Polymerase chain reaction (continued) on a chip, 174–76 defined, 174 Polymers, 21, 23 defined, 23 forms, 21 parylenes, 23 photoresist, 21 polyimide, 21, 23 Polysilicon, 14, 17–18 beam structures, 18 deposition of, 38 importance, 17 mechanical properties, 17 piezoresistive effect, 26 surface micromachining, 69–71 Population inversion, 143 Potassium hydroxide (KOH), 16 etch rate, 47 as KOH, 46 Pressure sensors, 89–93 fabrication process, 91 high-temperature, 93–94 schematic illustration, 90 silicon-fusion-bonded, 91 See also Sensors Principle axes, 15 Protective coatings, 222–23 Psychological barrier, 8–9 Q Quality control, 244–46 Quartz crystals, 201 micromachining, 21 as piezoelectric material, 29 R Reactive ion etching (RIE), 51–52 Redwood Microsystems valve, 120–22 defined, 120 fabrication steps, 121 illustrated, 120 operating mechanism, 121 See also Micromachined valves Reliability, 243–56 accelerated life modeling, 248–49 bath-tub relationship, 248 case study, 254–56 defined, 246 GR-CORE series, 245 ISO 9000/QS 9000, 244 standards, 244–46 statistical methods in, 246–48 tests, 246 See also Failure(s); Quality control Resonators, 200–211 beam, 203–6 comb-drive, 201–3 coupled-resonator bandpass filter, 206–8 film bulk acoustic, 208–11 microelectromechanical, 200–211 See also RF MEMS RF MEMS, 189–214 devices, 189 losses, 190 low-resistivity metals, 190 microelectromechanical resonators, 200–211 microelectromechanical switches, 211–14 passive electrical components, 190–200 signal integrity, 189–90 Room-temperature vulcanizing (RTV) rubbers, 227, 252 S Santur DFB tunable laser, 148–51 Screen printing, 65–66 defined, 65 illustrated, 65 process, 65–66 Seebeck effect, 29, 30 coefficients, 30 defined, 29 thermocouple structure using, 30 Self-assembled monolayers (SAM), 61 coating process, 61 electromagnetic, 82 precursors, 61 Sensing capacitive, 82 methods, 81–82 objective, 81 piezoresistive, 81–82 Sensors, 89–116 acceleration, 96–114 angular rate, 104–7 carbon monoxide gas, 114–16 high-temperature pressure, 93–94 mass flow, 94–96 pressure, 89–93 protective coatings, 222–23 stress-sensitive, 222 Sensors and Actuators (A, B, C), 9 280 Index Sensors Magazine, 10 Shape-memory alloys, 23–24 actuation with, 85 critical temperature and, 23–24 Shocks, 251–52 Side-shooter nozzles, 87 Silicon, 13–19 amorphous, 14, 17–18 crystalline, 14–17 defined, 13 interactions, 18 mechanical integrity and, 18 micromachining, 33 microstructures, 14 optical reflectivity, 18 polysilicon, 14, 17–18 properties, 14 surface oxidation, 18 as thermal conductor, 18 Silicon carbide, 22 Silicon dioxide, 38–39 Silicon direct bonding, 56–57 defined, 56 performance, 56 process, 56–57 Silicon-fusion bonding, 94 Silicon fusion bonding with reactive ion etching (SFB-DRIE), 71 defined, 71 high aspect ratio, 71 illustrated, 72 Silicon nitride, 19 deposition of, 39–40 LPCVD, 48 Silicon-on-sapphire (SOS) wafers, 35 Silicon oxide, 19 Silk screening. See Screen printing Single-crystal reactive etching and metallization (SCREAM) process, 72–74 defined, 72 development, 74 illustrated, 74 Sliding plate microvalve, 124–26 defined, 124 designs, 126 fabrication, 126 schematic cross section, 125 See also Micromachined valves Small Times Magazine, 10 Soft lithography, 66–67 Sol-gel process, 58 Spin-on methods, 40 Sputter deposition, 35–36 defined, 35 directional randomness, 36 planar/cylindrical magnetron, 36 Stiction, 253 Stress isolation, 221–22 SU-8 photosensitive epoxy, 61–62 defined, 61 structures, 62 use of, 62 Supercritical drying, 60–61 Surface-micromachined variable capacitors, 192–97 design, 194 etch holes, 195 fabrication, 192–93, 194 implementations, 193 in portable applications, 193 versions, 193 See also Capacitors Surface micromachining polysilicon, 69–71 schematic illustration, 70 systems of materials for, 70 Surface mount technologies (SMT), 217 Switches, 211–14 cantilever, 212, 213–14 desirable parameters, 211 membrane, 212, 213 prototypes, 211 See also RF MEMS T Tape peel test, 253 TaqMan tagging, 175, 176 Tetramethyl ammonium hydroxide (TMAH), 48, 112 Thermal actuation, 84 Thermal failures, 254 Thermal inkjet heads, 116–19 concept, 117 fabrication, 117–18 fabrication illustration, 118 nozzles, 116 Thermal management, 220–21 Thermoelectric coolers (TECs), 29 Thermoelectricity, 29–30 Thermosonic gold bonding, 228 Thin metal films, 20–21 choice of, 20 etching, 44 Index 281 TiNi Alloy Company valve, 122–23 metals, 20 defined, 122 fabrication sequence, 123 illustrated, 122 performance, 123 See also Micromachined valves Titanium-nickel alloys, 24 Transition temperature, 23, 24 Transportation Recall Enhancement, Accountability, and Documentation (TREAD), 6 Tunable lasers, 142–51 as bench-top test instruments, 142 building blocks illustration, 143 DFB, 148–51 elements, 143 external cavity, 144–48 metal packaging, 238–39 specifications, 144 tuning operations, 144 U Ultraprecision mechanical machining, 64 Ultrasonic machining, 68 V Valves. See Micromachined valves Vanishing dipole, 28 Variable optical attenuators (VOAs), 142, 161–65 cross-sectional schematic, 164 defined, 161 diffraction operation, 163 fabrication, 165 key characteristics, 161 principle of operation, 162 Voltage-controlled oscillators (VCOs), 192 Volume manufacturing, 8 W Wafers dicing concerns, 219–20 thickness, 219 Wavelength-division multiplexing (WDM), 142 Wavelength locker, 151–54 defined, 151 elements, 152 etalon, 153 schematic illustration, 153 Wire bonding, 227–29 aluminum, 228 gold, thermosonic, 228 limitations, 229 See also Electrical interconnects Y Yaw-rate sensor, 112 282 Index Recent Titles in the Artech House Microelectromechanical Systems (MEMS) Series Fundamentals and Applications of Microfluidics, Nam-Trung Nguyen and Steven T. Wereley Introduction to Microelectromechanical (MEM) Microwave Systems, Héctor J. De Los Santos An Introduction to Microelectromechanical Systems Engineering, Second Edition, Nadim Maluf and Kirt Williams MEMS Mechanical Sensors, Stephen Beeby et al. RF MEMS Circuit Design for Wireless Communications, Héctor J. De Los Santos For further information on these and other Artech House titles, including previously considered out-of-print books now available through our In-Print-Forever ® (IPF ® ) program, contact: Artech House Artech House 685 Canton Street 46 Gillingham Street Norwood, MA 02062 London SW1V 1AH UK Phone: 781-769-9750 Phone: +44 (0)20 7596-8750 Fax: 781-769-6334 Fax: +44 (0)20 7630-0166 e-mail: artech@artechhouse.com e-mail: artech-uk@artechhouse.com Find us on the World Wide Web at: www.artechhouse.com . Wereley Introduction to Microelectromechanical (MEM) Microwave Systems, Héctor J. De Los Santos An Introduction to Microelectromechanical Systems Engineering, Second Edition, Nadim Maluf and Kirt Williams MEMS. 02062 London SW1V 1AH UK Phone: 78 1-7 6 9-9 750 Phone: +44 (0)20 759 6-8 750 Fax: 78 1-7 6 9-6 334 Fax: +44 (0)20 763 0-0 166 e-mail: artech@artechhouse.com e-mail: artech-uk@artechhouse.com Find us on the. interconnects Y Yaw-rate sensor, 112 282 Index Recent Titles in the Artech House Microelectromechanical Systems (MEMS) Series Fundamentals and Applications of Microfluidics, Nam-Trung Nguyen and Steven