... by the squelching action of DNA following protein binding However, interestingly, the protein regains a unique mode of aggregation even when bound to DNA following an enhancement in the concentration ... aggregates of mismatch repair proteins MutS, MutL in relation to their interaction with mismatch containing DNA and the ongoing ATP hydrolysis Here we have mainly used dynamic light scattering (DLS) ... protein species in solution Addition of either a single mismatch (hetero) or no mismatch (homo) containing duplex DNA (0.15 lm of molecules) to MutS protein (0.15 lm) resulted in interesting changes,...
Ngày tải lên: 07/03/2014, 12:20
... Explosion Science and Technology, Beijing Institute of Technology 2School of Aerospace, FML, Department of Engineering Mechanics, Tsinghua University, Beijing, China Introduction Excellent physical ... mechanisms distinct from their crystalline counterparts The coexistence of brittle grains and soft amorphous grain boundaries (GBs) consisting in nanocrystalline SiC (nc-SiC) results in unusual deformation ... indicators of a-SiC with varying χ The number of four-fold coordinated C and Si atoms declines with increasing χ especially for the case of Si atom, which is in accordance with the argument in...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 2 pot
... with single 6-rings in ABC sequence with single 4-rings or 6-2 rings (b) ATO with single 4- or 6-rings (c) AFI with single 4- or 6-rings (d) VFI with single 6-rings (e) ATV with single 4-rings ... ordering in amorphous phase is the key point for applications in optoelectronics devices 34 12 Silicon Carbide – Materials, Processing and Applications in Electronic Devices Will-be-set-by -IN- TECH ... and a strain enthalpy ΔHsize Indeed, the large atomic size difference introduces a microscopic strain by incorporating C-C or Si-Si bonds while an ordered crystal is intrinsically strain free...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 3 pdf
... annealing at 800ºC a narrowing of this line, at 900ºC a sharp narrowing of the line Si(111) and the appearance of Si(220) and Si(311) lines of polycrystalline Si phase, as well as two weak lines ... 12) approximately k800 ≈ [Iint(800ºС)/Iint(20ºС)]×100% = 72% of silicon atoms in the layer is incorporated into crystallites of Si The remaining atoms of Si (28%) are in an amorphous mixture of ... line of amorphous silicon Si(111) at θ = 14.3º is observed (Fig 14) Increase of annealing temperature above 800ºC causes narrowing of this line, increasing the number and amplitude of the line...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 4 docx
... Processing and Applications in Electronic Devices Really, as seen in Table 5, the increase of carbon concentration x in the layer SiC0,12 in times in comparison with SiC0.03 results to a smaller increase ... layer only in 1.91 times Further increase in the concentration of carbon x in the SiCх layers in 13, 23, 32, 47 times leads to an increase in the number of optically active Si−C-bonds in several ... 25% small particles, showing inhomogeneous filling The main thermal properties of composite materials obtained by gas pressure infiltration of ceramic preforms containing a bimodal mixture of...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 5 pot
... 2004) was introduced In Fig 4, the horizontal coordinate is along the dashed line in Fig 3, and the longitudinal coordinate is the intensity ratio According to the intensity ratio, the scanning scope ... j ' = cos δ sin δ cos γ − cos δ sin δ − cos δ sin γ k ' cos δ sin δ cos γ − cos δ sin δ cos2 δ + sin δ cos γ − sin δ sin γ cos δ sin γ i sin δ sin γ j ... consequence, wetting 5.2 Drainage curves for gas-pressure infiltration Determination of threshold pressures is often not sufficient to fully characterize wetting in infiltration processing Intrinsic capillary...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 6 docx
... a confinement dimension in the range of 2.5 to nm, in good agreement with the TEM image After 10h annealing, the TO and LO peaks become sharper and more intense, indicating an increase in the ... The Raman line broadening can be described by the (linear) dependence of its half width upon the inverse grain size, as reported previously for many nanocrystalline materials including CeO2 (Kosacki ... of oxygen from the cross-linking process resulted in a stoichiometry closer to Si/C = and an increase in size of the β-SiC grains which were in the range of to 10 nm in commercial fibres The TEM...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 7 docx
... for monitoring involved gases into and out of the process tubes and a loading station used for loading (or unloading) wafers into (or from) the process tubes as shown in figure The heating assembly ... Central Electronics Engineering Research Institute (CEERI)/ Council of Scientific and Industrial Research (CSIR) India Introduction The thin thermally grown SiO2 plays a unique role in device fabrication ... GRMF in both oxidizing ambient 218 Silicon Carbide – Materials, Processing and Applications in Electronic Devices Fig 11 Determination of growth rate multiplication factor between both terminating...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 8 pptx
... for treating long range interactions in ab initio and force-field-based calculations in clusters, J Chem Phys 110: 2810–2821 Tuckerman, M E & Parrinello, M (1994) Integrating the car-parrinello ... obtaining the maximally localized orbitals is to introduce the transformation in Eq (38) into Eq (39) and then to minimize the spread functional with respect to Uij : ∂ Ω[{ψ }] = (40) ∂Uij The minimization ... that include dynamic and thermal effects A primary goal for considering this surface is to determine whether 3C-SiC(001)-3×2 is a promising candidate for creating ordered semiconducting-organic interfaces...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 9 pot
... that the incorporation of C does not induce significant interface reconstruction Namely, the two Si layers proximal to the interface maintain the stacking 299 Introducing Ohmic Contacts into Silicon ... structure and relating it to device properties, revealing, in this way, physics origin of contact issues in SiC electronics In addition to determining atomic structure of 4H-SiC/Ti3SiC2 interface, the ... 3C/2H combinations; The grain size distribution of SiC in space includes both very small and very large grains (1.5 nm - 26 μm), with most grains in the 0.1–1 μm range Single-crystal SiC grains can...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 10 pdf
... stages of an example process of HPHT sintering: – loading, – sintering, – unloading 314 Silicon Carbide – Materials, Processing and Applications in Electronic Devices 2.2 Samples preparation Powders ... nitride Sintering of composites, especially at higher temperatures, leads to lower grain growth than it is in single-phase powders sintered separately This indicates a favorable effect of inhibiting ... TiB2, shows an increase in density with sintering temperature up to a maximum value, and then its stabilization A further increase of the sintering temperature results in cracking of the samples...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 11 doc
... are in wide use are intermediate between the two in the sense that the avalanche zone is well defined having a finite width neither too thin nor too wide The charge is injected from a well defined ... Materials, Processing and Applications in Electronic Devices Gilden and Hines derived an expression for the diode terminal impedance in a Read type structure by assuming a thin avalanche zone ... discovered by Lord Kelvin in 1856 This property is quantified in terms of gauge factor (GF), which is defined as the fractional change in the resistance per unit strain (Window, 1992): GF = ΔR...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 12 docx
... involve high temperatures as in combustion control in gas turbine engines, where the operating temperatures are around 600C (Vandelli, 2008) and in pressure monitoring during deep well drilling ... general ndings that all considered polytypes are indirect semiconductors are not surprising, including that the conduction-band minimum is located at X point in the zinc-blende structure or at M in ... conduction-band minima are situated on the X line near X [110] The X point in the fcc BZ represents the position of the minimum in the zinc-blende 3C-SiC Two of these X points are folded onto M points of...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 13 potx
... includes cutting of difficult-to-machine materials, milling and 3-D-shaping, turning, piercing, drilling, polishing etc These operations can be performed just by using plain water jet machining ... an increase in σDC with increasing thickness The inlet plot, showing the infrared spectra of the PI films, allows relating this evolution to the remaining presence after the material processing ... increase in the probability to find defects or impurities in the material bulk leading to the failure of the insulating layer In the case of PI films, this tendency is associated to the increase in...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 14 doc
... during AWJM using different abrasive materials For all types of abrasives the taper of cut shows an increasing trend with increase in work feed rate With increase in work feed rate the machining ... illustrated in Fig 20 Average width of cut decreases with increase in work feed rate since with the increase in feed rate the Application of Silicon Carbide in Abrasive Water Jet Machining 451 work ... Engineering, National Institute of Technology, Rourkela, of Mechanical Engineering, National Institute of Technology, Hamirpur, India Introduction Polymer composites form important class of engineering...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 15 doc
... a-SiCN:H thin films were deposited by HWCVD using SiH4, CH4, NH3 and H2 as precursors (Swain et al., 2008) Increasing the H2 flow rate in the precursor gas more carbon is introduced into the a-SiCN:H ... traced back during the unloading Several methods are given to evaluate the data In most cases, the contact stiffness is determined at the beginning of the unloading (BauerMarschallinger et al., ... treatments (coatings), working perfectly in ambient air, giving true atomic resolution in ultra-high vacuum (and in liquid environment) The disadvantages are: Single scan image size in the micrometer...
Ngày tải lên: 19/06/2014, 11:20
Silicon Carbide Materials Processing and Applications in Electronic Devices Part 16 doc
... = Ekin + EBV(k), 515 (9) where h.ν = irradiation energy, Ekin=energy of the emitting electron, and EBV(k)=binding energy The determination of the different binding energies of an element in a ... Some of the methods for preparing such samples are: Tissue sectioning by a microtome, sample staining, mechanical milling, chemical etching, and ion etching (sputtering) Recently, focussed ion ... and structural properties have been thoroughly investigated by means of indentation hardness testing, pin on disk wear testing in reciprocating sliding motion, glow discharge optical emission spectroscopy...
Ngày tải lên: 19/06/2014, 11:20
báo cáo hóa học:" Quality of life in bipolar disorder: A review of the literature" pptx
... cerns, including improving inter-episode functioning and perceived quality of life Our review found that there is growing interest in characterizing QoL in bipolar disorder populations, and determining ... between the two reviews due to differing inclusion criteria) The remaining 21 (75%) were published between 2000 and 2004, indicating that there is developing interest in this field of research The studies ... subtle changes in well-being, functioning and QoL Although there appears to be increasing use of QoL measures in pharmacological research in bipolar populations, we identified surprisingly few studies...
Ngày tải lên: 20/06/2014, 15:20
Báo cáo hóa học: "Rumination in Bipolar Disorder: Evidence for an Unquiet Mind" docx
... deficit in inhibiting selffocus These hypotheses provide interesting lines of investigation that might be pursued in future neuroimaging studies Conclusions and future directions The mind in bipolar ... present in patients with bipolar disorder in euthymic states is exacerbated in mania and depression In fact, in studies using tests of executive functioning, including attentional setshifting [65, ... rumination in depressed states [22] demonstrates that rumination maintains and even worsens depressed mood However, it is unclear whether rumination plays a role in exacerbating or maintaining...
Ngày tải lên: 21/06/2014, 19:20
Báo cáo hóa học: " Impact and Mitigation of Multiantenna Analog Front-End Mismatch in Transmit Maximum Ratio Combining" potx
... using (11) (single channel) Simulated using (8) (single channel) Analytically using (11) (average) Analytically using (11) (single channel) Simulated using (8) (single channel) Analytically using ... (interleaved), curve fitting in the frequency domain must be applied to recover the missing information Curve fitting is implemented by linear interpolation in band and holding at the edges of the ... using (24) (single channel) Simulated using (14) (single channel) Analytically using (24) (average) (a) (b) Figure 4: The average (in dB) and the variance (in linear units) of the SNR loss R in...
Ngày tải lên: 22/06/2014, 23:20