Operating Instructions Thank you for purchasing a Panasonic brand equipment ● Be sure to read the Operating Instructions for proper and safe usage ● Before placing the machine in service, be sure to read the Safety precautions ● Please keep these operating instructions for future reference 201812 Confirmation Preparation Production Screen Printer Data editing NM-EJP6A System administration SPG Model No Options Screen Printer At a glance Operating Instructions Operating Procedure N7201A552E16 S-2 Original Instructions Use of this equipment … About this equipment ●This equipment is designed and manufactured to be used for screen printing of solder paste on PCBs or similar boards It should not be used for any other purpose ●This equipment requires board handling equipment, i.e conveyors, at the entrance and exit side of the machine For proper operation ●You must receive technical training before you start operating the machine ●For information regarding available training courses, please contact Panasonic Smart Factory Solutions Co., Ltd., Sales company or Sales agent For machine training in Europe, you may contact Panasonic Industry Europe: Panasonic Industry Europe GmbH FA Division Robert-Koch-Strasse 100, 85521 Ottobrunn Germany Phone number:0049-(0)89-453541192 Contents of CE Declaration of Conformity (Manufacturer) Panasonic Smart Factory Solutions Co., Ltd 2-7, Matsuba-cho, Kadoma, Osaka 5718502 Japan (Product) Screen Printer (Trade Name) Panasonic (Model ID) SPG (Model No.) NM-EJP6A (Statement) The object of the declaration described above is in conformity with the requirements of the following EU legislations and harmonized standards: SPG S-3 (Council directive) Machinery Directive: 2006/42/EC EMC Directive: 2014/30/EU (Harmonized standards) EN 60204-1:2006 +A1:2009, EN ISO 12100:2010, EN 61000-6-4:2007+A1:2011, EN 61000-6-2:2005 (Authorized Representative and Authorized Person to Compile the Technical File in EU) Panasonic Testing Centre Panasonic Marketing Europe GmbH Winsbergring 15, 22525 Hamburg, F.R Germany EJP6AE-CE-00OM-03 System evolution according to High production / stable quality Screen printer ■Hybrid squeegee Standard equipped with hybrid squeegee head having a proven track record of being used successfully with our sophisticated equipment The head helps ensure stable rolling actions of solder paste and a reduction in printing time ■High speed mask cleaning Employment of new cleaning system contributes to reducing paper consumption frequency to 6mm / time In addition, parallel processing of transfer and cleaning operations helps minimize lost production time ■3 conveyors-equipped Standard equipment of three conveyors helps reduction of PCB change time Diverse options ■Pot type automated solder supply unit Controls the amount of solder paste on stencil (mask) with the help of the line length measuring sensor That have permitted long hours of continuous printing with stable quality ■Universal stencil holder One-touch change of the mask size without using a tool offers greater changeover efficiency ■One-touch support pin set Support unit for batch change Allows you to set magnet pins in given positions while checking a PCB ■Stencil vacuum support stencil-release ■PCB support function Being integral with the conveyor rail, the support plate supports the entire back side of PCB from end to end, helping achieve stable printing quality Performing print and stencil-release with vacuuming a stencil reduce stencil shift and stick, and enable to provide stable printing SPG S-4 EJP6AE-CE-00OM-03 JISSO Organization of Manuals Preparation and how to use Operating Procedure Chip mounter Describes overall operating procedure from production preparation including material setting to data creation and modification Required checks and cleaning Maintenance Describes contents of regularly required checks, adjustments and cleaning including procedures to exchange consumable parts Getting help Troubleshooting Troubleshooting Describes errors or problems that may occur on the equipment and associated countermeasures Please note that contents of this manual are subject to change without notice Options of this equipment are outlined in a different manual Related Documentation Parts List (Mechanical/ Electrical) Wiring Diagram SPG S-5 EJP6AE-CE-00OM-03 How to read operating instructions Easy-to-find titles ／Tag headlines／Page number Title Sub-Section Chapter Maintenance 4-1-4 Section Replacement Sub-Section title Replacing battery Section title ●Sequence number when same title is utilized Side Index Page number - -4 - Replacement When multiple pages have the same title Chapter, Section, Sub-Section, Sub-Section Page number ■About reference （→P - -1 ） Reference number Major classification title Symbol to show reference SPG S-6 EJP6AE-BP-00CM-00 Visual procedure／operation by reading Operating procedure Operation button Contents of operation Start production SERVO START ON Shows to turn in the direction of the arrow Operation switch Shows to push another switch or button while holding down the ACTIVATION switch (Position of switches may vary.) Shows the next button operation (Hierarchy procedure) after the operation mode is selected Shows to push the operation button Operation procedure screen 1 Select the reset item + (Completes continuous preparation.) SPG S-7 Shows the operation results Shows to push another switch or button while holding down the ACTIVATION switch EJP6AE-BP-00CM-00 Table of contents Confirmation -1 -2 -3 -4 -5 Safety precautions Precautions Warning labels Safety management Safety switches/ Key management /Maintenance placard -6 Handling the SD card and the Product nameplate Disposing of the gas spring -7 Handling the used battery -8 Disposal of consumables items About cleaning solvent -9 -10 Component names -10-1 Appearance diagram/ -10-2 -10-3 -10-4 -10-5 -10-6 SPG S-8 Operating units Operation switch Touch screen Support menu Menu structure Main units EJP6AJ-CT-00CM-00 -2-8 -3 -3-1 -3-2 -3-3 -3-4 -3-5 -3-6 -3-7 -3-8 -3-9 -3-10 Production -4 -1 Confirmation Preparation Loading and saving of file To [File editing] screen Loading production data Loading machine parameter Saving production data Saving machine parameter Production -2-1 -2-2 -2-3 -2-4 -2-5 -2-6 -2-7 File operation Clearing production data / Initialization of SD card Sorting production data Continuous preparation Overview of continuous preparation Change of task setting File operations Squeegee exchange PCB support exchange Stencil set Supplying solder paste Solder kneading Counter reset Setting of planned production volume Individual preparation Production -1-1 Test print -1-2 Production start and stop -1-3 How to check screen during -2 production, when stationary and after production Replenishment of material -2-1 Cleaning paper exchange -2-2 Replenishing cleaning solvent SPG S-9 Data editing -2 Start of equipment Setting of password Mode switching LNB connection screen System administration -1-1 -1-2 -1-3 -1-4 Basic operation Options -1 At a glance Preparation EJP6AE-CT-00OM-03 Table of Contents Data editing -1 -1-1 -1-2 -1-3 -1-4 -1-5 -1-6 -1-7 -1-8 -1-9 -1-10 -1-11 -1-12 -2 -2-1 -2-2 -2-3 -2-4 -2-5 -2-6 -2-7 -2-8 -2-9 System administration -1 -1-1 -1-2 -1-3 -1-4 -1-5 -1-6 -1-7 -1-8 -1-9 -2 -2-1 -2-2 -2-3 -2-4 SPG S-10 Production data editing PCB data edit PCB recognition data edit Pattern recognition-related data edit PCB positioning data edit Stencil data edit Stencil recognition data edit Batch teaching data edit Print position data edit Print process parameter edit Print counter edit Function switch edit Data check Production data teaching Before starting teaching operations Recognition target condition data Batch teaching PCB recognition teach Stencil recognition teach Print positioning teach Printing pressure teach Height detection(Option) Pattern recognition teach Machine adjustment How to enter [machine adjustment menu] screen/Origin return Conveyor width adjustment Transfer motion/PCB recognition Confirmation of print motion Confirmation of stencil cleaning motion Confirmation of stencil recognition/solder supply motion Confirmation of input/output Confirmation of axis information Maintenance of the recognition device Machine setting Setting of adjustment switch/time setting Gathering of recognition results/setting of back light Operator level customization Printing accuracy EJP6AE-CT-00OM-03 Operating procedure 6-1-8 Options Setting of PCB hold down motion/PCB transfer test PCB transfer test (adjustment of PCB clamp force) Carry out PCB transfer test after conveyor width have been adjusted and support pins have been installed ●In[data modification]screen(P.4-1-1-1), selection of PCB transfer speed for each PCB is possible Turn servo on + + (PCB is transferred from pre-process to transfer conveyor.) ●When stopping transfer motion SPG 6-1-8-3 Turn servo off Open the safety cover EJP6AE-MB-06OM-05 Regulator knob Confirm PCB clamp state and adjust clamp force to fit the PCB shape and material ● Pull out regulator knob, turn to adjust and push in ●Clamp force: Force to hold the PCB ●When PCB warp is detected due to excessive clamp force, decrease air pressure ●When adjusting air pressure, decrease below the desirable pressure setting, then adjust the pressure setting accordingly ●Air pressure setting range: 0.20 to 0.40 MPa (If air pressure is set at 0.20 MPa or less, clamping may not work reliably.) ●Correlation between air pressure and clamp force 10 PCB clamp force (N) 0.20 23.6 0.30 35.4 0.40 47.2 Options Air pressure (MPa) Close the safety cover Turn servo on + (The PCB transfers to the right conveyor) 11 10 + (PCB is transferred from transfer conveyor to post-process.) 11 (Returns to [Machine adjustment menu] screen.) SPG 6-1-8-4 EJP6AE-MB-06OM-05 Operating procedure 6-1-9 Pattern recognition Options About pattern recognition Pattern① Pattern② Pattern③ Pattern recognition is intended for individual PCBs being attached to a carrier, in which positional deviation of each individual PCB is recognized, and then, in response to the deviations of all the individual PCBs, a print position correction is made Workflow summary To enable the pattern recognition function, you need to set Software switch’s “Pattern recognition” to “ON.” In addition, make sure to always conduct PCB recognition teach before starting pattern recognition Entry of PCB recognition data Enter PCB recognition data as is conventionally done (→P.4-1-2) Entry of pattern recognition data Entry of pattern attribute data Set the position and shape of a recognition mark(s) on each individual PCB (→P.4-1-3) PCB recognition teach Conduct teach as is conventionally done (→P.4-2-4) Pattern recognition teach Set the lamp value for pattern recognition (→P.4-2-4) Production SPG 6-1-9-1 EJP6AE-MB-06OM-05 Pattern data preparation To perform pattern recognition, you are required to enter “Pattern recognition data” and “Pattern attribute data.” (→P.4-1-3） As shown in the figure on the right, the position of a mark for pattern recognition is calculated based on pattern recognition point data and pattern origin point data You can check the evolution data screen (→P.4-1-3) for the calculated recognition mark position ﾊﾟﾀｰﾝ① Pattern Pattern Pattern recognition point data (X2, Y2) Pattern origin coordinates (X1, Y1) Origin of PCB data coordinate system Flow of pattern recognition teach In pattern recognition teach, you will set the lamp value for pattern recognition For information on how to operate the pattern recognition teach, refer to “4-2-9 Pattern recognition teach.” Starting teach Options PCB loading Movement to teach mark Lamp value setting Do it at points A, B Recognition Recognition test Completion of teach SPG 6-1-9-2 EJP6AE-MB-06OM-05 Operating procedure 6-1-9 Pattern recognition Options Pattern recognition process during production ■Recognition position correction by a means of pattern recognition In the pattern recognition process during production, the marks on individual PCBs attached to a carrier are recognized, and a print position correction is made so that the printing accuracy of all the individual PCBs will fall within the range of “Ptn pos dev Limit” (→P.4-1-8 Pint position data) When deviation of an individual PCB is so large that a print position correction fails to keep the positional deviations of all the individual PCBs within the limits of “Ptn pos dev Limit,” or when positional deviation of individual PCB ③ is too large to be corrected (preventing a position correction from adjusting all the individual PCBs within the limits of “Ptn pos dev Limit”), a print position correction is made such that the correction amount is calculated from the positional deviations of individual PCBs ① and ② ﾊﾟﾀｰﾝ① Individual PCB ① Individual PCB ② Individual PCB ③ ■Handling of an uncorrectable PCB ①When Software switch’s “NG pattern check” is set to “ON”; In the presence of an individual PCB that is uncorrectable, the machine comes to a single stop prior to printing, and the NG pattern check screen is displayed C D A B A Remove PCB B Retry C PTN D Pattern lag Removes the PCB Continues production as it is, without removing the PCB A print position correction will be made according to the pattern recognition result Displays the pattern numbers Displays the correction amount of each pattern in X and Y directions ②When Software switch’s “NG pattern check” is set to “OFF”; In response to the positional deviation(s) of patterns other than the uncorrectable one, a print position correction is made without single stop before printing Note ●Because a print position correction is made according to the positional deviation(s) of all individual PCBs attached to a carrier in order that all the individual PCBs may be kept within the limits of “Ptn pos dev Limit,” print positional accuracy could be reduced in an area where highly accurate attachment has been provided SPG 6-1-9-3 EJP6AE-MB-06OM-05 Operation At a glance Operating procedure 7-1-1 Specifications Equipment specifications / outline dimensions Equipment specifications Items SPG Specifications Control system Microcomputer system External memory Data is managed using the SD card Requires around 300 KB for one data (up to GB available) Applicable PCB dimensions Min 50 ×50 mm to Max 510 ×460 mm Thickness 0.3 to 8.0 mm Stencil frame 736 ×736mm , Option : 650 ×550 mm,600 ×550 mm, 550 ×650 mm Squeegee type Metallic squeegee Squeegee length 530,480,370,270 mm Squeegee speed mm to 400 mm/s Printing pressure Input range 5×10-2 to 54×10-2 N/mm(For squeegee of 370mm length) ●Actual available printing pressure differs from squeegee type or length ●Stable printing may not be achieved under the printing pressure of 10×10-2 N/mm or less Squeegee motion Single squeegee (one way printing) and double squeegee (round printing) are exchangeable PCB positioning reference Center PCB fixing method Mechanical clamp (standard) or PCB vacuum-holding (option) method Offset of stencil positioning ±5 mm in the X and Y directions, ±1.2˚ in the rotation direction Clearance between stencil and PCB -1.5 to +3.0mm Stencil back side cleaning function Dry type and wet type (Selection and combination are available.) Cleaning paper dimensions Width 540,370 mm, Length 15 m, Paper tube inner diameter 20 mm Dimensions W 580 × D 800 × H 500 mm (Excluding a signal tower and a touch screen) Mass Mass of the main unit: 500 kg (Full option) Electric source Rated voltage : Single-phase, AC 200 V / 220 V / 230 V / 240 V ±10 V Frequency:50 / 60 Hz Rated capacity:1.7 kVA Supply air pressure 0.5 to 0.8 MPa (Working air pressure 0.5 to 0.55 MPa) Supply air amount Motor suction specification: 30 L/min Ejector suction specification: 400 L/min Environment for operation Temperature:10 to 35 ˚C Humidity:25 to 75 %RH (No condensation) Environment for transporting and storing Temperature:-20 to 60 ˚C Humidity:75 %RH or lower (No condensation) Altitude Up to 1,000 m above sea level Noise Below 75 dB (A) Laser class Class 7-1-1-1 EJP6AE-MB-07OM-02 Outline dimensions and Working area 1580 (Conveyor width) Solvent tank SPG Power cable connection 7-1-1-2 EJP6AE-MB-07OM-02 At a glance 2000(When Signal tower standing) 1487(Touch screen) 1574 (Total width) (Minimum set distance(SPD line specification) Stencils are changed alternately Working area Outline dimensions Operating procedure 7-1-2 Specifications Applicable PCB specifications Applicable PCB specifications Items Specifications ●PCB dimensions L size Min.:50 (L)×50 (W) mm Max.:510 (L)×460 (W) mm PCB size (mm) PCB thickness :0.3 ≤ T ≤ 8.0mm PCB mass:3.0 kg or less (including the carrier weight) Within ±1.0 mm Allowable PCB warpage ●For a PCB with thickness of 8.0 mm, the upper limit of warpage is 0.5 mm ●If a cutout is located on PCB, it is possible to change the stopper position to an arbitrarly position in XY direction PCB cutout range PCB Max.8.5mm From belt surface Dead space *PCB edge support (automatic): 4.5mm PCB edge support (fixed): 5mm Open space for transfer ●Mark shape examples PCB recognition correction is based on the positional relationship between the marks and the circuit pattern Certain contrast is required between recognition mark and PCB base ●"3"on the left: Equilateral triangle Line width of"4"on the left: 0.3 mm or more PCB recognition mark ●Mark dimension and background The background of a mark requires the non-interference area outside the mark ●Not all the marks are black SPG 7-1-2-1 EJP6AE-MB-07OM-02 At a glance SPG 7-1-2-2 EJP6AE-MB-07OM-02 Operating procedure 7-1-3 Specifications Stencil specifications Stencil specifications Stencil which can used in standard specifications (Standard specifications: From left to right flow, Front reference) (Unit: mm) Type Screen stencil size Plate-making reference X direction 29-inch frame Standard 29-inch frame DEK size standard 736 × 736 mm Center Center 510 × 460 mm Front *1 650 × 550 mm M size frame *2 Max size of applicable PCB Center (Max.508 × 508 mm) Option Y direction 550 × 650 mm 600 × 550 mm Center Center 350 × 300 mm Front 330 × 250 mm Center 350 × 300 mm Front 330 × 250 mm Center 350 × 300 mm Front 330 × 250 mm ●Since stencil recognition is carried out from the stencil underside, a recognition mark needs to be located on the underside or in the form of through-hole ●If there is no recognition mark on the stencil underside, the stencil aperture is used as a reference for positioning ●For any screen stencil size, the applicable minimum PCB size is 50× 50 mm ●For SPG, only the front reference is available (Rear-reference type is not available) ●If using the screen stencils and plate-making references that are not listed above, please consult us ●To change the screen-stencil frame dimensions, the stencil data and the stencil holder width needs to be changed ●The stencil intended for pasting the stencil in Y direction shall be pasted on the outside of the "PCB size + One side 75 mm" area (If there is convex area within 75 mm, the print quality will be affected because of no PCB adhesion with the stencil.) *1 When a DEK size front reference frame is used, [Automatic stencil positioning (option)] is required *2 When a M size frame is used, [Universal stencil holder (option)] is required SPG 7-1-3-1 EJP6AE-MB-07OM-02 ■[Stencil data edit](→ P.4-1-5) ●Next page ■About a plate position When ‘Custom’ is selected in [Stencil type], you can input the stencil plate position D A C A Distance between the frame end and the plate position B Stencil aperture part C Stencil D Stencil frame At a glance B (PCB pattern area) Notice To change the stencil size, [stencil type] of stencil data (→P.4-1-5) and mounting or removing of spacer needs to be changed SPG 7-1-3-2 EJP6AE-MB-07OM-02 SPG 7-1-3-3 EJP6AE-MB-07OM-02 NOTICE The contents of this document are subject to change without prior notice ◍Company and product names described in this document are trademarks or registered trademarks of their respective companies ◍ Some of our products fall under the export control items (or technologies) established in the Foreign Exchange and Foreign Trade Act When exporting (or providing technologies overseas), please check its legal restrictions and be sure to take necessary procedures such as to obtain the export permission When reselling or moving this equipment, please make sure to contact us, our sales subsidiaries or agents 4-1-62, Minoshima, Hakata-ku, Fukuoka City, Fukuoka, Japan Phone number: +81-92-477-1205 Fax number: +81-92-477-1664 © Panasonic Smart Factory Solutions Co., Ltd 2018 Unauthorized copying and distribution is a violation of the law Printed in Japan ... Machinery Directive: 200 6/42/EC EMC Directive: 201 4/ 30/ EU (Harmonized standards) EN 602 04-1: 200 6 +A1: 200 9, EN ISO 12 100 : 201 0, EN 6 100 0-6-4: 200 7+A1: 201 1, EN 6 100 0-6-2: 200 5 (Authorized Representative... PD0116M1 Front side PD0 101 M1 Rear side PD0 101 M1 SPG 1-3-1 EJP6AE-SF -00 CM -06 Confirmation Caution Warning Front side Front side PW0 104 M1 PC0 107 M1 PCB positioning lifter Front side Front side PC0133M1... -9 - 10 Component names - 10- 1 Appearance diagram/ - 10- 2 - 10- 3 - 10- 4 - 10- 5 - 10- 6 SPG S-8 Operating units Operation switch Touch screen Support menu Menu structure Main units EJP6AJ-CT -00 CM -00 -2-8