Cách nhận biết linh kiện của máy mounter (NPM)

NPM Recognition KnowKnow-how Contents • Recognition System Configuration • Recognition Data Creation Example • Troubleshooting • Image Save Function 1／ 21 Recognition System Configuration CM Series Component data: Basics (reference etc.) NPM Optical system configuration: Line sensor (transmission, reflection, side) 3D sensor Component data: Basics (reference) + Option Algorithm selection: Customer Automatic teaching: QFP, BGA, Compound Optical system configuration: Line sensor (transmission, reflection, side) 3D sensor Ref1 to 255 BM Series Algorithm selection: Automatic selection Component data: Basics (type) + Option Automatic teaching: All components Type 101 to 106 Automatic teaching: QFP, BGA, Irregular shape Optical system configuration: Head camera (reflection triple) Fixed camera (reflection triple) 2D (reflection triple, transmission) 3D sensor Algorithm selection: Customer Ref1 to 255 Type 101 to 106 2／ 21 • Although having inherited the component data of BM series, it has inherited the data input form of the editor of PANAPRO • It has incorporated the optical system of CM series • It has incorporated all the algorithms of CM series and BM series It automatically selects the optimal algorithm from the recognition library Component Creation Example u The following introduce the component creation example when irregularirregular-shaped components are selected with DGS/LWS The introduction concentrates on the frequently used shapes, such as lead group, ball group, and corner Component (TOP VIEW) 1-way lead connector Creation example (Standard) Creation example Added shape data (red lines) Lead group Mold section Reflection or Transmission  Lamp Lead group Ball group Ball group Corner Corner 1-way lead connector Lead section Reinforced lead (insert etc.) present Reflection or Transmission   If the angle accuracy is bad, add corners or electrode shapes across the lead line Lamp Lead group Reflection or Transmission  If the lead group has encroached on the mold, it is unsuitable for transmitting recognition If the angle accuracy is bad, add corners or electrode shapes across the lead line Lead section Lamp Creation example Lamp Lead group Ball group Ball group Corner Corner 3／ 21 Reflection or Transmission   Lamp Lead group Ball group Corner Reflection   To recognize the black mold section, use transmission Lamp Transmission Lead group Ball group Corner  Component (TOP VIEW) Creation example (Standard) Resistor network component Lead group Reflection or Transmission  Lamp Reflection or Transmission Lead group Ball group Ball group Corner Corner Tantalum capacitor  If the lead size or the position is unstable, change to the transmitted lighting, and register the mold corner positions If the lead size is unstable, specify the electrode positions using corner shapes Lamp Lead group Reflection or Transmission  Lamp Ball group Corner Corner Round (Cylindrical) component Specify “round” for the mold shape Lamp Round added Without-angle-detection option added Reflection  Reflection or Transmission Lead group Ball group Creation example If the electrode size is not stable, add corner shapes to the outermost electrode positions Add a (single) lead so that it may enclose the electrode line collectively Lamp Creation example  Round added Without-angle-detection option added 4／ 21 Transmission  Transmission Lead group Ball group Specify “round” for the mold shape Lamp Lamp Corner  Component (TOP VIEW) Creation example (Standard) Filter component #1 Lead group Two or more leads are arranged unevenly Filter component #2 Right and left electrodes differ in width Lead group Filter component #3 The electrode shape is trapezoidal Reflection Lamp  (2 leads x + Lead group lead) Corner Reflection Lamp  Corner If electrodes are not U-shaped, input the average width of the electrodes Lamp Lead group Reflection  Reflection  If the lead position/shape is unstable, register only the mold information, and not use the shape data (Use the transmitted lighting.) Lamp Reflection  Lamp Corner 5／ 21 Reflection  If the lead position/shape is unstable, register only the mold information, and not use the shape data (Use the transmitted lighting.) Transmission Mold only If the lead position/shape is unstable, register only the mold information, and not use the shape data (Use the transmitted lighting.) If the mold color is whitish, register corners not leads Lamp Transmission Mold only If the mold color is whitish, register corners not leads If the right and left electrodes differ in width, input each one correctly Lamp Creation example If the mold color is whitish, register corners not leads If there are two or more leads, register them collectively as a lead group Lamp Creation example Lamp Mold only Transmission Component (TOP VIEW) Creation example (Standard) Insertion pin component #1 Insertion lead group 10 Lead Insertion pin component #2 11 Insertion lead group Corner Insertion pin component #3 Lamp Lamp Lamp Lamp Lamp Lamp  Reflection (+ Side) + Transmission   If a pin line has two or less pins, register every pin individually Lamp If an insertion pin line has two or less pins Reflection (+ Side)  Register the component-moldsection corner positions using the transmitted lighting together Lamp If there are no electrodes etc besides insertion pins Creation example For insertion pin components, register other shapes than insertion pins to assist detection Lamp If there are any electrodes etc besides insertion pins Creation example Reflection (+ Side) Insertion lead group  (In the above example, Lead  pin x pcs.) 6／ 21 12 Component (TOP VIEW) Connector component Mold section: White 13 Creation example (Standard) Creation example If there is a sufficient amount of protrusion of leads from the mold, register the lead group Specify white for (Protrusion guideline = the mold color 0.20 [mm]) Lamp Lead group Card slot component Specify white for the mold color Lamp Reflection  Corner If the lead line of the same size lines up with equal pitches, register the lead group Lamp Lead group Reflection or Transmission  If there is a small amount of protrusion of leads from the mold, register other shapes, such as corners, than the lead group (Protrusion guideline = 0.20 [mm]) Reflection  Lamp Lead group Reflection or Transmission  Lamp Lead group Reflection or Transmission  Add a (single) lead Lead group Corner 7／ 21 Transmission   Lamp Corner If there are a few (2 or less) external electrodes, add a corner with transmission Lamp If leads are not aligned evenly or are of the different types, register the leads individually Lead group  Do not use a jack insertion section because its shape is unstable Pin jack component Lamp If the angle accuracy is bad, add corners or electrode shapes across the lead line Corner 14 Creation example Reflection or Transmission   If there is any mold protrusion whose shape is similar to a lead Lamp Lead group Register the Leads individually Reflection  15 Component (TOP VIEW) Creation example (Standard) Shield case component Creation example For shield case components, register corners all around the component outline Lamp Corner 16 Creation example Earth spring component Reflection (+ Side) or Transmission Lamp Lamp Lamp Lamp  For earth spring components, register corners all around the component outline If the image of the R-shape section is unstable, add also the side lighting (in the case of reflection) Lamp Corner Reflection (+ Side) or Transmission  Lead group Corner 17 Lamp Lamp 8／ 21 Lamp Brief Description of Detection Specifications by Shape  This page provides the brief description and precautions on the detection of each shape used on the previous pages (1) Lead group (4) Rectangle • For each lead, the tip and side edges are detected and positioned • When the number of registered leads is two or more, the distance (pitch) among lead center positions is checked * If there is an unnecessary mold projection etc among leads, split and register the lead group Refer to the component data creation example, No.14 pin jack, creation example • Each of the top, bottom, right, and left edges is detected and positioned * If a specific edge image is unclear at the lead base etc., detecting this edge becomes unstable; in this case, therefore, register that as a (single) lead group (2) Ball group • For each ball, the edges in outer regions are detected and positioned • When the number of registered ball matrices is two or more, the distance (pitch) among ball center positions is checked (5) Line Only one side registered Also opposing side registered For rectangular shape, The unstable bottom edge will not detecting the bottom be detected by regarding the shape as a lead (facing up) edge is unstable • The edge on a specified line is detected and positioned * Because of directional detection, always register another shape also in opposing/orthogonal direction (3) Corner • Each edge on two lines is detected and positioned • Positioning is applied only in the two directions; therefore, registering another shape at the opposing side/corner on the component stabilizes the detection position The edge at the electrode bottom is unclear Only top and bottom registered => Cannot be positioned in horizontal direction Registered in all directions (6) Round • The edges in outer regions are detected and positioned * If the outer regions are partially unclear, specify the start and end angles • The component center position to be finally detected is determined by the vector error average of the detection position to the center position (Cx, Cy) of each registered shape 9／ 21 Configuration and Function of Lighting for Component Recognition  The following pages describe the configuration and roles of the lighting for component recognition Configuration of lighting for component recognition For NPM, there are three lighting configurations for acquiring component images: • Transmissive lighting • Reflective lighting • Side lighting (unit option) Transfer head/nozzle Lighting unit Side lighting Transmissive lighting Sensor optical system The role of each lighting configuration is as follows: [Transmissive lighting image example] Transmissive lighting: Irradiates a component background with light to generate the component silhouette image Used when component electrodes not shine (because of mirror electrodes) or for positioning a component by its outline Reflective lighting: Irradiates a component underside with light to generate the component electrode image Used for positioning the one by electrodes on the component underside or when the nozzle outer size is larger than the component size [Reflective lighting image example] Side lighting: [Side lighting image example] Irradiates a component side with light to generate a component side image Used for clarifying an electrode outline when the electrodes have a curved shape (BGA components, J-lead components) 10／ 21 Reflective lighting • The component will be acquired as a silhouette image • The background becomes a white level • The electrodes become a white level • The mold becomes a white to black level according to the component molding color (The left figure shows the case of black state.) • The background becomes a black level • The outer regions of curved electrodes become a white level • The plane basically becomes a black level Configuration and Function of Lighting for Component Recognition Precautions in changing the lighting lamp value The NPM has a function to allow the lamp value of each lighting to be changed separately on equipment in order to make a component image condition good This page shows the image condition precautions for each lighting configuration [Transmissive lighting image precautions] Light amount: Low Light amount: Moderate [Reflective lighting image precautions] Positioning by electrodes Light amount: Moderate [Side lighting image precautions] Only side lighting ON Light amount: High Positioning by outline Light amount: Moderate Choose [Lighting] on the component recognition teaching setting screen Set each individual lighting value on the teaching screen The transmissive lighting irradiates a component background reflector with light to shine the background • If the set light amount is low, the background does not fully shine, and a black streaky shadow appears on the reflector • If the set light amount is high, also the component is irradiated with light, and the component silhouette image becomes unstable For the transmissive lighting, use the machine-default value basically (16/12/8-nozzle head: Lamp value = 40, 2/3-nozzle head: Lamp value = 80) The reflective lighting irradiates an entire component underside with light to shine the component electrodes (or the whole) In the example on the left figures: • When using the component electrodes for positioning (shape registration), adjust the light amount so that the mold may not shine like a high light amount state • However, when using the component outline for positioning (shape registration), set a higher light amount so that the mold outline may be acquired clearly For the reflective lighting, adjust it so that the registered shape may be clear on the image When making BGA components recognized, not use the reflective lighting basically Turning on the reflective lighting has the following harmful effects: • The component land pattern shines, and the boundary information on a ball outline becomes unclear • Also the missing balls shine similarly to the normal balls, causing such balls not to be judged defective any more Side + Reflective lighting ON When turning on the reflective lighting for the polarity mark inspection or because of a brightness error due to an uneven ball surface, make sure that its light amount is about a maximum of 50 * Any lighting corrects the relationship between lamp value and light amount by the brightness calibration function Therefore, depending on equipment (unit), an extreme low light amount (lamp value: under about 10) may make the lighting control value for lamp value negative, thereby disabling the lighting Make sure that the light amount is 10 or more more 11／ 21 Configuration and Function of Lighting for Component Recognition Image guidelines in changing the lighting lamp value This page introduces the image guidelines in changing the lighting lamp value using the example of representative components Example Internal electrode component Tantalum, ECSP, Filter, LCC For a component with electrodes on its underside (placement-side electrodes), when using the electrodes for positioning, set the light amount so that the brightness difference between electrodes and mold may be fully acquired Brightness distribution with light amount high Shape registration of electrodes Guidelines for light amount setting: Light amount = High Example Internal electrode component Aluminum electrolytic capacitor For a component such as an aluminum electrolytic capacitor, when you want to use the mold outline for positioning because the electrodes vary greatly to the mold outline: (In order to avoid the adjacent component interference on a populated PCB) Turn off the reflective lighting and turn on the transmissive lighting to carry out the transmitting recognition (In this case, the reflective and the transmissive lighting should not be on concurrently.) Reflective lighting  Positioning by electrodes (2) (2) Brightness difference between mold and background > Standard light amount (1) Brightness difference between electrodes and mold: 100 or more (1) Example Differences in substitute components Transmissive lighting  Positioning by mold 12／ 21 For a substitute component, when there is a difference in the component mold color or in the shape other than electrodes: • Register only the same shape (shape of the portion to be mounted on a PCB land pattern), not changing the lighting setting • If you have changed the recognition conditions by changing the lighting only, the recognition becomes unstable when a substitute component is used Register only the lead group of common shape Mold color: Different  Do not register the mold shape Configuration and Function of Lighting for Component Recognition Image guidelines in changing the lighting lamp value Example Ball-type component BGA, CSP For ball-type components such as BGA/CSP, you can acquire the ball-only image by using the side lighting For this type of component, not turn on the reflective lighting basically Mold pattern shining Standard light amount Plus reflective lighting on Black missing [Remarks] The ball detection processing detects the outer regions of ball Therefore, even if the ball's peak (center) is black, the detection will not be affected Turning on the reflective lighting has the following harmful effects: • The component land pattern shines, and the boundary information on a ball outline becomes unclear • Also the missing balls shine similarly to the normal balls, causing such balls not to be judged defective any more For BGA components in the standard lamp setting, the transmissive lighting is also turned on When the transmissive lighting turns on: • Processing time will have an advantage because the mold information is used for the rough positioning for ball array detection • A wrong component detection by component outline will be carried out because the component outline information is checked (* When the nozzle outline size is larger than the component mold size, turn off the transmissive lighting.) Example Curved electrode component PLCC/SOJ, Cylindrical resistor When making J-lead components (PLCC, SOJ) and cylindrical resistors recognized with the reflective lighting, turn on also the side lighting to clarify the component (electrode) outline image and stabilize the detection position Lead tip clarified With the reflective lighting, the horizontal plane of component underside is acquired as an image For a curved plane, its side is hard to be acquired as an image In such a case, turn on also the side lighting to acquire the clearer image including the side and stabilize the detection Only reflective lighting ON Side lighting Reflective + Side lighting ON Reflective lighting Only underside shining 13／ 21 Reflective lighting Entire curve shining Recognition related Troubleshooting Example Recognition u The following pages introduce the factorial analyses and remedies for recognition trouble Setting the pitch tolerance for multiplemultiple-lead components and ball array components When the shape data: lead group/ball group/insertion lead group is specified, the measured average pitch information appears on the result screen for recognition teaching If a recognition error code: Ans=36 (measured pitch abnormal) has occurred, set the pitch (bend) tolerance of the recognition option on the basis of this displayed information Lead group Insertion lead group Ball group Measured average pitch display Moreover, for ball group components, also the ball-diameter size measurement average appears If a recognition error code: Ans=32 (electrode width size abnormal) has occurred, set the ball diameter tolerance of the recognition option on the basis of this displayed information 14／ 21 Changing the size tolerance of chip components If, for chip components (chip resistors/chip capacitors), the size is judged abnormal even when a component is picked up successfully, the tolerance judged abnormal can be changed by changing the size tolerance Error code in case of size abnormal: Size abnormal of Ans25 (L side)/25 (W side) Choose [Advanced]-[Tolerance] on the recognition data edit screen of DGS/LWS [Remarks] For size tolerance, “+” side (tolerance for the component becoming large) “-” side (tolerance for the component becoming small) can be specified separately If chip side-standing pickup may occur, “change only the size + L side tolerance” or “change only the “+” side tolerance.” [For reference] When a size error (Ans25/26) occurs, the measured size information will be recorded in the recognition error screen information If the size error occurs frequently, change the input size or the size tolerance on the basis of this information In the error screen information A: Measured size information B: Input size information 15／ 21 CR determination for chip components To discriminate between capacitors and resistors of chip components, check the brightness of the center of component Choose [Advanced]-[Brightness Check] on the recognition data edit screen of DGS/LWS Example) Checking 0603C (capacitor) (Left) Recognition OK if the component data is a capacitor (Right) Recognition NG if the component data is a resistor Checking 1005R (resistor) (Left) Recognition NG if the component data is a capacitor (Right) Recognition OK if the component data is a resistor The following values are guidelines They need to be adjusted according to components [Process Window] Set [mm] for Cx and Cy, and [degrees] for angle For Dx and Dy, input 50% to 70% of short side on component [Brightness Measure Method] Choose the histogram, and input 70% for capacitors For resistors, input 30% [Brightness of Defined Area] For capacitors, check that the level is within the following range Lower-limit level: 0, Upper-limit level: 240 For resistors, check that the level is within the following range Lower-limit level: 240, Upper-limit level: 255 16／ 21  If the center of capacitor is white, such capacitors may be confused with resistors  If the center of resistor is black because of dark lamp value, contamination, etc., such resistors may be confused with capacitors Investigating the mounting deviation If the mounting deviation is due to the recognition deviation, it can be checked in the following way Choose [Advanced]-[Vision Options]-[Support Flag]-[Add] on the recognition data edit screen of DGS/LWS Images will be saved to the recognition error history (RER file) The recognition deviation can be checked by checking the RER file 1/4 Support Flag 2/4 3/4 Recognition deviation 4/4 The possibility of recognition deviation can be checked from the mount log 1.5 [Input]-[Apply] (not currently supported in DGS) 0.5 -0.5 -1 -1.5 -2 17／ 21 Mounting deviation (XY deviation, large) Example) X and Y of mounting position might deviate significantly Add the “Fixed XY Shift Result” option to the recognition data * The center range check is an option that causes a recognition error when the result of nozzle center and that of component center are significantly different * Against the deviation due to unstable pickup etc To be separately remedied for wrong recognition Choose [Advanced]-[Vision Options]-[Fixed XY Shift Result]-[Add] on the recognition data edit screen of DGS/LWS Make the settings for the center range option [Input]-[Apply]-[Close] Input the offsets for the pickup deviation Input the tolerable deviation amount between nozzle center and component center If the window size is too small, an error may be caused to all components; therefore, correct that to the appropriate size If a recognition error occurs frequently in midstream, it seems stable at the time when the set window size is exceeded If the mounting position deviates significantly in spite of the input of this option, this seems to be caused by pickup deviation after recognition, component drop, etc The window size can be determined by referring to the mount log 1.5 Fixed XY Shift Result 0.5 -0.5 -1 -1.5 The window size can be set to 1 mm if it is not tight at 1 mm Mount log of a specific component -2 (RCGX, RCGY) 18／ 21 Mounting deviation (q (q deviation, large) Make the settings for the inclination range check option [Input]-[Apply]-[Close] Input the reference angle Normally, it is degrees Example) q of mounting angle might deviate significantly Add the “Rotation Check” option to the recognition data * The inclination range check is an option that changes the tolerance of recognition result q * Against the q deviation due to unstable pickup etc To be separately remedied for q wrong recognition *1 If this option is not set, the default angle is used for verification Basically, the default angle is 30 degrees, though it varies depending on components Choose [Advanced]-[Vision Options]-[Rotation Check]-[Add] on the recognition data edit screen of DGS/LWS Input the tolerance To make it severe, set 30 degrees or less If the tolerable angle is too small, an error may be caused to all components; therefore, correct that to the appropriate tolerable angle If the mounting angle inclines significantly in spite of the input of this option, this seems to be caused by pickup deviation due to pre-rotation of head, etc The reference angle and the tolerable angle can be determined by referring to the mount log 1.5 Rotation Check 0.5 -0.5 -1 -1.5 The tolerable angle can be set to 0.2 degrees if it is not tight at 0.2 degrees -2 Mount log of a specific component (RCGX, RCGY) 19／ 21 Mounting deviation (X/Y/q (X/Y/q deviation, small) Example) The mounting position and the angle deviate by a fixed amount constantly in the same direction Add the “Mount Offset” option to the recognition data The placement position offset is an option that adds * the offset amount to X, Y, q of the recognition result constantly * It changes the recognition center and inclination definition Choose [Advanced]-[Vision Options]-[Rotation Check]-[Add] on the recognition data edit screen of DGS/LWS Mount Offset 20／ 21 Make the settings for the placement position offset option [Input]-[Apply]-[Close] Input the offset amount The value to input is the one for mounting at degrees For mounting at 90 degrees, the value input in X will be offset in the Y direction of the equipment When this component is being mounted at two or more angles, it will be applied to either component Mounting deviation (X/Y deviation, small) Example) The mounting position deviates by a fixed amount constantly in the same direction If the shape option is shifted only by the amount of mounting deviation, the mounting position will be aligned Lead group Cx: Distance from component center X to lead group center X Cy: Distance from component center Y to lead group center Y Change the shape data in the recognition data Choose [Odd Shaped Component]-[Advanced]-[Shape Options][Shape selection]-[Edit]-[Cx,Cy input]-[Apply]-[Close] on the recognition data edit screen of DGS/LWS In the figure exemplified left, inputting -1 mm for Cx shifts the mounting position by -1 mm It is necessary to change all the registered shape options The value to input is the one for mounting at degrees For mounting at 90 degrees, the value input in X will be offset in the Y direction of the equipment 21／ 21 3D-specific recognition error (QFP/SOP) 3DWhen the 3D sensor is used, remedies vary according to recognition error types Error code ANS 46 (1 to 4) 46 (11) 46 (12) 46 (13) 36 (10 to 13) Factor Lead float Remedy Check the component The component is too far from the sensor Some leads are 0.5 mm or more higher Check the component Recheck the component height The component is not horizontal Leads are on both sides by 0.5 mm Recheck the pickup state The component is too close to the sensor Some leads are 0.5 mm or more lower Check the component Recheck the component height Lead count error Check the component Generally, the above remedies are adopted; depending on components, however, the sensitivity adjustment of 3D might be necessary The characteristics of the height image when the sensitivity of 3D is not appropriate include: • If the sensitivity is too low  Some leads have holes in their centers (which occurs relatively more frequently in upper/lower sides) • If the sensitivity is too high  Some leads expand or they ooze among others (right/left leads) Thus, either case results in the image different from the physical shape 22／ 21 If a recognition error occurs in spite of a conforming component, adding and adjusting “3D Sensor Control” might remedy that Add “3D Sensor Control” on DGS/LWS beforehand, and adjust the actual by teaching on the machine 3D specific recognition error (QFP/SOP) continued 3D 3D specific recognition error (BGA) 3D Set laser power  minimum light quantity in this order at the teaching screen of the machine Because of the internal structure of 3D sensor, although degrees and 180 degrees of component resemble each other in their images, 90 degrees and 270 degrees might be different from degrees in their images In this case, the setting values for 90 degrees and 270 degrees can be given • Laser power Normally, use the default 192 If, however, the height measurement area of right/left leads (about 0.4 mm from the lead tip) is stringy, lower this to 128 etc to prevent the stringiness on the extension of the height measurement area Stringiness on the extension of the height measurement area  Laser power adjustment required • Balls need 0.25 mm or more height They must be hemispherical • A warp in the entire component might infrequently cause an allall-ball inspection error This is not an anomaly in the 3D sensor For line sensor, that results in OK; however, no warp will be detected • For conforming component, as with QFP, add “3D Sensor Control” on DGS/LWS beforehand, and adjust the actual by teaching on the machine Make the settings at the teaching screen of the machine • Laser power Use the default 192 • Minimum light quantity It should be adjusted so that the height of balls and entire body may be acquired Roughly, the value is about 70 (A) Stringiness outside the height measurement area  Laser power adjustment not required Alternatively, as long as the height of only balls can be acquired on the image by increasing the minimum light quantity close to 800, that can be recognized (B) If the wiring pattern is seen among balls or the top of balls is missing in black, it is not applicable • Minimum light quantity It should be adjusted so that the physical shape of the leads in the height measurement area may be exactly acquired For QFP, it is necessary to adjust upper/lower leads and right/left leads at the same time If either is in an abnormal state, 3D recognition is not available Increase the minimum light quantity Some leads are connected with one another Decrease the minimum light quantity Appropriate image (A) Some lead insides are chipped or missing 23／ 21 (B) Information Gathering when Recognition Error Occurs u If a recognition error occurs, gather the following information for the error factor analysis analysis  Recognition error screen information For NPM, when a recognition error occurs, such information as code number of recognition error (error summary) and summarized pickup state and set lamp value will be recorded as the error screen information In the following procedure, the error screen information can be saved to an LNB/SD card 1) Saving at the recognition device maintenance screen when the machine stops Step 1: Enter the recognition device maintenance screen, and press the “History Save” button 2) Save method by transferring the error history of each PCB production to LNB In the following procedure, the error screen information can be transferred to LNB for each PCB production in automatic operation It can be used for the component pickup state check etc when pickup is unstable Step 1: Choose the soft switch from the main menu Step 2: Set the recognition image LNB transfer in No OFF  ON After PCB is produced, the error history as of then will be transferred to LNB It will be saved to “/ / lnbroot/machineinformation / ***(machine serial) / log / rer.” Step 2: When it prompts for the destination to save the recognition data, specify LNB or SD When LNB is specified: //lnbroot/machineinformation/***(machine serial)/log/rer When SD is specified: /PRIVATE/MEIGROUP/PFSC/NPM/***(machine serial)/RECOG 24／ 21  Recognition detail image information To conduct the recognition check test after acquiring the recognition image data itself, in case of recognition error, for the purpose of recognition data check, etc., acquire the “recognition detail image information” in the following procedure Step 1: Enter the recognition device maintenance screen, and press the “Image Save” button Step 2: The button of the nozzle recognized last on the operation stage is active Select the button of the nozzle that has picked up the desired component, and press the “Save” button * The “Check” button displays the component image of the selected nozzle Step 3: When it prompts for the destination to save the recognition data, specify LNB or SD When LNB is specified: //lnbroot/machineinformation/***(machine serial)/log/rer When SD is specified: /PRIVATE/MEIGROUP/PFSC/NPM/***(machine serial)/RECOG • The recognition detail image information recorded by this operation is the image data of the component that underwent the recognition scanning last To acquire the image information in case of an error in a specific component, set “error stop count = 1” for this component, and operate/acquire data while the machine is in a single stop state because of the error After the machine is restarted or after another component undergoes the recognition scanning, the source image data will be abandoned 25／ 21