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MINISTRY OF EDUCATION AND TRAINING HO CHI MINH CITY UNIVERSITY OF TECHNOLOGY AND EDUCATION FACULTY FOR HIGH QUALITY TRAINING GRADUATION PROJECT MECHANICAL ENGINEERING TECHNOLOGY RESEARCH, DESIGN AND MANUFACTURING 2-DOF XY COMPLIANT USING SOFT STRUCTURE COMBINATION OF AMPLIFIER FOR PRECISION LOCATION SYSTEM BASE ON WIRE CUTTING TECHNOLOGY LECTURER: M.E DANG MINH PHUNG NGUYEN THANH TAN STUDENT: PHAN NHAT HIEU SKL009921 Ho Chi Minh City, February 2023 HCMC UNIVERSITY OF TECHNOLOGY AND EDUCATION FACULTY OF HIGH-QUALITY TRAINING BACHELOR THESIS RESEARCH, DESIGN AND MANUFACTURING 2-DOF XY COMPLIANT USING SOFT STRUCTURE COMBINATION OF AMPLIFIER FOR PRECISION LOCATION SYSTEM BASE ON WIRE CUTTING TECHNOLOGY Student name: Student ID: NGUYEN THANH TAN 18144049 PHAN NHAT HIEU 18144018 Major: MECHANICAL ENGINEERING TECHNOLOGY Supervisor: M.E DANG MINH PHUNG Ho Chi Minh City, February 2023 HCMC UNIVERSITY OF TECHNOLOGY AND EDUCATION FACULTY OF HIGH-QUALITY TRAINING BACHELOR THESIS RESEARCH, DESIGN AND MANUFACTURING 2-DOF XY COMPLIANT USING SOFT STRUCTURE COMBINATION OF AMPLIFIER FOR PRECISION LOCATION SYSTEM BASE ON WIRE CUTTING TECHNOLOGY Student name: Student ID: NGUYEN THANH TAN 18144049 PHAN NHAT HIEU 18144018 Major: MECHANICAL ENGINEERING TECHNOLOGY Supervisor: M.E DANG MINH PHUNG Ho Chi Minh City, February 2023 CỘNG HOÀ XÃ HỘI CHỦ NGHĨA VIỆT NAM Độc lập - Tự – Hạnh phúc PHIẾU NHẬN XÉT ĐỒ ÁN TỐT NGHIỆP (Dành cho giảng viên hướng dẫn) Họ tên sinh viên: Nguyễn Thành Tấn MSSV:18144049 Hội đồng: Họ tên sinh viên: Phan Nhật Hiếu MSSV:18144018 Hội đồng: Tên đề tài: RESEARCH, DESIGN AND MANUFACTURING 2-DOF XY COMPLIANT USING SOFT STRUCTURE COMBINATION OF AMPLIFIER FOR PRECISION LOCATION SYSTEM BASE ON WIRE CUTTING TECHNOLOGY Ngành đào tạo: Mechanical Engineering Technology Họ tên GV hướng dẫn: ThS Đặng Minh Phụng Ý KIẾN NHẬN XÉT Nhận xét tinh thần, thái độ làm việc sinh viên: Nhận xét kết thực ĐATN 2.1.Kết cấu, cách thức trình bày ĐATN: 2.2 Nội dung đồ án: (Cơ sở lý luận, tính thực tiễn khả ứng dụng đồ án, hướng nghiên cứu tiếp tục phát triển) 2.3.Kết đạt được: 2.4 Những tồn (nếu có): Đánh giá: Mục đánh giá TT Hình thức kết cấu ĐATN Đúng format với đầy đủ hình thức nội dung mục Điểm Điểm tối đa đạt 30 10 Mục tiêu, nhiệm vụ, tổng quan đề tài 10 Tính cấp thiết đề tài 10 Nội dung ĐATN 50 Khả ứng dụng kiến thức toán học, khoa học kỹ thuật, khoa học xã hội… Khả thực hiện/phân tích/tổng hợp/đánh giá 10 Khả thiết kế chế tạo hệ thống, thành 15 phần, quy trình đáp ứng yêu cầu đưa với ràng buộc thực tế Khả cải tiến phát triển 15 Khả sử dụng công cụ kỹ thuật, phần mềm chuyên ngành… Đánh giá khả ứng dụng đề tài 10 Sản phẩm cụ thể ĐATN 10 Tổng điểm 100 Kết luận: Được phép bảo vệ Không phép bảo vệ TP.HCM, ngày tháng năm 2023 Giảng viên hướng dẫn ((Ký, ghi rõ họ tên) CỘNG HOÀ XÃ HỘI CHỦ NGHĨA VIỆT NAM Độc lập - Tự – Hạnh phúc PHIẾU NHẬN XÉT ĐỒ ÁN TỐT NGHIỆP (Dành cho giảng viên phản biện) Họ tên sinh viên: Nguyễn Thành Tấn MSSV:18144049 Hội đồng: 02 STT: 27 Họ tên sinh viên: Phan Nhật Hiếu MSSV:18144018 Hội đồng: 02 STT: 27 Tên đề tài: RESEARCH, DESIGN AND MANUFACTURING 2-DOF XY COMPLIANT USING SOFT STRUCTURE COMBINATION OF AMPLIFIER FOR PRECISION LOCATION SYSTEM BASE ON WIRE CUTTING TECHNOLOGY Ngành đào tạo: Mechanical Engineering Technology Họ tên GV phản biện: TS Mai Đức Đãi Ý KIẾN NHẬN XÉT Kết cấu, cách thức trình bày ĐATN: Nội dung đồ án: (Cơ sở lý luận, tính thực tiễn khả ứng dụng đồ án, hướng nghiên cứu tiếp tục phát triển) Kết đạt được: Những thiếu sót tồn ĐATN: Câu hỏi: Đánh giá: TT Mục đánh giá Hình thức kết cấu ĐATN Điểm Điểm đạt tối đa 30 Đúng format với đầy đủ hình thức nội dung 10 mục Mục tiêu, nhiệm vụ, tổng quan đề tài 10 Tính cấp thiết đề tài 10 Nội dung ĐATN 50 Khả ứng dụng kiến thức toán học, khoa học kỹ thuật, khoa học xã hội… Khả thực hiện/phân tích/tổng hợp/đánh giá 10 Khả thiết kế, chế tạo hệ thống, thành phần, 15 quy trình đáp ứng yêu cầu đưa với ràng buộc thực tế Khả cải tiến phát triển 15 Khả sử dụng công cụ kỹ thuật, phần mềm chuyên ngành… Đánh giá khả ứng dụng đề tài 10 Sản phẩm cụ thể ĐATN 10 Tổng điểm 100 Kết luận: Được phép bảo vệ Không phép bảo vệ TP.HCM, ngày tháng năm 2023 Giảng viên phản biện ((Ký, ghi rõ họ tên) ACKNOWLEDGEMENT We lost for words to express my gratitude and admiration for my thesis and research advisor Dang Minh Phung We credit this individual with inspiring me and showing the importance of critical thinking The advisor is also acknowledged for being a brilliant and hardworking scientist We also thank the members of the thesis advisory and exam committee for my generosity in providing valuable feedback to improve the work Being a part of the team has been meaningful for us and we are grateful for the friendship and inspiration of my brilliant colleagues Finally, the administrative staff in the Faculty of Mechanical Engineering are remembered for their prompt support and kind care i 5.3 Simulation result There are some charts in simulation Figure Total deformation S1-S2 x-axis Figure 5 Total deformation S2-S3 x-axis 48 Figure Total deformation S3-U x-axis Figure Total deformation S1-S2 y-axis 49 Figure Total deformation S2-S3 y-axis Figure Total deformation S3-U y-axis 50 Figure 10 Safety factor S1-S2 Figure 11 Safety factor S2-S3 51 Figure 12 Safety factor S3-U 52 CHAPTER 6: EXPERIMENTAL TESTS 6.1 Manufacturing The compliant mechanism was cut using the wire cutting method due to its benefits The material used was 7075 aluminums because it has a high ratio of yield strength to Young's modulus, meaning it can experience more deflection before failing The single degree of freedom stage sample was cut using this method not only for its advantages, but also because it is more cost-efficient compared to water cutting The 2-DOF Amplifier can be manufactured using Wire cutting method and CNC machining The overlapping relation relationship between the plate and the base are secured by bolted joins or adhesive bonding Introduce about Wire cutting method Figure Wire cutting theory The wire cutting technique is a manufacturing process that creates intricate shapes from metal or other materials with the help of a thin wire tool The tool, created through electrical discharge machining (EDM), erodes the material and shapes it through spark erosion This method is particularly useful for cutting hard-to-cut materials and is often used in the creation of molds and dies 53 Wire cutting offers several advantages such as high precision, no physical contact with the workpiece that reduces tool wear and prevents material damage, compatibility with a wide range of materials, ability to machine hard materials, capability to produce complex shapes, and avoidance of thermal damage to the material Figure 02-DOF amplifier machining 6.2 Experimental set up In Figure 6.3, a sample of the Degree-of-Freedom stage can be seen, and the entire experimental set-up is depicted in Figure 6.4 The compliant mechanism, base, and piezo microphone actuators After the components have been manufactured and assembled, open loop experiments are performed under a microscope, as shown in Figure 6.3, to observe the behavior of the mechanism when the actuators are in operation The piezo microphone actuators can be controlled both manually and automatically by providing a voltage signal The open loop experiments are first performed by manually turning the actuator shafts, and then by applying voltage signals to the actuators The displacement of the triangular stage is measured using cameras, with a small dot placed on the triangular stage, as shown in Figure 6.4 The pixel coordinates of the point are calculated from the camera images mounted on the microscope and then converted to world coordinates 54 Figure Displacement device set-up Figure Actual measuring set-up by Digital indicator 55 6.3 Open test Measuring displacement by laser sensor: Laser base sensor Optical table Output displacement Mitutoyo Digital Indicator Input displacement on Y direction Figure Experimental set-up workspace test by laser sensor 56 Figure 6 Measuring result Table Actual results Measuring times Input displacement Output displacement Unit 55 712 µm 55 715 µm 55 680 µm 55 700 µm 55 710 µm 55 722 µm 55 716 µm 55 690 µm 55 712 µm 10 55 717 µm 57 In conclusion, the study conducted under standard conditions in the ANSYS environment showed a simulated data value of 641 µm, which was subsequently reduced to 628 µm after optimization with an error rate of 2% However, it is important to note that the experimental data may not always reflect the simulated data due to various external factors For instance, temperature variations during the measurement process may result in inaccuracies, which can significantly impact the measured data Additionally, the accuracy of the measuring equipment can also play a significant role in determining the level of error in the data Machining errors may also occur during the manufacturing process, which can further affect the overall precision and accuracy of the results Furthermore, environmental factors such as vibration can also contribute to deviations in the data Therefore, it is essential to take into account these external factors when analyzing and interpreting the results obtained from the experiments This will help to ensure that the data obtained is reliable, and any variations in the results are due to the tested variables rather than external factors In summary, while the ANSYS environment provides a valuable tool for simulating data, it is crucial to recognize the potential influence of external factors when processing experimental results 58 CHAPTER 7: CONCLUSIONS In conclusion, this thesis has presented a comprehensive study of compliant mechanisms and their potential applications Through a thorough literature review, the advantages and disadvantages of compliant mechanisms were evaluated and the need for a more advanced and optimized design was established A compliant 2-DOF stage was designed, calculated and optimized using theoretical and RSM methods The design was then manufactured and experimentally tested to verify the validity of the established analytical models and the optimized parameters The results showed that the proposed design effectively demonstrated superior performance in terms of precision, stability and accuracy The experiment was conducted to validate the simulation results and to compare the performance of the proposed design with previous designs The results showed that the proposed design outperformed previous designs and met the requirements of various applications Overall, the findings of this thesis provide valuable contributions to the field of compliant mechanisms and demonstrate the potential of compliant mechanisms for a wide range of engineering applications The proposed design and optimization method serve as a useful reference for future research and development in this field In light of these results, it is concluded that compliant mechanisms are a promising technology that can play a crucial role in various engineering applications The findings of this thesis provide valuable insights into the design and optimization of compliant mechanisms and pave the way for further research and development in this field 59 REFERENCES [1] Howell, L L., Magleby, S P., Olsen, B M., & Wiley, J (Eds.) (2013) Handbook of compliant mechanisms John Wiley & Sons, Incorporated [2] Shigley, J E., and Uicker, J J., 1995, Theory of Machines and Mechanisms, 2nd Ed., McGraw-Hill, New York [3] SP, B., & Bharanidaran, R (2020) Design and testing of a compliant mechanism-based XYθ stage for micro/Nano positioning Australian Journal of Mechanical Engineering, 110 [4] Hiemstra, D B., Parmar, G., & Awtar, S (2012) Performance tradeoffs posed by moving magnet actuators in flexure-based nano positioning IEEE/ASME Transactions on Mechatronics, 19(1), 201-212 [5] Tian, Y., Ma, Y., Wang, F., Lu, K., & Zhang, D (2020) A novel XYZ micro/nano positioner with an amplifier based on L- shape levers and halfbridge structure Sensors and Actuators A: Physical, 302, 111777 [6] Sun, X., Chen, W., Zhou, R., Zhang, J., & Chen, W (2011, June) Design of compliant parallel mechanism for nanoimprint lithography In 2011 6th IEEE Conference on Industrial Electronics and Applications (pp 200-205) IEEE [7] Teo, T J., Chen, I M., & Yang, G (2014) A large deflection and high payload flexurebased parallel manipulator for UV nanoimprint lithography: Part II Stiffness modeling and performance evaluation Precision Engineering, 38(4), 872-884 [8] Rad, F P., Vertechy, R., Berselli, G., & Parenti-Castelli, V (2018) Compliant serial 3R chain with spherical flexures In Advances in Robot Kinematics 2016 (pp 11-21) Springer, Cham [9] Seidemann, Volker, Sebastian Bütefisch, and Stephanus Büttgenbach "Fabrication and investigation of in-plane compliant SU8 structures for MEMS and their application to micro valves and micro grippers." Sensors and Actuators A: Physical 97 (2002): 457-461 60 [10] Kota, S., Joo, J., Li, Z., Rodgers, S M., & Sniegowski, J (2001) Design of compliant mechanisms: applications to MEMS Analog integrated circuits and signal processing, 29(1), 7-15 [11] Jiaxiang Zhu, Guangbo Hao, Shiyao Li, Shuwen Yu, 2021, A Mirror-Symmetrical XY Compliant Parallel Manipulator with Improved Performances Without Increasing the Footprint [12] Ing Farid Parvari Rad, 2014 DESIGN AND CHARACTERIZATION OF CURVED AND SPHERICAL FLEXURE HINGES FOR PLANAR AND SPATIAL COMPLIANT MECHANISMS [13] N Lobontiu, Compliant Mechanisms: Design of Flexure Hinges, CRC Press, 2002 [14] Design, modelling and characterization of a 2-DOF precision positioning platform, Yanling Tian and partners, 2014 [15] Design and optimization of full decoupled micro/nano-positioning stage based on mathematical calculation, Zhigang Wu, Yangmin Li and Min Hu, 2018 [16] O’Brien, W Long-range motion with nanometer precision Photonics Spectra 2005, 39, 80–81 [17] Zeng W et al 2018 Design and analysis of a compliant variable-diameter mechanism used in variable-diameter wheels for lunar rover, Mechanism and Machine Theory (2018), https://doi.org/10.1016/j.mechmachtheory.2018.03.003 [18] DOF fully compliant space pointing mechanism, May 07, 2019, BYU-CMR [19] N D Masters, L L Howell A self-retracting fully compliant bi-stable micromechanism, Journal of, Microelectromechanical, Systems, 2003, 12(3) [20] B Volland, K Ivanova, T Ivanov, et al Duo-action electro thermal microgripper Microelectronic Engineering, 2007, 84(5-8): 1329-1332 61
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