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sections, the sensor location is chosen to be x s ¼0.9 m, which was an ‘optimal’ location for the most number of axial and flexural modes. Uncontrolled and controlled longitudinal displacements at the strut–fuselage interface are plotted in Figure 15.21. The appearance of a number of secondary axial–flexural coupled modes can be seen in this figure. It can be noted that the additional secondary modes do not contribute significantly to the axial- displacement response compared to those due to the primary modes. However, this is not the case for the flexural-displacement response, where the primary modal amplitudes are influenced considerably by the secondary coupled modes, leading to shifts in the locations of poles and zeros of the closed-loop system. While constructing the closed-loop system, it is assumed that the sensor outputs corresponding to both x s x a 500 N q 500 N 50 N 15 kN x ActuatorSensor Fuselage interface Gearbox interface z Figure 15.20 Configuration of an active strut for the control of axial–flexural waves. 0 1 2 3 4 5 6 7 8 9 1 −200 −180 −160 −140 −120 −100 −80 −60 Frequency (kHz) Longitudinal displacement at fuselage interface (dB) Original Strut With dead actuators Closed−loop Figure 15.21 Longitudinal displacement responses at the fuselage interface for various gain-parameter values: X s ¼ 0:9m; X a ¼ 0:6m; y ¼ 90  . Vibration and Noise-Control Applications 393 of the longitudinal and transverse forced-frequency responses are available from the chosen sensor location. The longitudinal and inclined actuators are driven based on these measured longitudinal and transverse responses, respectively. Among different sets of parametric values, considered for velocity feedback gains (g u for the long- itudinal actuator and g w for the inclined actuator) and x s , considered earlier for the control of axial and flexural waves separately, the best results were achieved for g u ¼17.0 and g w ¼340.0. From these results, it can noted that with a constant gain velocity feedback scheme, an increase in effort to control the flexural waves leads to less attenuation in the longitudinal response. The modeling efforts presented here may be used as a basis for carrying out the ‘path-treatment’ for helicopter cabin noise. In such cases, it is of interest to know the level of energy attenuation at the spatial location of interest; here, the strut–fuselage interface. The kinetic energy has contributions from longitudinal (primary) and transverse (secondary) motions. In order to analyze the distribution of total kinetic energy among its longitudinal and transverse components in the closed-loop system, Figure 15.22 is presented. Plots of the normalized spectra of the relative amplitudes of the kinetic energy, ^ E u , for the longitudinal motions and ^ E w , for the transverse motions at the strut–fuselage interface are shown in this figure. The corresponding expressions are given by: ^ E u ¼ jð ^ u 0 Þ 2 j jð ^ u 0 Þ 2 þð ^ wÞ 2 j ; ^ E w ¼ 1 À ^ E u ð15:2Þ where ^ u 0 and ^ w are the spectral amplitudes of the long- itudinal and transverse displacements, respectively, at the strut–fuselage interface. From this figure, it can be said that the kinetic energy associated with the significant transverse modes is attenuated, except at the frequency locations close to the first transverse resonance mode and the other three modes associated with resonances near 5.2 and 6.8 kHz. REFERENCES 1. T.H.G. Megson, Linear Analysis of Thin Walled Elastic Structures, Surrey University Press, Guildford, UK (1974). 2. Mira Mitra, Active vibration suppression of composite thin walled structures, M.Sc. Thesis, Indian Institute of Science, Bangalore, India (2003). 3. Mira Mitra, S. Gopalakrishnan and M. Seetharama Bhat, ‘Vibration control in a composite box beam with 0 2 4 6 8 10 12 −0.5 0 0.5 1 1.5 Frequency (kHz) Relative amplitude of kinetic energy E u E w E u Uncontrolled Controlled Figure 15.22 Distribution of kinetic energy between the longitudinal and transverse components at the fuselage interface for y ¼ 90  . 394 Smart Material Systems and MEMS piezoelectric actuators’, Smart Structures and Materials, 13, 676–690 (2004). 4. A.E. Staple and D.M. Wells, ‘The development and testing of an active control of structural response system for the EH101 helicopter’,inProceedings of the 16th European Rotorcraft Forum, pp. III.6.1.1–III.6.11 (1990). 5. A.E. Staple and B.A. MacDonald, ‘Active vibration control system’, US Patent, 5 219 143 (1993). 6. T.J. Sutton, S.J. Elliott, M.J. Brennan, K.H. Heron and D.A.C. Jessup, ‘Active isolation of multiple structural waves on a helicopter gearbox support strut’, Journal of Sound and Vibration, 205,81–101 (1997). 7. P.A. Nelson and S.J. Elliott, Active Control of Sound, Academic Press, London, UK (1992) 8. S.J. Elliott and L. Billet, ‘Adaptive control of flexural waves propagating in a beam’, Journal of Sound and Vibration, 163, 295–310 (1993). 9. M.J. Brennan, S.J. Elliott and R.J. Pennington, ‘The dynamic coupling between piezoceramic actuators and a beam’, Journal of Acoustical Society of America, 102, 1931–1942 (1997). 10. C.A. Yorker, Jr, J. Newington, W.A. Welsh, N. Haven and H. Sheehy, ‘Helicopter active noise control system’, US Patent, 5 310 137 (1994). 11. T.A. Millot, W.A. Welsh, C.A. Yoerkie, Jr, D.G. MacMartin and M.W. Davis, ‘Flight test of an active gear-mesh noise control on the S-76 Aircraft’,inProceedings of the 54th Annual Forum of the American Helicopter Society, 1, pp. 241–249 (1998). 12. I. Pelinescu and B. Balachandran, ‘Analytical study of active control of wave transmission through cylindrical struts’, Smart Materials and Structures, 10, 121–136 (2001). 13. D. Ortel and B. Balachandran,‘Control of flexural wave transmission through struts’,inProceedings of the SPIE Smart Structures and Materials Conference on Smart Struc- tures and Integrated Systems, 3668(2), SPIE, Bellingham, WA, USA, pp. 567–577 (1999). 14. A.H. von Flotow, ‘Disturbance propagation in structural networks’, Journal of Sound and Vibration, 106, 433–450 (1986). 15. D.W. Miller and A. von Flotow, ‘A traveling wave approach to power flow in structural networks’, Journal of Sound and Vibration, 128, 145–162 (1989). 16. J. Pan and C.H. Hansen, ‘Active control of total vibratory power flow in a beam. I: physical system ana- lysis’, Journal of Acoustical Society of America, 89, 200–209 (1991). 17. P. Gardonio and S.J. Elliott, ‘Active control of wave in a one- dimensional structure with scattering termination’, Journal of Sound and Vibration, 192, 701–730 (1996). 18. A.H. von Flotow, ‘Traveling wave control for large spacecraft structure’, Journal of Guidance and Control, 9, 462–468 (1986). 19. D. Roy Mahapatra, ‘Development of spectral finite element models for wave propagation studies, health monitoring and active control of waves in laminated composite structures’, Ph.D. Thesis, Indian Institute of Science, Bangalore, India (2003). 20. I. Pelinescu and B. Balachandran, ‘Analytical and experimental investigations into active control of wave transmission through gearbox struts’,inProceedings of the SPIE Smart Structures and Materials Conference on Smart Structures and Integrated Systems, 3985,SPIE, Bellingham, WA, USA, pp. 76–85 (2000). 21. D. Roy Mahapatra, S. Gopalakrishnan and B. Balachandran, ‘Active feedback control of multiple waves in helicopter gearbox support struts’, Smart Structures and Materials, 10, 1046–1058 (2001). Vibration and Noise-Control Applications 395 Index Absorber SAW accelerometer, 89, 334 X-ray lithography, 277 Vibration, 13, 82, 243 Accelerometer Absorbers, 89, 334 Applications of, 14, 15 integrated with CMOS, 308 with movable gate FET, 54 with SAW IDT combined with gyroscope, 372 design, 88 fabrication, 333 Acoustic admittance, 98 aperture, 338 emission sensor, 371 impedance, 86, 332 comparison of properties, 86 PVDF, 60 sensor, 57, 86 wave, 57, 97 Lamb wave, 326 Love wave, 57 sensor, 371 Active control, 212 Composite Beam, 248 Active damping, 11 Actuation law, 114, 187 actuator dynamics Cantilever beam, 251 Actuator (see also Transducers) applications of, 14, 15 collocated with sensors, delamination, 356 Comparison of schemes, 83 Control strategies, 247 definition of, 6 in microfluidic systems, 100 in smart systems, 7 magnetostrictive cantilever with, modeling of, 211 noise control in helicopter, 386 spectral element model of beam with, 213 piezoelectric modeling of, 188, 189 vibration control with, 378 piezofiber composite modeling of, 212 spectral element model of beam with, 213 polymers for, 27 PZT mounted beam, modeling of, 203 Adaptive control, 387 filter, 248 structures, 216 definition, 4 Adhesion of sputtered thin films, 21 comparison of curing schemes, 33 properties of polymers, 282 AMANDA process, 302 Amorphous thin film, 49 Amplifier charge preamplifier, in piezoelectric sensor, 86 differential, in resonant sensor, 53 high isolation, in wireless telemetry, 368 MOSFET, in PVDF hydrophone, 87 power amplifier, in structural health monitoring, 351 Analogies, 64 Anisotropic composite beam, wave equation for, 135 Anisotropic etchants, 260, 269 etching, 261, 271, 317 nature composites, 118 piezoelectric substrate, 58, 73 Annealing after direct bonding, 262 for ion implantation, 271 interfacial stress, 314, 322 Smart Material Systems and MEMS: Design and Development Methodologies V. K. Varadan, K. J. Vinoy and S. Gopalakrishnan # 2006 John Wiley & Sons, Ltd. ISBN: 0-470-09361-7 Annealing (continued) rapid thermal, for stress relief, 308, 337 solgel deposited films, 25 sputtered films, 25 Anodic bonding, 262 comparison with other schemes, 321 piezoresistive sensors, 50 Anodization, pulse potential, 270 APCVD (atmospheric pressure chemical vapor deposition), 266 Area coordinates, 161 Array of reflectors in SAW, 89, 334–336 ball-grid, 316 micro-mirror, 317 of perturbation mass, 372 of reaction chamber, 243 of electrodes, 216 of optical fibers, 286 Assay buffer, 344 Axisymmetric model, 213 ball-grid array, 316 bar element, Quadratic, 169, 170 Beam element, FEM, 160 exact solution, 160 piezofiber composite Actuator, spectral element model, 213 spectral element model piezofiber composite Actuator, 213 as flexural waveguide, 134 bending modes, 203, 378 composite, 135, 140, 195 active control of, 248 PFC, 252 piezoelectric bimorph, 195 smart, 195, 196, 350 Spectral element modeling, 215 Terfenol-D, 210 Euler–Bernoulli model, 215, 222 isotropic, wave propagation in, 139 laminated composite, wave equations for, 135 modeling of, PZT Actuator, 203 dispersion relation, 142 spectrum relation, 142 Bending mode wave, 144, 383 moment, 215 rigidity, 152 stiffness, 128 bimorph beam, 195 modes in a beam, 203, 378 bimorph beam, 195 Bending, 195 electrothermal, 80 magnetostrictive, 211 piezoelectric composite, 195, 378 PVDF, 196, 202 bimorph plate, 188 Biomimetic materials, 5 Bonding layer, 217 Bonding, flip chip, 315 hermetic, 317 Boundary conditions, 91, 118, 149, 152 in beams, 153, 252 in coupled analysis, 210 in FEM, 193, 199 in spectral element modeling, 215 Bragg grating, 52 Cantilever beam, 202, 211 distributed actuator, dynamics, 251 dynamics, 244 Cantilever rod, 181 Cantilever, carbon nanotube, 228 Capacitance analytical model of sensor, 216 deflected diaphragm, 46 gate, 55 in electromechanical analogies, 64 PZT, 218 carbon nanotube composites, 35, 60 Electrical Conductivity, 38 Carrier mobility, 55, 88 Carrier signal, 370 ceramic, Composites, 23 Ceramics, Deposition, 22, 268 Channel, current density, 54 Charge preamplifier, in piezoelectric sensor, 86 Charge electromechanical analogy, 64 generated in electrostrictive, 76 generated in piezoelectric, 48, 73, 85, 97, 360 stored in electrostatic actuator, 65 in polymerization, 29, 30 Classical finite difference technique, 150 closed loop control, 10, 232, 384 CNT sensor, CV diagrams, 341 CNT, UV curable polymer composite, 39 comparison bonding schemes, 321 actuation schemes, 83 Compliance, 63, 64 Composite Beam, 135, 140, 195 active control of, 248 active control, 248 laminated, 135, 140, 353 composite smart beam, 195, 196, 350 laminated, 120 metal/polymer, 300 piezoelectric, 191 398 Smart Material Systems and MEMS piezofiber, 212 sensors, modeling, 212 smart structure, 188, 192, 205 anisotropic nature, 118 carbon nanotube, 35, 60 ceramic, 23 structural health monitoring, 349 Conductivity, Electrical, 18 Electrical, of carbon nanotube, 38 Conductivity, in liquid sensing, 99 Conductivity, thermal, 18 Control of cracks, open loop, 364 Control strategies, actuator, 247 vibration control, 247 Control variable, 231 Control Vibration with Piezoelectric actuator, 378 closed loop, 10, 232, 384 open loop, 9, 194, 232, 384 open loop, cracks, 364 active, 212 Adaptive, 387 Controllability, 238, 247 Coriolis force, in SAW sensor, 373 coupled analysis, Boundary conditions, 210 Crack detection, 216, 273, 326, 349, 370 Crack formation, in packages, 315 Crack formation, in structures, 321, 362 Crystal cut, piezoelectric, 57, 85, 367 Crystal growth, silicon, 19, 260 Crystal orientation, 20, 260, 271 Crystal structure, 18, 81 Current density, effect on electrodeposition, 296 Current CV diagrams of CNT sensor, 341 drain current in FET, 55, 87 electromechanical analogy, 64 in electromagnetic actuator, 69 in electrostatic actuator, 67 in electrostrictive actuator, 76 CVD, 21, 39, 264, 332 of dielectrics, 266 Damping force, 157, 163, 231, 377 matrix, 159, 164, 168, 171, 234, 242 Data acquisition system, 327 Data fusion, 374 Delamination, actuator, collocated with sensors, 356 Demolding, 297 Deposition, 21 of ceramics, 22, 268 of metal, 20, 264 of polymer thin films, 35, 59 of Silicon, 263 Electrochemical, 299 Polysilicon, 268, 273 Pulse laser, 35 Silicon dioxide, 272, 273 Silicon nitride, 331 Sol-gel, 22, 25 Thick film, 23 Thin film, 22, 25, 263 Diaphragm, 26, 46, 80, 101, 317 capacitance, 46 micro valve, 100 Dielectric polarization, 74 Dielectrics, CVD, 266 Differential Amplifier, in resonant sensor, 53 Dipole moment, 48, 59, 73 Direct bonding, Annealing in, 262 Direct electromechanical analogies, 64 Dispersion angle, 327 Dispersion relation, 129, 135, 182, 326, 369 For beams, 142 Divergence theorem, 113, 155 Dopant selective etching, 260 Double cantilever beam, 361 Drain current in FET, 55, 87 DRIE (deep reactive ion etching), 260 Dry etching, 260 Effective mass, 77 stress, 217 Eigen structure, 240, 381, 383 Elastic constant, 48, 58, 75, 115, 124 waves, 57 Electrical conductivity, 18 Electrochemical deposition, 299 Electrochemical etching, 269 fabrication, 296 polymerization, 27, 282, 340 Electrodeposition, 296 Electrodynamic transducer, 70 Electromagnetic transducer, 68 Electromechanical analogies, 64 Electromechanical coupling coefficient, 99, 338 Electroplating, 21 Electrostatic transducer, 64 Electrostrictive transducer, 74 Electrothermal actuator, 80 Emission sensor, acoustic, 371 Epitaxial deposition, 20 Etch stop, 19, 260, 269, 270 Electrochemical, 269 Polycrystalline, 269 Etchant, 260, 269 anisotropic, 260, 269 Anisotropic, properties, 269 Index 399 Etching, 254, 263 Anisotropic, 260, 261 Eulerian coordinates, 106 strain tensor, 108 Eutectic bonding, 317, 318 Evaporation, 21, 264 Metal, 21, 264, 289, 335 Exact solution, 151, 160, 183 Excimer laser, 290, 294 Feedback control, 232, 239, 248, 365, 380 gain, 251, 388 sensor, 250, 391 System, Block Diagram, 248, 327, 343, 378 FEM, 115, 128, 145–185, 234 Superconvergent formulation, 147, 178, 380 fiber optic gyro Open loop configuration, 93 Field Strength, 74, 78 Finite Difference Method, 2 Flexural Plate Waves, 57, 97 Flexural waveguide with beam, 134 Flip chip, bonding, 315 Force balance, 65 Force method, 145 Force –Piezoelectric, 9 Fourier Transform, 129, 182, 233, 243 Friction, 36, 171, 371 Gas damping, 53 Gate capacitance, 55 Hamilton principle, 135, 156, 192 Helicopter noise control, Magnetostrictive actuator, 386 Hermetic bonding, 317, 320 Hermetic package, 312 High aspect ratio micro-fabrications, 288 micromachining, 301 microstructures, 8, 26, 257, 284, 290 high isolation amplifier, in wireless telemetry, 368 Hookean elastic solid, 114 Hooke’s law, 114 Hot embossing, 289 Hybrid processing, 8 Hybrid technology, 366 hydrophone, MOSFET Amplifier in, 87 IDT accelerometer, 332, 372 IDT accelerometer, 372 Impact damage, 366, 370 induced Strain, 12, 96, 195, 352 Inductor, moving coil, 68 Inertial constants, 136, 202 coupling, 136 force, 55, 148, 242 frame of reference, 92 loading, 371 navigation system, 366, 372 sensors, 46, 321 space, 92 injection molding, Polycarbonate (PC), 291 Interconnect, 308 Interdigital transducers, 51, 326, 365 interfacial stress, effect of annealing, 314, 322 Inverse Transform, 131 Ion implantation, Annealing for, 271 Isoparametric elements, 167 Isotropic plasma etching, 26 solids, 118, 119 waveguide, 136 wet etching, 260 Jacobian, 107, 165, 166, 170, 193 matrix, 167 transformation, 193 J-integral, 360 Lagrange equation, 158 Lagrangian coordinates, 109 strain tensor, 108 variable, 106 Lamb wave, 326 laminated, Composite beam, 135, 140, 353 Lamination, Classical theory, 126 Laser ablation, 25, 268, 290, 309, 317 Laser and electrochemical etching, 26 Laser, excimer, 290, 294 Laser-Doppler effect, 51 Lift off technique, 259 LIGA, process, 8, 257, 269, 274 linear time-invariant System, 240 Liquid crystal display, 288 liquid sensing, by Conductivity, 99 Lithography, 257 masks in, 258 Love wave, 57 sensor, 371 Low pressure chemical vapor deposition (LPCVD), 266, 272, 321 Lumped-element model accelerometer, 88 for pressure sensor, 46 Magneto-optic effect, 51 Magnetostrictive actuator, 49, 78, 349 modeling of, 204 Structural health monitoring with, 349 400 Smart Material Systems and MEMS Metal Deposition, 20, 264 evaporation of, 21, 264, 289, 335 sputtering of, 21 metal/polymer composite, 300 Metallo organic chemical vapor deposition (MOCVD), 21, 265 Micro-channel, 344 Microfabrication, electroplating, 21 Microfludic system, 342 Actuation, 100 Micromachining demolding in, 297 Micromolding, 289 in capillaries (MIMIC), 292 micro-mirror array, 317 Micro-nozzles, 29 Micro-transfer molding, 291 Minority carrier lifetime, 19 Mobility analogies, 64 MOCVD, 265 model, axisymmetric, 213 Modeling of carbon nanotubes, 35, 219, 340 magnetostrictive actuator, 204 piezofiber composite Actuator, 212 PZT mounted beam actuator, 203 piezoelectric actuator, 188, 189 cantilever with Magnetostrictive actuator, 211 Composite, sensors, 212 Molding, Micro-transfer, 291 Molecular beam epitaxy (MBE), 20 Monolayers, self assembled, 223 MOSFET Amplifier, in PVDF hydrophone, 87 Movable gate FET, Accelerometer, 54 Multichip modules (MCMs), 311 multilayer packages, 315 Nanocomposite, 39, 221 n-channel MOSFET 55, 86, 328 Negative resists, 258 Nickel electroplating, 296 Open loop, fiber optic gyro, 93 open loop Control, 9, 194, 232, 384 Operational amplifier, 54, 86 optical fiber array, 286 Optical, glucose sensors, 340 Optimum damping, 82, 233 Organic materials deposition methods for, 59, 266 nonstandard, 21, 264 patterning of, 31, 257, 259, 297, 330, 335 Organic thin films, 35, 59 Oxidation, 265 processes, 266 Packaging, 307–322 Passivation, 50, 321, 332 electrochemical, 269 PCR, 240 PDMS, 37, 289, 292 Passive valve, 100 PDMS (polydimethylsiloxane) process critical dimensions in, 260 line width in, 258, 287, 295 profiles in, 37 reactors for, 343 Passivation, 37, 289, 292 Permalloy electroplating of, 21, 282, 290, 296–298, 300 Permanent magnets, 22 perturbation mass, 372 PFC Beam, 252 Phase modulation, 93 Phospho silicate, 274, 307, 318 Phosphosilicate glass thin films, 274, 307 Photo electrochemical (PEC) etching, 8 Photoforming process, 9, 293 Photolithography, 14, 287, 289 Photoresist, 258 as masking layer for implant, 272 deposition of, 31, 290, 335 spin casting of, 332 SU-8, 263, 332, 342 electron-beam, 258 negative, 258 patterning, 31 positive, 258, 331 removal of, 297 Physical vapor deposition, 21, 264 PID control, 239, 240 Piezoelectric actuator, 364 modeling of, 188, 189 vibration control with, 378 bimorph, 195 bimorph, composite, Beam, 195 Piezoelectric coefficient, 85, 187 Piezoelectric composite, 191 Piezoelectric effect, 12, 333 Piezoelectric material, 4, 11, 48, 57, 77, 89, 187, 249, 338 Piezoelectric sensor, charge preamplifier, in, 86 substrate, anisotropic nature, 58, 73 transducer, 73 Crystal cut, 57, 85, 367 Piezoelectricity, 12, 48, 59, 195 Piezofiber composite Actuator modeling of, 212 spectral element model of beam with, 213 Piezoresistive pressure sensor, 94, 267 Piezoresistive sensors, anodic bonding, 50 Planarization, 298, 308 Index 401 Plane stress, 120, 127, 136, 189, 359 Plasma enhanced chemical vapor deposition (PECVD), 272, 332, 336 Plasma etching, 26, 260, 269, 272 Plasma in dry etching processes, 260 reactors for, 265, 272, 274 as etchants, 26, 260, 269, 272, 289, 321 etch rates, 260, 269 in deposition techniques, 263, 266, 332 ionization of, 260 Plastics PMMA (poly( methylmethacrylate)), 18, 277, 343 Polycarbonate (PC), in injection molding, 291 PDMS process in x-ray lithography, 275 Polyethylene (PE), in injection molding,289, 291 PMMA (poly( methylmethacrylate)), 18, 277, 343 Point load, 178, 179, 192 Poisson equation, 118 Polarization, dielectric, 74 Polycarbonate (PC), in injection molding, 291 Polycrystalline silicon, 8, 273 as etch mask for KOH, 260 as etch stop, 269 as masking layer for implant, 317 CVD of, 273 etch rate in KOH, 269 mechanical properties of, 19 PDMS process in x-ray lithography, 275 Polyimide, 60 polymer thin films, Deposition, 35, 59 polymerization, Electrochemical, 27, 282, 340 Polymers actuator for, 27 Polyoxymethylene (paM) resist, 291 properties, 282 Polysilicon, 50, 54,62, 80, 89, 263, 266, 268, 272, 273, 274 deposition, 268, 273 Polystyrene, 36 Polyvinylidene, 86, 102 Positive Photoresist, 258, 331 power amplifier, in structural health monitoring, 351 Principle of Potential energy, 154 Principle of Virtual Work, 115, 147, 254 Projection operator, 244 Projection, 8, 112, 284, 285 Proof mass, 53, 54 properties of polymers, 282 Proportional damping, 159 Proportional, 296, 336 Protein synthesis, 343, 344 Proximity printing, 275 Pulse laser deposition, 35 pulse potential anodization, 270 PVC, 2, 36, 340 PVD, 21, 264, 302 Pyrex, 50 PZT mounted beam actuator, modeling of, 203 PZT, Capacitance, 218 Q_matrix, 126 Quadratic bar element, 169, 170 Quadratic functional, 152 Quadratic rod element, 165 Quadrature, 166, 179 Quantum-well spectrum, 51 Quartzite, 19 Radial-flow, 266 Radiation, 24, 29 Radical-generating photoinitiator, 33 Rain monitors, 14 Rapid thermal annealing (RTA), 307 Rare earth elements, 5 Rate of formation, 33 Reaction chamber, 243 Rectangular element, FEM, 160 Rectangular grid, 106 Refractive index, 92 Refractory material, 21 Residual stress, 51, 91, 273, 360 Resistance change, 50, 95 Resistive heating, 82 Resonant frequency, 100, 233, 320 resonant sensor, differential amplifier in, 53 Resonator, 14, 53, 68, 323, 367 Rod element, FEM, 160 rod, cantilever, 181 Root locus, 237, 238, 239, 248, 391 Rotation rate, 14, 15, 52, 92 Rotational Inertia, 140, 215 Sacrificial layer, 26, 271–277 Sagnac effect, 51, 92 SAW accelerometer, 332, 372 combined with gyroscope, 372 design, 88 fabrication, 333 SCREAM, 26, 269, 271 Screen printing, 314 Second-order system, 135, 161, 232, 237 Self assembled monolayer, 223 Sensitivity analysis, 369 Shape memory alloy (SMA), 3, 5, 22, 81 Shape memory alloy (SMA), in thermal actuators, 81 Shape memory, applications of, 14 Shape memory, effect, 81 Shape memory, phase transformation, 3, 81 Shape memory, stress-induced martensite, 81 Shell CNT, 38, 221 finite element, 203 402 Smart Material Systems and MEMS thermal, 313 Shipley, 331, 335 Silica, 27, 52 Silicon dioxide, 260, 271, 313, 334, 373 deposition, 272, 273 Silicon growth, 19–20 hardness, 19 in micromachining, 110–111 nitride deposition, 331 [100] orientation, 19, 261, 269 [1l0] orientation, 261, 269 crystalline, 8, 19, 26, 257, 269 deep reactive ion etching, 260 deposition and etching of, 263 lattice planes in, 296 mechanical properties of, 17, 19, 21, 33 orientation of, 19, 261, 269 oxidation of, 265 physical/chemical etching, 260, 269, 271 piezoresistivity, 50 residual stress, 51, 91, 273 resists in, 258 Single crystal silicon, 268, 271 Wet etching, 260 silicon-on-insulator, 262, 318 Single crystal silicon, 268, 271 slotted-quartz, 256, 266 SMA, Crystal structure, 81 Smart composite beam, 195, 196, 350 smart structure, Composite, 188, 192, 205 Smart systems, Actuator, 7 solgel deposited films, Annealing, 25 Sol-gel deposition, 22, 25 Space-charge density, 87 Sparse matrix, 173 Spectral element model of beam with piezofiber composite Actuator, 213 with magnetostrictive actuator, 213 Boundary conditions, 215 composite beam, 215 Spectrum relation, 129, 135, 139 spin casting, 332 Spring-mass-damper system, 233, 236 sputtered films, Annealing, 25 sputtered thin films, Adhesion of, 21 Sputtering, Metal, 21 Stability analysis, 239 State equations, 234, 236 State variables, 65, 71, 76, 81, 234 Stiction, 313 Stiffness coefficients, 124, 137, 183, 199, 252 stiffness, bending, 128 Strain energy, 135, 147, 162, 197 Stress gradient, 164 stress relief, by rapid thermal annealing, 308, 337 Stress normal, 112 principal, 111 residual, 51, 91, 273 Stress-induccd martensite, 81 Structural health monitoring with Magnetostrictive transducer, 349 power amplifier in, 351 Structure, modeling of, for control, 189, 248 SU-8 resist, 263, 332, 342 Spin casting, 332 Surface micromachining, 8, 26, 271–275 Surface tension, 273, 335 Synchrotron radiation, 275 System architecture, 8 System, linear time-invariant, 240 System, linear, 232, 237 Terfenol-D, composite, 210 Thermal annealing, 262, 314 Thermal Conductivity, 18 evaporation, 318 Thermal expansion coefficient, 51, 80, 82, 314, 316 Thermal stress, 314 Thick film deposition, 23 Thick films, 23 Thin film deposition, 22, 25, 263 Thin film multilayer packages, 315 Thin film sensors, 216 thin films, sputtering, adhesion of, 21 Transconductance, 87, 328 Transducer comb type electrostatic, 68 Electrodynamic, 70 Electromagnetic, 68 electrostatic, 64 Electrostrictive, 74 Electrothermal, 80 Magnetostrictive, 74 Structural health monitoring with, 349 piezoelectric, 73 Transduction factor, 67, 72, 76, 80 transition temperatures, 77, 291 Triangular element, FEM, 160, 161 Tuned system, 286 Tungsten, 21, 264, 273, 307 Ultrasonic actuators, 15 Ultrasonic energy, 312 Ultrasonic NDT techniques, 325, 348 Ultrasonic probe, 39 Ultrasonic transducer, 7, 73, 325, 326 Ultrasonic wire bonding, 313 Ultrasonicated, 340, 341 Index 403 [...]...404 Smart Material Systems and MEMS Ultraviolet irradiation, 27, 282 Ultraviolet light, 31 Undercut etching of channels, 274 Undercut of the mask, 272 Unit feed back, 239 Unit gate area, 55 Unmanned carriage system, 13 Unstable system, 237, 239 UV curable polymers, 8, 27, 263, 281 UV curable polymers, with CNT, 39 UV, 258, 291 Vacuum Pressure reservoir, 21, 24, 50, 264 Valence band, 18, 38... Variational methods, 145 Velocity feedback, 251, 394 Velocity of sound, 57, 67, 89 Very low pressure chemical vapor deposition (VLPCVD), 265 Vibration absorber, 13, 82, 243 колхоз 10/24/06 Virtual work, 114, 154 Viscoelasticity, 105 Wafer bonding, 261, 317–320, 335 wave equation for anisotropic composite beam, 135 laminated composite beam, 135 wave propagation in composite beam, 143 isotropic beam,... isotropic beam, 139 Wet bench, 3, 35 Wet chemical etchant, 271 Wet etching, 50, 260, 269, 310, 317 Wet oxidation, 329 Wetting action, 316 Wheatstone bridge, 45, 50, 95 Wire bonding, 310 Work, virtual, 114, 154 x-ray lithography, 275 . stress, 314, 322 Smart Material Systems and MEMS: Design and Development Methodologies V. K. Varadan, K. J. Vinoy and S. Gopalakrishnan # 2006 John Wiley & Sons, Ltd. ISBN: 0-4 7 0-0 936 1-7 Annealing. kinetic energy between the longitudinal and transverse components at the fuselage interface for y ¼ 90  . 394 Smart Material Systems and MEMS piezoelectric actuators’, Smart Structures and Materials,. struts’,inProceedings of the SPIE Smart Structures and Materials Conference on Smart Struc- tures and Integrated Systems, 3668(2), SPIE, Bellingham, WA, USA, pp. 567–577 (1999). 14. A.H. von Flotow, ‘Disturbance

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