Tiêu chuẩn iso 11855 2 2012

INTERNATIONAL STANDARD ISO 11855-2 First edition 2012-10-01 Building environment design — Design, dimensioning, installation and control of embedded radiant heating and cooling systems — Part 2: Determination of the design heating and cooling capacity Conception de l'environnement des bâtiments — Conception, construction et fonctionnement des systèmes de chauffage et de refroidissement par rayonnement — `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - Partie 2: Détermination de la puissance calorifique et frigorifique la conception Reference number ISO 11855-2:2012(E) Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS © ISO 2012 Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) COPYRIGHT PROTECTED DOCUMENT © ISO 2012 All rights reserved Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either ISO at the address below or ISO's member body in the country of the requester ISO copyright office Case postale 56  CH-1211 Geneva 20 Tel + 41 22 749 01 11 Fax + 41 22 749 09 47 E-mail copyright@iso.org Web www.iso.org Published in Switzerland ii Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - © ISO 2012 – All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Contents Page Foreword iv  Introduction v  1  Scope 1  2  Normative references 1  3  Terms and definitions 2  4  Symbols and abbreviations 2  5  Concept of the method to determine the heating and cooling capacity 3  6  Heat exchange coefficient between surface and space 4  7  7.1  7.2  Simplified calculation methods for determining heating and cooling capacity or surface temperature 6  Universal single power function 7  Thermal resistance methods 9  8  8.1  8.2  Use of basic calculation programs 11  Basic calculation programs 11  Items to be included in a complete computation documentation 11  9  Calculation of the heating and cooling capacity 12  Annex A (normative) Calculation of the heat flux 13  Annex B (normative) General resistance method 36  Annex C (normative) Pipes embedded in wooden construction 42  Annex D (normative) Method for verification of FEM and FDM calculation programs 50  Annex E (normative) Values for heat conductivity of materials and air layers 54  Bibliography 56  © ISO for 2012 – All rights reserved Copyright International Organization Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS iii `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Foreword ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies (ISO member bodies) The work of preparing International Standards is normally carried out through ISO technical committees Each member body interested in a subject for which a technical committee has been established has the right to be represented on that committee International organizations, governmental and non-governmental, in liaison with ISO, also take part in the work ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part The main task of technical committees is to prepare International Standards Draft International Standards adopted by the technical committees are circulated to the member bodies for voting Publication as an International Standard requires approval by at least 75 % of the member bodies casting a vote Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights ISO shall not be held responsible for identifying any or all such patent rights ISO 11855-2 was prepared by Technical Committee ISO/TC 205, Building environment design ISO 11855 consists of the following parts, under the general title Building environment design — Design, dimensioning, installation and control of embedded radiant heating and cooling systems:  Part 1: Definition, symbols, and comfort criteria  Part 2: Determination of the design and heating and cooling capacity `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` -  Part 3: Design and dimensioning  Part 4: Dimensioning and calculation of the dynamic heating and cooling capacity of Thermo Active Building Systems (TABS)  Part 5: Installation  Part 6: Control Part specifies the comfort criteria which should be considered in designing embedded radiant heating and cooling systems, since the main objective of the radiant heating and cooling system is to satisfy thermal comfort of the occupants Part provides steady-state calculation methods for determination of the heating and cooling capacity Part specifies design and dimensioning methods of radiant heating and cooling systems to ensure the heating and cooling capacity Part provides a dimensioning and calculation method to design Thermo Active Building Systems (TABS) for energy-saving purposes, since radiant heating and cooling systems can reduce energy consumption and heat source size by using renewable energy Part addresses the installation process for the system to operate as intended Part shows a proper control method of the radiant heating and cooling systems to ensure the maximum performance which was intended in the design stage when the system is actually being operated in a building iv Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS © ISO 2012 – All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Introduction The radiant heating and cooling system consists of heat emitting/absorbing, heat supply, distribution, and control systems The ISO 11855 series deals with the embedded surface heating and cooling system that directly controls heat exchange within the space It does not include the system equipment itself, such as heat source, distribution system and controller The ISO 11855 series addresses an embedded system that is integrated with the building structure Therefore, the panel system with open air gap, which is not integrated with the building structure, is not covered by this series The ISO 11855 series shall be applied to systems using not only water but also other fluids or electricity as a heating or cooling medium The object of the ISO 11855 series is to provide criteria to effectively design embedded systems To this, it presents comfort criteria for the space served by embedded systems, heat output calculation, dimensioning, dynamic analysis, installation, operation, and control method of embedded systems `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - © ISO for 2012 – All rights reserved Copyright International Organization Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS v Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST INTERNATIONAL STANDARD ISO 11855-2:2012(E) Building environment design — Design, dimensioning, installation and control of embedded radiant heating and cooling systems — Part 2: Determination of the design heating and cooling capacity Scope This part of ISO 11855 specifies procedures and conditions to enable the heat flow in water based surface heating and cooling systems to be determined relative to the medium differential temperature for systems The determination of thermal performance of water based surface heating and cooling systems and their conformity to this part of ISO 11855 is carried out by calculation in accordance with design documents and a model This should enable a uniform assessment and calculation of water based surface heating and cooling systems The surface temperature and the temperature uniformity of the heated/cooled surface, nominal heat flow density between water and space, the associated nominal medium differential temperature, and the field of characteristic curves for the relationship between heat flow density and the determining variables are given as the result This part of ISO 11855 includes a general method based on Finite Difference or Finite Element Methods and simplified calculation methods depending on position of pipes and type of building structure The ISO 11855 series is applicable to water based embedded surface heating and cooling systems in residential, commercial and industrial buildings The methods apply to systems integrated into the wall, floor or ceiling construction without any open air gaps It does not apply to panel systems with open air gaps which are not integrated into the building structure The ISO 11855 series also applies, as appropriate, to the use of fluids other than water as a heating or cooling medium The ISO 11855 series is not applicable for testing of systems The methods not apply to heated or chilled ceiling panels or beams Normative references The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - ISO 11855-1:2012, Building environment design — Design, dimensioning, installation and control of embedded radiant heating and cooling systems — Part 1: Definition, symbols, and comfort criteria EN 1264-2, Water based surface embedded heating and cooling systems — Part 2: Floor heating: Prove methods for the determination of the thermal output using calculation and test methods © ISO for 2012 – All rights reserved Copyright International Organization Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Terms and definitions For the purposes of this document, the terms and definitions given in ISO 11855-1:2012 apply Symbols and abbreviations For the purposes of this document, the symbols and abbreviations in Table apply Table — Symbols and abbreviations Symbol Unit i — Parameter factors for calculation of characteristic curves AA m2 Surface of the occupied area AF m2 Surface of the heating/cooling surface area AR m2 Surface of the peripheral area bu — Calculation factor depending on the pipe spacing B, BG, B0 W/(m2K) D m External diameter of the pipe, including sheathing where used da m External diameter of the pipe di m Internal diameter of the pipe dM m External diameter of sheathing cW kJ/(kgK) Specific heat capacity of water ht W/(m2K) Total heat exchange coefficient (convection + radiation) between surface and space KH W/(m2K) Equivalent heat transmission coefficient KWL — Parameter for heat conducting devices kfin — Parameter for heat conducting devices kCL — Parameter for heat conducting layer LWL m Width of heat conducting devices Lfin m Width of fin (horizontal part of heat conducting device seen as a heating fin) LR m Length of installed pipes m — Exponents for determination of characteristic curves mH kg/s n, nG — q W/m2 Heat flux at the surface qA W/m2 Heat flux in the occupied area qdes W/m2 Design heat flux qG W/m2 Limit heat flux qN W/m2 Nominal heat flux qR W/m2 Heat flux in the peripheral area qu W/m2 Outward heat flux Ro m2K/W Partial inwards heat transmission resistance of surface structure Ru m2K/W Partial outwards heat transmission resistance of surface structure R,B m2K/W Thermal resistance of surface covering Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS Quantity Coefficients depending on the system Design heating/cooling medium flow rate Exponents `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - © ISO 2012 – All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) R,ins m2K/W sh m In Type B systems, thickness of thermal insulation from the outward edge of the insulation to the inward edge of the pipes (see Figure 2) sl m In Type B systems, thickness of thermal insulation from the outward edge of the insulation to the outward edge of the pipes (see Figure 2) sins m Thickness of thermal insulation sR m Pipe wall thickness su m Thickness of the layer above the pipe sWL m Thickness of heat conducting device S m Thickness of the screed (excluding the pipes in type A systems) W m Pipe spacing  W/(m2K) s,max °C Maximum surface temperature s,min °C Minimum surface temperature i °C Design indoor temperature m °C Temperature of the heating/cooling medium R °C Return temperature of heating/cooling medium V °C Supply temperature of heating/cooling medium u °C Indoor temperature in an adjacent space H K Heating/cooling medium differential temperature H,des K Design heating/cooling medium differential temperature H,G K Limit of heating/cooling medium differential temperature N K Nominal heating/cooling medium differential temperature V K Heating/cooling medium differential supply temperature V,des K Design heating/cooling medium differential supply temperature  W/(mK)  K Temperature drop V R  — Conversion factor for temperatures  — Content by volume of the attachment burrs in the screed Thermal resistance of thermal insulation `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - Heat exchange coefficient Thermal conductivity Concept of the method to determine the heating and cooling capacity A given type of surface (floor, wall, ceiling) delivers, at a given average surface temperature and indoor temperature (operative temperature i), the same heat flux in any space independent of the type of embedded system It is therefore possible to establish a basic formula or characteristic curve for cooling and a basic formula or characteristic curve for heating, for each of the type of surfaces (floor, wall, ceiling), independent of the type of embedded system, which is applicable to all heating and cooling surfaces (see Clause 6) Two methods are included in this part of ISO 11855:  simplified calculation methods depending on the type of system (see Clause 7);  Finite Element Method and Finite Difference Method (see Clause 8) © ISO for 2012 – All rights reserved Copyright International Organization Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Different simplified calculation methods are included in Clause for calculation of the surface temperature (average, maximum and minimum temperature) depending on the system construction (type of pipe, pipe diameter, pipe distance, mounting of pipe, heat conducting devices, distribution layer) and construction of the floor/wall/ceiling (covering, insulation layer, trapped air layer, etc.) The simplified calculation methods are specific for the given type of system, and the boundary conditions listed in Clause shall be met In the calculation report, it shall be clearly stated which calculation method has been applied In case a simplified calculation method is not available for a given type of system, either a basic calculation using two or three dimensional finite element or finite difference method can be applied (see Clause and Annex D) NOTE In addition, laboratory testing (for example EN 1264-2:2008, Clause 9) may be applied Based on the calculated average surface temperature at given combinations of medium (water) temperature and space temperature, it is possible to determine the steady state heating and cooling capacity (see Clause 9) Heat exchange coefficient between surface and space `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - The relationship between the heat flux and mean differential surface temperature [see Figure and Equations (1) to (4)] depends on the type of surface (floor, wall, ceiling) and whether the temperature of the surface is lower (cooling) or higher (heating) than the space temperature Figure — Basic characteristic curve for floor heating and ceiling cooling Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS © ISO 2012 – All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) C.2.3.2.2 Maximum or minimum permissible mean floor surface temperature The maximum permissible mean floor surface temperature is given by: max  s,m   i  k CL  ( s,max,min   i ) °C (C.1) where kCL is the equivalent coefficient of thermal conductivity for the heat conducting layer, in accordance with C.2.4.4.2 C.2.3.2.3 Limitation of maximum heat flow density to the room The maximum heat flow density is given in Clause C.2.3.3 Maximum/minimum permissible mean temperature of the heating or cooling medium   Hmax,min   i  qimax,min   Ri     RHC  °C   (C.2) The mean temperature of the heating medium shall never exceed this temperature C.2.3.4 Equivalent heat transmission coefficient Somewhat simplified, the heat output to the room can be described by the expression: qi  K Hi   H W/m2 (C.3) where `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - is the equivalent coefficient of thermal conductivity; KH  H   H   i is the differential temperature of the heating or cooling medium Calculate the equivalent coefficient of thermal conductivity towards the space from: K Hi  1/ ( RHC  Ri ) W/m2 °C (C.4a) and the equivalent coefficient of thermal conductivity towards the back-side from: K He  1/ ( RHC  Re ) W/m2 °C (C.4b) and K Hi  44 qimax,min  Hmax,min   i W/m2 °C Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS (C.4c) © ISO 2012 – All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) C.2.4 Calculation procedure for components and element characteristics C.2.4.1 General This calculation procedure comprises determination of:  thermal resistance above the heat conducting layer (see C.2.4.2);  thermal resistance on the back-side of the heat conducting layer (see C.2.4.3);  thermal resistance between the heat source and the heat conducting layer (see C.2.4.4) See C.2.3 for the calculation procedure for determination of equivalent heat transmission coefficient C.2.4.2 Thermal resistance above the heat conduction layer C.2.4.2.1 Thermal resistance of material layers Calculate and add up the thermal resistance of the various layers of material in the upper part of the floor as follows: Ro  d   jj m2 °C/W (C.5) C.2.4.2.2 Contact resistance If the heat conducting plates are not in perfect thermal contact with the floor materials, there will be a contact resistance For a normal design of heat conducting plates, this resistance is given by: Rcon,i  0,15 m2 °C/W If the heat conducting plates are carefully shaped and are bonded to the floor materials, then: Rcon,i  0,10 m2 °C/W Lower values of thermal contact resistance may be used if indicated by results of testing (EN 1264-2) C.2.4.2.3 Rsi  Boundary layer thermal resistance at the floor surface m2 °C/W hi (C.6) where hi is the heat transfer coefficient, depending on the type of surface (floor, wall, ceiling) and the mode (heating or cooling), as described in Clause C.2.4.2.4 Total thermal resistance The total thermal resistance from the heat conducting layer to the room is given by: Ri  Ro  Rcon,i  Rsi m2 °C/W (C.7) 45 © ISO 2012 – All rights reserved Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - j ISO 11855-2:2012(E) C.2.4.3 Thermal resistance on the back-side of the heat conducting layer C.2.4.3.1 Thermal resistance to neighbour conditioned room Calculate and add up the thermal resistance of the various layers of material in the back-side part of the construction as follows Ru  d  kk m2 °C/W (C.8) k This expression ignores the thermal contact resistance between the heat conducting layer and the sub-floor The total thermal resistance from the heat conducting layer at the back-side of the floor is given by: Re,0  Ru  Rse m2 °C/W (C.9) where Rse is the boundary layer resistance at the back-side towards a neighbour space This depends on the type of surface (floor, wall, ceiling) and the type of system (heating or cooling) C.2.4.3.2 Ground floor joist structure Calculate the thermal resistance for the outward side of the floor from the coefficient of thermal transmittance or the U-value, and subtract the thermal resistance for the inward side of the floor: Re,0  NOTE  Ri U m2 °C/W (C.10) The U-value of floor structures resting on the ground can be calculated from ISO 13370 C.2.4.3.3 Correction of Re As the heating or cooling pipe and its fastening to the heat conducting plates is generally placed in a channel in the underlying thermal insulation, the effect is a reduction of the back-side thermal resistance: Re  Re,0    Re m2 °C/W (C.11) Where the coefficient is a correction caused by two-dimensional effects and:  Re  d  ins  b m2 °C/W W (C.12) where d is the depth of the channel; b is the width of the channel; W is the pipe spacing Other components of the structure, such as the joists, also reduce the thermal resistance of the subconstruction This is allowed for by calculating the thermal conductivity of the lower layer as a single mean value for the various materials, based on their proportions of the respective layer `,`,,,,,```,````,`,, 46 Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS © ISO 2012 – All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) C.2.4.4 Thermal resistance between the heat source and the heat conducting layer C.2.4.4.1 Mean temperature of the heat conducting plates The purpose of the heat conducting plates is partly to distribute the heat from the coils over the entire crosssection of the floor, thus producing a more even temperature distribution, and partly to improve the thermal contact with the inward part of the floor The heat conducting plate roughly consists of two fins that are separated by a midsection where the plate is in thermal contact with the pipe The heat conducting plates are described by: width of the heat conducting plate < T LWL m s WL  L heat conducting performance W/°C Limitation of the method: The following conditions shall be fulfilled:  WL  10  Surroundingmaterials W/m°C s WL   WL  0,01 W/°C Calculate the characteristic length of the fin from: l s WL   WL m 1  Ri R e (C.13) where s WL is the thickness of the fin in [m];  WL is the thermal conductivity of the fin [W/m °C]; Ri is the internal thermal resistance [W/m2 °C]; Re is the external thermal resistance [W/m2 °C] The mean temperature of the fin is given by:  fin  k fin   fin °C k fin  (C.14) L    fin  Lfin  l  l (C.15) where  fin is the mean temperature of the fin, °C;  fin is the temperature at the fin junction with the pipe, which is the maximum temperature in the fin, °C; `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - 47 © ISO for 2012 – All rights reserved Copyright International Organization Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Lfin  LWL  LU T  LU  LG  m; 2 LU is the external diameter of the heating pipe, m; LG is the gap between the heat conducting plates, m The minimum temperature in the fin is given by: min  fin  k fin   fin °C  k fin C.2.4.4.2 (C.16) L  cosh  fin   l  (C.17) The mean temperature in the heat conducting layer The mean temperature in the heat conducting layer is given by:  CL  k CL   fin °C LU   Lfin  k fin  0,01 LG  k fin L k CL  C.2.4.4.3 (C.19) Fictitious thermal resistance of the heat conducting layer RCL  C.2.4.4.4 (C.18)     1 m2 °C/W 1  k CL   Ri R e (C.20) Pipe coils The required pipe coil parameters are the external diameter, the internal diameter and the thermal conductivity of the pipe material In addition, it is necessary to note whether the pipe walls contain any special layers for distributing the heat around the periphery, which affects the proportion of the circumference of the pipe that is in good contact with the conducting plate Nominally, the total thermal resistance through the pipe wall is given by: RR'  d  ln  o  m°C/W    R  d i  (C.21) where is the outer pipe diameter, m; di is the inner pipe diameter, m; R is the thermal conductivity of the pipe wall, W/m°C For PEX-pipes  = 0,35 W/m °C shall be used Annex E provides values for different types of pipes 48 Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - © ISO 2012 – All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) C.2.4.4.5 Thermal contact resistance between the heat conducting layer and the heating pipe This part of ISO 11855 considers two types of connections between the heating pipe and the heat conducting plate:  the centre of the heat conducting plate being bent into a U-profile, partly surrounding the heating pipe;  the heating pipes laid in channels cut in the underlying thermal insulation and surrounded by filler with a high thermal conductivity which, in turn, is in good contact with the smooth heat conducting plate above the pipes For both types of the contact, the resistance is calculated by: ' RR,con  m°C/W (C.22) where is the diameter of the pipe NOTE C.2.4.4.6 A more accurate value might be determined by two-dimensional computer calculations or by tests Resistance in the U-profile of the heat conducting device For heat conducting devices where the pipe is inserted in a U-profile, an additional thermal resistance applies Heat from the pipe is collected along the U-profile and shall be conducted to the plane part of the heat conducting device The linear resistance can be calculated by: Ru'  0,008 m°C/W da (C.23) where da is the diameter of the pipe C.2.4.4.7 Total thermal resistance between the heat source and the heat conducting layer ' RHC  W  RR'  W  RR,con  W  RU'  RCL m2 °C/W (C.24) where W is the pipe spacing `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - 49 © ISO 2012 – All rights reserved Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Annex D (normative) Method for verification of FEM and FDM calculation programmes D.1 Temperature distribution and heat transfer in a typical floor cooling system This test example shall be used to verify a steady-state numerical calculation program for FEM or FDM calculations The structure is shown in Figure D.1 with appropriate material properties and dimensions Further boundary conditions are:  room temperature below and above the structure = 26 °C;  water temperature is the mean = 18 °C;  turbulent flow (resistance between heating medium and inner pipe is assumed = 0);  thermal resistance at upper boundary air layer = 1/7 = 0,1 429 m2K/W;  thermal resistance at lower boundary air layer = 1/11 = 0,0 909 m2K/W;  pipe distance = 150 mm;  pipe outside diameter = 20 mm;  pipe wall thickness = 2,3 mm;  pipes simulated as circles;  screed below pipe = 10 mm;  screed above pipe = 30 mm `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - 50 Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS © ISO 2012 – All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Figure D.1 — System construction and material properties for the test example Table D.1, Figure D.2 and Figure D.3 show the results for the calculated temperature distribution and the corresponding heat flows For an acceptable verification, the calculated surface temperature shall be within 0,3K and the calculated heat flow within 3% of the values in Table D.1, Figure D.2 and Figure D.3 Table D.1 — Results of the calculated temperature distribution T (x = m) [°C] T (x = 0,0375 m) [°C] T (x = 0,075 m) [°C] 0,285 22,201 22,064 21,893 0,246 20,086 19,788 19,11 0,205 20,728 20,414 19,765 0,164 24,809 24,806 24,802 0,123 24,944 24,943 24,943 0,082 25,082 25,081 25,081 0,041 25,219 25,219 25,219 25,357 25,357 25,357 `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - y [m] © ISO for 2012 – All rights reserved Copyright International Organization Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS 51 Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - Figure D.2 — Results of temperature distribution 52 Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS © ISO 2012 – All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Figure D.3 — Results of temperature distribution `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - 53 © ISO for 2012 – All rights reserved Copyright International Organization Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Annex E (normative) Values for heat conductivity of materials and air layers E.1 Solid materials Values for thermal conductivity of different solid materials are given in Table E.1 Table E.1 — Thermal conductivity of different materials Material Thermal conductivity  W/(m⋅K) PB pipe 0,22 PP pipe 0,22 PE-X pipe (HDX MDX) 0,35 PE-RT 0,35 `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - Steel pipe 52 Copper pipe 390 Covering PVC with air included 0,15 Covering PVC with no air included 0,2 Heat conducting aluminium device 200 Heat conducting steel device 52 Cement screed 1,2 Anhydrite screed 1,2 Concrete (   2400kg / m³ ) 1,9 Gypsum plaster boards 0,25 Lime plaster 0,7 Industrial floor covering 0,7 Asphalt screed 0,9 Stone wood 0,4 Timber (wood-chip board) 0,15 E.2 Trapped air layers Values for the equivalent thermal resistance of different types of trapped air layers are given in Table E.2 54 Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS © ISO 2012 – All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Table E.2 — Values for the equivalent thermal resistance of trapped air layers in the floor, wall or ceiling construction The surfaces of the air layer is assumed to be non-metallic Position of layer Thickness of layer in mm 10 20 40 60 80 100 150 200 Vertical (walls) 0,116 0,154 0,174 0,181 0,180 0,179 0,177 0,174 0,172 m²K/W Horizontal (floor, ceiling) Heat flow upwards 0,132 0,164 0,177 0,184 0,188 0,189 0,190 0,191 0,192 m²K/W Horizontal (floor, ceiling) Heat flow downwards 0,135 0,182 0,220 0,248 0,260 0,266 0,270 0,276 0,278 m²K/W `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - © ISO for 2012 – All rights reserved Copyright International Organization Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS 55 Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST ISO 11855-2:2012(E) Bibliography [1] Konzelmann M and G Zöllner: Thermische Leistungen flächenintegrierter Heiz- und Kühlflächen Published in HLH 56 (2005) No pp 30-34 [2] Konzelmann M and G Zöllner: Wärmetechnische Published in HLH 33 (1982) No pp 136-142 [3] ISO 7730, Ergonomics of the thermal environment — Analytical determination and interpretation of thermal comfort using calculation of the PMV and PPD indices and local thermal comfort criteria [4] Glück B.: Wärmeübergangskoeffizienten an thermisch aktiven Bauteiloberflächen und der Übergang zu Basiskennlinien für die Wärmestromdichte Published in Gesundheits-Ingenieur 128 (2007) No pp 1-10 [5] EN 563, Safety of machinery — Temperatures of touchable surfaces — Ergonomics data to establish temperature limit values for hot surfaces [6] ISO/TS 13732-2, Ergonomics of the thermal environment — Methods for the assessment of human responses to contact with surfaces — Part 2: Human contact with surfaces at moderate temperature [7] EN 13202, Ergonomics of the thermal environment — Temperatures of touchable hot surfaces — Guidance for establishing surface temperature limit values in production standards with the aid of EN 563 [8] ISO 13370, Thermal performance of buildings — Heat transfer via the ground — Calculation methods [9] ISO 7726, Thermal environments — Instruments and methods for measuring physical quantities [10] Konzelmann, M und Zöllner, G.: Wärmetechnische Prüfung von Fbodenheizungen Verưffentlicht in HLH 33 (1982) Nr S 136-142 [11] Kast, W.; Klan, H und Bohle, J.: Wärmeleistung von Fbodenheizungen Verưffentlicht in HLH 37 (1986) Nr S 175-182 [12] Konzelmann, M und Zöllner, G.: Auslegung und wärmetechnische Prüfung von WarmwasserFbodenheizungen Verưffentlicht in SHT (1984) S 255-259 [13] Kast, W.; Klan, H und Bohle, J.: Wärmeleistung von Fußbodenheizungen Teil Veröffentlicht in HLH 37 (1986) Nr 10 S 497-502 [14] Schmidt, P.: Untersuchung zum Einfluss des Heizsystems und zum Außenflächenzuschlag bei der Wärmebedarfsrechnung; Fortschritt-Berichte der VDI-Zeitschriften Reihe Nr 80 (1981) [15] Konzelmann, M.: Wärmeabgabe von Fußbodenheizungen.- Entwicklung einer Prüfmethode; Fortschritt-Berichte VDI Reihe 19 : Wärmetechnik/Kältetechnik Nr 23 VDI-Verlag Düsseldorf (1988) [16] Bohle, J and Klan, H.: Design of Panel Heating and Cooling Systems » ASHRAE Transactions 2000 [17] Koschenz, M und Lehmann, B.: Thermoaktive Bauteilsysteme tabs EMPA Switzerland 2000 [18] Glück, B Wärmeübertragung von Raumheizflächen und Rohren VEB Verlag für Bauwesen Berlin 1989 [19] P.J Schneider Conduction Heat Transfer 2nd Printing Addison-Wesley Publishing Co Inc Reading MA 1957 56 Copyright International Organization for Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS von Fuòbodenheizungen â ISO 2012 All rights reserved Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - Prüfung ISO 11855-2:2012(E) Heiselberg, Per: Stratified flow in Rooms with a Cold Vertical Wall ASHRAE Trans 1994 V.100 Pt [21] Nordtest “Design of floor heating systems” Report nr XXX (in press) 2002 [22] EN 1264-5, Water based surface embedded heating and cooling systems — Part 5: Heating and cooling surfaces embedded in floors ceilings and walls — Determination of the thermal output [23] EN 12828:2002, Heating systems in buildings — Design for water based heating systems [24] EN 12831:2002, Heating systems in buildings — Method for calculation of the design heat load [25] EN 15377-1, Heating systems in buildings — Design of embedded water based surface heating and cooling systems — Part 1: Determination of the design heating and cooling capacity `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - [20] © ISO for 2012 – All rights reserved Copyright International Organization Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS 57 Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST `,`,,,,,```,````,`,,`,`````-`-`,,`,,`,`,,` - ISO 11855-2:2012(E) ICS 91.040.01 Price based on 56 pages © ISO 2012 – Allforrights reserved Copyright International Organization Standardization Provided by IHS under license with ISO No reproduction or networking permitted without license from IHS Licensee=University of Alberta/5966844001, User=sharabiani, shahramfs Not for Resale, 12/03/2013 08:51:54 MST