processor Package Drawing (Sheet of 2) Intel? ? Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 13 Intel? ? Xeon® Processor C5500/C3500 Series and LGA1366 Socket. .. 323107-002US Intel? ? Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 18 LGA1366 Socket Figure 3-2 LGA1366 Socket Contact Numbering (Top View of Socket) Intel? ? Xeon® Processor. .. Standards Intel? ? Xeon® Notes Processor C5500/C3500 Series Datasheet, Volume 323103 Intel? ? Xeon® Processor C5500/C3500 Series Datasheet, Volume 323317 Intel? ? 321326 321327 Xeon® Processor 5500 Series