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H110M-A/M.2 Repair Guide BESTER 04/06 BLOCK DIAGRAM POWER FLOW POWER ON SEQUENCE Timing Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except for body temp, all temperatures are measured with thermo couples inside solder joints, for better accuracy Primary Factors for Successful Rework: •Flux formulation and solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries and thermal solutions following the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel®BGA / Socket Rework Video (10 minutes in length): http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=1519232885001 MB Baking Time: 120〬C, hours BGA Baking Time: Voltage Measure Point Voltage Measure Point Station Net Name Diode resistance PU702 +3VSB_ATX 322 PQ605 +5VSB 501 PL201 VCCGT 477 PL704 VCCIO 477 ATX12V +12V_CPU 558 TPM +3VSB 322 PC553 VTT_DDR 418 EATXPWR +5VSB_ATX 612 PQ611 +5VSB_DUAL 517 EATXPWR +12V 534 EATXPWR +5V 449 TPM +3V 17 10.Signal Measure Point Station SR119 SR121 NA PQ605 TPM SR80 SR80 O1R6 O1R18 SD5 NA NA PQ532 EATXPWR EATXPWR EATXPWR TPM NA O1R12 SR75 HR210 PR109 PC168 SQ6 TPM ESDC3 XC74 XC71 Sequence 3.1 7/4.2 7.1 8/4.1 10 11 12 13 14 15 16 17 18 19 Signal Measure Point Net Name Diode resistance S_RTCRST# 778 S_SRTCRST# 783 AC Power Switch ON NA +5VSB 501 +3VSB 322 S_DPWROK 18 O_RSMRST# 18 PWRBTN# 856 O_IOPWRBTN# 561 S_SLP_S3# 581 S_SLP_A# NA S_SLP_LAN# NA S_SLP_S4# 582 ATX_PSON#_R 553 12V 543 5V 449 3V 17 P_PWROK_PS NA O_PWROK 35 H_CPUPWRGD 496 H_SVID_DATA 508 H_SVID_CLK 510 VCORE 427 P_VR_READY_10 445 S_PLTRST# 524 H_CPURST# 482 O_X1_RST# 589 O_X16_RST# 591 ... http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=151 923 2885001 MB Baking Time: 120 〬C, hours BGA Baking Time: Voltage Measure Point Voltage Measure Point Station Net Name Diode... temp, all temperatures are measured with thermo couples inside solder joints, for better accuracy Primary Factors for Successful Rework: •Flux formulation and solder paste formulation and volume... and volume ? ?A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries and thermal solutions