Micromechanical Photonics - H. Ukita Part 1 ppt

[...]... [1. 5] for both large projection display and color printing, optical switches [1. 6 ,1. 7] for communication, microservo mechanisms 2 1 From Optical MEMS to Micromechanical Photonics [1. 8, 1. 9] for optical and magnetic recording, and µ-TAS [1. 10] for medical treatment Advanced lithography has been applied not only to silicon (Si) but also to thin film materials, including dielectric [1. 11] , polyimide [1. 12],... urethanebased resin (SCR-500), as shown in Fig 1. 10 [1. 29] Since the two-photon 1. 2 Fabrication Methods 9 Table 1. 1 Comparison of proposed photoforming methods with high resolution method light source laser wavelength (nm) power resin a super IH process spinner titan-sapphire laser 780 50 kW (peak) urethane based (SCR-500) 3-D scanning He–Cd laser 442 1. 5 mW urethane based (Threshold) 3-D scanning laser... integrated with a surface-emitting LD [1. 16] A moving cantilever has been integrated with edge-emitting LDs and a photodiode in a resonant sensor [1. 17] Monolithic integration technologies are expanding the field of micromechanical photonics Novel probing technologies such as the scanning tunneling microscope (STM) and optical tweezers have advanced our knowledge of surface science [1. 18, 1. 19] and technology,... view F2 F1 Stators Rotor +V A A9 F3 F2 T9 T F1 Phasing scheme F39 F3 F1 F2 F1 Polysilicon Fixed axle +V F2 F19 T T9 F29 F3 Silicon nitride Silicon dioxidie Cross section Fig 1. 3 Top view, cross-section, and the phasing scheme of a micromotor fabricated by surface micromachining [1. 2] c 19 88 IEEE In the case of thick microstructures, SU-8 resists are widely used [1. 23] Physical properties of SU-8 can... 17 3 5.3 Experimental Analysis 17 9 5.3 .1 Comparison of Near-Field Probes 17 9 5.3.2 Photocantilever Probe 18 0 5.3.3 Gold Particle Probe 18 4 5.4 Future Applications 19 3 5.4 .1 Conventional Superresolution 19 3 5.4.2 Near-field... characteristics: 1 2 3 4 5 high-resolution patterning (less than 0 .1 µm) Easy and precise deflection by electrostatic or magnetic field No need for mask process Low throughput due to direct e-beam writing Low aspect ratio (less than 1 µm thick) 1. 2.2 Three-Dimensional Micromachining LIGA A surface-micromachined device has a thickness less than 10 0 µm However, many micromechanical devices, particularly microactuators,... devices [1. 20] One choice is the silicon-oninsulator (SOI) technology [1. 21] Advantages of the SOI technology are its simplicity and small number of process steps Group III–V compounds, such as GaAs and InP, are attractive candidates for monolithic integration of optical and mechanical structures [1. 14, 1. 15] Concrete examples are given later 1. 2 Fabrication Methods (a) Undercut Mask 3 (b) Fig 1. 1 Isotropic... 15 8 4.5.3 Velocity Vector and Flux Amount Analyses 15 9 4.6 Mixer Application for µ-TAS 16 3 5 Near Field 16 7 5 .1 Background 16 7 5.2 Theoretical Analysis 16 9 5.2 .1 FDTD Method 16 9 5.2.2... very large aspect 6 1 From Optical MEMS to Micromechanical Photonics Electron-beam Exposed part Resist Substrate Fig 1. 5 Electron beam lithography (EBL) in which focused high-energy electrons are irradiated to the electron-sensitive resist Syncrotron radiation Mask PMMA resist Metal substrate Development Ni deposition Mold Fig 1. 6 Lithographie galvanoformung abformung (LIGA) involves X-ray lithography... LD room temperature continuous oscillation in 19 70 and micromachining technology [1. 1, 1. 2] based on photolithography and selective etching in the late 19 80s resulted in the birth of optical MEMS [1. 3] /micromechanical photonics [1. 4] that combines/integrates electrical, mechanical, thermal, and sometimes chemical components through optics in the early 19 90s Various kinds of optical MEMS have been developed . oscil- lation in 19 70 and micromachining technology [1. 1, 1. 2] based on photolitho- graphy and selective etching in the late 19 80s resulted in the birth of optical MEMS [1. 3] /micromechanical photonics. 200692 011 2 ISBN 10 3-5 4 0-3 13 3 3-8 Springer-Verlag Berlin Heidelberg New York ISBN 13 97 8-3 -5 4 0-3 13 3 3-5 Springer-Verlag Berlin Heidelberg New York springer.com © Springer-Verlag Berlin Heidelberg. Biwako February 2006 Hiroo Ukita Contents 1 From Optical MEMS to Micromechanical Photonics 1 1 .1 Micromechanical Photonics – An Emerging Technology . . . . . . . 1 1.2 Fabrication Methods . . . . .