microwave and millimetre wave design for wireless communications pdf

Microwave and Millimetre-Wave Design for Wireless Communications Ian Robertson Nutapong Somjit Mitchai Chongcheawchamnan www.TechnicalBooksPDF.com www.TechnicalBooksPDF.com MICROWAVE AND MILLIMETRE-WAVE DESIGN FOR WIRELESS COMMUNICATIONS www.TechnicalBooksPDF.com www.TechnicalBooksPDF.com MICROWAVE AND MILLIMETRE-WAVE DESIGN FOR WIRELESS COMMUNICATIONS Ian Robertson University of Leeds, UK Nutapong Somjit University of Leeds, UK Mitchai Chongcheawchamnan Prince of Songkla University, Thailand www.TechnicalBooksPDF.com This edition first published 2016 © 2016 John Wiley & Sons, Ltd First Edition published in 2016 Registered office John Wiley & Sons, Ltd, The Atrium, Southern Gate, Chichester, West Sussex, PO19 8SQ, United Kingdom For details of our global editorial offices, for customer services and for information about how to apply for permission to reuse the copyright material in this book please see our website at www.wiley.com The right of the author to be identified as the author of this work has been asserted in accordance with the Copyright, Designs and Patents Act 1988 All rights reserved No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, except as permitted by the UK Copyright, Designs and Patents Act 1988, without the prior permission of the publisher Wiley also publishes its books in a variety of electronic formats Some content that appears in print may not be available in electronic books Designations used by companies to distinguish their products are often claimed as trademarks All brand names and product names used in this book are trade names, service marks, trademarks or registered trademarks of their respective owners The publisher is not associated with any product or vendor mentioned in this book Limit of Liability/Disclaimer of Warranty: While the publisher and author have used their best efforts in preparing this book, they make no representations or warranties with respect to the accuracy or completeness of the contents of this book and specifically disclaim any implied warranties of merchantability or fitness for a particular purpose It is sold on the understanding that the publisher is not engaged in rendering professional services and neither the publisher nor the author shall be liable for damages arising herefrom If professional advice or other expert assistance is required, the services of a competent professional should be sought Library of Congress Cataloging-in-Publication Data applied for ISBN: 9781118917213 A catalogue record for this book is available from the British Library Set in 10/12pt Times by Aptara Inc., New Delhi, India 2016 www.TechnicalBooksPDF.com Contents About the Authors xvii Acknowledgements xix Preface xxi 1.1 1.2 Introduction A Brief Timeline of Consumer Electronics The Electromagnetic Spectrum 1.2.1 Spectrum Licensing and Standards Industry Trends 1.3.1 The Multidisciplinary Nature of Modern RF Engineering 1.3.2 Business Matters Forms of Wireless Communication 1.4.1 Terrestrial Television 1.4.2 Satellite Communications and Broadcasting 1.4.3 Terrestrial Line-of-Sight Links 1.4.4 Cellular Mobile Communications 1.4.5 Wireless Indoor Networks 1.4.6 Hybrid Fibre-Radio Systems 1.4.7 RFID, NFC and ICT 1.4.8 Wireless Sensor Networks 1.4.9 Wearables and Body Area Networks 1.4.10 Machine-to-Machine and Robotic Communications Conclusion References 10 12 12 15 18 20 22 24 25 28 29 29 30 31 Transmitters and Receivers Introduction Transmitter and Receiver Components 2.2.1 Amplifier 2.2.2 Oscillator 2.2.3 Mixer 2.2.4 Band-Pass Filter 2.2.5 Modulator and Demodulator 32 32 33 33 34 34 35 36 1.3 1.4 1.5 2.1 2.2 www.TechnicalBooksPDF.com Contents vi 2.3 2.4 2.5 2.6 2.7 2.8 3.1 3.2 3.3 3.4 3.5 3.6 2.2.6 Antenna 2.2.7 The Superheterodyne Receiver Noise and Interference 2.3.1 Thermal Noise 2.3.2 Shot Noise 2.3.3 Flicker Noise 2.3.4 The Image Band and Noise 2.3.5 Interference 2.3.6 Atmospheric Attenuation 2.3.7 Path Loss Introduction to Modulation 2.4.1 Amplitude Modulation (AM) 2.4.2 Frequency Modulation (FM) Digital Modulation 2.5.1 Channel Capacity 2.5.2 Amplitude Shift Keying (ASK) 2.5.3 Frequency Shift Keying (FSK) 2.5.4 Phase Shift Keying (PSK) 2.5.5 Constellation Diagram 2.5.6 Quadrature Amplitude Modulation (QAM) 2.5.7 Orthogonal Frequency Division Multiplexing (OFDM) Modulation 2.5.8 Comparison of Eb /N0 versus BER for Various Modulation Schemes 2.5.9 Bandwidth Utilisation Efficiency and CNR Noise Analysis and Link Budget Calculation 2.6.1 Noise Equivalent Bandwidth 2.6.2 Noise Analysis in a Circuit 2.6.3 Figures of Merit 2.6.4 Noise Performance of Cascaded Networks 2.6.5 Noise Calculation Examples Some Wireless Transceiver Architectures 2.7.1 Superheterodyne 2.7.2 Double Conversion 2.7.3 Direct Conversion 2.7.4 Low-IF Architecture 2.7.5 Band-Pass Sampling Receiver Conclusion References 37 37 38 38 40 41 42 44 46 46 48 49 50 50 51 52 54 55 56 57 58 59 60 61 61 61 62 65 68 71 71 73 74 77 78 79 80 Scattering Parameters Introduction Z-Parameters (Open-Circuit Impedance Parameters) Y-Parameters (Short-Circuit Admittance Parameters) H-Parameters (Hybrid Parameters) ABCD-Parameters (Transmission or Chain Parameters) Summary of Two-Port Parameter Operations 81 81 81 82 83 84 85 www.TechnicalBooksPDF.com Contents vii 3.7 87 89 90 90 91 94 95 95 96 97 98 3.8 4.1 4.2 4.3 4.4 4.5 4.6 5.1 5.2 5.3 5.4 Scattering Parameters 3.7.1 Flowgraph Representation of Two-Port S-Parameters 3.7.2 Properties of S-Parameters 3.7.3 S-Parameters and Decibels 3.7.4 N-Port S-Parameters 3.7.5 Measuring S-Parameters Transmission Parameters 3.8.1 Definition 3.8.2 Relationship Between T- and ABCD-Parameters 3.8.3 Application to Cascaded Networks References Lumped-Element Filters Introduction Filter Theory 4.2.1 Transfer Function Analysis 4.2.2 The s-Domain 4.2.3 Bode Plots 4.2.4 Impulse Response and Causality 4.2.5 The Need for a System Impedance Butterworth, Chebyshev and Elliptic Low-Pass Prototypes 4.3.1 Butterworth Low-Pass Filter 4.3.2 Chebyshev Filter 4.3.3 Elliptic Filter Filter Design Method 4.4.1 High-Pass Transformation 4.4.2 Band-Pass Transformation 4.4.3 Band-Stop Transformation 4.4.4 Band-Pass Filter Design Example 4.4.5 Group Delay Practical Lumped Elements Capacitively-Coupled Resonator Filter References 99 99 100 100 101 102 103 105 107 107 109 110 111 113 115 116 117 118 120 121 124 Transmission Line Theory Introduction Reflections on Transmission Lines 5.2.1 Open-Circuited Line 5.2.2 Short-Circuited Line Transmission Line Theory 5.3.1 Telegrapher’s Equation 5.3.2 Lossless Transmission Line Standing Waves on a Lossless Transmission Line with Mismatched Load 5.4.1 Impedance Variation along a Transmission Line 125 125 126 127 127 129 129 134 www.TechnicalBooksPDF.com 135 140 Contents viii 5.5 5.6 5.7 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 The Smith Chart 5.5.1 Standing Wave Ratio Circles 5.5.2 Smith Chart Computer Tools The Signal Flow Graph 5.6.1 SFG Diagram 5.6.2 SFG Simplification Conclusion References 142 147 149 150 150 152 154 154 Transmission Line Components Introduction Coaxial Components Twisted Pairs and Twin-Lead Rectangular Waveguide Microstrip 6.5.1 Analysis and Synthesis 6.5.2 Microstrip Frequency Limitations 6.5.3 Microstrip Discontinuities and EDA Software 6.5.4 Test Fixtures and Housings Common Microstrip Components 6.6.1 Quasi-Lumped Elements 6.6.2 Distributed Elements 6.6.3 Wilkinson Splitter/Combiner 6.6.4 Parallel-Coupled Lines 6.6.5 Lange Coupler 6.6.6 Branch-Line Coupler 6.6.7 Rat-Race Hybrid 6.6.8 Planar Marchand Balun 6.6.9 Microstrip Resonators Uniplanar Transmission Lines 6.7.1 Coplanar Waveguide 6.7.2 Coplanar Strips 6.7.3 Slotline Other Transmission Line Types 6.8.1 Stripline 6.8.2 Suspended Substrate Techniques 6.8.3 Thin-Film Microstrip 6.8.4 Lumped and Lumped-Distributed Components 6.8.5 Substrate Integrated Waveguide 6.8.6 Ridge Waveguide and Finline 6.8.7 Dielectric Waveguides 6.8.8 Micromachined Lines Conclusion References 155 155 155 157 158 161 163 163 164 164 166 166 168 170 171 173 173 174 175 176 177 177 178 178 179 179 179 180 180 181 182 183 184 184 185 www.TechnicalBooksPDF.com Microwave and Millimetre-Wave Design for Wireless Communications 566 Micrometer or motor control Slug Signal conductor Ground Ground (a) (b) Figure 18.30 (a) Cross-section of a typical slabline tuner (b) An early prototype of an automated tuner developed at the University of Leeds [12] components in the frequency domain Mathematically, X-parameters are based on the polyharmonic distortion (PHD) framework introduced by Verspecht and Root [14, 15] The reason that the extension of this work to the representation of devices with X-parameters is so important is that it means, for the first time, that nonlinear devices can be fully represented with a ‘black box’ of measured or modelled parameters in the same way that linear devices, components and circuits have been represented with S-parameters for more than 50 years The principle behind X-parameters is the treatment of each of the scattered waves as a harmonic series, as illustrated simplistically in Figure 18.31 Obviously, if a single tone is input into a nonlinear device then harmonic components will be transmitted and reflected However, in order to represent a device located anywhere within a nonlinear circuit or subsystem, it is important to create a more general representation and this requires that the input signal is also treated as a harmonic series These key steps in developing the fully flexible, multipurpose X-parameter representation are illustrated in Figure 18.31 For a two-port nonlinear network, the incoming and scattered waves must all be represented as a Fourier series and the parameters a1 , b1 , a2 and b2 from the linear case are developed into matrices containing the magnitude and phase of the Fourier coefficients The X-parameters characterise the conversion from harmonicto-harmonic for the scattered wave components Since the degree to which harmonics are generated is highly dependent on signal level, X-parameters are multidimensional parameters that vary with frequency, signal level and harmonic index With exceptional elegance, Xparameters are actually a superset of S-parameters, and the linear S11 , S21 , S12 and S22 can all be found within the X-parameter set, being those with frequency index [1,1] at low power levels www.TechnicalBooksPDF.com Measurement Techniques 567 P A1 f X DUT A2 P P f P B1 f Figure 18.31 B2 f X-parameter representation of a nonlinear device X-parameters have some similarities to the conversion matrices often encountered in the harmonic balance modelling of nonlinear circuits, such as mixers They assume a steadystate solution and cannot be used for transient simulation, but are able to represent a very wide range of signal waveforms, including modulated signals In order to derive waveforms from a harmonic series, the phase of each harmonic needs to be known This provides a new challenge for the network analyser measurement because absolute phase is not determined by conventional VNAs So, as well as adding absolute power level calibration, an important key step in equipping a VNA to make X-parameter measurements is to introduce a phase reference, which Keysight by injecting a comb generator into the LO With this, and suitable firmware, the PNA-X can be used as a complete nonlinear VNA (NLVNA) system Furthermore, the Keysight NLVNA system can be combined with Maury® automated tuners to provide the capability to characterise the X-parameters of the DUT over a very wide range of load impedances, providing exceptional capability for power amplifier modelling and design References Applying Error Correction to Network Analyzer Measurements, AN 5965-7709E Available at: www.keysight.com Millimeter Wave Connector Care, 15th September 2014, Keysight Technologies, Inc Available at: http://na.support.keysight.com/pna/connectorcare/whnjs.htm Lucyszyn, S (2001) Measurement techniques, in: RFIC & MMIC Design and Technology (eds I.D Robertson and S Lucyszyn), Chapter 12 IEE Publishers Lucyszyn, S (2007) RFIC and MMIC measurement techniques, in: Microwave Measurements (eds R Collier and D Skinner), Chapter 11, IET Publishers, London, pp 217–262 Marks, R.B (1991) A multiline method of network analyser calibration IEEE Transactions, MTT-39, 1205– 1215 Deal, W.R (2008) Coplanar waveguide basics for MMIC and PCB design Microwave Magazine, (4), 120– 133 Ang, K.S and Robertson, I.D (2001) Analysis and design of impedance-transforming planar Marchandbaluns IEEE Transactions on Microwave Theory and Techniques, 49 (2), 402–406 Underhill, M.J (2001) University of Surrey, Private communication www.TechnicalBooksPDF.com 568 Microwave and Millimetre-Wave Design for Wireless Communications Bocklemann, D.E and Eisenstadt, W.R (1995) Combined differential and common-mode scattering parameters: theory and simulation IEEE Transactions on Microwave Theory and Techniques, MTT-43, 1530–1539 10 Dunsmore, J and Xin Chen (2104) Measurements for microwave differential and IQ devices 83rd ARFTG Microwave Measurement Conference, Tampa, FL, June, pp 1–4 11 Weatherspoon, M.H and Dunleavy, L.P (2005) Vector corrected on-wafer measurements of noise temperature IEEE Transactions on Instrumentation and Measurement, 54 (3), 1327–1332 12 Pierpoint, M., Pollard, R.D., and Richardson, J.R (1986) An automated measurement technique for measuring amplifier load-pull and verifying large-signal device models IEEE MTT-S International Microwave Symposium Digest, Baltimore, MD, USA, 2–4 June, pp 625–628 13 McIntosh, C.E., Pollard, R.D., and Miles, R.E (1999) On the feasibility of using an active tuner for measuring microwave noise parameters IEEE Transactions on Instrumentation and Measurement, 48 (6), 1294–1300 14 Verspecht, J and Root, D.E (2006) Polyharmonic distortion modelling Microwave Magazine, (3), 44–57 15 Root, D.E., Verspecht, J., Horn, J., and Marcu, M (2013) X-Parameters: Characterization, Modeling, and Design of Nonlinear RF and Microwave Components The Cambridge RF and Microwave Engineering Series Cambridge University Press ISBN: 9780521193238 www.TechnicalBooksPDF.com Glossary 3GPP 3rd Generation Partnership Project ACI Adjacent Channel Interference ADC Analogue-to-Digital Converter AiP Antenna-in-Package AM Amplitude Modulation AMPS Advanced Mobile Phone System ASIC Application-Specific Integrated Circuit ASK Amplitude-Shift Keying ATSC Advanced Television Standards Committee AWG or ARB Arbitrary Waveform Generator BAW Bulk Acoustic Wave BCB Benzocyclobutene BER Bit-Error Rate BGA Ball Grid Array BiCMOS Bipolar Complementary Metal-Oxide-Semiconductor BNC Bayonet Neill–Concelman connector BPF Band-Pass Filter BUE Bandwidth Utilization Efficiency CCI Co-Channel Interference CDMA Code-Division Multiple Access CMOS Complementary Metal-Oxide-Semiconductor CNR Carrier-to-Noise Ratio COFDM Coded Orthogonal Frequency Division Multiplexing CORDIC COordinate Rotation DIgital Computer CPS Coplanar Strips CPW Coplanar Waveguide Microwave and Millimetre-Wave Design for Wireless Communications, First Edition Ian Robertson, Nutapong Somjit and Mitchai Chongcheawchamnan © 2016 John Wiley & Sons, Ltd Published 2016 by John Wiley & Sons, Ltd www.TechnicalBooksPDF.com Glossary 570 DAC Digital-to-Analogue Converter DBM Double-Balanced Mixer DC Direct Current DEMOD Demodulator DFE Design for the Environment DFM Design for Manufacture DFT Discrete Fourier Transform DIY Do-It-Yourself DSB Double-Sideband DSP Digital Signal Processing DTMB Digital Terrestrial Multimedia Broadcast DUT Device-Under-Test DVB-T Digital Video Broadcasting Terrestrial E-cal Electronic Calibration EDA Electronic Design Automation EIA Electronics Industry Association EIRP Effective Isotropic Radiated Power EM Electromagnetic EMC Electromagnetic Compatibility EMI Electromagnetic Interference EMS Electronics Manufacturing Services EPC Electronic Product Code EURAMET European Association of National Metrology Institutes EVM Error Vector Magnitude F Noise Factor FCC Federal Communications Commission (USA) FDMA Frequency Division Multiple Access FDTD Finite-Difference Time-Domain FEM Finite Element Method FER Frame-Error-Rate FET Field-Effect Transistor FFT Fast Fourier Transform FM Frequency Modulation FPGA Field-Programmable Gate Array FSK Frequency-Shift Keying FSPL Free-Space Path Loss GaAs Gallium Arsenide GaN Gallium Nitride GPRS General Packet Radio System www.TechnicalBooksPDF.com Glossary 571 GPS Global Positioning System GSM Global System For Mobile Communications (Previously Groupe Sp´eciale Mobile) HBT Heterojunction Bipolar Transistor HEMT High Electron Mobility Transistor HSIW Hollow Substrate Integrated Waveguide IC Integrated Circuit ICT Inductively-Coupled Telemetry IEEE The Institute of Electrical and Electronics Engineers IF Intermediate Frequency InP Indium Phosphide IoT Internet of Things IP Intellectual Property or Internet Protocol IRR Image Rejection Ratio ISDB Integrated Services Digital Broadcasting ISI Intersymbol Interference ITU International Telecommunications Union JFET Junction Field-Effect Transistor LAN Local Area Network LCP Liquid Crystal Polymer LDMOS Laterally Diffused Metal-Oxide-Semiconductor LNA Low-Noise Amplifier LNB Low-Noise Block LO Local Oscillator LOS Line-of-Sight LRL Line-Reflect-Line LRM Line-Reflect-Match LRRM Line-Reflect-Reflect-Match LTCC Low Temperature Co-Fired Ceramic LTE Long Term Evolution LUT Look-Up Table m2m Machine-to-Machine MAG Maximum Available Gain MBE Molecular Beam Epitaxy MEMS Microelectromechanical Systems MESFET Metal–Semiconductor Field-Effect Transistor mHEMT Metamorphic High Electron Mobility Transistor MIM capacitor Metal-Insulator-Metal Capacitor MIMO Multiple-Input and Multiple-Output MMIC Monolithic Microwave Integrated Circuit www.TechnicalBooksPDF.com Glossary 572 MOCVD Metal Organic Chemical Vapour Deposition MoM Method of Moments MP3 MPEG Layer 3; audio format MPEG-2 Motion Picture Experts Group II; video format MSG Maximum Stable Gain NF Noise Figure NFC Near-Field Communications NIST National Institute of Standards and Technology (USA) NLOS Non-Line-of-Sight NMOS N-Type Metal-Oxide-Semiconductor NMT Nordic Mobile Telephony NPL National Physical Laboratory (UK) NTSC National Television System Committee NTT Nippon Telegraph and Telephone Corporation ODE Ordinary Differential Equation ODM Original Design Manufacturer OEM Original Equipment Manufacturer OFCOM Office of Communications (UK) OFDM Orthogonal Frequency Division Multiplexing OOK On-Off Keying PA Power Amplifier PAL Phase Alternating Line PAPR Peak-to-Average Power Ratio PAR Peak-to-Average Ratio PCB Printed Circuit Board PCM Process Control Monitor PD Phase Detector (oscillator) or Predistorter (power amplifier) PDE Partial Differential Equation PDK Process Design Kit PGA Pin-Grid Array pHEMT Pseudomorphic High Electron Mobility Transistor PLL Phase-Locked Loop PSK Phase-Shift Keying PWM Pulse-Width Modulation QAM Quadrature Amplitude Modulation QFN Quad Flat No-Leads QPSK Quadrature Phase-Shift Keying RF MEMS Radio Frequency Micro-Electromechanical Systems RF Radio Frequency RFIC Radio Frequency Integrated Circuit www.TechnicalBooksPDF.com Glossary 573 RFID Radio Frequency Identification RFOW RF-on-Wafer RoHS Restriction of Hazardous Substances RTD Resonant Tunnelling Diode RWG Rectangular Waveguide RX Receiver SAW Surface Acoustic Wave SECAM S´equentiel Couleur a M´emoire SFG Signal Flow Graph SiGe Silicon Germanium SiP System-in-Package SIW Substrate Integrated Waveguide SMD Surface-Mounted Device SoC System-on-Chip SOLT Short-Open-Load-Thru SRD Step-Recovery Diode SRF Self-Resonant Frequency SSB Single Side-Band STB Set-Top Box TACS Total Access Communication System TDMA Time-Division Multiple Access TE Transverse Electric TEM Transverse Electromagnetic TFMS Thin-Film Microstrip TM Transverse Magnetic; or Trademark when superscript TRL Thru-Reflect-Line TV Television TX Transmitter UHF Ultrahigh Frequency USB Universal Serial Bus UV Ultraviolet VCO Voltage-Controlled Oscillator VHF Very High Frequency VNA Vector Network Analyser VSA Vector Signal Analyser VSWR Voltage Standing Wave Ratio W-CDMA Wideband Code-Division Multiple Access WEEE Waste Electrical and Electronic Equipment WSN Wireless Sensor Network www.TechnicalBooksPDF.com www.TechnicalBooksPDF.com Index Note: Page numbers followed by ff indicate and following pages 3-D packaging 182, 497, 507 3GPP (3rd Generation Partnership Project) ABCD-parameters 84 active load 310 adjacent channel interference (ACI) 44, 321 admittance parameters 82 Advanced Mobile Phone System (AMPS) Advanced Television Standards Committee (ATSC) 14 amplitude modulation (AM) 36, 49 amplitude shift keying (ASK) 52 analogue-to-digital converter (ADC) 50, 77, 468 antenna 5, 17, 434ff, 512 antenna arrays 458, 512 antenna gain 5, 17, 435, 450 antenna-in-package (AiP) 512 application-specific integrated circuit (ASIC) 496 arbitrary waveform generator (AWG or “ARB”) 542 atmospheric attenuation 6, 447 balanced amplifier 314, 318 balanced mixer 398, 405 ball-grid array (BGA) 505, 513 balun 175, 402 band-pass filter (BPF) 35, 111, 194, 211ff bandwidth utilization efficiency (BUE) 57, 60 Barkhausen criterion 351 Bayonet Neill–Concelman (BNC) connector 157 benzocyclobutene (BCB) 274 bias choke 169, 308 bipolar complementary metal-oxidesemiconductor (BiCMOS) 248, 464 bipolar transistor 263, 301 bit-error-rate (BER) 57, 59, 467 Bode plot 102 bottom-up fabrication 256 branch-line coupler 173, 408 bulk acoustic wave (BAW) 392 Butterworth filter 103, 107, 379 calibration standards 548, 553 carrier-to-noise ratio (CNR) 61, 379 cascaded networks 65, 84, 95 cascaded noise figures 65, 316 Cauer topology 106 cellular mobile communications 3, 20, 249, 458 channel capacity 51, 491 channel estimation 492 characteristic impedance 92, 105, 126, 134, 163, 279 Chebyshev filter 107, 210 chip-on-board 267, 504 Clapp oscillator 347, 382 class A 269, 327 cleanroom 249 cloud robotics 30 coaxial cable 105, 125, 155 coaxial connector types 156 coax-microstrip launcher 164, 559 co-channel interference (CCI) 44 Microwave and Millimetre-Wave Design for Wireless Communications, First Edition Ian Robertson, Nutapong Somjit and Mitchai Chongcheawchamnan © 2016 John Wiley & Sons, Ltd Published 2016 by John Wiley & Sons, Ltd www.TechnicalBooksPDF.com Index 576 code division multiple access (CDMA) 22, 544 coded orthogonal frequency division multiplexing (COFDM) 15, 58 combline filter 223ff common-gate stage 301, 387, 403 common-mode rejection 564 complementary metal-oxide-semiconductor (CMOS) 7, 248, 262, 372 complex s operator 102, 355 connector care 556 constant reactance circle 144 constellation diagram 53, 56, 325, 410, 546 contract manufacturer 10 COordinate Rotation DIgital Computer (CORDIC) 477 coplanar strips (CPS) 158, 178 coplanar waveguide (CPW) 177, 418, 560 coupled-slotline mode 178, 563 cross-coupled filters 237 cross-coupled oscillator 372 Darlington pair 312 DC biasing 169, 309 decibels 5, 64, 90, 299 demodulator (DEMOD) 33, 36, 75, 379, 483 design for the environment (DFE) design-for-manufacture (DFM) device-under-test (DUT) 87, 548ff dielectric image guide 183 dielectric insular image guide 183 dielectric resonator 176, 188, 363 dielectric waveguide 183 digital modulation 50 digital predistortion 340, 486ff digital signal processing (DSP) 9, 464ff Digital Terrestrial Multimedia Broadcast (DTMB) 14 digital TV 14 Digital Video Broadcasting-Terrestrial (DVB-T) 14 digital-to-analogue converter (DAC) 473 diode mixer 396, 525 dipole antenna 437 direct conversion receiver 74 directivity 179, 435, 444, 550 discrete Fourier transform (DFT) 474 distributed amplifier 313 distributed mixer 407 Doherty amplifier 334 double-balanced mixer (DBM) 175, 395, 399 double-sideband (DSB) 50, 65 dual-gate FET 262, 397, 400, 407 effective isotropic radiated power (EIRP) 12, 47 electromagnetic interference (EMI) 44 electromagnetic spectrum 3, 452 electronic calibration (E-cal) 554 electronic design automation (EDA) 163, 497, 515ff Electronic Product Code (EPC) 25 elliptic filter 107, 110, 237 energy per bit (Eb) 51 error correction 60, 550 error vector magnitude (EVM) 325 even and odd modes 172, 207, 336, 564 fabless design 11, 496 far-field region 27, 436, 448 fast Fourier transform (FFT) 15, 475 Federal Communications Commission (FCC, USA) 6, 325 feedforward linearisation 340, 464 FET feedback amplifier 312, 340 FET mixer 396 fibre-radio systems 24 field-effect transistor (FET) 256 Field-Programmable Gate Array (FPGA) 489 finite element method (FEM) 517, 533 finite-difference time-domain (FDTD) 517, 533 finline 182, 339 fixed links 18, 46 flicker noise 41, 77, 362 flip-chip assembly 430, 505 flowgraph 89, 150, 303, 551 folded dipole antenna 439 free-space path loss 442, 449 frequency division multiple access (FDMA) 21 frequency modulation (FM) 50 frequency shift keying (FSK) 54 frequency synthesiser 389 Friis noise factor formula 65, 316 Friis transmission equation 46, 448 front-to-back ratio 436 gain definitions 298, 300 gallium arsenide (GaAs) 248ff gallium nitride (GaN) 259, 497 gate periphery 261, 300 general packet radio system (GPRS) 22 Gilbert cell mixer 392, 405 www.TechnicalBooksPDF.com Index 577 Global positioning system (GPS) 17 Global System for Mobile Communications (GSM) 2, 21, 540 group delay 118, 160, 238 hairpin filter 233 harmonic balance technique 522 harmonic mixers 547 Hartley architecture 401 heterodyne receiver 33 heterojunction bipolar transistor (HBT) 248, 265, 302 high electron mobility transistor (HEMT) 248, 258, 411 high power transistors 270 hollow substrate integrated waveguide (HSIW) 182, 272, 510 homodyne receiver 32 horn antenna 444 H-parameters (hybrid parameters) 83, 86 image rejection ratio (IRR) 466 image signal 35, 42, 65, 72, 394, 398, 401 IMPATT diode 276 impedance and admittance inverters 123, 191ff impulse response 101, 457 indium phosphide (InP) 7, 248ff indoor propagation 47, 453, 490 inductively coupled telemetry (ICT) 25 integrated circuit 1, 74, 253 Integrated Services Digital Broadcasting (ISDB) 14 intellectual property 8, 11 interdigital filter 217 intermediate frequency (IF) 18, 33, 71, 392 International Telecommunications Union (ITU) 7, 48 Internet of Things (IoT) 1, 22, 25, 509, 511 intersymbol interference (ISI) 14, 44, 61, 457, 490 I–Q Imbalance 76, 464, 482 IQ modulation 57, 484 isotropic antenna 5, 37, 435, 450 I–V curves 258, 270, 327 J-inverter 191ff jitter 360 K-inverter 122ff, 191ff Kuroda’s identity 203 Lange coupler 173, 314, 335, 399, 411 laterally diffused metal-oxide-semiconductor (LDMOS) 248, 263 lead frame package 505ff LineCalc 163 line-of-sight (LOS) 18, 46, 69 link budget 61, 447, 450 liquid crystal polymer (LCP) 162, 498 L-networks 284 local area network (LAN) 7, 489 long term evolution (LTE) 7, 22, 461, 540 long-tailed pair 310, 313, 403 look-up table (LUT) 488 loop antenna 441 lossy match amplifier 308 low noise amplifier (LNA) 17, 33, 63, 315 low noise block (LNB) 18 low temperature co-fired ceramic (LTCC) 163, 175, 182, 391, 503ff low-IF Architecture 77, 465 LRL (line-reflect-line) calibration 561 LRM (line-reflect-match) calibration 561 LRRM (line-reflect-reflect-match) calibration 561 lumped element filter 99ff lumped-distributed components 180, 199 machine-to-machine communications (m2m) 29, 509 Mason’s non-touching loop rule 150, 303, 551 matching network 279ff maximum available gain (MAG) 306 maximum stable gain (MSG) 306 Maxwell’s equations 455, 516, 530 MEMS inductor 419 MEMS packaging 429 MEMS phase shifter 425 MEMS varactor 420 metal organic chemical vapour deposition (MOCVD) 259, 266, 301 metal-insulator-metal (MIM) capacitor 274, 562 metal-semiconductor field effect transistor (MESFET) 257, 300 metamorphic High Electron Mobility Transistor (mHEMT) 259 method of moments (MoM) 517, 529 microelectromechanical systems (MEMS) 415ff micromachined transmission line 416 microstrip 161ff, 210, 268, 335, 445 microstrip frequency limitations 163 www.TechnicalBooksPDF.com Index 578 microstrip patch antenna 445 microstrip resonators 176 microstrip test fixture 165, 501, 558 MIMO (multiple-input and multiple-output) 22, 460, 467 mixed-mode S-parameters 563 monolithic microwave integrated circuit (MMIC) 248, 272, 516, 534 molecular beam epitaxy (MBE) 252 Moore’s law 1, 249 More than Moore 255 multi-chip module (MCM) 498ff multipath propagation 14, 21, 45, 457ff, 490 National Institute of Standards and Technology (NIST, USA) 549, 562 National Physical Laboratory (NPL, UK) 549 near-field communications (NFC) 25, 447 NMOS 249, 263 noise circles 317 noise equivalent bandwidth 61 noise factor (F) 62ff, 316 noise figure (NF) 62ff, 316 noise figure of mixers 65 noise performance of cascaded networks 65, 316 noise temperature (Te ) 66 nonradiative dielectric guide (NRD) 183 N-port S-parameters 91 Nyquist criterion 354 Nyquist diagram 356 OFCOM (Office of Communications, UK) On-Off-Keying (OOK) 53 ordinary differential equation (ODE) 521 original design manufacturer (ODM) 11 original equipment manufacturer (OEM) 11 orthogonal frequency division multiplexing (OFDM) 14, 58, 489ff package styles 267, 504ff PAL (Phase Alternating Line) 12 parallel stub 168, 290 parallel-coupled line filter 211ff parallel-coupled microstrip lines 171, 207, 233 parasitics 120 partial differential equations (PDEs) 534 process control monitor (PCM) 534 peak-to-average ratio 59, 298, 318 phase detector 377 phase noise 34, 56, 361ff phase-shift keying (PSK) 55 phase velocity 134, 425 phase-locked loop (PLL) 377ff pHEMT (pseudomorphic high electron mobility transistor) 248, 257 photoimageable thick-film process 502 photolithography 249 photoresist 250 PIN diode 276 pin-grid array (PGA) 505 planar electromagnetic simulation 529 planar Marchand balun 175, 402 Plessey Research Caswell 257 power amplifier 269ff, 326ff power amplifier linearisation 339, 486 power combining techniques 334 power gain 33, 91, 298 predistortion linearisation 340, 486 process design kit (PDK) 534 propagation constant 126, 132, 160 propagation loss pulse-width modulation (PWM) 332 Q-factor 177, 272, 282, 362, 416 Quad Flat No-leads (QFN) 505 quadrature amplitude modulation (QAM) 57, 325, 409 quadrature-phase shift keying (QPSK) 56, 544 quantisation error 51, 468 quarter-wave transformer 169, 293, 296 quartz crystal resonator 365 quasi-optical power combining 338 QUCS (Quite Universal Circuit Simulator) 128 radial and butterfly stub 169 radiation pattern 5, 427, 436 radiation resistance 434 radio frequency identification (RFID) 25 radio frequency micro-electromechanical systems (RF MEMS) 415ff radio horizon 12 radiofrequency integrated circuit (RFIC) 9, 74, 271ff rapid prototyping of PCBs 500 rat-race hybrid 174, 181 reactively matched amplifier 311 receiver 32ff www.TechnicalBooksPDF.com Index 579 recta-coax 416 rectangular waveguide (RWG) 158, 181, 337, 444 reference planes 88, 552, 560 reflections on transmission lines 126 reflector antenna 443 resistive FET mixer 397 resolution bandwidth 544 resonant tunnelling diode (RTD) 277 reticle 534 return loss 91, 137 RF-on-wafer (RFOW) measurements 535, 560 rib image guide 183 Richards transformation 202 ridge waveguide 182 robotic communications 29 sample and hold 468 satellite communications 15 satellite navigation systems 17 Scattering parameters 81ff, 548 Schottky diode 275 SECAM (S´equentiel couleur a` m´emoire) 12 second-order intermodulation 319 self-resonant frequency (SRF) 121, 122, 274 semiconductor wafer 249, 254 set-top box (STB) 18 Shannon’s Law 59, 461 Shot noise 40, 362 SiGe HBT 265 signal flow graph 89, 150 single-ended mixers 392 single-sideband (SSB) 50, 65, 362, 401 sliding load 553 slotline 178 small-signal equivalent circuit 259, 300 the Smith chart 142ff Smith chart computer tools 149, 293 SOLT (short-open-load-thru) calibration 550 source- and load-pull 564 S-parameters 81ff, 548 spectral efficiency 9, 20, 58 spectrum licensing spiral inductor 120, 167, 273, 502, 536 stability circles 304 stability factor 305, 386 standing wave ratio circles 147 standing waves 135ff stepped-impedance low-pass filter 208 step-recovery diode 277 stiction 421 stripline 179 stub matching 290 substrate integrated waveguide (SIW) 181, 338, 502 superheterodyne receiver 37, 71 surface acoustic wave (SAW) 27, 74 surface mount device (SMD) 121, 282, 497, 503 suspended substrate microstrip 179 symbol 53 synchrodyne receiver 33 system impedance 87, 105, 279 system-in-package (SiP) 495, 509 system-on-chip (SoC) 11, 18, 256, 496 TACS (Total Access Communication System) 20 TE (transverse electric) 159, 178 telegraph 3, 434 telegrapher’s equation 129 television 3, 12 TEM (transverse electromagnetic) 156, 172, 281, 417 test fixture 165, 501, 558 thermal noise 38, 57, 315 thin-film microstrip (TFMS) 180 third-order intermodulation 321 time division multiple access (TDMA) 21 TM (Transverse Magnetic) 159 top-down fabrication 256 transceiver architectures 71ff transconductance 258 transfer function 100 transient behaviour of transmission lines 126, 137 transmission-line resonator 176, 188, 363 transmission-line transformer 170 transmitter 32ff transverse resonances 163 travelling-wave antenna 442 Tri-plate 179 TRL calibration 558 T (transmission)-parameters 95ff twin-lead 157 twisted pair 157 two-port network 81ff two-port oscillator model 349 two-port parameter conversion 87 www.TechnicalBooksPDF.com Index 580 unilateral transducer gain 307 uniplanar transmission lines 177 unit gate width 261 vector modulator 410 vector network analyser (VNA) 94, 547 vector signal analyser (VSA) 540 VNA calibration 549 voltage standing wave ratio (VSWR) 139, 547 voltage-controlled oscillator (VCO) 375 wafer-scale packaging 495 waveguide bands 160 waveguide-to-microstrip transition 512 wavelength W-CDMA (wideband code-division multiple access) 544 wearables and body area networks 29 weaver architecture 401 Wilkinson splitter/combiner 170, 335 wireless sensor network (WSN) 28 Yagi–Uda antenna Y-parameters 82 442 zero-level packaging 430, 507 ZigBee® 7, 10, 23, 540 Z-parameters 81 www.TechnicalBooksPDF.com