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B150I PRO GAMING/AURA Repair Guide ELF 2016/02/01 BLOCK DIAGRAM POWER FLOW POWER ON SEQUENCE Timing Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except for body temp, all temperatures are measured with thermo couples inside solder joints, for better accuracy Primary Factors for Successful Rework: •Flux formulation and solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads) Caution: Always remove batteries and thermal solutions following the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel®BGA / Socket Rework Video (10 minutes in length): http://link.brightcove.com/services/player/bcpid1409165005001?bckey=AQ~~,AAA AqwZd9wk~,X1Exj3sUi-03b71FGkEmVWbi4T4yGcor&bctid=1519232885001 Voltage Measure Point Voltage Measure Point Station Net Name Diode resistance OQ760 +3VSB_ATX 327 PL706 +5VSB 500 PL201 VCCGT 463 EATX12V +12V_CPU 747 TPM +3VSB 293 PC956 VTT_DDR 423 EATXPWR +5VSB_ATX 600 PL903 +5VSB_DUAL 508 EATXPWR +12V 496 EATXPWR +5V 476 PQ403 +3V 321 10.Signal Measure Point Station SR120 SR121 NA PL706 TPM SR1627 SR1627 O1R14 O1R90 PR689 NA NA PR518 EATXPWR EATXPWR EATXPWR PQ403 EATXPWR PR625 SR75 HR210 PR109 PC189 SQ6 TPM ESDC3 OR770 XC71 Sequence 3.1 7/4.2 7.1 8/4.1 10 11 12 13 14 15 16 17 18 19 Signal Measure Point Net Name Diode resistance S_RTCRST# 783 S_SRTCRST# 783 AC Power Switch ON NA +5VSB 500 +3VSB 293 S_ RSMRST# 18 O_RSMRST# 18 PWRBTN# 839 O_IOPWRBTN# 511 S_SLP_S3# 503 S_SLP_A# NA S_SLP_LAN# NA S_SLP_S4# 504 ATX_PSON#_R 549 12V 496 5V 476 3V 321 P_PWROK_PS NA O_PWROK 35 H_CPUPWRGD 445 H_SVID_DATA 506 H_SVID_CLK 511 VCORE 420 P_VR_READY_10 536 S_PLTRST# 501 H_CPURST# 430 O_ X1 RST# 584 O_ X16_RST# 588 ... Diagram for G3 to S5 Timing Diagram for S5 to S0/M0 Frequency Flow Socket reflow profile Lead-Free Rework Thermo profile Graphic for BGA & Chipset Except for body temp, all temperatures are measured... Rework: •Flux formulation and solder paste formulation and volume •A capable thermal reflow profile •Proper PCB pad solder preparation/wicking (clean-up of the residual solder from the PCB pads)... Caution: Always remove batteries and thermal solutions following the system design disassembly process steps prior to BGA rework to avoid damaging the BGA View this Intel®BGA / Socket Rework