An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 7 pot
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 7 pot
... )]°⋅sHz
; bandwidth (Hz); resolution (º/s); and dynamic range (dB), the lat-
ter two being functions of noise and bandwidth. Short- and long-term drift of the
output, known as bias drift, is another ... dioxide
insulator
TaAl resistor
Al conductor
1. Grow oxide for insulator, sputter TaAl and Al, pattern Al and TaAl,
pattern Al again to form resistor and conductive trace.
2. PEC...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 10 potx
... 310–3 17.
[10] Jerman, H., and J. D. Grade, “A Mechanically-Balanced, DRIE Rotary Actuator for a
High-Power Tunable Laser,” Tech. Digest Solid-State Sensor and Actuator Workshop, Hil
-
ton Head Island, ... it remains an enabling technology and a means to an end. It is impera
-
tive to understand the final application in order to assess the importance and
applicabili...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 13 potx
... available in TO- type hermetic metal packages. How
-
ever, pressure to reduce manufacturing costs has led the company to adopt a stan
-
dard plastic dual-in-line (DIP) solution and establish first-level ... and electricity—voltage, current, and
electrical resistance are dual to temperature, heat flux, and thermal resistance,
respectively. A network of resistors is an...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 16 potx
... 56– 57
defined, 56
performance, 56
process, 56– 57
Silicon-fusion bonding, 94
Silicon fusion bonding with reactive ion
etching (SFB-DRIE), 71
defined, 71
high aspect ratio, 71
illustrated, 72
Silicon ... 48
Silicon-on-sapphire (SOS) wafers, 35
Silicon oxide, 19
Silk screening. See Screen printing
Single-crystal reactive etching and
metallization (SCREAM) process,
72 74
defined,...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 1 doc
... Micro; and Stephen Durant and Christopher Eide of
Morrison and Foerster. Evan Green and Carter Hand of New Focus were kind
enough to review portions of the manuscript. Thanks go to our editor, ... student alike to an understanding of how MEMS are
designed and fabricated. Dr. Maluf s book concentrates mostly on how to design
and manufacture MEMS. This is to be expec...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 2 pptx
... components for identify-friend-or-foe
systems
Head- and night-display systems
Low-power, high-density mass data storage devices
Embedded sensors and actuators for condition-based maintenance
Integrated ... general support and for recognizing the value of an introductory book
on MEMS. I would like to thank Greg Kovacs, Kirt Williams, and Denise Salles for
reading the manuscript...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 3 pps
... meaning lithography, elec
-
troplating, and molding.
both PSG and BPSG soften and flow to conform with the underlying surface topog
-
raphy and to improve step coverage. LTO films are used for passivation ... Zorman, C. A., and M. Mehregany, “Materials for Microelectromechanical Systems,” in
The MEMS Handbook, Chapter 15, M. Gad-el-Hak (ed.), Boca Raton, FL: CRC Press,...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 4 pptx
... the anisotropic etching of cavities in {100}-oriented silicon: (a) cavities,
self-limiting pyramidal and V-shaped pits, and thin membranes; and (b) etching from both sides of
the wafer can yield ... Wet etchants in aqueous solution offer the advantage of low-cost batch
fabrication—25 to 50 100-mm-diameter wafers can be etched simultaneously and
can be either of the isotropic or aniso...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 5 doc
... Etching and Metallization
The single-crystal reactive etching and metallization (SCREAM) process [ 37] uses
yet another approach to release crystalline microstructures. Standard lithography
and etching ... Microactuators, and Microsystems
(MEMS) ,” Proceedings of the IEEE, Vol. 86, No. 8, August 1998.
Summary 77
and with electroplating in the production of ink-jet nozzles. Due...
An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 6 pptx
... orientation-dependent
etching of grooves, wafer bonding, and dicing [8], and (b) nozzle formed by DRIE and wafer
bonding. (After: [9].)
Mandrel
Photoresist
1. Make mandrel, pattern photoresist
Metal
2. ... 9.81 m/s
2
), sensitivity (V/G), reso
-
lution (G), bandwidth (Hz), cross-axis sensitivity, and immunity to shock. The
range and bandwidth required vary significantly depend...
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