nanopackaging. nanotechnologies and electronics packaging, 2008, p.553

[...]... for Microelectronics Applications, Proceedings of the 55th IEEE Electronic Components and Technology Conference, Orlando, FL, 2005, pp 51–54 67 L Ekstrand, Z Mo, Y Zhang, and J Liu, Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling, Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, 2005,... Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, 2005, pp 13–15 10 S Koh, R Rajoo, R Tummala, A Saxena, and K.T Tsai, Material Characterization for Nano Wafer Level Packaging Application, Proceedings of the 55th IEEE Electronic Components and Technology Conference, Orlando, FL, 2005, pp 1670–1676 11 S Bansal, E Toimil-Molares, A Saxena, and R Tummala, Nanoindentation... 40–44 40 J Kolbe, A Arp, F Calderone, E.M Meyer, W Meyer, H Schaefer, and M Stuve, Inkjettable Conductive Adhesive for Use in Microelectronics and Microsystems Technology, Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, 2005, pp 160–163 41 J.G Bai, K.D Creehan, and H.A Kuhn, Inkjet printable nanosilver suspensions for enhanced... Electronic Components and Technology Conference, Orlando, FL, 2005, pp 55–59 65 J Liu, M.O Olorunyomi, X Lu, W.X Wang, T Aronsson, and D Shangguan, New NanoThermal Interface Material for Heat Removal in Electronics Packaging, Proceedings of the 1st IEEE Electronics Systemintegration Technology Conference, Dresden, Germany, 2006, pp 1–6 66 Z Mo, R Morjan, J Anderson, E.E.B Campbell, and J Liu, Integrated... explain and model the new phenomena exposed Furthermore, nanotechnologies have already yielded everyday consumer benefits beyond stain-resistant clothing and transparent sunblock So, it is hardly surprising to discover active research and development programs in nanotechnology applications to electronics packaging, with special nanotechnology sessions at electronics packaging research conferences and research... Microsystem Design and Packaging and Component Failure Analysis (HDP’04), Shanghai, 2004, pp 382–384 A.M Bondar, A Bara, D Patroi, and P.M Svasta, Carbon Mesophase/Carbon Nanotubes Nanocomposite – Functional Filler for Conductive Pastes, Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, 2005, pp 215–218 A Bara, A.M Bondar, and P.M Svasta,... Electronic Components and Technology Conference, Orlando, FL, 2005, pp 1859–1863 9/29/2008 8:06:14 PM 10 J.E Morris 39 A Moscicki, J Felba, T Sobierajski, J Kudzia, A Arp, and W Meyer, Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology, Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, 2005, pp... W Chandler Blvd., Chandler, AZ 85226, USA ravi.v.mahajan@intel.com Debendra Mallik Intel Corp, M/S CH5-157, 5000 W Chandler Blvd., Chandler, AZ 85226, USA debendra.mallik@intel.com James E Morris Department of Electrical & Computer Engineering, Portland State University, P.O Box 751, Portland, OR 97201, USA j.e.morris@ieee.org Shalini Prasad Department of Electrical & Computer Engineering, Portland... Polymers and Adhesives in Microelectronics and Photonics, Tokyo, 2007 46 A Moscicki, J Felba, P Gwiazdzinski, and M Puchalski, Conductivity Improvement of Microstructures Made by Nano-Size-Silver Filled Formulations, Proceedings of the 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Tokyo, 2007 47 J.G Bai, Z.Z Zhang, J.N Calata, and G.-Q Lu, Characterization... R Doraiswami and R Tummala, Nano-Composite Lead-Free Interconnect and Reliability, Proceedings of the 55th IEEE Electronic Components and Technology Conference, Orlando, FL, 2005, pp 871–873 50 P Lall, S Islam, J Suhling, and G Tian, Nano-Underfills for High-Reliability Applications in Extreme Environments, Proceedings of the 55th IEEE Electronic Components and Technology Conference, Orlando, FL, 2005, . high-level approach to the modeling process in Chap. 2, backed up with multiple examples of nanoscale modeling in packaging, present and future, including nanoimprinting, solder paste printing,. transmission, power input, and voltage control. It also pro- vides for thermal dissipation and the physical protection required for reliability. Packaging governs the size, weight, and shape of the end product. activated tunneling and percolation, as explained by Wu and Morris in Chap. 8. Nanoparticle applications in passive components are rounded out by the Jha et al.’s Chap. 9 on inductors and antennas,