804 k03 v3 x RAY檢驗作業規範 PTSGI EN(0816) ok 模版更新

Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE OF 21 Revision History Rev Status Revision Date Revised By 2007/6/14 文文文 2019/8/17 Rebel Description 文文 page10-page23 文文 NG 文文文文 Added various NG diagrams on pages 10–23 1文文文文文文文 Add English translation 2文文文文文文文 Add Vietnamese translation 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE OF 21 目目 CONTENTS 1.0 文文 PURPOSE 2.0 文文 SCOPE .3 3.0 文文 RESPONSIBILITIES 4.0 文文文文 FLOWCHART 5.0 文文文文 ACTIVITIES DESCRIPTION 6.0 文文文文文 AUTHORITY 7.0 文文 APPENDIX 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE OF 21 1.0 文文 PURPOSE 文文文文文文文文文文文文文 X-ray 文文文文文文文 SMT 文文文文文文文文文文文 The purpose of this guideline is to set a standard operating procedure when using the X-ray machine to inspect SMT solder joint quality 2.0 文文 SCOPE 文文文文文文文文文文文文文文文文文文文文文文文文文文文 This guideline is applicable to the regular inspection of PCB production and the analysis of other defective boards 3.0 文文 RESPONSIBILITIES 3.1 文文文文文 Board production department 3.1.1 文文文文文文文文文文文文文文文文 X-ray 文文文文文 Production workers send the PCBs for inspection to the X-ray machine according to the specified time frame 3.1.2 文文文文文文文文文文文文文文文文文文, 文文文文文文, 文文文文文文文文文文文文文文文文 Engineering staff are responsible for operating and inspecting all PCBs for inspection, filling out inspection records and notifying the results of defective boards to the process engineer 3.2 文文文文 Other departments 文文文 X-ray 文文文文文文文文文文 X-ray 文文文, 文文文 “ X-ray 文文文文文 ” Send the PCBs for defect analysis by X-ray to the X-ray machine and fill out the “X-ray inspection application” form 4.0 文文文文 FLOWCHART X-ray 文文文文(X-ray inspection flow): 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE OF 21 OK X-Ray inspection & analysis Board production department Send the PCB for inspection to X-ray Record the results and return PCBs End NG Fill out the inspection application Other departments Record the defects and issues and respond to the process engineer 5.0 文文文文 ACTIVITIES DESCRIPTION 5.1 文文文文 Inspection time point 5.1.1 文文文文 Normal production 5.1.1.1 文文文文文文文文文PCB 文文文文文文文文文文文文文文文文文文 PCB PCB production lines文fornt and back文send PCBs every hours under normal production 5.1.1.2 文文文文文文文文文文文文 PCB 文文文文文文文文文文文文文文文文文 PCB 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE OF 21 The front/back production lines should send PCBs respectively within 15 minutes after model switch 文文文文文文文 5.1.2 First mass production of the new model PCB 文文文文文文文文文文文文文文文 20 文 The front/back production lines should send the first 20 pieces of that lot for inspection BGA 文文 5.1.3 BGA repair 文文文 BGA 文 PCB 文文文文 X-ray 文文 All PCBs with BGA repair must be inspected by X-ray 5.1.4 文文文文 Other departments 文文文文文文文文文 X-ray 文文文文文文文文文, 文文文文文文文文 Other departments can apply for inspection when it is necessary to use X-ray to analyze the product or defective PCBs 5.2 文文文文 Inspection area 5.2.1 文文文文文文文文文文文文文文文文文文文 PCB 文文文文: 文文文文文文文文文文文文文文文文, 文 BGA, CSP 文文文 For PCB inspection parts of normal production or the first mass production of a new model, the inspection area should focus on parts whose soldering cannot be verified by visual inspection, such as parts including BGA and CSP 5.2.2 文文文文文文文 PCB 文文文文文文文文文文文文文文文文文文 For PCBs sent from other departments, the inspection area should be bad parts position or the desired inspection area 5.3 文文文文 Inspection results 5.3.1 X-ray 文文文文文文文文文文文文文文文文文文文 “X-ray 文文文文”文“X-ray 文文文文文” 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE OF 21 After the inspection, the X-ray inspector should record the results in “X-ray inspection record” and “X-ray inspection application.” 5.3.2 X-ray 文文文文文文文文文文文 PCB 文文文文文文文文文文文文文文文 The X-ray inspector should notify the process engineer about the inspected board issues 文文文文文文文 Saving files: 5.4.1 文文文文文文文文文文文文文文 Datacom 文文文MobileCom 文文文SatCom 文文文文文 There are three folders on the desktop, including Datacom photo, MobileCom photo and SatCom photo 5.4.2 文 文文文文文文文文文文文文文文文文 SMT 文文文文文文文文 The data of the first pieces must be saved and the data of other boards can be saved separately upon SMT engineers' decision 5.4.3 文文文文文文文文文文文文文 The file should be named as follows: _ _ _ _ _ _ _ - _ _ _ _ _ - _ _ _ _ _ _ 5.4 文文文(文文文050622) yy/mm/dd (e.g.: 050622) M/O 文文(文文文22323) M/O number (e.g.: 22323) 55 文文文文文(文文文UMA01.006) 55-level product name (e.g.: UMA01.006) 文文文文文 Reaction to abnormality: 5.5.1 文 文文文文文文文文文文文文文 SMT 文文文文文文文文文文文文文 SMT 文 文文文文文文文文文文文文文文文文文 When any abnormality of the first pieces is discovered, staff should notify SMT engineer to confirm and readjust SMT production parameters for reproduction until products pass the inspection 5.5.2 文文文文文文文文文文文文文文文文文文文 SMT 文文文文文文 The bad parts of specific products requiring 100% inspection should be gathered and staff should notify SMT engineer for analysis 5.6 文文文文文 Void standard 5.6.1 文文文文文文文文文文文文文文文,文文文文文文文文文文文文文文文文文文 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 When void proportion reaches 5%, parts should be listed in continuous observation; when reaches 10–20%, the inspection frequency should be doubled and when reaches 25%, should notify the engineer and stop the line for review 5.5 6.0 文文文文文 AUTHORITY 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE OF 21 文文文文文文文文文文文文文文文文文文文文文文文文文文 This guideline will be implemented after approval by the top manager of this factory Amendment shall be approved in the same fashion 7.0 文文 Appendix: 文文文文X-RAY 文文文文文 (Form No:804-K03-01) Appendix 1: X-ray inspection application (Form No:804-K03-01) 文文文文X-RAY 文文文文 (Form No:804-K03-02) Appendix 2: X-ray inspection record (Form No:804-K03-02) 文 文文 NG 文文文文: Descriptions of NG illustrations 文文(SHORT): 1-1.文文文文文文文文:文文文 KV 文文 μA 文文文,文文文文 Printer 文文文文文文文文文, 文文文文文文文文文:文文文文文文文文文文文Printer 文文 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE OF 21 文文文文文文文 文文文文文:文文文文文文文文,KV & μA 文文文文 90KV 文 5μA,文 KV 文文文文文文文文文文文文文,文文文文 Solder ball shorts caused by the solder paste: Use low KV and low μA for inspection Solder paste short may result from printing This phenomenon can be improved by the following methods: confirm if the stencil is in good condition, printer setting or malfunction exists The figure shows the short caused by excess solder paste It is recommended to inspect with 90KV and 5μA A small amount of tin will be penetrated when KV value is too large and this will affect the judgement 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE OF 21 1-2.文文文文:文文文 Ram 文文文文文文文文文文,文文文 46 文 Solder ball short: This figure shows the phenomenon of the solder ball short of ram chip (46-degree angle) 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 10 OF 21 1-3 文文文文:文文文文文 85KV 文 10 μA 文文文文文文文.KV 文文文文文文文文 Solder ball short: This figure shows the condition under an environment with around 85KV and 10μA A high KV value can easily lead to the misjudgment 1-4: 文文文文(46 文文):文 Mounter 文文文文文文文文文文,文文文文文文文文文文文文文,文文文文文文文文文文文文文文文,文文文文文文,文文文文文文 文文文(OPEN)文文文 (Creak),文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 Solder ball shift (46-degree angle): Though the cohesion of solder paste can pull back solder balls, the excess shift and limited pull-back ability still result this phenomenon when the mounter coordinates settings contain shifts This phenomenon can lead to open and crack easily; when non-wetting exists, this shift will lead to insufficient soldering surface and lower strength and thus affect product reliability 1-5: 文文文文(0 文文):文 文文文文文文文文文文文文 Solder ball shift (0 degree): It is possible to inspect the inner ring soldering at degree inclination 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 11 OF 21 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 12 OF 21 1-6: 文文文文(0 文文文文):文文文文文文 MOUNTER 文文文文文文文文文文文,文文 KV 文文文文文文文文文 Solder ball shift (0-degree inspection): Can clearly show the mounter coordinates program settings contain excess shifts It is possible to tell with a lower KV value 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 13 OF 21 2.文文文文(Missing Ball): 2-1:文文 LOSE(0 文文):文文文文文文文,文文文文文文文文文文,文文文文文文,文文文 文文文文文文文文文文文,文文文文文文文文文文文文文文 Missing ball (0 degree): From this figure, it is clear that there is no solder flash around the specified solder location The solder ball must therefore be missing, otherwise there would be traces of solder 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 14 OF 21 2-2:文文文文:文文文文文文文文 46 文文文文,NG 文文文文文文文文文,文文 PAD 文文文,文文文文文文文文文文(Wetting),文文文文(Open) Open solder joint: Move the image receiver to a 46-degree angle for inspection There is one pad, the solder pad of PAD, above the NG solder ball An open occurs when the solder ball is not wetted with the pad 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 15 OF 21 2-3 文文文文: Open solder joint: 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 16 OF 21 2-4: 文文文文: Open solder joint: 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 17 OF 21 2-5: 文文文文:SHIFT 文文文文文(Open) Open solder joint: This type of open is caused by shift 2-6: 文文文文: Open solder joint: 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 18 OF 21 2-7: 文文文文: Open solder joint: 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 19 OF 21 2-8: SOCKET 文文: Socket open: 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 20 OF 21 3.文文文文文(Void Inspection): 3-1.文文文文(Void):0 文文文文,文文文文文文文文文文文,文文文文文文 NG Solder void: Under degree inspection, if voids are too large to be reliable, the inspection result can be defined as NG (rejected) 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 Document Content □文文文文 Addition of Document □文文文文 Alteration of Document □文文文文 Revocation of Document Subject: X-RAY 文文文文文文 Doc No.: 804-K03 REV: X-Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE 21 OF 21 3-2: 文文文文(Void):46 文文文文文,文文文文文文文文文文文文文文文文文,文文文文文文文,文文文文文文文文文文 Solder ball void: When inspection is taken under a 46-degree angle, voids can be seen at the top, middle and bottom layers of solder ball Large voids or excess voids indicate lower product reliability 文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文文 The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC Form No.: 2-JQ-021-04, 006 ... Appendix: 文文文? ?X- RAY 文文文文文 (Form No :804- K03- 01) Appendix 1: X- ray inspection application (Form No :804- K03- 01) 文文文? ?X- RAY 文文文文 (Form No :804- K03- 02) Appendix 2: X- ray inspection record (Form No :804- K03- 02)... 文文文 X- ray 文文文文文文文文文文 X- ray 文文文, 文文文 “ X- ray 文文文文文 ” Send the PCBs for defect analysis by X- ray to the X- ray machine and fill out the ? ?X- ray inspection application” form 4.0 文文文文 FLOWCHART X- ray... X- RAY 文文文文文文 Doc No.: 804- K03 REV: X- Ray Inspection Guideline for SMT Solder Joint Quality Effective Date: PAGE OF 21 After the inspection, the X- ray inspector should record the results in ? ?X- ray