Engineering Materials and Processes phần 4 pptx
Engineering Materials and Processes phần 4 pptx
... (c) 30% N 2 and (d) 40 % N 2 [5] Diffusion Barriers and Self-encapsulation 39 3 .4. 4 Discussion The RBS data showed that the N 2 flow ratio influences the composition, phases, and thicknesses ... Diffraction Standard (JCPDS ICDD cards #: 25-1280, 26-0985, 32-1282, 25-1278, 14- 047 1, 31-1370, & 32-1283), PDF Database, 19 94. [18] G. S. Chen, and T. S. Chen, J. Appl. Ph...
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Engineering Materials and Processes phần 2 pptx
... Jose, CA, 19 94. [3] J. Li, J. W. Mayer, Y. Shacham-Diamand, E. G. Colgan, Appl. Phys. Lett. 60. 2983(1992). [4] D. Adams, and T. L. Alford, Materials Science and Engineering: Reports 40 , 207(2003). ... RBS and Auger electron spectroscopy (AES). The RBS analysis was performed using 1.7 MV Tandem Accelerator with He +2 beam energies between 2.0 and 4. 3 MeV. The backscatt...
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Engineering Materials and Processes phần 5 pptx
... test. Table 4. 2. Scratch test results of failure load in grams [7] Sample As-deposited 250°C 300°C 350°C Pa-n/Si 8.0 6.9 5.5 4. 5 Ag/Pa-n/Si 4. 4 4. 4 5.5 ... in Table 4. 1. The variation of resistivity can be best explained with XRD analysis mentioned below. Thermal Stability 59 Energy (MeV) Channel Yield 4. 4.3 Results 4. 4....
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Engineering Materials and Processes phần 10 pptx
... 60, 62, 67 Oxide surface layer, 84, 89, 93, 95 Parylene, 48 , 49 Pa-n, 48 , 49 dielectric, 48 , 49 reliability issues, 549 phase change, 50 Polyimides, 2, 548 Recoil energy, 8 Refractory ... Lett. 45 , 157(2000). [17] D. Adams, T. L. Alford, Materials Science and Engineering R 40 , 207(2003). Index Adhesion analysis, 54 tape test, 55 scrat...
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environmental engineering dictionary and directory phần 4 pptx
... Hazardous Materials Information System. HMR Hazardous materials regulations. HMTA Hazardous Materials Transportation Act. HMTR Hazardous Materials Transportation Regulations. HOA Hand-off-automatic. HOBr ... mono-, di-, and trichloroacetic acids and mono- and dibromoacetic acids. © 2001 by CRC Press LLC HAA6 The sum of the concentration of six haloacetic acid compounds which inc...
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Engineering Materials and Processes phần 1 doc
... ……………………………………………….… 44 4. 2.1 Introduction …………………………………………… ……… 44 4. 2.2 Results ………………………………………………………… 44 4. 2.3 Discussion and Conclusions ……….………………………….… 46 4. 3 Silver Deposited on Parylene-n ... …………………………………………………… 41 3.5 References ………………………………………………………………. 42 4 Thermal Stability ………………………………………………………… 43 4. 1 Introduction …………………………………………………………… 43 4. 2 Silver-...
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Engineering Materials and Processes phần 3 docx
... (%) Tantalum nitride composition 15 Ta 0.78 N 0.22 20 Ta 0. 64 N 0.36 25 Ta 0.55 N 0 .45 30 Ta 0.51 N 0 .49 40 Ta 0 .45 N 0.55 Figure 3.9. 3.7 MeV RBS spectra from TaN films ... interconnect Ag metal and the underlying dielectric that will act as both an adhesion promoter and an effective diffusion barrier between interconnect metal and adjacent materials....
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Engineering Materials and Processes phần 6 doc
... Thermal Stability 67 4. 4 .4 Discussion 4. 4 .4. 1 Aluminum Transport in Silver Films RBS and AES analyses reveal that annealing a Ag (200 nm)/Al(8 nm) bilayer ... Films 42 9, 248 (2003). [5] K. Sieradzki, K. Baily, and T. L. Alford, Appl. Phys. Lett. 79, 340 1(2001). [6] H. C. Kim, and T. L. Alford. J. Appl. Phys. 94( 8), 5393(2003). [7] K. S. Gadre and ... K. S. Gadre and...
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Engineering Materials and Processes phần 7 ppsx
... an NH 3 ambient for 120 minutes. Only the surface peaks and positions are shown [8]. 30 40 50 60 70 80 90 0 2 4 6 8 10 12 14 16 40 0 o C 500 o C 600 o C Ag(200nm)/Al(20nm) on SiO 2 Thickness ... suggests that the surface layer mainly consists of Al and O. Integration of the Al and O peaks in Figure 6 .4 yielded an Al-to-O ratio of 0. 64. 78 Silver Metallization Figure...
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Engineering Materials and Processes phần 8 pdf
... nm) and (b) Al (30 nm)/Ag(200 nm) [8] 0 2 040 6080100120 0.0 0.1 0.2 0.3 0 .4 0.5 8 M(t) M( ) Annealing Time (a) Al(20 nm)/Ag(200 nm) 600 o C 500 o C 40 0 o C 0 2 040 6080100120 0.0 0.2 0 .4 0.6 0.8 1.0 8 (b) ... Ag(200 nm)/Al(20 nm) and 0. 34 eV for Ag(200 nm)/Al(30 nm) structures. These values of the activation energies are in agreement with that reported in literature (0....
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