H110I-PLUS D3/MS Repair Guide ELF_XU GTSD 2015/11/02 BLOCK DIAGRAM POWER FLOW POWER ON SEQUENCE Timing Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except for body temp, all temperatures are measured with thermo couples inside solder joints, for better accuracy Primary Factors for Successful Rework: •Flux formulation and solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries and thermal solutions following the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel®BGA / Socket Rework Video (10 minutes in length): http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=1519232885001 MB Baking Time: 120〬C, hours BGA Baking Time: Voltage Measure Point Voltage Measure Point Station Net Name Diode resistance PU702 +3VSB_ATX 358 PQ605 +5VSB 502 PCE207 VCCGT 447 PCE301 VCCIO 456 PC749 VCCSA 458 EATX12V +12V_CPU 553 TPM +3VSB 293 PC550 VTT_DDR 423 EATXPWR +5VSB_ATX 602 PQ708 +5VDUAL 526 EATXPWR +12V 502 EATXPWR +5V 445 PQ403 +3V 316 10.Signal Measure Point Station SR120 SR121 NA PQ605 TPM SQ7 PD701 O1R14 O1R18 SD5 NA NA PQ532 EATXPWR EATXPWR EATXPWR PQ403 EATXPWR O1R12 SR75 HR210 PR109 PC168 SQ6 TPM ESDC3 SATAEXPRESS XC71 Sequence 3.1 7/4.2 7.1 8/4.1 10 11 12 13 14 15 16 17 18 19 Signal Measure Point Net Name Diode resistance S_RTCRST# 778 S_SRTCRST# 778 AC Power Switch ON NA +5VSB 502 +3VSB 293 S_PWROK 35 O_RSMRST# 17 PWRBTN# 849 O_IOPWRBTN# 504 S_SLP_S3# 488 S_SLP_A# NA S_SLP_LAN# NA S_SLP_S4# 511 ATX_PSON#_R 547 12V 502 5V 445 3V 316 P_PWROK_PS NA O_PWROK 34 H_CPUPWRGD 414 H_SVID_DATA 504 H_SVID_CLK 510 VCORE 406 P_VR_READY_10 456 S_PLTRST# 494 H_CPURST# 397 O_ X1 RST# 583 O_ X16_RST# 583