Package Mechanical Drawings ppt

April 2013 1 © 2013 Microsemi Corporation Package Mechanical Drawings Naming Conventions This document lists all package types used for Microsemi FPGAs and provides detailed drawings and dimensions. Table 1 lists the package types, their acronyms, and the naming convention used when referring to a package of that type with a particular pin count. Table 1 • Package Naming Conventions Package Type Package Name Acronym Package/Pin Naming Convention (example) Ceramic Packages Ceramic Pin Grid Array CPGA PG84 Ceramic Quad Flat Pack CQFP CQ208 Ceramic Chip Carrier Land Grid Substrate CCLG CC256 Ceramic Column Grid Array CCGA CG484 Ceramic Land Grid Array CLGA LG484 Plastic Packages (leadframe-based, peripheral leads) Quad Flat No Lead QFN QN48 Plastic Quad Flat Pack PQFP PQ208 Thin Quad Flat Pack TQFP TQ144 Very Thin Quad Flat Pack VQFP VQ176 Plastic Quad Flat Pack (exposed heatsink) RQFP RQ208 Plastic Leaded Chip Carrier PLCC PL44 Plastic Packages (substrate-based, area array pins) Plastic Ball Grid Array (1.27 mm pitch) PBGA BG272 Fine Pitch Plastic Ball Grid Array (1.00 mm pitch) FBGA FG144 Chip Scale Package (0.50 mm pitch) CSP CS81 Chip Scale Package (0.80 mm pitch)* CSP CS49 Micro Chip Scale Package UCS UC36 Very Fine Ball Pitch Grid Array VFPBA VF400 Note: *Currently the CS49, CS128, CS180, and CS289 packages are 0.80 mm pitch rather than 0.50 mm pitch. Revision 44 Ceramic Pin Grid Array (CPGA) 2 Revision 44 Ceramic Pin Grid Array (CPGA) PG84 Notes: 1. All dimensions are in inches unless otherwise stated. 2. BSC = Basic spacing between centers. Supported Devices A1010B A1020B Orientation Pin 1.100" ± 0.020" square 0.072" 0.088" 0.015" 0.120" 0.140" 0.100" BSC 0.018" ± 0.002" 0.050" ± 0.010" 0.045" 0.055" L K J H G F E D C B A 1110987654321 Pin #1 ID Top View Bottom View Side View 1.000" BSC Package Mechanical Drawings Revision 44 3 Ceramic Pin Grid Array PG100 Notes: 1. All dimensions are in inches unless otherwise stated. 2. BSC = Basic spacing between centers. Supported Devices A1225XL* A1415A* Note: *This product is obsolete. 0.015" Orientation Pin 1.100" ± 0.015" square 0.072" 0.88" 0.120" 0.140" 0.050" ± 0.010" Pin #1 ID 0.05" 0.055"            111051 Top View Bottom View Side View 0.100" BSC 1.000" BSC 0.01 ± 0.00" Ceramic Pin Grid Array (CPGA) 4 Revision 44 Ceramic Pin Grid Array PG132 Notes: 1. All dimensions are in inches unless otherwise stated. 2. BSC = Basic spacing between centers. Supported Devices A1240A A1240XL* Note: *This product is obsolete. 0.015" Orientation Pin 0.120" 0.140" 0.100" BSC 0.018" ± 0.002" 0.050" ± 0.010" 1.200" BSC 0.072" 0.088" Pin #1 ID 0.045" 0.055" 11 12 1310987654321 N M L K J H G F E D C B A Top View Bottom View Side View 1.360" ± 0.015" square Package Mechanical Drawings Revision 44 5 Ceramic Pin Grid Array PG175 Notes: 1. All dimensions are in inches unless otherwise stated. 2. BSC = Basic spacing between centers. Supported Devices A1440A* Note: *This product is obsolete. Index Mark 0.018" ± 0.002" 0.130" ± 0.010" 0.050" ± 0.005" 0.105" ± 0.010" 1.400" BSC 0.100" BSC 0.05" ± .0005" 1.570" ± 0.015" square R P N M L K J H G F E D C B A Top View Bottom View Side View 123456789101112131415 Ceramic Pin Grid Array (CPGA) 6 Revision 44 Ceramic Pin Grid Array PG176 Notes: 1. All dimensions are in inches unless otherwise stated. 2. BSC = Basic spacing between centers. Supported Devices A1280A A1280XL* Note: *This product is obsolete. 0.120" 0.140" 0.105" ± 0.010" 0.050" ± 0.005" 1.400" BSC 0.100" BSC 1.570" ± 0.015" square 11 12 13 14 1510987654321 R P N M L K J H G F E D C B A 0.018" ± 0.002" 0.05" ± 0.005" Top View Bottom View Side View Index Mark Package Mechanical Drawings Revision 44 7 Ceramic Pin Grid Array PG207 Notes: 1. All dimensions are in inches unless otherwise stated. 2. BSC = Basic Spacing between Center. Supported Devices A1460A 0.100" BSC 0.05" ± 0.005" 0.115" ± 0.011" 11 12 13 14 15 16 1710987654321 U T R P N M L K J H G F E D C B A 1.600" BSC 0.018" ± 0.002" 0.180" ± 0.010" 0.05" ± 0.005" Top View Side View Bottom View Index Mark 1.77" ± 0.010" square Ceramic Pin Grid Array (CPGA) 8 Revision 44 Ceramic Pin Grid Array PG257 Notes: 1. All dimensions are in inches unless otherwise stated. 2. BSC = Basic spacing between centers. Supported Devices A14100A 1.970" ± 0.015" square 0.105" ± 0.012" 0.100" BSC 0.120" 0.140" 0.018" ± 0.002 " 0.05" ± 0.005" 0.005" ± 0.005" Top View Bottom View Side View A B C D E F G H J K L M N P R T V X Y 1 2 3 4 5 6 7 8 9 10111213141516171819 1.800" ± 0.012 I ndex Mark Package Mechanical Drawings Revision 44 9 Ceramic Quad Flat Pack (CQFP) CQ84 Notes: 1. Units are mm. 2. LID should be connected to GND. 3. Die attach area should be connected to GND. Top View Ceramic Quad Flat Pack (CQFP) 10 Revision 44 Ceramic Quad Flat Pack CQ84 Side View and Bottom View Notes: 1. Units are mm. 2. LID should be connected to GND. 3. Die attach area should be connected to GND. Supported Devices A1020B RT1020* A32100DX* RH1020* A54SX32A RT54SX32S*, RTSX32SU Note: *This product is obsolete. Bottom View Side View MAX. 2.31 MAX. 2.00 1.77 ± 0.18 2.15 ± 0.25 (2.55) (0.45) DEPTH (2.15) (2.05) (2.40) DEPTH INDEX MARK (PLATING OPTION) 84 1 64 64 43 42 21 22 4X (0.76 × 45º) CHAMFER 4X (1.25) (1.10) (DEPTH 0.45) 4X LEAD MATERIAL Fe-Ni-Co ALLOY BRAZED Ag-Cu ALLOY 0.889 4X 24.13 ± 0.25 CERAMIC [...]... Lead material is Kovar with gold plate over nickel 4 Packages are shipped unformed with the ceramic tie bar 5 Package is cavity down, with the lid facing the bottom of the package However, the leads can be formed on either side if the application requires the lid to be facing the top Supported Devices A42MX36 16 R ev i sio n 4 4 Package Mechanical Drawings Ceramic Quad Flat Pack CQ256—Cavity Down with... circular for the CQ208, CQ256, and CQ352 3 Seal ring and lid are connected to Ground 4 Lead material is Kovar with minimum 60 microinches gold over nickel 5 Packages are shipped unformed with the ceramic tie bar 14 R ev i sio n 4 4 Package Mechanical Drawings Supported Devices CQ208 CQ256 A32200DX* A54SX16 A54SX32 RT54SX72S* RTSX72SU RT54SX72S* RTSX72SU Note: *This product is obsolete R ev i si o n 4 4... dimensions 2 Outside lead frame holes (from dimension H) are circular for the CQ208, CQ256, and CQ352 3 Seal ring and lid are connected to Ground 4 Packages are shipped unformed with the ceramic tie bar in a test carrier 12 R ev i sio n 4 4 Package Mechanical Drawings Supported Devices CQ132 CQ172 CQ196 CQ208 CQ256 CQ352 AX250 AX500 AX1000 AX2000 A1425A A1280A A1460A A42MX36 A14100A RT1425A RH1280* RT1460A... chamfer leads are applied to maintain minimum spacing between corner leads; otherwise, keep normal lead shape 2 Die attach paddle center of package is tided to ground (GND) Supported Devices A3PN010 A3P030/A3PN030 30 AGN010 AGL030/AGLN030 R ev i sio n 4 4 Package Mechanical Drawings QN68 Bottom View Top View D2 A D Datum A D/2 B e NX k E/2 D2 2 E2 2 Datum B E2 E Detail C Pin 1 Indicator NX b Detail A bbb... 0.5/2 0.5/2 0.5 Terminal Tip 6 0.5 QN180/QN132 QN108 Detail B (LC When Present) K k L1 34 L1 LC 7 LC R ev i sio n 4 4 Package Mechanical Drawings Quad Flat No Lead QN108 Bottom View A44 A56 B41 B52 Pin A1 Mark A43 A1 B40 B1 B13 A14 B27 A29 B26 B14 A28 Note: Die attach paddle center of package is tied to ground (GND) A15 Supported Devices AFS090 R ev i si o n 4 4 35 Quad Flat No Lead (QFN) Quad Flat No... theoretical true position dimension and so has no tolerance The dimensions above are for reference only For more accurate dimensions, use the dimensions in the SMD drawings for a specified device For heat sink information, refer to the Hermetic Package Mechanical Configuration document (Cavity, weight, lid size and heat sink size) located at: www.actel.com/documents/HermeticPckg.pdf R ev i si o n 4 4 19 Ceramic... 0.254±0.025 LID 0.508±0.051 6.001 6.001 4X 0.254 6.140 LID 15.240±0.152 (R 0.254) R ev i sio n 4 4 Side View (with partial section view) 0.889±0.051 (bottom to External Bonding pads) LID 12.954±0.152 Package Mechanical Drawings CCLG Substrate Dimensions Top View (Zoom 2.4x) 17.000 ±0.203 LID 12.954±0.152 6.001 A1 Index Corner 193 256 (1.000X45°) CHAMFER 6.140 External Bonding Pad 1 192 TYP 6.001 6.140 6.140... 3 4 5 6 7 8 9 101112131415 161718 19 20 2122 Bottom View Note: The top and side views will be completed in the future Supported Devices RT3PE600L RT3PE3000L 22 R ev i sio n 4 4 CLGA Side View Package Mechanical Drawings Ceramic Column Grid Array CG624 Top View A D A2 A1 A1 Corner Index Area A A2 b E CCGA Side View D1 e AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A CLGA Side View E1 e 1 2 3... R P E1 N M L K J H G F E D C B A e 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Bottom View Supported Devices RT3PE3000L 24 R ev i sio n 4 4 CLGA Side View Package Mechanical Drawings CCGA Dimensions CG484 CG624 CG896 Dimension Min Nom Max Min Nom Max Min Nom Max CCGA - A 5.19 5.72 6.19 4.54 4.88 5.41 5.65 6.23 6.75 CLGA - A 3.06 3.51 3.83 2.41 2.67 3.05 3.16 3.51... Bottom View Notes: 1 The units are in mm 2 The seal ring area must be connected to GND 3 Die attach area must be connected to GND Supported Devices RTAX2000S 26 R ev i sio n 4 4 CLGA Side View Package Mechanical Drawings CG1272 Top View 0.100 2.772 ± 0.270 37.500 ± 0.380 +0.150 2.210 –0.060 0.508 ± 0.025 37.500 ± 0.380 (1.50 × 45º) CHAMFER 3X (1.50 × 45º) CHAMFER 0.150 A 5.935 MAX 5.135 MIN 35.000 A . Corporation Package Mechanical Drawings Naming Conventions This document lists all package types used for Microsemi FPGAs and provides detailed drawings and dimensions. Table 1 lists the package. referring to a package of that type with a particular pin count. Table 1 • Package Naming Conventions Package Type Package Name Acronym Package/ Pin Naming Convention (example) Ceramic Packages Ceramic. Ground. 4. Packages are shipped unformed with the ceramic tie bar in a test carrier. A b H D1 D2 E2 E1 F L1 K Ceramic Tie Bar Number 1 e A1 C Lead Kovar Lid Top View Side View Package Mechanical Drawings Revision