IEC 63035 Edition 1 0 201 7 06 INTERNATIONAL STANDARD MIDI (musical instrument digital interface) specification 1 0 (Abridged Edition, 201 5) IE C 6 3 0 3 5 2 0 1 7 0 6 (e n ) ® TH IS PUBLICATION IS C[.]
I E C 63 ® I N TE RN ATI ON AL S TAN D ARD M I D I (m u s i cal i n s tru m e n t d i g i tal i n te rface) s pe ci fi cati on IEC 63035:201 7-06(en) ( Abri d g ed E d i ti on , 5) Edition 201 7-06 T H I S P U B L I C AT I O N I S C O P YRI G H T P RO T E C T E D C o p yri g h t © I E C , G e n e v a , S wi tz e rl a n d All rights reserved Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IEC's member National Committee in the country of the requester If you have any questions about I EC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local I EC member National Committee for further information IEC Central Office 3, rue de Varembé CH-1 21 Geneva 20 Switzerland Tel.: +41 22 91 02 1 Fax: +41 22 91 03 00 info@iec.ch www.iec.ch Ab ou t th e I E C The I nternational Electrotechnical Commission (I EC) is the leading global organization that prepares and publishes I nternational Standards for all electrical, electronic and related technologies Ab o u t I E C p u b l i ca ti o n s The technical content of IEC publications is kept under constant review by the IEC Please make sure that you have the latest edition, a corrigenda or an amendment might have been published I E C Catal og u e - webstore i ec ch /catal og u e The stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents Available for PC, Mac OS, Android Tablets and iPad I E C pu bl i cati on s s earch - www i ec ch /search pu b The advanced search enables to find IEC publications by a variety of criteria (reference number, text, technical committee,…) It also gives information on projects, replaced and withdrawn publications E l ectroped i a - www el ectroped i a org The world's leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and French, with equivalent terms in additional languages Also known as the International Electrotechnical Vocabulary (IEV) online I E C G l os sary - s td i ec ch /g l oss ary 65 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002 Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR I E C J u st Pu bl i s h ed - webstore i ec ch /j u stpu bl i sh ed Stay up to date on all new IEC publications Just Published details all new publications released Available online and also once a month by email I E C C u stom er S ervi ce C en tre - webstore i ec ch /csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csc@iec.ch I E C 63 ® Edition 201 7-06 I N TE RN ATI ON AL S TAN D ARD M I D I (m u s i cal i n s tru m e n t d i g i tal i n terface) s pe ci fi cati on ( Abri d g ed E d i ti on , 5) INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 33.1 60.30; 35.040.01 ; 35.200 ISBN 978-2-8322-4355-8 Warn i n g ! M ake s u re th a t you ob tai n ed th i s p u b l i cati on from an au th ori zed d i stri b u tor ® Registered trademark of the International Electrotechnical Commission –2– I EC 63035: 201 I EC 201 CONTENTS FOREWORD I NTRODUCTI ON Scope Norm ative references Terms and definitions General Hardware Data format Message types 1 General 1 Channel messages 1 3 System m essages 1 4 Data types 4 General 4 Status bytes 4 Data bytes Channel m odes Power-up default conditions MI DI im plementation chart instructions I ntroduction General Function description Basic Channel Mode 3 Note N umber 5 Velocity 5 Aftertouch 5 Pitch Bend 5 Control Change 5 Program Change 5 System Exclusive 5 System Comm on 5 1 System Real Tim e 5 Aux m essages 3 Notes Annex A (normative) Summary of MI DI messages Annex B (normative) Control Change messages (Data bytes) 20 B Control Change m essages and Channel Mode messages 20 B Registered Parameter numbers 23 Annex C (norm ative) System Exclusive m essages 25 C System Exclusive m essages 25 C Universal System Exclusive messages 25 Annex D (normative) MI DI I mplem entation Chart template 30 Bibliograph y 31 I EC 63035: 201 I EC 201 –3– Figure Figure Figure Figure Figure – MI DI standard hardware – Types of MI DI bytes – Types of MI DI m essages – Structure of a single message 1 – Structure of System Exclusive message 1 Table Table Table Table Table Table Table Table – Modes for receiver – Modes for transmitter A – MI DI Specification m essage summ ary B – Control Changes and Mode Changes (Status bytes 76 to 91 ) 20 B – Registered Param eter numbers 24 C – System Exclusive messages 25 C – U niversal System Exclusive messages 26 D – MI DI I m plementation Chart template 30 –4– I EC 63035: 201 I EC 201 INTERNATI ONAL ELECTROTECHNI CAL COMMISSI ON M I D I ( M U S I C AL I N S T RU M E N T D I G I T AL I N T E RF AC E ) S P E C I F I C AT I O N ( Ab ri d g e d E d i ti o n , ) FOREWORD ) The I nternati on al Electrotechni cal Comm ission (I EC) is a worl d wid e organization for stan dardization com prisin g all n ation al el ectrotechnical comm ittees (I EC National Comm ittees) The object of I EC is to prom ote internati onal co-operation on all questions concerni ng stand ardi zati on in the el ectrical an d electronic fields To this end and in additi on to other acti vities, I EC publish es I nternational Stan dards, Techn ical Specifications, Technical Reports, Publicl y Avail abl e Specificati ons (PAS) an d Gu ides (hereafter referred to as “I EC Publication(s)”) Thei r preparation is entrusted to technical comm ittees; any I EC National Comm ittee interested in the subj ect dealt with m ay partici pate in this preparatory work I nternational, governm ental an d n on governm ental organ izations l iaising with th e I EC also participate i n this preparation I EC collaborates closel y with the I ntern ational Organi zation for Stand ardization (I SO) in accordance with ditions determ ined by agreem ent between th e two organi zati ons 2) The form al decisions or ag reem ents of I EC on tech nical m atters express, as n early as possible, an i nternati onal consensus of opi nion on the rel evant subjects since each technical com m ittee has representati on from all interested I EC N ational Com m ittees 3) I EC Publications have the form of recomm endations for intern ational use an d are accepted by I EC National Com m ittees in that sense While all reasonable efforts are m ade to ensure that the tech nical content of I EC Publications is accu rate, I EC cann ot be h eld responsi ble for th e way in which th ey are used or for an y m isinterpretation by an y en d u ser 4) I n order to prom ote intern ational u niform ity, I EC National Com m ittees und ertake to apply I EC Publications transparentl y to the m axim um extent possible i n their national an d regi on al publicati ons Any d ivergence between an y I EC Publication and the correspondi ng national or regi on al publicati on sh all be clearl y in dicated in the latter 5) I EC itself d oes n ot provi de an y attestation of conform ity I n dependent certificati on bodies provi de conform ity assessm ent services and, in som e areas, access to I EC m arks of conform ity I EC is not responsi ble for an y services carri ed out by ind ependent certification bodi es 6) All users shou ld ensure that th ey h ave the l atest editi on of thi s publicati on 7) No liability shall attach to I EC or its directors, em ployees, servants or ag ents inclu din g in divi du al experts an d m em bers of its tech nical com m ittees and I EC Nati onal Com m ittees for any person al i nju ry, property d am age or other dam age of any n ature whatsoever, wheth er di rect or indirect, or for costs (includ i ng leg al fees) and expenses arisi ng out of the publ ication, use of, or relian ce upon, this I EC Publicati on or any other I EC Publications 8) Attention is drawn to th e N orm ative references cited in th is publ ication Use of the referenced publ ications is indispensable for the correct applicati on of this publication 9) Attention is drawn to the possibility that som e of the elem ents of this I EC Publication m ay be the su bject of patent rig hts I EC shall not be held responsibl e for identifyi ng any or all such patent ri ghts I nternational Standard I EC 63035 has been prepared by I EC technical com mittee 00: Audio, video and m ultimedia systems and equipm ent The text of this standard is based on the following docum ents: CDV Report on votin g 00/2597/CDV 00/2858/RVC Full information on the voting for the approval of this I nternational Standard can be found in the report on voting indicated in the above table This docum ent has been drafted in accordance with the I SO/I EC Directives, Part The comm ittee has decided that the contents of this docum ent will rem ain unchanged until the stability date indicated on the I EC website under "http: //webstore iec.ch" in the data related to the specific docum ent At this date, the docum ent will be I EC 63035: 201 • • • • I EC 201 –5– reconfirmed, withdrawn, replaced by a revised edition, or am ended A bilingual version of this publication m ay be issued at a later date –6– I EC 63035: 201 I EC 201 INTRODUCTION I EC 63035 contains the same first pages as in the MI DI Detailed Specification (the original core specification text) published by the MI DI Manufacturers Association (MMA) These are included within this standard as Clauses to This specification was submitted to the I EC under the auspices of a special agreement between the I EC and the MMA The MM A is a non-profit corporation that serves as a support organization and forum for the advancement and adoption of MI DI technology (along with the Association of Musical Electronics I ndustry, or AMEI , in J apan) The MI DI technology dates back to 983 when the protocol and electrical specification com prised pages and the m ajority of the message identifiers were not yet defined Over the subsequent years, the MMA and AMEI determ ined consensus of the worldwide MI DI industry, and defined numerous additional m essages (via Confirmation of Approval documents), as well as m an y Recommended Practices for the use of MI DI technolog y, all the while maintainin g MI DI as "1 0" (meaning that no significant changes were m ade to the initial specification ) The MMA docum entation for M I DI now encompasses m ore than 50 different docum ents in print or on the World Wide Web This standard contains the sam e first pages as in th e MMA’s MI DI Detailed Specification but does not contain all of the subsequent information developed by M MA/AMEI Rather, this document contains a complete listing (with basic description) of all defined MI DI messages to date, with references to the appropriate M MA docum entation Companies that want to im plem ent MI DI technology are advised to also consult the MMA docum entation that is listed in the Biograph y Although the MI DI Detailed Specification includes an electrical connection specification ("MI DI -DI N "), other transports (U SB, Firewire, etc.) have also been approved by MMA/AM EI for use with MI DI Protocol For details and documentation of approved ph ysical transports, please contact the MI DI Manufacturers Association The term "MI DI " is known all around the world as referring to the techn ology which is defined in the MM A/AMEI documents, and so should not be used for an y other purpose Com panies that im plement MI DI technology in their products in com pliance with MM A specifications m ay use the term MI DI to describe their products, but m ay not use the term to describe an y extensions or enhancements that are not defined by MMA/AM EI Onl y M MA/AM EI can define the m essages, transport payloads, and Recommend Practices which are prom oted as "MI DI " so as to prevent an y dilution and confusion of the m eaning of "M I DI " I mplem enters of MI DI technolog y should consult MMA and/or AMEI (depending on the relevant market) for specific trademark usage policies I EC 63035: 201 I EC 201 –7– M I D I ( M U S I C AL I N S T RU M E N T D I G I T AL I N T E RF AC E ) S P E C I F I C AT I O N ( Ab ri d g e d E d i ti o n , ) S cop e This I nternational Standard specifies a hardware and software specification which m akes it possible to exchange symbolic m usic and control information between different m usical instruments or other devices such as sequencers, computers, lighting controllers, m ixers, etc using MI DI technolog y (musical instrum ent digital interface) N o rm a t i ve re fe re n c e s The following docum ents are referred to in the text in such a way that som e or all of their content constitutes requirements of this docum ent For dated references, onl y the edition cited applies For undated references, the latest edition of the referenced docum ent (including an y am endm ents) applies I EC 601 30-9, Connectors for frequencies below MHz - Part 9: Circular connectors for radio and associated sound equipment T e rm s a n d d e fi n i t i o n s For the purposes of this docum ent, the followi ng terms and definitions apply I SO and I EC m aintain term inological databases for use in standardization at the following addresses: • I EC Electropedia: available at http: //www electropedia.org/ • I SO Online browsing platform: available at http://www iso org/obp ve l o ci ty parameter which typically changes the intensity and resultant volume of the note that is being played and varies according to the force applied Note to entry: Velocity is used as Key Velocity as in a pian o key a ft e rt o u c h param eter that m easures the level of intensity applied to a note after it has been played and continues to be depressed Note to entry: Typicall y, Aftertouch is useful for addi ng vi brato or trem olo effects to a soun d in m uch the sam e way that a violi n can ad d vol u m e or pitch changes to a sustained note usin g fing er vi brato or ad ditional bowing intensity 3 m od u l ati on wh e el wheel controller found on synthesizers that players can use to progressively introduce modulation depth to a sound –8– I EC 63035: 201 I EC 201 pitch wh eel wheel type device, normall y found to the left of a synthesizer keyboard, used to manipulate the pitch of a played note or notes pitch ben d activity or message, generall y initiated by a pitch wheel, that sm oothl y raises and/or lowers the pitch of note or chord osci ll ator circuitry or software program that generates the kernel of a synthesizer sound Note to entry: I n th e earl y days, oscill ators gen erated fairly basic soun d types (sawtooth, square, pu lse etc) I n m odern synthesi zer en gin es, oscillators can be driven by m yri ad waveform s and sam ples pan param eter that specifies the location of a sound wi thin the stereo field 4 General H ardware The hardware MI DI interface operates at 31 , 25 × (1 ± %) kBd asynchronous, with a start bit, data bits (D0 to D7), and a stop bit This makes a total of bits for a period of 320 µ s per serial byte The start bit is a logical (current on) and the stop bit is a logical (current off) Bytes are sent LSB first Circuit: (See Figure ) m A current loop type Logical is current ON One output shall drive one and onl y one input To avoid ground loops, and subsequent data errors, the transm itter circuitry and receiver circuitry are internall y separated by an opto-isolator (a light em itting diode and a photo sensor which share a single, sealed package) The receiver shall require less than m A to turn on Rise and fall times should be less than µ s Connectors: DI N pin (1 80°) fem ale panel m ount receptacle which is specified in I EC 601 30-9 as type designation I EC-04 The connectors shall be labelled "MI DI I N " and "MI DI OUT" N ote that pins and are not used, and should be left unconnected in the receiver and transmitter Pin of the MI DI I n connector should also be left unconnected The grounding shield connector on the MI DI j acks should not be connected to an y circuit or chassis ground When MI DI Thru inform ation is obtained from a MI DI I n si gnal, transmission m ay occasionall y be perform ed incorrectl y due to signal degradation (caused by the response tim e of the optoisolator) between the rising and falling edges of the square wave These tim ing errors will tend to add up in the "wrong direction" as m ore devices are chained between M I DI Thru and MI DI I n jacks The result is that, regardless of circuit quality, there is a limit to the num ber of devices which can be chained (series-connected) in this fashion