Analyzing the kaizen event application in direct material management at intel products vietnam co , ltd

LIST OF ACRONYMS ACRONYMS EXPLANATION IPV Intel Product Vietnam EPX Type of material (Epoxy) FOL Front of line RIL Rapid Integrated Lean PM Preventive Maintenance SC Station Controller SLI Single Lot Number MT Manufacturing Technician IW Intel Warehouse MFG Manufacturing AE Assembly Engineer DMR Direct Material Room DMRA Direct Material Replenishment Automation PDCA Plan-Do-Check-Act DO Direct Observation VA/NVA Value Added/ Non-Value Added ATM Assembly-Test-Manufacturing VNAT Vietnam Assembly & Test OS2 Organizer Specialist Sup Supervisor Page iv LIST OF TABLES Table 2.1: Seven Quality Tools 19 Table 3.1: Ideal state 38 Table 3.2: Waste Identification 38 Table 4.1: Roles and responsibility 48 Table 4.2: Problem statement 51 Table 4.3: Define role and responsibility 59 Table 4.3: Total lots counted on system 60 Table 4.5: The changes in the consume of units before and after using new process 61 Page v LIST OF FIGURES Figure 1.1: Intel logo Figure 1.2: Intel Products Vietnam Figure 1.3: Intel Products Vietnam Organization 11 Figure 1.4: CPU Haswell Core i5 was assembled and tested in Vietnam 11 Figure 1.5: Material Overview 12 Figure 1.6: The Process of Substrate 12 Figure 1.7: Some components of a chip 13 Figure 1.8: Example of the indirect material 14 Figure 2.1: Deming’s wheel PDCA 18 Figure 3.1: The RIL event flow 34 Figure 3.2: High level flow of EPX 36 Figure 3.3: Epoxy fishbone analysis 37 Figure 3.4: Current State Map 39 Figure 3.5: Future State map 42 Figure 3.6: the differences between before & after applying new process 43 Figure 3.7: the diagram of differences between before & after applying new standard 44 Figure 3.8: Freerzer EPXS phase 2-10k before and after RIL 44 Figure 3.9: Ordering Process 44 Figure 3.10: Team member in EPX Saving RIL 46 Figure 4.1: FIFO Kanban 47 Figure 4.2: Ordering material process 48 Figure 4.3: Substrate problem 51 Figure 4.4: A hole in MBB of substrate bundle 52 Figure 4.5: small lot and expired day 53 Figure 4.6: Lot issue 53 Figure 4.7: Fishbone Chart 54 Figure 4.8: New substrate control process 57 Figure 4.9: waste in DMR 58 Figure 4.10: Lot check 60 Figure 4.11: The comparison between the difference before and after using new process 62 Page vi TABLE OF CONTENTS THE INSTRUCTOR’S COMMENTS .i THE REVIEWER’S COMMENTS ii THANKFUL LETTER iii LIST OF ACRONYMS iv LIST OF TABLES v LIST OF FIGURES vi TABLE OF CONTENTS vii INTRODUCTION 1 Reason for subject selection Objectives of the research Subject and scope of research Research Methodology The structure of the research CHAPTER 1: INTRODUCTION OF INTEL PRODUCTS VIETNAM CO., LTD 1.1 General introduction about Intel Corporation 1.2 General introduction about Intel Products Vietnam 1.2.1 Preliminary information 1.2.2 History and development 1.2.3 Vision and Mission 10 1.2.4 Scope of activities 10 1.2.5 Organizational Structure 11 1.2.6 Main product 11 1.3 Direct Material Room Overview 12 CHAPTER 2: THEORETICAL BASIC 15 2.1 Quality Concept 15 2.1.1 Quality Definition 15 2.1.2 Quality Management 16 2.1.3 Quality Improvement 16 2.1.4 Quality Tool 19 2.2 The 5S Kaizen 21 2.3 The Kaizen concept 22 Page vii 2.4 The Kaizen Event 23 2.4.1 The Kaizen Event definition 23 2.4.2 Purpose of the Kaizen Event 24 2.4.3 Four phases of the Kaizen Event 25 2.5 Kanban System 28 2.6 Material Management 28 CHAPTER 3: ANALYSIS OF THE KAIZEN EVENT APPLICATION IN THE DIRECT MATERIAL MANAGEMENT AT INTEL PRODUCTS VIETNAM 29 3.1 The real state of Kaizen application at Intel Products Vietnam 29 3.1.1 Four phases of a Kaizen event at Intel 29 3.1.2 Basic Kaizen Event flow at Intel: 30 3.1.3 Encouraging the employee to Kaizen Event together 32 3.2 Analysis of Kaizen Event application in Direct Material Management at Intel Products Vietnam 33 3.2.1 Apply Kaizen Event model through the RIL event in VNAT 33 3.2.2 VNAT RIL for Phase 10K CNLUSFF syringes material saving 34 3.3 The Limitations in the Kaizen Event implementation process 46 CHAPTER 4: PROPOSING THE APPLICATION OF KAIZEN EVENT IN SUBSTRATE PROCESS CONTROL FOR DIRECT MATERIAL MANAGEMENT AT INTEL PRODUCTS VIETNAM 47 4.1 Substrate Control Process Improvement 47 4.1.1 Material ordering and receiving process in VNAT 47 4.1.2 Problem Statement 50 4.1.3 Find Out Solution 54 4.1.4 Estimated Flow of Implementing Kaizen for substrate control process 57 4.1.5 Estimating the effectiveness of the countermeasures 61 4.2 Some solutions to decrease limitations of the Kaizen Event at VNAT 63 CONCLUSION 63 LIST OF REFERENCES 65 APPENDIX 67 Page viii INTRODUCTION Reason for subject selection Nowadays, thanks to the rapid development of technology, the world increases profound changes in all fields from business, production to management, from trade to agriculture at rapid speed and makes us feel amazed Started in 1970 when electronics were the first introduced, opened the door to a transformation of business processes and production systems, until 1990 when the official Internet appearance, the degree of spreading and creating a strong influence on the industrial revolution 4.0 Technologies such as cloud computing, IoT-Internet of things, AI-Artificial Intelligence, AR/VR- Virtual Reality/Augmented Reality, Big Data, Wi-Fi, Block chain, Nanotechnology, meet the expectations of users by interdisciplinary and bringing people a better life The explosion of technology cannot help to mention the great contribution of the smart chip Realizing the potential of data as well as technology is fertile ground for huge profits, the races in smart chip production are increasingly fierce among the tech tycoons This shows that the technology market is fiercely competitive, in addition to some factors such as people, products, prices, , quality is also an important factor associated with existence, development, and the success of an organization According to Barbara B Flynn (1994), quality management is first viewed as an element of the integrated approach known as World Class Manufacturing; quality management supports and is supported by JIT, human resources management, top management support, technology management and strategic management and include Material Management With the ambition to be more successful, the name and the product of an enterprise must meet the criteria that customers expect, which is called quality If we want to have quality products in the output, we must ensure the quality materials in the input, controlling the quality of the input materials, improvements should be executed to improve the efficiency index of productivity, time, and machinery to eliminate the waste generated from the early stages of production to optimize resources As mentioned above, the famous and powerful businesses such as Intel, Qualcomm, and Nvidia, Amazon, Google are interested in data mining through the invention of supersmart chips to gradually dominate the market share, take the competitive advantage of Page the leader, they try to get ahead in the race to create top-of-the-line artificial intelligence technology, these chips starting to become more important than ever The chips go through many stages, from the preparation of materials to assembly to the packaging of finished products, each stage has its quality assurance and control processes to ensure that after the chip is produced, they can work well and release on time to give the company a competitive advantage It requires Intel Products Vietnam Co., Ltd to control input materials strictly so that the manufacturing process is operating behind smoother In addition, in the process of managing raw materials on the floor, Intel has also applied the Kaizen event and tools to support the Lean implementation, bringing efficiency to the management of materials at the company Recognizing the importance of quality and the outstanding benefits of implementing Kaizen event for the management of raw materials for product manufacturing, as an intern at Intel Products Vietnam Co., Ltd., along with the experience and knowledge learned at Ho Chi Minh City University of Technology and Education, I chose the topic "Analyzing The Kaizen Event Application in Direct Material Management at Intel Products Vietnam Co., Ltd " to deploy the graduation thesis Objectives of the research - Researching in the current status of Material management at Intel Products Vietnam Co., Ltd - Researching and analyzing the Kaizen Event application in the direct material management process - Proposing a solution to improve the application of Kaizen Event in the direct material management process for substrate Subject and scope of research - Research subject: The Kaizen event implementation to improve direct material management process - Scope of research:  About time: Research on Kaizen event direct material management process from March 2020 to October 2020 Page  About space: Researching within the workshop of Intel Products Vietnam Co., Ltd Research Methodology During the internship and thesis research, I mainly use a combination of the following methods: - Collecting secondary data: open data is available to use from companies, written documents, diagrams, information on portals related to material management and Kaizen event implementation Then I started to synthesize information, analyze the data, make an objective evaluation - Collecting primary data: during the internship, I can observe the management process and directly implement some elements of the management process, thereby collecting useful data or backlog that needs to be dealt with In addition, there are some forms of collection such as consulting with buddies, interviewing CW and related departments for more data The structure of the research - Chapter 1: The Introduction of Intel Products Vietnam Co., Ltd - Chapter 2: Theoretical Basic - Chapter 3: Analysis of The Kaizen Event Application in The Direct Material Management at Intel Products Vietnam - Chapter 4: Proposing The Application of Kaizen Event in Substrate Process Control for Direct Material Management at Intel Products Vietnam Page CHAPTER 1: INTRODUCTION OF INTEL PRODUCTS VIETNAM CO., LTD 1.1 General introduction about Intel Corporation Intel Corporation was established on July 18, 1968 by Robert Noyce and Gordon Moore who pioneered the design of semiconductor Intel Corporation is an American multinational corporation and technology company and has the main office in Santa Clara, California, in Silicon Valley Intel is a combination of the words "Integrated" and "Electronic" Figure 1.1: Intel logo Source: Internet Intel has a long history of development, starting in 1971 when the first microprocessor was created, and this event began a technological revolution and historic inventions, still now, Intel has invented technology products, chips, and microprocessors that follow to Moore's law, Wikipedia, "It refers to Moore’s perception that the number of transistors on a microchip doubles every two years, though the cost of computers is halved." Intel focuses on exploiting primary and unprocessed data, and data has great potential for developing breakthrough technologies Data has emerged as a transformational force in an era where an explosion of devices permeate all our interactions, but data only has value when it can be turned into actionable insights In addition, the increase in value of data is inseparably linked to three tech inflections happening today – AI, 5G’s transformation of the network, the growth of the intelligent edge Organizations who can elevate these inflection points and push up actionable insights will lead the ways people can shape the world Page  Products: Intel is well-known for advanced, high-performance processors for every usage, including enterprise-scale servers, IoT devices, laptops, desktops, workstations, and mobile devices  Processor Families: Intel® CoreTM Processors, Intel® Xeon® Processors, Intel Atom® Processors, Intel® Pentium® Processors, Intel® Celeron® Processors, … They use for managing 3D, deliver cloud computing, get insights from data analytics, push up data center effectively Additionally, many kinds of processors are used to operate mobile devices and energy-efficient servers, laptops, …  Cloud: Intel® Xeon® Platinum Processors Family, Intel® Xeon® Gold Processors Family, Intel® Xeon® Silver Processors Family, … Lay the foundation for robust Software Defined Infrastructure (SDI) solutions across the broadest range of platforms—including software-defined compute, storage, or networking  AI, IoT, and Machine Learning: Intel® Xeon® Platinum Processors Family, FPGA Devices, Intel® MovidiusTM Vision Processing Unit (VPU) Use existing data to get new insights, explore customer behavior patterns, and find market opportunities - all based on your existing scaling framework  Gaming: Intel® CoreTM X-series Processor Family, Intel® CoreTM i7 Processors, Intel® CoreTM i5 Processors It's a great choice for intense gaming Play the most demanding games - while streaming or recording  Intel’s purpose: “We create world-changing technology that enriches the lives of every person on earth.” With clear and ambitious goals, Intel is inspired to create more and more practical values for people, innovating technology to meet all the needs of people in modern life, to create into a world of safer, smarter, more wonderful places to live, builds healthy and energetic, exciting, full of enthusiasm communities, and increased productivity Page As the fishbone diagram illustrates, the causes are believed to be the direct effects on phantoms and expired lots are mostly caused by the factor of humans and the methods The first reason is that there are no procedures to control the static lot and substrate lot at stage 589 The second, because of the lack of procedures to it, people performed the wrong way against the specification due to carelessness or not paying attention to the substrate transportation To set goals for this Kaizen, I come up with ideal states:  Ideal state - Zero case for substrate lot mismatch - Zero substrate expired scrapped - Zero substrate lot missing  And target conditions are as follow: - Standardized control process for substrate - Reduce 80% static lot based on weekly BP - Reduce 90% missing case based on cycle count data Identification of countermeasures A trigger about carrying out Kaizen and give the process for substrate management is implemented, people propose the following solutions to solve the problem, there are two methods that are considered to be most workable, and can solve the problem comprehensively, with only small modifications to the management system and creating a specific control routine for the substrate lots at stage 589  Substrate static lot monitoring at stage 589 When lot at operation reaches the 15days limitation, the system will automatically send a notification mail to trigger to the MT / Sup / OS of the areas where the substrate is unpacked and transformed to the tray or stage that substrate is the first ingredient needed After receiving the trigger mail, Laser, CTM MT Sup/OS access the following link to review the lot hit 15 days at operation, then they will decide in consuming this lot or not  If it is yes, the system will not send the trigger mail again Page 56  If it is no, they have to follow the link on trigger mail to update lot status, there are ways for them to do:  Consumption ECD (day to dispose cannot be more than 25 days at operation)  Justification/ Comment The next step of a process is that this lot will be consumed by ECD or not?  If it is Yes, it will end the process  If it is No, Lot is returned to WH if lots hit more than 25 days at operation without a demand in SDA horizon Next, they comment to return to WH due to no demand on portal, and finally, DM MSE terminates the lot and return it to IW Figure 4.8: New substrate control process Source: DMR specification 4.1.4 Estimated Flow of Implementing Kaizen for substrate control process 2.1.4.1 5S implementation initially for pursuit Kaizen In the beginning of applying kaizen philosophy for process improvement, 5S has been seen as the simplest but most powerful tool for Kaizen, 5S is a cornerstone of any successful implementation 5S is a simple tool for administrating your workplace in a clean, efficient and safe in order to enhance your productivity, visual management and to make sure the introduction of standardized working Seri - sort At DMR, here contains the number of bundles of substrate that have issues such as: a hold in MBB, moisture inside bundle exceed limitation, lot lack of quantity, small lot, Page 57 expired lot So, to apply new substrate control process, we must clean up DMR by two ways: - Firstly, ask Sup/OS that those lot can be used or not and if it can, DMR CW will deliver it to tool for running - Secondly, return lot to WH if there are no problem outside the bundle and commit the quality inside - Thirdly, with the lot that overdue or be impacted by external force cause broken and cannot be used, we will submit it in system for scraping Seiton – Set in order In the near future, DMR will move to near the places where substrate is entranced as first step for producing, and then reallocating DMR with more rack and they intend to divide those rack into distinct groups for each of group product name in owning to save time for cycle count or respond promptly the demand of floor immediately if they call for this lot urgently Small board is used to display the product name so that CW can recognize with ease and promptly identify where the lot is Seiso – Shine Regularly clean the DMR room to promote a clean, safe and effective working space The rack must always be cleaned to ensure it does not stick to dirt, find the source of dirt, pay attention to the corners of the room where trash can appear like CW gloves, paper bags, Figure 4.9: waste in DMR Source: DMR specification Seiketsu – Standardize Page 58 At this step, the responsibilities of everyone in this kaizen are clarified, each position has its own task to complete to ensure the new process works smoothly and efficiently, DMR is not overloaded when contains too many damaged or long-awaited lots to run Table 4.3: Define role and responsibility Material Substrate Operation 589 Action Area owner Review static lot hits 10 days at operation Laser/FOL Sup Check loading next 10 days Laser/FOL Sup, product MI Fill in due date to consume lots Laser Sup/FOL sup Review next days loading if it hits the due date for consuming Laser/FOL Sup, Product MI Weekly review lots in 589 if any lots hit 10 days but no action DM MSE Return physical substrate to WH if any request from Laser Sup DM MSE/DM Room Daily clean up DM room, removed waste DMR CW Daily audit and check outside of physical bundle randomly Team lead Remark Source: DMR specification Shitsuke – Sustain To create a sense of maintaining the S above, people must adhere to and carry out their duties, the awareness is most heightened Reviewing the process and 5S activity is necessary for team to come up with new ideas for continuous improvement 4.1.4.2 How to Implement the process: Page 59 On the first step, we filtered data from system about the lots have day at operation more than 10 days, after that we start to clean up for DMR as the first step to pursue the new process path, in fact that those lots are at somewhere at Kanban in floor or stored in DMR, and we have to find its location and bring physical bundles back to DMR for further proceeding Below is the number of substrate lot that I summarized: Table 4.4: Total lots counted on system Source: Author summarize Lot Found Total checked lots on system Return to WH Scrap Phantom Reproduce 80 20 90 15 213 Lot Unfound Total Lot status at 589 100 90 80 70 60 50 40 30 20 10 Lot return Lot Scrap Phantom Lot Lot use Unknown lot Figure 4.10: Lot check Source: DMR specification The chart also makes clear that the total lots need to find is 213 lots (~1030ku), however, we just found about 198 lots (~950ku ) and proceed to ask Sup/OS whether run them or not, we also return to IW if those lots stay healthy and scrap lots that no longer be used Subsequently, we apply new process as I present above chapter Page 60 4.1.5 Estimating the effectiveness of the countermeasures After cleaning up DMR, we applied new process to monitor static lots, we followed the process carefully and captured the situation of substrate lots from ordering to finish operation 589, and below is the result recording: Table 4.5: The changes in the consume of units before and after using new process Source: Author summarize Ww 32 33 Calculated data if not applied new standard Order Scrap Consumption quantity (units (units) (units) ) 130 125 83 80 Actual data when applied new standard Order quantity (units) 125 125 Return IW (lots) 80 79 Consumption (units) Scrap (units) 34 120 118 117 115 35 100 100 109 109 0 36 112 110 116 115 37 96 94 94 90 38 Tota l 128 125 118 117 769 752 17 759 750 Before Apply New Process 300 250 200 125 125 118 150 100 110 94 80 100 50 130 WW32 83 WW33 120 WW34 Scrap 100 112 96 WW35 WW36 WW37 Order quantity Page 61 Consumption 128 WW38 After Apply New Process 300 250 200 125 115 150 117 115 109 90 79 100 50 125 WW32 117 80 WW33 WW34 Scrap 116 109 WW35 WW36 Return IW 94 WW37 118 WW38 Figure 4.11: The comparison between the difference before and after using new process Source: DMR specification The chart illustrates the differences between new standard implementation and when it still not existed The gap between Lot Order and Consumption has been shortened, proving the new process works very efficiently After the lot has been ordered, Sup / OS directly run it, and the system will send out the running request lots when they are at operation 589 too long, that is also a positive factor for Sup / OS to understand the status of the lot and help them decide whether to run the lot or not or returns to DMR or not, because it is convenient for DMR to perform the returning process to the IW In addition, this also helps to avoid damage to lots when staying out for too long and damage in the process of moving many times that shows through the reduction of scrap numbers from 17 to and so can save company fees It is clear that the new control process can control effectively the substrate flow in the floor with the Return to Warehouse step, avoiding the mismatch between physical lot and lot on the system, and MT in the FOL of Laser Mark was forced to run all the normal lots including small or large lot Moreover, DM MSE can trigger the lots stay at operation 589 more than 10 days through mail so that when the Sup or OS2 order substrate they are able to consider the quantity of the order by checking this mail Page 62 4.2 Some solutions to decrease limitations of the Kaizen Event at VNAT Below are some suggestions for dealing with the limitation outlined in Chapter 3: The owner should plan the schedule to audit the Kanban regularly A regular audit will help the owner to keep an eye on the current situation in compliance with the SWI of the MT, in addition to the owner can understand the wishes and inconveniences of the SWI implementation process so that better options Create an automatic letter sent from owner to remind Supervisors of communicating SWI content to MT and CW about disposing of EPX tubes left in the refrigerator in accordance with SWI's instructions, send letters to encourage the staff in the EPX department to be more accountable in their roles Print the process of arranging EPX tubes in the freezer, laminate plastic and stick them on the surface outside of the freezer and should have an illustration of "Remnant Kanban" stuck on the outside surface of the refrigerator This will prompt MT directly when they proceed to take the EPX and arrange inside the refrigerator neatly and in the right place CONCLUSION Intel Products Vietnam CO., LTD is a large company with a long period of development Their commitment to positive global impact is embedded in their purpose to create Page 63 technology that enriches the lives of every person on earth So, to meet the needs of Intel customers in particular and the world in general, and pursuit their commitment, ensure its position in the technology market, in accordance with output, quality is considered as the most priority factor in manufacturing Chipset Especially, quality not only possesses in the finished product but also in the input like material With awesome material management, Intel will effectively control inventory, minimize unnecessary waste, thereby saving costs in inventory, transportation, and storage space In addition, when there are improvements in the process, people can the job smoothly, optimizing the work done Through the report, the author has shown a part of the process of applying Kaizen Event to direct materials management at Intel Products Vietnam; Author also analyzed the procedure of RIL at Intel Moreover, the Author suggests solutions for implementing improvements in the Substrate control process, and through the results, improvements in the process have been achieved certain successes if it is fully applying in the workshop However, there are still limitations the author could not find out because of a short internship and unadaptable experience To sum up, the author needs to have selflearning more and wants to have a chance to work in the Quality field to widen the author's knowledge horizon Page 64 LIST OF REFERENCES AAFP (2020, November) Basics of Quality Improvement Retrieved from aafp.org: https://www.aafp.org/family-physician/practice-and-career/managing-yourpractice/quality-improvementbasics.html#:~:text=Quality%20improvement%20(QI)%20is%20a,analyze%20 data%20and%20test%20change Anh Chi Phan, Ayman BahjatAbdallah, YoshikiMatsui (2011, October) Quality management practices and competitive performance: Empirical evidence from Japanese manufacturing companies Retrieved from ScienceDirect.com: https://www.sciencedirect.com/science/article/abs/pii/S0925527311000429 Barbara B Flynn, Roger G Schroeder, Sadao Sakakibara (2002, April 12) A framework for quality management research and an associated measurement instrument Retrieved from Wiley Online Library: https://onlinelibrary.wiley.com/doi/abs/10.1016/S0272-6963(97)90004-8 Bernard W Taylor, Roberta S Russell (2001) Operations Management Creating Value Along The Supply Chain United States of America: Jonh Wiley & Sons, INC Casey, T (2019) Substrate management process at VNAT Ho Chi Minh: Intel Products Vietnam Eileen M Van Aken, Jennifer A Farris (2010) A framework for designing, managing, and improving Kaizen event programs Retrieved from https://www.emerald.com/insight: https://www.emerald.com/insight/content/doi/10.1108/17410401011075648/ful l/html?fullSc=1&mbSc=1 Imai, M (1986) The Key To Japan's Competitive Success In M Imai, The Key To Japan's Competitive Success (p 132) Japan: McGraw-Hill Education J Michalska, D Szewieczek (2007) The 5S methodology as a tool for improving the organisation Journal of Achievements in Material and Manufacturing Engineering , 24 - 30 Karen Martin, Mike Osterling (2007) The Kaizen Event Planner: Achieving Rapid Improvement in Office, Service and Technical Environments USA: Clearance Center, Inc Manos, A (2007, February ) The Benefits of Kaizen and Kaizen Events Retrieved from proquest.com: https://search.proquest.com/openview/9d2fe051fa4889fcd7cfd18f6cae1d2b/1?p q-origsite=gscholar&cbl=34671 Neuwirth, B C (2017, May 10) The Importance Of 5S Retrieved from manufacturing.net: https://www.manufacturing.net/operations/article/13194867/the-importance-of5s Ortiz, C A (2009) Kaizen and Kaizen Event United States of America: Pearson Education, Inc Pinedo, M L (2004) Planning and Scheduling in Manufacturing and Service New York: Springer Dordrecht Heidelberg London New York Page 65 Staff, G P (2020, December) Kaizen Event Retrieved from graphicproducts.com: https://www.graphicproducts.com/articles/kaizen-event/ Trung, N Q (2020) VNAT RIL for phase 10k CNLUSFF EPXs syringes material saving Hochiminh: Intel Vietnam Vietnam, I (2020, 12 4) Ho Chi Minh City Campus Retrieved from Explore Intel: https://www.exploreintel.com/vietnam?v=7e0f5dd Wiljeana J Glover, Jennifer A Farris, Eileen M Van Aken, Toni L Doolen (2011, April 20) Critical success factors for the sustainability of Kaizen event human resourceoutcomes: An empirical study Retrieved from academia.edu.com: https://www.academia.edu/17669668/Critical_success_factors_for_the_sustaina bility_of_Kaizen_event_human_resource_outcomes_An_empirical_study Page 66 APPENDIX Appendix 1: EPX freezer before applying control process Source: VNAT RIL for phase 10k CNLUSFF EPXs syringes material saving Appendix 2: Pace scope (Role & Responsibilities) for EPXs Improvement Appendix 3: High level flow of Substrate flow Source: DMR specification Page 67 Appendix 4: Gantt Chart Source: Author Page 68 BIÊN BẢN CHẤM KHÓA LUẬN TỐT NGHIỆP DÀNH CHO GVHD Tiêu chí đánh giá Nội dung Trích dẫn tài liệu tham khảo Yếu Trung Bình Khá Giỏi 0-3.0 3.1-4.0 4.1-5.0 5.1-6.0 Nội dung chương khơng có liên kết Những vấn đề cần nghiên cứu, mục tiêu nghiên cứu, nội dung không phù hợp với tên đề tài Các phân tích cịn lan man, chưa chi tiết Tất phân tích nhận định khơng có sở Nhiều ý phân tích thiếu mạch lạc, mâu thuẫn 0-0.4 Có tài liệu tham khảo Khơng có trích dẫn lý thuyết (khái niệm) nêu đề tài Có nhiều bảng biểu chưa đặt tên, đánh số ghi nguồn Nội dung chương thiếu liên kết Những vấn đề cần nghiên cứu, mục tiêu nghiên cứu, nội dung chưa phù hợp hoàn tồn vào tên đề tài Các phân tích cịn lan man, chưa chi tiết Có nhiều phân tích nhận định khơng có sở Nội dung chương có liên kết Những vấn đề cần nghiên cứu, mục tiêu nghiên cứu, nội dung phù hợp với tên đề tài, phân tích sơ sài, chưa chi tiết, chưa tập trung giải toàn vấn đề nghiên cứu Một số phân tích, nhận định thiếu sở Nội dung chương có liên kết Những vấn đề cần nghiên cứu, mục tiêu nghiên cứu, nội dung phù hợp với tên đề tài Phân tích chi tiết, tập trung giải vấn đề nghiên cứu Các phân tích nhận định có sở 0.5-0.6 Tài liệu tham khảo khơng phong phú Khơng có trích dẫn lý thuyết (khái niệm) nêu đề tài Có nhiều bảng biểu chưa đặt tên, đánh số ghi nguồn 0.7-0.8 Tài liệu tham khảo phong phú Có số lý thuyết (khái niệm) chưa trích dẫn Có số bảng biểu chưa đặt tên, đánh số ghi nguồn đầy đủ 0.9-1.0 Tài liệu tham khảo phong phú Có trích dẫn đầy đủ lý thuyết (khái niệm) nêu đề tài Các bảng biểu đặt tên, đánh số đầy đủ, ghi nguồn đầy đủ (trừ bảng biểu tác giả tự phân tích, tính tốn) Điểm 0-0.9 1.0-1.3 1.4-1.7 Triển khai ý thiếu rõ Triển khai ý thiếu Triển khai ý thiếu rõ ràng, mâu thuẫn rõ ràng lộn xộn ràng Có số lỗi lộn xộn Rất nhiều lỗi Nhiều lỗi sử sử dụng từ ngữ Câu văn từ sử dụng từ ngữ dụng từ ngữ (chưa phù (chưa phù hợp với hoàn ngữ (chưa phù hợp với hoàn hợp với hoàn cảnh) cảnh) Câu văn thiếu cảnh) Câu văn thiếu Câu văn thiếu mạch mạch lạc, có số lỗi mạch lạc, nhiều lỗi lạc, nhiều lỗi tả tả tả 0-0.4 0.5-0.6 0.7-0.8 Rất liên lạc với Thỉnh thoản liên lạc Thường xuyên liên lạc Thái độ GV để duyệt với GV để duyệt với GV để duyệt Điểm thưởng dành cho sinh viên viết báo cáo tiếng Anh dao động từ 0,1-1,0 điểm 1.8-2.0 Triển khai ý rõ ràng, liền mạch Sử dụng từ ngữ phù hợp với hoàn cảnh Câu văn mạch lạc, khơng có lỗi tả 0.9-1.0 Rất thường xuyên liên lạc với GV để duyệt Tổng điểm: Kết luận:  Cho SV bảo vệ trước hội đồng  Không cho SV bảo vệ trước hội đồng Ngày ….tháng… năm …… Giảng viên chấm KLTN ... Vietnam Co. , Ltd - Researching and analyzing the Kaizen Event application in the direct material management process - Proposing a solution to improve the application of Kaizen Event in the direct material. .. Proposing The Application of Kaizen Event in Substrate Process Control for Direct Material Management at Intel Products Vietnam Page CHAPTER 1: INTRODUCTION OF INTEL PRODUCTS VIETNAM CO. , LTD 1.1... Material Management at Intel Products Vietnam Co. , Ltd " to deploy the graduation thesis Objectives of the research - Researching in the current status of Material management at Intel Products Vietnam