F-' @ ic P DATA COMMUNICATION Technological Trends and Advances r I I r FIBER OPTIC DATA COMMUNICATION: TECHNOLOGICAL TRENDS AND ADVANCES FIBER OPTIC DATA COMMUNICATION: TECHNOLOGICAL TRENDS AND ADVANCES CASIMER DeCUSATIS Editor IBM Corporation Poughkeepsie, New York ACADEMIC PRESS An Elsevier Science Imprint San Diego London Boston New York Sydney Tokyo Toronto This book is printed on acid-free paper @ Copyright 2002,1998by Academic Press Al rights reserved l No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher Requests for permission to make copies of any part of the work should be mailed to the following address: Permissions Department, Harcourt, Inc., 6277 Sea Harbor Drive, Orlando, Florida 32887-6777 The appearanceof the code at the bottom of the fist page of a chapter in this book indicates 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to the Academic Press chapter is given ACADEMIC PRESS An Elsevier Science Imprint 525 B Street, Suite 1900,San Diego, CA 92101-4495, USA http://academicpress.com ACADEMIC PRESS LIMHTD An Elsevier Science Imprint Harcourt Place, 32 Jamestown Road, London NW17BY,UK http://academicpress.com Library of Congress Catalog Card Number: 2001095439 International Standard Book Number: 0-12-207892-6 Printed in China 02 03 04 05 RDC To the people who give meaning to my life and taught me to look for wonder in the world: my wife, Carolyn, my daughters, Anne and Rebecca, my parents, my godmother, Isabel, and her mother, Mrs Crease - CD Contents xi xiii Contributors Preface Part Technology Advances Chapter History of Fiber Optics Jeff D Montgomery 1.1 1.2 1.3 1.4 1.5 Earliest Civilization to the Printing Press The Next 500 Years: Printing Press to Year 2000 Fiber Optic Communication Advancement, 1950-2000 Communication Storage and Retrieval Future of Fiber Optic Communications, 2000-2050 References Chapter Market Analysis and Business Planning 17 22 31 32 Yann E Moman and Ronald C Lasky 2.1 2.2 2.3 2.4 2.5 2.6 Introduction The Need for Applications Supporting Technology Infrastructure Implementing a Market Survey Business Planning Summary Appendix: Market Analysis on a Transmitter Optical Subassembly Industry Description and Outlook World Fiber Optics Industry Target Markets Competition Position Conclusion References vii 32 32 33 34 37 41 42 42 45 48 58 60 61 62 Index Fiber optic networks, 9, 15-17 for datacom, 153 future Of, 22-3 topologies, 153, 154-156 trends, 53-55 Fiber optic power splitter, 97 Fiber optics industry See also entries beginning with Optical drawbacks, history, 9-3 industry description and outlook, 4 , professional organizations, 489490 world statistics, 47-48 Fiber optic transceivers, 508 Fiber Quick Connect (FQC), 82,98 Fiber-to-thecurve configuration See FTTC configuration Fiber-to-the-home configuration.See FITH configuration Fiber-to-the-officeconfiguration.See FTTO configuration Fiber Transport Services (FTS), 98-1 11 rn Fiber t u k switch, 161 Fibre Channel, 497,536 Fibre Channel Arbitrated Loop, 153 Fibre Channel Association (FCA), 60 Fibre Channel Connection See FICON Fibre Channel MFS, 333 Fibre Channel Standard (FCS), 52,53 Fibre Channel Systems Initiative (FCSI), 60 FICON, 158,209,294,498499,503,536 Field-programmablegate mays (FGPAs), 252-253 FIGS.See Fiber image guides First-generation CMOS-SEED,394-397 First-generation DWDM systems, 140,175 Fixed attenuators, 102 FJ connectors See Fiber-Jack connectors Flash lamps, 11, 12 “Flat panel” video screens, 24 Flip-chip bonding, 308,366,382,536 “Flow shop,’’ 475,536 Fluorozirconate glass, 124 FOCIS See Fiber Optic Connector Intermatability Standard Four photon mixing, 116 Fourth-generationWDM systems, 141 Fourth-order Bessel-Thompson filter, 329-330 Four wave mixing (FWM), 116, 164,443 FPA See Fabry-Perot amplifiers 559 FQC See Fiber Quick Connect Frame-to-frame interconnections, 17-230 Free-space backplane, 236-238 Free-space communications,506 Free-space OCIs, 248 Free-space optical links, 128,505-506 Free spectral range, 430 Frequency chirping, 165 Frequency division multiple access (FDMA), 209 FTS.See Fiber Transport Services FITC configuration,55 FlTH configuration,55 F?TO Configuration, 55 Fujitsu VPWOO, 278 Fujitsu VPP5000,278 Full width at half maximum (FWHM), 430 Functional layout, 478,479 FWM See Four wave mixing Gain equalization, 435436 Gallium arsenide, 12-13 Garage, 80 GBIC See Gigabit interface converter GDPS, 139,286 General Electric Co., 8, 15 GeographicallyDispersed Parallel Sysplex See GDPS GGP fiber, 72 Gigabit Ethernet, 219,222,501-504,536 Gigabit interface converter (GBIC), 152,508 Gigabit links, 286 Gigabyte System Network (GSN), 506 Glass, history, 14 Glass ceramic ferrule, 83 Glass-clad fiber bundle imaging, 11 Glass fibers, history, 14 Glass-glass-polymer,72 “Glob-top” encapsulation, 314 Gordon, James, 12 GR-326-CORE, 64 Group velocity dispersion (GVD), 115, 157, 165-166 GSN See Gigabyte System Network Guided-wave system demonstrator,252-255 GVD See Group velocity dispersion Hall, Robert N., 15 HANS See Home area networks Hansell, Clarence W., 11,14 560 Index Hard Polymer Clad fiber See HPCF Harper, Marion, Jr., 34 Hayashi, Izuo, 13 HE mode, 111 Heavy-metal fluoride fibers, 94 Hecht, Jeff, 14 HIBITS project, 234 Hicks, Wilbur, 10, 11, 14 Hierarchical networks, 204-206 High Bitrate ATM Terminationand Switching, 234 High Performance Networking Forum, 506 High Speed Plastic Network Consortium (HSPN), 507 High-speed switching, smart pixel technology, 388-39 Hill gratings, 169 HiPerLinks, 286-290,504 HIPPI, 506 Hitachi SR2001,278 Hitachi SR8000,278 Hockham, George, 10,14 HOIEC packaging See Hybrid optoelectronic integrated circuit (HOEIC) packaging Home area networks (HANS), 229 Hopkins, Harold H., 11 HP 9000 Superdome, 279 HP Openview, 163 HPC- 1,280,284-285 HPCF, 123 HSPN See High Speed Plastic Network Consortium Huang, A., 353 Hubbed ring WDM topology, 154,183 Hughes Research Laboratories, 15 Hybrid integration, 365-373,382,537 Hybrid modes, 111 Hybrid optoelectronic integrated circuit (HOEIC) packaging, 20 Hypercube topology, 273 Hypelplane, 385-387 IBM RS/6000 SP, 279 IBM Systed390 Enterprise Servers, 135,286 IB Signal Conditioner, 325 ICL DAP, 275 IEEE LAN standards, 492 IFBs See Imaging fiber bundles Imaging fiber bundles (IFBs), 250 Incoherent bundles, 95 Incom, 10 Infineon, 20,233,244 InfiniBand, 321-350,537 bit-to-bit skew, 333-334 connectors, 345-347 electrical interface, 3W326 fiber optic cable, 348-350 InfiniBand link layer, 323-326 opticaljitter specification, 331-333 optical signals, 325-331 optical specfications, 334-344 packet format, 323-324 “Inside process,” fiber optic cable fabrication, 90 Inside vapor deposition (IVD), fiber optic cable, 92 Integrated circuit, history, 20,21 Integrated waveguides, 234-236 Intel iWarp, 276,283 Intelligent optical intemetworking, 193-207 Internet growth rate, 135-136 history, 22 IP over WDM, 196196,198 next-generation Internet (NIGH), 159 “optical Internet,” 137 Intersymbol interference (ISI), 333 Intersystem Channel (ISC), 139,286 ISC See Intersystem Channel ISI See Intersymbol interference ITU grid standard wavelengths, for DWDM, 140-144 IVD See Inside vapor deposition iWarp, 276,283 IBM, 139,296,298 IBM 2029 Fiber Saver, 176-193 IBM 2938 Array Processor, 275 IBM 3838 Array Processor, 275 IBM 9729 Optical Wavelength Division Multiplexer, 175-176 IBM Parallel Sysplex, 139,279,286-296,499 IBM RS/6000 S80,279 Jenkins, B K , 353 Jitter, 331-333,537 “Job shops,”475476,538 Kahn, Robert, 22 Kao, Charles K., 10, 11, 14 Kapany, Narinder, 11 Karbowiak, Antoni E., 10 Index KDD (Japan), 17 Keck, Donald, 11,15 Kelvin-to-Celsiusconversion, 487 Kentucky Linux Athlon Testbed See KLAT2 Kern effect signal distortion, 157 KGD See Known good die (KGD) approach Kilby, Jack St Clair, 20 KLlO TOPS-10 processor, 276 KLAT2 processor, 277 Known good die (KGD) approach, 473 Kotler’s rule, 35 Kroemer, Herbert, 12 Lambadanet, 424 Lamm, Heinrich, 11 LANs, 492,539 Large effective area fiber See LEAF Laser Diode Labs, 15 Laser diodes, history, 15 Lasers, 11-12 Latency, 158-160,296-298,538 LBOS See Liquid crystal on silicon LC connectoTs; 64,74-77,81,85-87 LEAF, 117-118 mr LEDs, s a t pixel technology, 383,404,405 Leica Technologies,506 LIGA fabrication technology, 234 Lightby 40 channel AWG mux-demux, 145 LightRay MPX, 506 mr Liquid crystal on silicon (LBOS), s a t pixel technology, 37&373,379,382 “Low birefringence” fiber, 113 Low-loss optical fiber, history, 10-11,15 LP mode, 111 Lucent Corp., 64,103,104, 114,118,145,170, 171 Lucina fiber, 123 MAC-In, 506 MacChesney, John, 11 Mach-Zehnder interferometer,43 Maiman, Theodore, 11-12,15 MANS, 136,137,539 Manufacturing See also Packaging assembly processes, 472474 automatiodrobotics, 479480 “chicken and egg” syndrome, 467 colocation, 468-469 costs, 46346,474475,482,539 cycle time, 460463,479 561 delivery, 4.48 design, 456-457,480485 diversity of technologies, 467468 flexibility,474-479 integration, 469-472 “job shop” vs “flow shop,” 475476 modular layout, 476477,479 on-time delivery, 457 performance, 4 , 6 pricing, 463466 reliability, 448 service expectations, 449 ‘’visible horizon lead time,” 460 Market analysis, 32-62 fiber optic communication,26-29 market survey, 34-37,55-58 need for product, 32-33 sample, 42-62 technology infrastructure., 33-34 transmitter optical subassembly,42-62 Marketing strategy, defining, 36-37 Market survey, 3437,55-58 Masers, 12 Massachusetts Institute of Technology, 129 Maurer, Robert, 11,15 MBE See Molecular-beamepitaxy MBGA package See Metal ball grid array (MBGA) package MCMprocess.473 MCP cable See Mode conditioning patch cables MCVD See Modified chemical vapor deposition ME-ARIOPTO See Advanced Research Initiative in Microelectronics M a s , P.J., 13 Measurementunits, conversiontables, 486487 Mechanical computation machines, MESFETs, monolithic integration, 362 Meshed ring WDM topology, 155 Metal ball grid array (MBGA) package, 15 Metric preiixes, 487 Metric-to-Englishconversion, 486 MetroCor fiber, 118 Metropolitan Optical Network (METON), 426 Microstructured fibers, 125 Microwave relay communication, Microwave research, 12 MIMD, 274-275 “Mini-GBJC” connector, 80 Mini-MAC, 506 Mini-MT connectors, 77 562 Index "Mini-SC"connectors, 79 Mite1 Corp., 145 Mitsubishi Rayon Co., Ltd., 227 MMC connectors, 233 MOCVD See Modified chemical vapor deposition Mode conditioning patch cables (MCP), 106-1 11 Modified chemical vapor deposition (MCVD), fiber optic cable, 90,92 Modular layout, 475477,479 Modulators, smart pixel technology, 360, 366-367 Module assembly, optoelectronic packaging, 317-3 18 Molecular-beam epitaxy (M6E),13 MONET project, 170-172,426 Monolithic grating spectrometer,432 Monolithic integration, smart pixel technology, 359-363,382 MontgomeIy,Jeff D., 15 Mosaic Fabrications, 10,14 Mosaics, 96-97 MPlambdaS, 199 MPLS, 199,423 MPO connector, 506 MPX connector, 506 MQW devices See Multiple quantum well devices MT ferrules, 507 MTP connectors, 99,100 IvlT-RT connectors, 64-68,81-87 MU connectors, 78 Multifiber TerminationPush-on connectors See MTP connecton Multi MC connectors See MMC connectors Multimode ferrules, 120 Multimode fiber, 104-106,540 Multiple quantum well (MQW) devices, 354-359,383 Multiple Wavelength Optical Network (MONET), 170-172,426 Multiplexing, 140,540 See also Wavelength division multiplexing Multi-Protocol Label Switching See MPLS Multiwavelengthtransport network (MWTN), 426 NAS See Network attached storage NCube, 276 Near end crosstalk (NEXT), 116 NEC Corp., 129 NEC SX-5,279-280 Negative frequency chirp, 115 Neodymium-dopedchalcogenide fibers, 124, 167 Netview, 163 Network attached storage (NAS), 138 Networked computers, 21 Network interface units (NKJs), 159 Network topologies, WDM, 153, 154-160 Network topology, parallel processor design, 272-273 Neural networks, 391,406,541 NEXT See Near end crosstalk 159 Next-generation Internet (NIGH), Next-generation multimode fiber, 104-106 NIGH See Next-generationInternet MUS.See Network interface units NLOG See Nonlinear optical gate Non-entertainmentvideo, 25 Nonlinear effects, wavelength-division multiplexing (WDM), 163-170 Nonlinear optical gate (NLOG), 157 Non-Uniform Memory Access (NUMA) architecture, 284 Non-zero dispersion shifted fiber (NZDSF), 116 Nortel Networks, IBM 2029 Fiber Saver and, 176-193 OADM See Optical add/dmp multiplexing OC3/ATM 155,499-500,503 OC-IUATM 622,500 Occam, 283 OCI card See Optical Channel Interface (OCI) card OCIs See Optical chip interconnects OCLD card See Optical Channel Laser and Detector (OCLD) card OCM card See Optical Channel Manager (OCM) card ODC, 138 Oms.See Ordered fiber bundles OFC protocol, 139 O K See Optically Interconnected Integrated Circuits OLIVES, 234,426 OLS See Optical label switching OMA See Optical Modulation Amplitude Omnidirectional fibers, 129 Index “1+1” SONET-type protection switching, 160 One-dimensionalVCSEL array, 219-222 ONTC See Optical Network Technology Consortium Opened rings, 153 Open Fiber Control protocol See OFC protocol Openview, 163 OptiAir, 170 Optical adddrop multiplexing (OADM), 153, 156,162 Optical amplifiers, 10-11, 13, 16-17, 123-125, 167-168,433436 Optical attenuators, 102 Optical backplane connectors, 506 Optical backplanes, 230-241 Optical Channel Interface (OCI) card, 180 Optical Channel Laser and Detector (OCLD) card, 180 Optical Channel Manager (OCM) card, 180-181 Optical chip interconnects (OCIs), 246-255 Optical computer, 353 Optical connectors, 506 Optical crossbar switches (OXBS), 159 Optical Data Center See ODC Optical fiber See also Fiber optic cable; Fiber optic networks dispersion controlling fiber, 114-1 19 encapsulated fiber and flex circuits, 103 fabrication, 94 microstructured fibers, 125 next-generation multimode fiber, 104-106 omnidirectional fibers, 129 photonic crystal fiber, 125-128 photosensitive fibers, 119-120 plastic optical fibers (POFs), 120-123, 226-230,507 polarization controlling fibers, 111-1 14 rare earth-doped fiber, 124-125 Optical gating wavelength conversion, 442 Optical Interconnectionsfor VLSI and Electronic Systems See OLIVES Optical interconnects, 216-257 board interconnects, 217,218,241-246 chip interconnections, 246-255 direct interboard interconnection, 238 frame-to-frame interconnections, 217-230 optical backplanes, 23C241 smart pixel technology, 384-391 “Optical Internet,” 137 563 Optical intemetworking, 193-207 digital wrappers, 194-196 hierarchical networks, 204-206 I over WDM, 194-196 P standards, 200-203 WAN traffic engineering, 196-200 Optical jitter specification,331-333 Optical label switching (OLS), 199 Optically Interconnected Integrated Circuits (OIIC), 253 Optically interconnectedparallel supercomputers,296-298 Optical Micro-Networksprogram See ChEEta.h/OMNET Optical mode conditioners, 105-1 11 Optical Modulation Amplitude (OMA), 331 Optical Network TechnologyConsortium (ONTC), 170,426 Optical packet switches, 27,29 Optical regenerators, 157 Optical signal (OSIG) mode, 171 Optical 3R regenerator, 157 Optical Time Division Multiplexing See OTDM Optical transfer function (OTF), 152 Optical transport networks (Crmrs), 136 Optic splitters, 97 Optinex2, 103 Opti-Jack connectors, 77-78 Optoelectronic conversion,440 Optoelectronic packaging, 15-320 Optoelectronics See also Fiber optic cable; Fiber optic links MiniBand, 321-350 manufacturing,447-485 packaging, 303-320,359-373 professional organizations,489490 smart pixel technology, 236,352410 Ordered fiber bundles (Oms),250 OS1 model, 491 OTDM, 423 OTE See Optical transfer function OTNs See Optical transport networks “Outside process,” fiber optic cable fabrication, 92 Outside vapor deposition (OVD), fiber optic cable, 92 OVD See Outside vapor deposition OXBS See Optical crossbar switches OXCs, 162 564 Index Packaging, 303-320,472-473 first level packages, 305,311-315 hierarchy, 305 optoelectronicpackaging, 315-320 printed circuit board (PCB), 305 second level assembly techniques, 305-31 smart pixel technology, 35S373 surface-mount technology (SMT), 304, 311-313 Through Hole Technology (THT), 304-305 Packet switches, 27,29,541 PANDA fiber, 113 Panduit Corp., 77 Panish, Morton, 13 Parallel coupled processor architecture, 139 Parallel links, 20,541 Parallel optical transceivers, 509 Parallel processor design, 270-299 CMU Warp processor, 273,283 GDPS, 139,286 network topology, 272-213 Parallel Sysplex, 139,279,286-296,499 processors, 274-282 SKY HPC-1,280,284-285 supercomputers, 296-298 transputer, 273,276,283-284 Tsukuba CP-PACS/2048,281,285 Parallel processors, history, 275-282 Parallel Sysplex, 139,279,286-296,499 PAROLI transceivers, 244 PAROLI transmitter, 233 Payne, David, 13 PBGA See Plastic ball grid array (PBGA) packages PCA See Product Cost Apportionment PCB See Printed circuit board PCVD See Plasm-assisted chemical vapor deposition PDG See Polarization dependent gain PDL See Polarization dependent loss Peer-to-Peer Remote Copy (PPRC) protocols, 293 "Perfect minor" technology, 129 Perfluorinated plastic optical fibers, 228 Photonic A/D conversion, smart pixels, 406-409 Photonic crystal fiber, 125-128 Photonic networks, 156-157 Photonics, 353,542 Photosensitive fibers, 119-120 Photosensitivity, 169 Physical constants, 488 Pipeline topology, 272-273 Pirelli, 114, 170 Planck, Max, 12 Planck's constant, 488 Plasma-assisted chemical vapor deposition (PCVD), fiber optic cable, 90,92 Plastic ball grid array (PBGA) packages, 13-3 15 Plastic optical fibers (POFs), 120-123,226-230, 507 Plastic/polymer ferrules, 120 Pluggable transceivers, 80 Pluribus processor, 275 PMD See Polarization mode dispersion PMF See Polarization maintaining fiber PMMA, 121,227,228,235 POFs See Plastic optical fibers POINT project, 235 Point-to-point WDM topology, 154, 156 Polarization controlling fibers, 111-1 14 Polarization dependent gain (PDG), 114 Polarization dependent loss (PDL), 114 Polarization Maintaining and Absorption Reducing Fiber See PANDA fiber Polarization maintaining fiber (PMF), 112 Polarization mode dispersion (PMD), 157 Polarization preserving fiber, 112 Polyguide, 235 Polymer ferrules, 120 Polymer optical fibers See Plastic optical fibers Polymer Optical Interconnect Technology project See POINT project Polymer waveguides, 242,245 Poole, S.B., 13 Positive frequency chup, 115 PPRC protocols See Peer-to-Peer Remote Copy (PPRC) protocols Praseodymium doped amplifiers, 124,167 Prefixes, metric, 487 Printed circuit board (PCB), 305 Printing press, history, 5,17-18 Product Cost Apportionment (PCA), 484,543 Product development market analysis; 32-62 market survey, 34-37,55-58 marketing strategy, 36-37 need for product, 32-33 supporting technology, 33-34 Index Professional organizations, 489490 Protocols ATM/SONET protocols, 136-137,423 defined, 543 EXON, 99,151,152,158,208-209,498 OFC protocol, 139 PPRC protocol, 293 for WDM, 150-151 XRC protocol, 294 Psaltis, D., 353 Pump diode, 16 QCSE See Quantum confined Stark effect Quad Flat Package (QFP), 310 Quantum confined Stark effect (QCSE), 355, 543 Q u a m contact connectors See SC-QC connectors RACE project, 426 Rainbow, 424 Rare earth-doped fiber, 124-125, 167 RCA, RCA Samoff Laboratories, 15 RCE LED See Resonant cavity-enhanced (RCE) LED Reality-based programs, 25 Regeneration, 156 Remote DMA (Remote Direct Memory Access), 285 Reshaping, 156 Resonant cavity-enhanced (RCE) LED, 383, 404,405 Retiming, 156 Robotics, in manufacture, 479480 Rocket vehicle technology, Russel, Phillip, 125 “Safety stock,” 463 SANS, 138,203,546 Sanwa Corp., 78 Satellite microwave communication,9 Saturable absorber, 442 SBCON, 498 SBS See Stimulated Brillouin scattering SC-DC connectors, 64,68-70,80-82,86,87 SC-DC UniCam connectors, 70 Schockley,William, 12 Schultz, Peter, 11, 15 SC-QC connectors, 68-70,82 565 SDH See Synchronous digital hierarchy SDM See Space-divisionmultiplexing Second-generationCMOS-SEED, 397-402 Second-generationDWDM systems, 141 SEED See Self-electrooptic effect device Segmenting, 35 Self-electmoptic effect device (SEED), 357 Self-healing, 162 Semiconductoramplifier,433434 Semiconductordevices, history, 12 Serial-to-parallelconverter,210 SETI, 296 SFF connectors See Small Form Factor connectors SFP transceivers, 80 SGI 2000,280 SGI 3800,280 Shelf Processor card (SP card), 180 SIC manual See Standard Industrial Classificationmanual Siecor, 68 Siemens, 12 Signal amplification,history, 19 Signal processing, smart pixel technology, 391-409 SIMD, 274-275 Single-mode fiber,ll,95 Sinusoidaljitter, 333 SIPAC system, 232 SKYchannel, 284 SKY HF‘C-1,280,28&285 Small Form Factor connectors (SFFconnectors), 63-87 BTW connectors, 74,75 comparing, 80-87 Fiber-Jack (FJ) connectors, 77-78 LC connectors, 64,74-77,81,85-87 “Mini-GBJC” connector, 80 mini-MT connectors, 77 “mini-SC” connectors, 79 MT-RJ connectors, 64-68,81-87 MU connectors, 78 multi-terminationunibody, 78 Opti-Jack connectors, 77-78 SC-DC connectors, 64,68-70,80-82,86,87 SC-DC UniCam connectors, 70 SC-QC connectors, 68-70,82 SMU Connectors, 78 transceivers, 79-80, 84 VF-45 connectors, 64,71-74,81-83,86,87 566 Index Smart pixel technology, 236,352410,545 aggregate capacity, 373-374 analog-to-digital conversion, 402-409 applications, 381,384409 array size, 379-380 backplane interconnections, 386-388 complexity, 374-375 design, 375-381,382-383 device speed, 378-379 digital image halftoning, 391402 direct epitaxy, 363-365 epitaxial lift-off (ELO), 368-370,382 flip-chip bonding, 366,382 future trends, 409410 high-speed switching, 388-391 history, 353-354 hybrid integration, 365-373,382 liquid crystal on silicon (LBOS), 370-373, 379,382 monolithic integration, 359-363,382 multiple quantum well devices, 354-359 optical interconnects, 384-391 performance metrics, 373-376 signal processing, 391-409 system integration, 380 SMF-LS fibem, 17 SMT See Surface-mount technology SMU connectors, 78 Snitzer, Elias, 10, 13, 14, 16 Solder bumps, 308,310-31 SONET, 52,53,186,497,498 Source Synchronous interfaces, 322 Space-divisionmultiplexing (SDM), 55 Sparse WDM (SWDM), 140 SP card See Shelf Processor card Spec Trans Specialty Optics, 507 Speed of light, 488 SPIBOC project, 234 “Spoofing”the channel, 160 Spun fiber, 113 SR2001,278 SR8000,278 SRS See Stimulated Raman scattering S-SEED Symmetric SEED See Stacked planar optics, 236 Standard Industrial Classification (SIC) manual, 35 Standardised Packaging and Interconnect for Inter- and Intra-Bod Optical Interconnections See SPIBOC project Standards ANSI standards, 493-494 connectors, 64 Ethernet standards, 497,502-503 IEEE LAN standards, 492 optical internetworking, 200-203 Standard TelecommunicationsLaboratories (STL), 10,14,15 STAR4N processor, 275 Stephan-Boltzmannconstant, 488 Stimulated Brillouin scattering (SBS), 166 Stimulated Raman scattering (SRS), 166, 167 STM See Synchronoustransport mode Storage area networks See SANS Strowger switch, 7,21 STSIOC, 495 STS-XC, 496 Sun Enterprise 10000,280 Sun Ultra HPC 4500,280 Sun XDBus, 284 Supercomputers,296-298 SuperHIPPI, 506 Superluminal waveguides, 129-130 Super-MT, 507 Supply Chain Cost, 484 Surface-mount technology (SMT), 304, 11-3 13 SWDM See Sparse WDM Switchable grating, 432 Switch-based private networks, 203 SX-5,279-280 Symmetric SEED (S-SEED), 358-359 Synchronous digital hierarchy (SDH), 52,53, 495,497 Synchronous optical networks See SONET Synchronous transport mode (STM),495-496 Sysplex llmer, 287,291,498 System6, 354 system7, 354 Systimax LazrSPEED fiber, 104 TAB See Tape-automatedbonding Tape-automatedbonding FAB), 309-310 Tape ball array package, 14 Tape ball grid array (TBGA) package, 314,315 TBGA package See Tape ball grid array (TBGA) package TCM See Time-compression multiplexing TCPIIP, 22 TDM See Time division multiplexing Index TDMA See Tlme division multiple access Telcordia Corp., 163, 171 Telecommunication technology, history, 7-3 Telephone communications, 134 Telephone signal switching, 21 Television, history, 23-25 Tellium, 171 Temperatureconversion table, 487 Terabit-per-fiber transmission, 17, 18 TERKS system, 163 TerraLink system, 505 Terrestrial microwave relay, Texas Instruments, 20 Thermocompression wirebonding, 308 ThermoTrex Corp., 506 Thin film interference filters, 146 Third-generation DWDM systems, 141, 176 Three-wave mixing, 443 TT, Through Hole Technology ( H )304-305 TIA-568-B, 64 18 Time compressionmultiplexing (TCM), 55,2( Time division multiple access (TDMA), 209, 210 147-148 Time division multiplexing (TDM), Time-space converter, 210 Timmons, Jeffrey, 37 Tivoli Netview, 163 Token ring topology, 500 Toray Industries, Inc., 227,507 TONStopology, 273 TOSA See Transmitteroptical subassembly Total jitter, 333 Townes, Charles, 12 Transceivers, 79-80,84,334-344,508,547 Transistors, 19-20,26 Transmitteroptical subassembly (TOSA), market analysis, 42-62 Transmitters, history, 12-13 Transponder, 150,547 Transputer, 273,276,283-284 Traveling wave amplifiers (TWA), 433,434 Truephase family, 114 Tm-Wave fiber, 117,118 Tsukuba CP-PACS/2048,281,285 Tunable laser, 442 Tunable laser diodes, 427 Tunable receiver, 429433 Tunable transmitter, 426429 TWA See Traveling wave amplifiers “Twisted pair” insulated copper wires, 7, 14 567 Ultra-dense WDM systems, 141 Ultra HPC 4500,280 Unicenter, 163 Unidirectional switching, 184 Units of measure, conversion tables, 486-487 Up-chirp, 115,548 U-Tokyo GRAF’E-6,281 Vacuum tubes, 19 VAD See Vapor axial deposition van Heel, Abraham, 11 Vapor axial deposition (VAD), fiber optic cable, 92.93 VCs See Virtual containers VCSELs (vertical-cavity surface-emitting lasers), 60-61,223 238,242, 509 defined, 548 monolithic integration, 362 one-dimensionalVCSEL array, 219-222 smart pixel technology, 362,383 Very long instruction word (VLIW) microprocessor, 283 VF-45 connectors, 64,71-74,81-83,86,87 Videoconferencing, 23 Video games, 23-24 Video screen development, 24 V ~ u acontainers (VCs), 496497 l Vrul private network (VPN), 195 ita “Visible horizon lead time,” 460 VLIW microprocessor See Very long instruction word (VLIW) microprocessor VPN See Virtual private network VPP700,278 VPP5000,278 WANs, traffic engineering, 196-200 Warp processor, 276,283 Waveguides integrated waveguides, 234-236 polymer waveguides, 242,245 superluminal waveguides, 129-130 two-dimensional waveguide, 250 Wavelength converter, 4 W Wavelength-division multiplexing (WDM), 55, 102,140-21 commercial systems, 170-193 design, 147,149-152 distance and repeaters, 153-158 first-generation WDM, 175-176 history, 426 568 Index Wavelength-divisionmultiplexing (WDM) (conf' d ) IBM 2029 Fiber Saver, 176-193 IBM 9729 Optical Wavelength Division Multiplexer, 175-176 intelligent optical internetworking, 193-207 latency, 158-160 network management, 162-163 network topologies, 153, 154-160 nonlinear effects, 163-170 optical amplifiers, 167-168 protection and restoration, 160-162 protocols supported by, 150-151 types, 140-149 WAN, 172 Wavelength mixing, 443 Wavelength multiplexer/demultiplexer, 436-437 Wavelength-routednetworks, 425,548 Wavelength router, 437-440 WaveMux, 170 WDM See Wavelength-divisionmultiplexing WDM filters, 154 WDM rings, 153 WDhWWDMA, history, 426 Wedge bonding, 308,309 Weker, Heinrich, 12 Wide Spectrum WDM (WWDM), 140,222 Wmbonding, 308,548 Wolf, Helmut F., 15 WWDM See Wide Spectrum WDM XDBus, 284 XFC communication.See Cross-system coupling facility (XCF) communication XRC protocols See Extended Remote Copy (XRC) protocols ZBLAN glass, 124 Zeiger, Herbert, 12 Zig-zag-type beam propagation, 236 Zimar, Frank, 15 - L - - N8SI I LZ68LO ZZ108L 6EE06 NI I ... FIBER OPTIC DATA COMMUNICATION: TECHNOLOGICAL TRENDS AND ADVANCES FIBER OPTIC DATA COMMUNICATION: TECHNOLOGICAL TRENDS AND ADVANCES CASIMER DeCUSATIS Editor... to Year 2000 Fiber Optic Communication Advancement, 195 0-2 000 Communication Storage and Retrieval Future of Fiber Optic Communications, 200 0-2 050 References Chapter Market Analysis and Business... severe distance-times-bandwidth limitation Fiber optic waveguide has become the next-generation transmission media, initially for long-distance, high -data- rate transport As technologies and production