... Simulation of the system Evaluation of different designs Iteration and obtaining an acceptable design Optimization of the system design Automation andcontrol Communicating the final design Figure 2 . 14 ... thermostat control with an on/off mechanism is often used with the designed thermal system to maintain the desired temperature levels 58 Designand Optimization of Thermal Systems 2.2 CONCEPTUAL DESIGN ... the number ofdesign variables Making modifications in existing systems refers to the use of the information available on the designof these systems for developing a conceptual designand not necessarily...
... components, and subsystems The basic nature of thermal systems will be outlined, and examples of different types ofsystems will be presented from many diverse and important areas 1.1 ENGINEERING DESIGN ... Experimental data Analysis and evaluation Acceptable? Yes Acceptable design obtained FIGURE 1.4 Schematic of a typical design procedure Redesign No Introduction 1. 1.3 SELECTION VERSUS DESIGN We are frequently ... may differ in intensity and sequence 1. 3 THERMAL SYSTEMS Let us now turn our attention to thermal systemsand consider the nature of these systemsand the various types ofsystems that are commonly...
... Stoecker and Jones Introduction FIGURE 1. 19 Photographs of practical heat pumps (From KIST, Korea.) 37 38 Designand Optimization of Thermal Systems (19 82), Cooper (19 87), and Kreider and Rabl (19 94) ... pump (b) FIGURE 1. 11 Power systems based on (a) solar energy and (b) nuclear energy (Adapted from Howell and Buckius, 19 92.) 30 Designand Optimization of Thermal Systems most of which are not ... Ozisik (19 85) and Incropera and Dewitt (20 01) in heat transfer, Fox and McDonald (2003) and Shames (19 92) in fluid mechanics, Howell and Buckius (19 92), Cengel and Boles (2002) and Moran and Shapiro...
... A fixed sum of money may also be 94 Designand Optimization of Thermal Systems 74 10 19 47 31 29 44 18 46 49 28 27 17 11 26 48 42 43 32 16 33 41 12 14 13 FIGURE 2.25 The first page of a typical ... D1 and D and the length L, and for different operating conditions, including off -design, given by the flow rates m1 and m2 and the inlet temperatures T1,i and T2,i Basic Considerations in Design ... Figure 2 .19 (a), is to be designed The design variables are the two outer diameters D1 and D2 of the inner and outer tubes, respectively; the two wall thicknesses t1 and t2; and the length L of the...
... important in the designof FIGURE 2.33 Range of thermal conductivity k for a variety of materials under normal temperature and pressure 11 0 Designand Optimization of Thermal Systems thermal systems ... Incropera, F.P and Dewitt, D.P (20 01) Fundamentals of Heat and Mass Transfer, 5th ed., Wiley, New York Jaluria, Y and Lombardi, D (19 91) Use of expert systems in the designof thermal equipment and processes, ... P2.6(b) 11 8 Designand Optimization of Thermal Systems (c) Extrusion of aluminum from a heated cylindrical block, of diameter 15 cm at a temperature of 600 K, to a rod of diameter cm at the rate of...
... given profile Such simplifications of the 14 4Designand Optimization of Thermal Systems boundary conditions not only reduce the complexity of the model, but also make it easier to understand and ... heat 13 4Designand Optimization of Thermal Systems treatment The flow of hot gases and thermal energy, on the other hand, is studied as a continuum, using a continuous model Both the discrete and ... casing, inner lining, and heating unit of the oven? Briefly justify your answers Modeling of Thermal Systems 3 .1 INTRODUCTION 3 .1. 1 IMPORTANCE OF MODELING IN DESIGN Modeling is one of the most crucial...
... Modeling of Thermal Systems 14 9 T1 T2 T2 Streamlines T2 Isotherms (a) (b) A1 A2 V1 V2 2 ρ1V1A1 = ρ2V2 A2 (c) (d) FIGURE 3 .13 Differential formulations (a) Flow in an enclosed region due to inflow and ... equations 15 6 Designand Optimization of Thermal Systems Wall Insulation (Tw )1 = 500 K (Ti)2 = 300 K x 10 cm 20 cm Temperature (a) 500 K 41 5 .27 K 40 0 K 300 K Distance (b) FIGURE 3 .16 Boundary ... variations of the thermal conductivity k, 15 4Designand Optimization of Thermal Systems Wall Insulation L D FIGURE 3 .15 The cylindrical furnace, with the wall and insulation, considered in Example 3.4...
... 2.0 S 1. 5 10 10 10 3 1. 91 3 .10 4 .11 5.03 3 .48 6.66 7. 51 9 .19 4. 67 7.59 10 .08 12 .33 It is expected from theoretical considerations that Q varies with R and S as ARbSc, where A, b, and c are constants ... 0 .1 0.2 0.3 0 .4 0.5 0.6 0.8 1. 0 1. 2 y: 0.87 1. 82 2.86 4. 0 5.26 6.65 9.88 13 .8 18 .52 3.32 The flow rate F is given at various values of the pressure P as P 0.025 0.05 0 .1 0.2 0.3 0 .4 0.5 F 1. 41 ... transfer, and data analysis, are often governed by linear systems A system of n linear equations may be written in the general form a11x1 a12 x a1n x n b1 a21x1 a22 x a2 n x n b2 an1x1 an x ann...
... of the system Evaluation of the design Selection of an acceptable design Optimization of the design follows the determination of a domain of acceptable designs and is not included here Most of ... circuitry 3 04Designand Optimization of Thermal Systems Library of Previous Designs Any industry involved with the designofsystemsand equipment would generally develop many successful designs ... volume V gives 10 00 42 00 V (To – 20) 2 .1 105 10 3 Acceptable Designof a Thermal System 317 where the density of water is taken as 10 00 kg/m3 and the specific heat at constant pressure as 42 00 J/(kg...
... equations: U x1 G x1 U x2 0, G x2 0, G x1 0, x1 x U* 36 .49 3, (8 .47 ) 12 (8 .48 ) These equations lead to 4x1 x2 0, Therefore, x* 2 .46 6, x* 4. 866, 2.027 (8 .49 ) It can be shown that if either x1 or x2 is ... Keisler (19 86) and Kaplan (2002), and in books on optimization, such as Fox (19 71) , Beightler et al (19 79), and Chong and Zot (20 01) For the case of two independent variables, x1 and x2, with U(x1, ... following system of equations: U x1 G1 x1 G2 x1 m Gm x1 U x2 G1 x2 G2 x2 m Gm x2 U xn G1 xn G2 xn m Gm xn Lagrange Multipliers 47 7 G1(x1, x2, x3, , xn) G 2(x1, x2, x3, , xn) 0 Gm(x1, x2, x3,...
... forward Int Adds Int Div Comp Int Mult exp Real Add Real Mult — 10 24 66 14 22 16 16 16 16 64 646 20 10 258 15 49 19 3 16 - 10 24 - 12 16 - modeling section, preliminary investigations can be made from ... pp 44 -52, Feb 19 95 [13 ] Gajski, D and Vahid, F., Specification anddesignof embedded hardware-software systems, IEEE Design & Test of Computers, pp 53-67, Spring 19 95 [ 14 ] DeBardelaben, J and ... Hardware/software codesign for signal processing systems A survey and new results, Proc of the 29th Annual Asilomar Conference on Signals, Systems, and Computers, Nov 19 95 [15 ] IEEE Std 11 64 -19 93...
... 12 .4 ˆ D Nf P 14 11 EXAMPLE Annotate your designs with transistor sizes that achieve this delay 8 8 10 25 25 25 8 Y 25 10 10 10 24 6 12 6 Y 8 16 16 0 * (4/ 3) / 4. 2 = 50 16 16 0 * / 4. 5 ... the two designs H = 16 0 / 16 = 10 B = N = D0 S Y D1 S P 22 G (4 / 3) (4 / 3) 16 / D0 S D1 S Y P 1 F GBH 16 0 / ˆ f N F 4. 2 G (6 / 3) (1) F GBH 20 ˆ f N F 4. 5 ˆ D ... significantly decreases area and power Inverter NAND2 fastest P/N ratio A 1. 41 4 Y gu = 1. 15 gd = 0. 81 gavg = 0.98 NOR2 B Y A B 2 A 2 Y gu = 4/ 3 gd = 4/ 3 gavg = 4/ 3 1 gu = gd = gavg = 3/2 23 OBSERVATIONS...
... G )1/ N + P Design NOR4 N G P D 2 34 NAND4-INV 2 29.8 NAND2-NOR2 20/9 30 .1 INV-NAND4-INV NAND4-INV-INV-INV 2 22 .1 21. 1 NAND2-NOR2-INV-INV 20/9 20.5 NAND2-INV-NAND2-INV 16 /9 19 .7 INV-NAND2-INV-NAND2-INV ... 22 .1 Path Delay: Gate sizes: z = 96 *1/ 5.36 = 18 y = 18 *2/5.36 = 6.7 A[3] A[3] 10 10 A[2] A[2] 10 10 A [1] A [1] 10 10 A[0] A[0] 10 10 y z word[0] 96 units of wordline capacitance y z word [15 ] 48 ... 3*5 + = 22 = 4.4 FO4 40 EXAMPLE: 3-STAGE PATH Work backward for sizes y = 45 * (5/3) / = 15 x = (15 *2) * (5/3) / = 10 x x A P: N: P: x N: y 45 45 P: 12 y N: B B 45 45 41 BEST NUMBER OF STAGES...