An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 13 potx
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 13 potx
... available in TO- type hermetic metal packages. How - ever, pressure to reduce manufacturing costs has led the company to adopt a stan - dard plastic dual-in-line (DIP) solution and establish first-level ... and electricity—voltage, current, and electrical resistance are dual to temperature, heat flux, and thermal resistance,respectively. A network of resistors is an adequate first-order model to ... pat - terns corresponding to the landing sites of the solder bumps. Automated pick -and- place machines position the die, top face down, and align the bond pads to thesolder-paste pattern on the...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 10 potx
... 310–317.[10] Jerman, H., and J. D. Grade, “A Mechanically-Balanced, DRIE Rotary Actuator for aHigh-Power Tunable Laser,” Tech. Digest Solid-State Sensor and Actuator Workshop, Hil - ton Head Island, SC, ... it remains an enabling technology and a means to an end. It is impera - tive to understand the final application in order to assess the importance and applicability of MEMS for that particular ... Hall,1999.MacDonald, L. W., and A. C. Lowe (eds.), Display Systems: Design and Applications, WestSussex, England: Wiley, 1997.Micromechanics and MEMS: Classic and Seminal Papers to 1990, W. Trimmer...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 16 potx
... 9000/QS 9000, 244standards, 244–46statistical methods in, 246–48tests, 246See also Failure(s); Quality controlResonators, 200–211beam, 203–6comb-drive, 201–3coupled-resonator bandpass filter, ... technologies (SMT), 217Switches, 211–14cantilever, 212, 213 14desirable parameters, 211membrane, 212, 213 prototypes, 211See also RF MEMS TTape peel test, 253TaqMan tagging, 175, 176Tetramethyl ... 66–67Sol-gel process, 58Spin-on methods, 40Sputter deposition, 35–36defined, 35directional randomness, 36planar/cylindrical magnetron, 36Stiction, 253Stress isolation, 221–22SU-8 photosensitive...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 1 doc
... student alike to an understanding of how MEMS aredesigned and fabricated. Dr. Maluf s book concentrates mostly on how to design and manufacture MEMS. This is to be expected of Dr. Maluf, who has ... ofMorrison and Foerster. Evan Green and Carter Hand of New Focus were kindenough to review portions of the manuscript. Thanks go to our editor, Mark Walsh,for his unwavering support. Kirt Williams ... Capacitors 192Bulk-Micromachined Variable Capacitors 195Micromachined Inductors 197Microelectromechanical Resonators 200Comb-Drive Resonators 201Beam Resonators 203Coupled-Resonator Bandpass...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 2 pptx
... components for identify-friend-or-foesystemsHead- and night-display systemsLow-power, high-density mass data storage devicesEmbedded sensors and actuators for condition-based maintenanceIntegrated ... products. Ongoing efforts at many companies and laboratoriesthroughout the world promise to deliver, in the not-too-distant future, new and sophisticated miniature components and microsystems. It is ... with100-mm (4-in) and 150-mm (6-in) diameters. Larger-diameter (200-mm and 300-mm) wafers, used by the integrated circuit industry, are currently economicallyunjustified for MEMS. Standard 100-mm wafers...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 3 pps
... meaning lithography, elec - troplating, and molding.both PSG and BPSG soften and flow to conform with the underlying surface topog - raphy and to improve step coverage. LTO films are used for passivation ... Zorman, C. A., and M. Mehregany, “Materials for Microelectromechanical Systems,” inThe MEMS Handbook, Chapter 15, M. Gad-el-Hak (ed.), Boca Raton, FL: CRC Press,2002.[10] Zhang, Z. L., and ... quickly extended to a broad range of other alloys, including titanium-nickel, copper-aluminum-nickel,iron-nickel and iron-platinum alloys. A basic understanding of the underlying physi - cal principles...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 4 pptx
... the anisotropic etching of cavities in {100}-oriented silicon: (a) cavities,self-limiting pyramidal and V-shaped pits, and thin membranes; and (b) etching from both sides ofthe wafer can yield ... uniform and controlled etch depths. Some applications, such asbulk-micromachined pressure sensors, demand a thin ( 5- to 2 0- m) silicon mem - brane with dimensional thickness control and uniformity ... it is to achieve good bonding [21].Grinding, Polishing, and Chemical-Mechanical PolishingSome applications use a thin layer of silicon (5 to 200 µm) that is fusion-bonded to astandard-thickness...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 5 doc
... regularly produced. The cured material is resis - tant to most chemicals and is thermally stable. SU-8 has been used to form microflu - idic channels and optical waveguides. It has also been used ... BibliographyChang, C. Y., and S. M. Sze (eds.), ULSI Technology, New York: McGraw-Hill, 1996.Flamm, D. L., and G. K. Herb, “Plasma Etching Technology,” in Plasma Etching: An Introduction, D. M. Manos and ... electroplate first metal; (b)blanket electroplate second metal; and (c) planarize to same thickness.CHAPTER 4MEM Structures and Systems in Industrial and Automotive Applications“…for I believe...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 6 pptx
... orientation-dependentetching of grooves, wafer bonding, and dicing [8], and (b) nozzle formed by DRIE and waferbonding. (After: [9].)MandrelPhotoresist1. Make mandrel, pattern photoresistMetal2. ... 9.81 m/s2), sensitivity (V/G), reso - lution (G), bandwidth (Hz), cross-axis sensitivity, and immunity to shock. Therange and bandwidth required vary significantly depending on the application.Accelerometers ... bottom handle wafer. Silicon-fusion bonding of a p-type top wafer with an n-type epixatial layer encapsulates and seals the cavity. Electrochemical etchingor standard polishing thins down the top...
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An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 7 pot
... )]°⋅sHz; bandwidth (Hz); resolution (º/s); and dynamic range (dB), the lat-ter two being functions of noise and bandwidth. Short- and long-term drift of theoutput, known as bias drift, is another ... dioxideinsulatorTaAl resistorAl conductor1. Grow oxide for insulator, sputter TaAl and Al, pattern Al and TaAl,pattern Al again to form resistor and conductive trace.2. PECVD silicon nitride and ... TaAl is resistive and has a near-zero thermal coeffi-cient of expansion [38], while Al is a good conductor. The aluminum and TaAl arepatterned, leaving an Al/TaAl sandwich to form conductive...
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