Heat Transfer Engineering Applications Part 1 potx

HEAT TRANSFER – ENGINEERING APPLICATIONS Edited by Vyacheslav S. Vikhrenko Heat Transfer – Engineering Applications Edited by Vyacheslav S. Vikhrenko Published by InTech Janeza Trdine 9, 51000 Rijeka, Croatia Copyright © 2011 InTech All chapters are Open Access distributed under the Creative Commons Attribution 3.0 license, which allows users to download, copy and build upon published articles even for commercial purposes, as long as the author and publisher are properly credited, which ensures maximum dissemination and a wider impact of our publications. After this work has been published by InTech, authors have the right to republish it, in whole or part, in any publication of which they are the author, and to make other personal use of the work. Any republication, referencing or personal use of the work must explicitly identify the original source. As for readers, this license allows users to download, copy and build upon published chapters even for commercial purposes, as long as the author and publisher are properly credited, which ensures maximum dissemination and a wider impact of our publications. Notice Statements and opinions expressed in the chapters are these of the individual contributors and not necessarily those of the editors or publisher. No responsibility is accepted for the accuracy of information contained in the published chapters. The publisher assumes no responsibility for any damage or injury to persons or property arising out of the use of any materials, instructions, methods or ideas contained in the book. Publishing Process Manager Bojan Rafaj Technical Editor Teodora Smiljanic Cover Designer InTech Design Team Image Copyright evv, 2010. Used under license from Shutterstock.com First published November, 2011 Printed in Croatia A free online edition of this book is available at www.intechopen.com Additional hard copies can be obtained from orders@intechweb.org Heat Transfer – Engineering Applications, Edited by Vyacheslav S. Vikhrenko p. cm. ISBN 978-953-307-361-3 free online editions of InTech Books and Journals can be found at www.intechopen.com Contents Preface IX Part 1 Laser-, Plasma- and Ion-Solid Interaction 1 Chapter 1 Mathematical Models of Heat Flow in Edge-Emitting Semiconductor Lasers 3 Michał Szymanski Chapter 2 Temperature Rise of Silicon Due to Absorption of Permeable Pulse Laser 29 Etsuji Ohmura Chapter 3 Pulsed Laser Heating and Melting 47 David Sands Chapter 4 Energy Transfer in Ion– and Laser–Solid Interactions 71 Alejandro Crespo-Sosa Chapter 5 Temperature Measurement of a Surface Exposed to a Plasma Flux Generated Outside the Electrode Gap 87 Nikolay Kazanskiy and Vsevolod Kolpakov Part 2 Heat Conduction – Engineering Applications 119 Chapter 6 Experimental and Numerical Evaluation of Thermal Performance of Steered Fibre Composite Laminates 121 Z. Gürdal, G. Abdelal and K.C. Wu Chapter 7 A Prediction Model for Rubber Curing Process 151 Shigeru Nozu, Hiroaki Tsuji and Kenji Onishi Chapter 8 Thermal Transport in Metallic Porous Media 171 Z.G. Qu, H.J. Xu, T.S. Wang, W.Q. Tao and T.J. Lu VI Contents Chapter 9 Coupled Electrical and Thermal Analysis of Power Cables Using Finite Element Method 205 Murat Karahan and Özcan Kalenderli Chapter 10 Heat Conduction for Helical and Periodical Contact in a Mine Hoist 231 Yu-xing Peng, Zhen-cai Zhu and Guo-an Chen Chapter 11 Mathematical Modelling of Dynamics of Boiler Surfaces Heated Convectively 259 Wiesław Zima Chapter 12 Unsteady Heat Conduction Phenomena in Internal Combustion Engine Chamber and Exhaust Manifold Surfaces 283 G.C. Mavropoulos Chapter 13 Ultrahigh Strength Steel: Development of Mechanical Properties Through Controlled Cooling 309 S. K. Maity and R. Kawalla Part 3 Air Cooling of Electronic Devices 337 Chapter 14 Air Cooling Module Applications to Consumer-Electronic Products 339 Jung-Chang Wang and Sih-Li Chen Chapter 15 Design of Electronic Equipment Casings for Natural Air Cooling: Effects of Height and Size of Outlet Vent on Flow Resistance 367 Masaru Ishizuka and Tomoyuki Hatakeyama Chapter 16 Multi-Core CPU Air Cooling 377 M. A. Elsawaf, A. L. Elshafei and H. A. H. Fahmy Preface Enormous number of books, reviews and original papers concerning engineering applications of heat transfer has already been published and numerous new publications appear every year due to exceptionally wide list of objects and processes that require to be considered with a view to thermal energy redistribution. All the three mechanisms of heat transfer (conduction, convection and radiation) contribute to energy redistribution, however frequently the dominant mechanism can be singled out. On the other hand, in many cases other phenomena accompany heat conduction and interdisciplinary knowledge has to be brought into use. Although this book is mainly related to heat transfer, it consists of a considerable amount of interdisciplinary chapters. The book is comprised of 16 chapters divided in three sections. The first section includes five chapters that discuss heat effects due to laser-, ion-, and plasma-solid interaction. In eight chapters of the second section engineering applications of heat conduction equations are considered. In two first chapters of this section the curing reaction kinetics in manufacturing process for composite laminates (Chapter 6) and rubber articles (Chapter 7) is accounted for. Heat conduction equations are combined with mass transport (Chapter 8) and ohmic and dielectric losses (Chapter 9) for studying heat effects in metallic porous media and power cables, respectively. Chapter 10 is devoted to analysing the safety of mine hoist under influence of heat produced by mechanical friction. Heat transfer in boilers and internal combustion engine chambers are considered in Chapters 11 and 12. In the last Chapter 13 of this section temperature management for ultrahigh strength steel manufacturing is described. Three chapters of the last section are devoted to air cooling of electronic devices. In the first chapter of this section it is shown how an air-cooling thermal module is comprised with single heat sink, two-phase flow heat transfer modules with high heat transfer efficiency, to effectively reduce the temperature of consumer-electronic products such as personal computers, note books, servers and LED lighting lamps of small area and high power. Effects of the size and the location of outlet vent as well as the relative distance from the outlet vent location to the power heater position of electronic equipment on the cooling efficiency is investigated experimentally in X Preface Chapter 15. The last chapter objective is to minimize air cooling limitation effect and ensure stable CPU utilization using dynamic thermal management controller based on fuzzy logic control. Dr. Prof. Vyacheslav S. Vikhrenko Belarusian State Technological University, Belarus [...]... 4384 Al0.4 Ga0.6 As (waveguide) 0.35 11 .1 378 4696 active layer 0.007 44 327 5 318 Al0.4 Ga0.6 As (waveguide) 0.59 11 .1 378 4696 Al0.6 Ga0.4 As (p-cladding) 1. 5 11 .4 402 4384 GaAs (cap) 0.2 44 327 5 318 p-contact 1 318 12 8 19 300 In (solder) 1 82 230 7 310 heat source yes - equation (11 ) no yes - equation (11 ) yes - equation (9) yes - equation (11 ) yes - equation (11 ) no no no Table 3 Transverse structure... imperfections, which elude 8 6 Heat Transfer - Engineering Applications Will-be-set-by-IN-TECH Device number Heterostructure A Heterostructure B Heterostructure C 1 12.03/7.38 11 .23/7. 31 8.9/8.24 2 13 .35/7.38 12 .17 /7. 31 7.0/4.76 Table 2 Measured/calculated thermal resistances in K/W (Szymanski et al (2007)) ´ qualitative assessment A similar problem was described in Manning (19 81) , where even greater discrepancies... difficult to solve 18 Heat Transfer - Engineering Applications Will-be-set-by-IN-TECH 16 The authors who consider dynamical models usually concentrate on initial heating (temperature rise during the first current pulse) of the laser inside the resonator (Nakwaski (19 83b)) or at the mirrors (Nakwaski (19 85; 19 90)) The papers mentioned above developed analytical solutions of time-dependent heat conduction... case of zero convection coefficient) upper surface In Szymanski (2007), ´ using the isothermal condition (16 ) T ( x, yt ) = Tup instead of convection is proposed The model is based on the solution of equation (1) obtained 16 14 Heat Transfer - Engineering Applications Will-be-set-by-IN-TECH Fig 11 Contour plot of temperature calculated under the assumption of convective cooling at the top surface (a),... MathematicalofModelsinof Heat Flow in Edge-Emitting Semiconductor Lasers Mathematical Models Heat Flow Edge-Emitting Semiconductor Lasers 13 11 three-dimensional heat conduction equation.4 Heat source has been inserted according to (8)- (11 ), where N (z) has been calculated analytically from the linear diffusion equation with constant coefficients (approach (ii) from section 3 .1) Fig 6 is in qualitative... (2003)) (13 ) (14 ) MathematicalofModelsinof Heat Flow in Edge-Emitting Semiconductor Lasers Mathematical Models Heat Flow Edge-Emitting Semiconductor Lasers S f ( z = 0) = R f S b ( z = 0), S b ( z = L ) = R b S f ( z = L ) 15 13 (15 ) Note the quadratic terms in equations (13 ) and (14 ), which describe the spontaneous radiation To avoid problems with estimating the spatial distribution and extent of heat. .. respectively Table 1 List of symbols 5 3 6 Heat Transfer - Engineering Applications Will-be-set-by-IN-TECH 4 Fig 2 Schematic view of a laser chip cross-section (A) Function describing the heat source (B) 2 Models based on the heat conduction equation only Basic thermal behaviour of an edge-emitting laser can be described by the stationary heat conduction equation: ∇(λ(y)∇ T ( x, y)) = − g( x, y) (1) accepting... (http://www.pdesolutions.com/) has been used 14 Heat Transfer - Engineering Applications Will-be-set-by-IN-TECH 12 4 Models including the diffusion equation and photon rate equations The most advanced thermal model is described by Romo et al (2003) It takes into account electro-opto-thermal interactions and is based on 3-dimensional heat conduction equation ∇(λ( T )∇ T ) = − g( x, y, z, T ), (12 ) 1- dimensional diffusion... imperfections 4 2 Heat Transfer - Engineering Applications Will-be-set-by-IN-TECH Fig 1 Schematic view of the laser chip or laser array mounted on the heat spreader and heat sink (not in scale) like voids in the solder or overhang (the chip does not adhere to the heat- spreader entirely) may significantly obstruct the heat transfer Surface recombination, the main mirror heating mechanism in bipolar devices,... Vhr : g J ( x, y, z) = I 2 Rs , Vhr (11 ) where Rs is the device series resistance 3.3 Selected results Axial (mirror to mirror) distribution of relative temperature3 in the active layer of the edge-emitting laser is shown in Fig 6 It has been calculated numerically solving the 3 The temperature exceeding the ambient temperature 12 10 Heat Transfer - Engineering Applications Will-be-set-by-IN-TECH Fig . Heat Flow in Edge-Emitting Semiconductor Lasers 6 Will-be-set-by-IN-TECH Device number Heterostructure A Heterostructure B Heterostructure C 1 12.03/7.38 11 .23/7. 31 8.9/8.24 2 13 .35/7.38 12 .17 /7. 31. Vsevolod Kolpakov Part 2 Heat Conduction – Engineering Applications 11 9 Chapter 6 Experimental and Numerical Evaluation of Thermal Performance of Steered Fibre Composite Laminates 12 1 Z. Gürdal,. HEAT TRANSFER – ENGINEERING APPLICATIONS Edited by Vyacheslav S. Vikhrenko Heat Transfer – Engineering Applications Edited by Vyacheslav