thermal and mechanical properties

Báo cáo vật lý: "Compatibility, Mechanical, Thermal, and Morphological Properties of Epoxy Resin Modified with Carbonyl-Terminated Butadiene Acrylonitrile Copolymer Liquid Rubber" pps

Báo cáo vật lý: "Compatibility, Mechanical, Thermal, and Morphological Properties of Epoxy Resin Modified with Carbonyl-Terminated Butadiene Acrylonitrile Copolymer Liquid Rubber" pps

... present work attempts to discuss the compatibility between CTBN and the EP, and to investigate the thermal, mechanical, and morphological properties of the modified EP EXPERIMENTAL 2.1 Materials The ... (Tg) of the EP Properties of Modified Epoxy Resin 3.3 Tensile Properties Table shows the effect of CTBN content on the tensile properties of the EP As expected, the tensile strength and Young’s ... Figure 3: The effect of CTBN content and different testing speeds on the KIC of the EPs Properties of Modified Epoxy Resin In order to correlate the mechanical properties of the modified EP with...

Ngày tải lên: 07/08/2014, 14:20

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Tài liệu PHYSICAL, CHEMICAL, AND MECHANICAL PROPERTIES OF BAMBOO AND ITS UTILIZATION POTENTIAL FOR FIBERBOARD MANUFACTURING docx

Tài liệu PHYSICAL, CHEMICAL, AND MECHANICAL PROPERTIES OF BAMBOO AND ITS UTILIZATION POTENTIAL FOR FIBERBOARD MANUFACTURING docx

... chemical, and mechanical properties of the bamboo species Phyllostachys pubescens The effects of plant age, horizontal layer, and vertical height location on physical, chemical, and mechanical properties ... fiberboard and evaluate water soaking, modulus of elasticity (MOE), modulus of rupture (MOR), and internal bond (IB) properties of the panels and compare the age effect on the physical and mechanical properties ... alpha cellulose, and Klason lignin contents and the lowest extractive and ash contents The epidermis had the highest extractive and ash contents and the lowest holocellulose and alpha-cellulose...

Ngày tải lên: 22/02/2014, 09:20

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Intel ® X58 Express Chipset Thermal and Mechanical Design Guide pot

Intel ® X58 Express Chipset Thermal and Mechanical Design Guide pot

... B-3 Thermal and Mechanical Design Guide 31 Mechanical Drawings for Package & Reference Thermal Solution Figure B-1 32 IOH Package Drawing Thermal and Mechanical Design Guide Thermal and Mechanical ... availability § Thermal and Mechanical Design Guide 29 Thermal Solution Component Suppliers 30 Thermal and Mechanical Design Guide Mechanical Drawings for Package & Reference Thermal Solution B Mechanical ... § Thermal and Mechanical Design Guide Thermal and Mechanical Design Guide Introduction Introduction The goals of this document are to: • Outline the thermal and mechanical operating limits and...

Ngày tải lên: 09/03/2014, 00:20

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Intel ® Pentium® 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines docx

Intel ® Pentium® 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines docx

... cool down and stay within thermal specifications Various registers and bus signals are available to monitor and control the processor thermal status A thermal solution designed to the TDP and case ... electrical, thermal, and structural integrity under shock and vibration events The mechanical requirements of the attach mechanism depend on the weight of the heatsink and the level of shock and vibration ... size, and relative position of fans and vents determine the chassis thermal performance, and the resulting ambient temperature around the processor The size and type (passive or active) of the thermal...

Ngày tải lên: 09/03/2014, 00:20

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practical guide to the packaging of electronics thermal and mechanical design and analysis

practical guide to the packaging of electronics thermal and mechanical design and analysis

... Electrical Design Specifications Mechanical Design Specifications Electrical and Thermal Parameters ANALYSIS Thermal Analysis Load Carrying and Vibration Analysis Reliability and MTBF Calculations REFERENCES ... are four topics that I categorize under packaging and enclosure design and analysis These are electromagnetic, thermal, mechanical, and thermomechanical analyses We will not cover electromagnetics ... 34 Chapter where At and Aj are the areas of surfaces i and j, respectively, and /? ,and Pj axe the angles between the position-dependent normal vectors to surfaces i and j and a line of length...

Ngày tải lên: 03/06/2014, 01:25

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báo cáo hóa học:" Ultrasonication effects on thermal and rheological properties of carbon nanotube suspensions" pot

báo cáo hóa học:" Ultrasonication effects on thermal and rheological properties of carbon nanotube suspensions" pot

... Ultrasonication effects on thermal and rheological properties of carbon nanotube suspensions Binglu Ruan*1,2 and Anthony M Jacobi1 Mechanical Science and Engineering, University of Illinois, ... improvement of thermal equipment and systems as: air-conditioning and refrigeration, transportation, electronic cooling, heating and ventilating, etc Researchers have found many ways to enhance the thermal ... obtained The standard image processing methods included pixelization, threshold definition, binary conversion, and geometry analysis -3- Thermal conductivity and viscosity measurements Thermal conductivity,...

Ngày tải lên: 21/06/2014, 17:20

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Báo cáo vật lý: "Comparison of the Effects of Organoclay Loading on the Curing and Mechanical Properties of Organoclay-Filled Epoxidised Natural Rubber Nanocomposites and Organoclay-Filled Natural Rubber Nanocomposites" pot

Báo cáo vật lý: "Comparison of the Effects of Organoclay Loading on the Curing and Mechanical Properties of Organoclay-Filled Epoxidised Natural Rubber Nanocomposites and Organoclay-Filled Natural Rubber Nanocomposites" pot

... crystallisation NR also had shown excellent improvements in mechanical properties, thermal properties, barrier properties and flame-retardant properties when compounded with organoclays.7–11 In this ... min–1 RESULTS AND DISCUSSION 3.1 Cure Characteristics Figures and and Table show the results for the scorch time, t2, and cure time, t90, for both organoclay-filled NR nanocomposites and organoclayfilled ... values of the minimum and maximum torques 3.2 Mechanical Properties Figure and Table show the effect of organoclay loading on the tensile strength of organoclay-filled NR and ENR nanocomposites...

Ngày tải lên: 07/08/2014, 14:20

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Báo cáo lâm nghiệp: "Comparison of physical and mechanical properties of tension and opposite wood from ten tropical rainforest trees from different species" pptx

Báo cáo lâm nghiệp: "Comparison of physical and mechanical properties of tension and opposite wood from ten tropical rainforest trees from different species" pptx

... diversity and to measure the physical and mechanical properties in the tension wood sector as compared to the opposite wood sector, on specimen corresponding to the standard methods MATERIAL AND METHODS ... bending and in compression (MPa), Tangential, radial and longitudinal shrinkage (%), tangential/radial shrinkage ratio (TS/RS) and transversal + radial shrinkage for opposite wood (OW) and tension ... saturated and anhydrous states on the dimension in the saturated state Initial dimensions of the specimens are 20 × 20 × 50 mm3 (RTL) for longitudinal shrinkage and 20 × 20 × 10 mm3 (RTL) for radial and...

Ngày tải lên: 07/08/2014, 16:21

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Báo cáo lâm nghiệp: "End-use related physical and mechanical properties of selected fast-growing poplar hybrids (Populus trichocarpa × P. deltoides)" potx

Báo cáo lâm nghiệp: "End-use related physical and mechanical properties of selected fast-growing poplar hybrids (Populus trichocarpa × P. deltoides)" potx

... between wood density or mechanical properties and growth rate in P deltoides × nigra The objective of this study is to evaluate the variability in selected physical and mechanical properties of new ... characteristics for selected trees and total stand; mean radial increment and radial increment of last 10 years (cm), circumference at BH (cm) and total tree height (m) with standard deviations Clone Beaupré ... proportion and the slower decrease of heartwood proportion with height in ’Hoogvorst’, the increase in density is less pronounced The relation between density and mechanical properties (MOE and MOR)...

Ngày tải lên: 07/08/2014, 16:21

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Báo cáo khoa học: "Natural durability, physical and mechanical properties of Atlas cedar (Cedrus atlantica Manetti) wood from Southern Italy" ppsx

Báo cáo khoa học: "Natural durability, physical and mechanical properties of Atlas cedar (Cedrus atlantica Manetti) wood from Southern Italy" ppsx

... The results of physical and mechanical characterisation of Atlas cedar wood from Southern Italy are summarised on table IV Table V refers about physical and mechanical properties found on the ... libani and Cedrus atlantica, with a lot of ornamental cultivars, frequently giving origin to hybrids The Atlas cedar can reach 50 m height and 1.50 m DBH The species is light demanding and cannot ... Molise, Calabria, Sardinia and Sicily Table I Performed tests, dimensions of utilised samples and standard followed for the tests Test type Sample dimension (cm) Standard reference long × transerve...

Ngày tải lên: 08/08/2014, 14:20

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Báo cáo y học: "The differential contribution of tumour necrosis factor to thermal and mechanical hyperalgesia during chronic inflammation" pps

Báo cáo y học: "The differential contribution of tumour necrosis factor to thermal and mechanical hyperalgesia during chronic inflammation" pps

... 253)) 320- and 242-bp fragments of the TNFR1 and TNFR2 receptors from rat brain and monocyte cDNA, respectively (gifts from Adrian Bristow, National Institute for Biological Standards and Control, ... inflammation induction (n = 4) Thermal (b) and mechanical (c) hyperalgesia were assessed throughout the study (b)Both prearthritic and postarthritic etanercept therapy abolished thermal hyperalgesia days ... with higher doses producing significant mechanical and thermal hyperalgesia by 15 minutes [6-8] Furthermore, application of TNF-α enhances calcium currents and increases neuron sensitivity to the...

Ngày tải lên: 09/08/2014, 06:23

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Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 1 doc

Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 1 doc

... model 3.225 © E.A Fitzgerald-1999 15 Thermal Velocity • So far we have discussed drift velocity vD and scattering time τ related to the applied electric field x • Thermal velocity vth is much greater ... drag term, i.e the electrons have many collisions during drift 1/τ represents a ‘viscosity’ in mechanical terms 3.225 © E.A Fitzgerald-1999 10 Mean-free Time Between Collisions, Electron Mobility ... electrons crossing plane in time dt = n(dxA) = n(vddtA) • # charges crossing plane per unit time and area = j ( ) j = n v d dtA (− e ) dtA = − nevd = (ne 2τ m )E • Ohm’s Law: j = σ E ⇒ σ = (ne...

Ngày tải lên: 11/08/2014, 14:20

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Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 5 ppt

Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 5 ppt

... Thermal Promotion • Because electron-hole pairs are generated, the Fermi level is approximately in the middle of the band gap • The law of mass action describes the electron and hole ... E F =  m*   * + kbT ln h   me  Eg Since me* and mh* are close and in the ln term, the Fermi level sits about in the center of the band gap ( ) − Eg  k T 2 * * p or n = ni = 2 b  me ... carrier traps and/ or enhanced recombination sites Ec Edeep Recombination through deep level Ev 3.225 © E Fitzgerald-1999 Generation and Recombination • Generation – photon-induced or thermally induced,...

Ngày tải lên: 11/08/2014, 14:20

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Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 10 pps

Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 10 pps

... Tuller-2001 15 Microhotplate Characteristics • Milli-second thermal rise and fall times programmed thermal cycling low duty cycle • Low thermal mass low power dissipation • Arrays enhanced selectivity ... Temp:360C, H2, CO, NH3 (10, 50 and 100 ppm), NO2 (0.2, 0.4, and ppm) [ Pfad: \ alpha missy Messungen messplatz_1 ] 3.225 M Jägle / 27.02.2001 © H.L Tuller-2001 11 MicroElectroMechanical Systems - MEMS ... sensing a change in environment and responding without need for a microprocessor A device has both gas sensing and actuating function by integration of semiconducting oxide and piezoelectric thin films...

Ngày tải lên: 11/08/2014, 14:20

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Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 9 pps

Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 9 pps

... Traditionally admired for their stability • Mechanical • Chemical • Thermal • Exhibit other key functional properties • Electrical, Electrochemical, Electromechanical • Optical • Magnetic 3.225 20 ... (Pb0.98La0.02(Zr0.7Hf0.3)1-xTixO3 AFE­ FE System (C Heremans and H.L Tuller, J Euro Ceram Soc., 19, 1139 (1999).) Atmosphere dependent conductivity (I Kosacki and H.L Tuller, Sensors & Actuators B 24-25, 370 ... • Conservation • ♦ Emissions • Smoke stack • Automotive Needed: advances in sensors, actuators and energy conversion devices 3.225 18 Harsh Environments Ceramic Sensors Automotive Emissions Factory...

Ngày tải lên: 11/08/2014, 14:20

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Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 3 pot

Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 3 pot

... absorb energy and contribute to properties TF~104K (Troom~102K), EF~100Eclass, vF2~100vclass2 3.225 © E Fitzgerald-1999 Effect of Temperature (T>0): Coupled electronic -thermal properties in conductors ... variable α = ∫ ψ *α op ψ dV v 3.225 © H.L Tuller-2001 19 Time and Spatial Dependence of ψ Assume ψ (x,y,z,t) separable into ψ(x,y,z) and φ(t) Applying separation of variables: − h ∇ 2ψ h ∂φ +V ... Model Traveling wave picture L Standing wave picture Ψ ( x) = Ψ ( x + L) L e ikx = e ik ( x + L ) e ikx = 2πn k= L Just having a boundary condition means that k and E are quasi-continuous, i.e...

Ngày tải lên: 11/08/2014, 14:20

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Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 6 pps

Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 6 pps

... Note that dopants move the fermi energy from mid-gap towards either the valence band edge (p-type) or the conduction band edge (n-type) n-type material in equilibrium p-type material in equilibrium ... Joining p and n p n Ec EF Ev Carriers flow under driving force of diffusion until EF is flat - - + + + + Holes diffuse Electrons diffuse 3.225 © E Fitzgerald-1999 13 Space Charge, Electric Field and ... increases depletion region, and no current flows ideally Forward Bias Reverse Bias np np eVbi-e|Va| nn nn eVbi-e|Va| pp Solve minority carrier diffusion equations on each side and determine J at depletion...

Ngày tải lên: 11/08/2014, 14:20

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Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 8 pdf

Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 8 pdf

... Fiber 3.225 Colors Produced by Chromium Above: alexandrite, emerald, and ruby Center: carbonate, chloride, oxide Below: potassium chromate and ammonium dichromate 3.225 © H.L Tuller, 2001 Chromium ... five 3d orbitals in a tetrahedral and an octahedral ligand field Note: When the element is a mid-gap dopant, transitions within this element lead to absorption and/ or emission via luminescence ... chromium atom (A) and a trivalent chromium ion (B) 3.225 © H.L Tuller, 2001 10 Octahedral Environment of Transition Metal Ion Interaction of the d orbitals of a central ion with six ligands in an octahedral...

Ngày tải lên: 11/08/2014, 14:20

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Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 4 pps

Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 4 pps

... promoted from the valence band to the conduction band E Ec near band gap E=hν k Creates a ‘hole’ in the valence band Ev near band gap 3.225 © E Fitzgerald-1999 Holes and Electrons • • Instead ... 1,000,000 Remember that: 3.225 µ= eτ m* and 1 ∂2E = m * h ∂k 2 Metals and Insulators • EF in mid-band area: free e-, metallic • EF near band edge – EF in or near kT of band edge: semimetal – EF in gap: ... ionic, MP and Eg increase while ao tends to decrease 3.225 © H.L Tuller-2001 Trends in III-V and II-VI Compounds Larger atoms, weaker bonds, smaller U, smaller Eg, higher µ, more costly! Band Gap...

Ngày tải lên: 11/08/2014, 14:20

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Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 11 potx

Materials Science and Engineering - Electronic and Mechanical Properties of Materials Part 11 potx

... I A L e- What is µ? For θ=0, E = − µH ≈ −Φ B I since energy ~ LI and for loop L = ΦB I Φ B = ∫ ∫ H ⋅ dS ~ HA ∴ µH = Φ B I = HAI and ∴ µ = IA e ω A = πr c 2π e µ = − ωr 2c I =− 3.225 © E Fitzgerald-1999 ... magnetization MKS: B = µ0(H+M) = µ0nI + µ0M µr = B/ µ0H = + (M/H) = + χm 3.225 © E Fitzgerald-1999 Maxwell and Magnetic Materials • Ampere’s law ∫ H ⋅ dl = I = • For a permanent magnet, there is no real ... length = nl Nφ B N ( BA) 4π L= n lA = = I I c B= 3.225 © E Fitzgerald-1999 Magnetic Permeability and Susceptibility Insert magnetic material Magnetic dipoles in material can line-up in magnetic...

Ngày tải lên: 11/08/2014, 14:20

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