Kỹ thuật vi xử lý full

Bài giảng Kỹ thuật Vi xử lý Ngành Điện tử-Viễn thông Đại học Bách khoa Đà Nẵng Hồ Viết Việt, Khoa ĐTVT Tài liệu tham khảo [1] Kỹ thuật vi xử lý, Văn Thế Minh, NXB Giáo dục, 1997 [2] Kỹ thuật vi xử lý Lập trình Assembly cho hệ vi xử lý, Đỗ Xuân Tiến, NXB Khoa học & kỹ thuật, 2001 Chương 1.1 Các hệ thống số - Hệ thập phân - Hệ nhị phân - Hệ thập lục phân 1.2 Các hệ thống mã hoá - ASCII - BCD 1.3 Các linh kiện điện tử số - Các cổng logic: AND, OR, XOR,NOT - Các giải mã 1.1 Các hệ thống số „ „ Hệ đếm thập phân (Decimal) Còn gọi hệ đếm số mười (Vì có q người có chín ngón tay mười ngón chân?) „ „ Dùng mười ký hiệu: 1,2,3,4,5,6,7,8,9,0 Ví dụ:1.1: Ba nghìn Chín trăm Bảy mươi Tám 3978 = 3x103 + 9x102 + 7x101 + 8x100 = 3000 + 900 + 70 + 1.1 Các hệ thống số „ „ „ Hệ đếm nhị phân (Binary) Còn gọi Hệ đếm số hai Sử dụng hai ký hiệu (bit): (Các hệ thống điện tử số sử dụng hai mức điện áp?) „ „ „ Kích cỡ, LSB, MSB số nhị phân Số nhị phân khơng dấu (Unsigned) Số nhị phân có dấu (Số bù hai) Số nhị phân „ Mỗi ký hiệu gọi Bit (Binary Digit- Chữ số nhị phân) Kích cỡ số nhị phân số bit MSB (Most Significant Bit): Bit sát trái LSB (Least Significant Bit): Bit sát phải „ Ví dụ 1.1: 1010101010101010 „ „ „ MSB LSB số nhị phân 16-bit Số nhị phân không dấu „ „ „ Chỉ biểu diễn giá trị không âm (>= 0) Với n-bit biểu diễn giá trị từ đến 2n – Ví dụ 1.3: Giá trị V số nhị phân không dấu 1101 tính: V(1101) = 1x23 + 1x22 + 0x21 + 1x20 = + + + = 13 Số nhị phân không dấu „ Tổng quát: Nếu số nhị phân N n-bit: N = b( n-1) b( n-2) … b1 b0 giá trị V là: V = b(n -1) x 2(n-1)+b (n-2) x2 (n-2)+ … + b1 x 21 + b0 x 20 Các số nhị phân không dấu 4-bit biểu diễn giá trị từ ? đến ? 16 giá trị từ đến 15 Nhị phân không dấu Giá trị thập phân 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 10 1011 11 1100 12 1101 13 1110 14 1111 15 Số nhị phân không dấu „ „ Dải giá tri số không dấu 8-bit [0,255] (unsigned char C) Dải giá tri số không dấu 16bit [0,65535] (unsigned int C) Chuyển đổi thập phân sang nhị phân „ Ví dụ 1.4 Chuyển 25 sang nhị phân không dấu Dùng phương pháp chia liên tiếp Chia „ „ „ „ „ 25/2 12/2 6/2 3/2 1/2 Thương số Dư số 12 1 0 1 = = = = = Kết là: 11001 LSB MSB 82C55A MODE AND MODE (INPUT) MODE AND MODE (OUTPUT) PC3 PA7-PA0 1 1/0 PC2-PC0 = INPUT = OUTPUT PA7-PA0 OBFA PC7 CONTROL WORD D7 D6 D5 D4 D3 D2 D1 D0 PC6 ACKA PC4 STBA PC5 IBFA PC2-PC0 PC3 INTRA CONTROL WORD D7 D6 D5 D4 D3 D2 D1 D0 1 ACKA PC4 STBA IBFA PC5 I/O WR MODE AND MODE (INPUT) PC3 PA7-PA0 CONTROL WORD D7 D6 D5 D4 D3 D2 D1 D0 PA7-PA0 OBFA PC6 ACKA PC4 STBA PC5 IBFA PC1 PC3 INTRA PC7 PB7-PB0 WR PC6 PB7, PB0 MODE AND MODE (OUTPUT) RD OBFA RD PB7-PB0 PC7 PC2-PC0 I/O WR 1/0 PC2-PC0 = INPUT = OUTPUT RD INTRA CONTROL WORD D7 D6 D5 D4 D3 D2 D1 D0 1 1 OBFB PC2 ACKB PC0 INTRB RD WR FIGURE 14 MODE COMBINATIONS 12 PC7 OBFA PC6 ACKA PC4 STBA PC5 IBFA PB7-PB0 INTRA PC2 STBB PC1 IBFB PC0 INTRB 82C55A MODE DEFINITION SUMMARY MODE MODE MODE IN OUT IN OUT PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 In In In In In In In In Out Out Out Out Out Out Out Out In In In In In In In In Out Out Out Out Out Out Out Out PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 In In In In In In In In Out Out Out Out Out Out Out Out In In In In In In In In Out Out Out Out Out Out Out Out PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 In In In In In In In In Out Out Out Out Out Out Out Out INTRB IBFB STBB INTRA STBA IBFA I/O I/O INTRB OBFB ACKB INTRA I/O I/O ACKA OBFA Special Mode Combination Considerations GROUP A ONLY Mode or Mode Only I/O I/O I/O INTRA STBA IBFA ACKA OBFA INPUT CONFIGURATION There are several combinations of modes possible For any combination, some or all of Port C lines are used for control or status The remaining bits are either inputs or outputs as defined by a “Set Mode” command D7 D6 D5 I/O I/O IBFA D4 D3 D2 INTEA INTRA INTEB GROUP A During a read of Port C, the state of all the Port C lines, except the ACK and STB lines, will be placed on the data bus In place of the ACK and STB line states, flag status will appear on the data bus in the PC2, PC4, and PC6 bit positions as illustrated by Figure 17 D1 D0 IBFB INTRB GROUP B OUTPUT CONFIGURATION D7 D6 OBFA INTEA Through a “Write Port C” command, only the Port C pins programmed as outputs in a Mode group can be written No other pins can be affected by a “Write Port C” command, nor can the interrupt enable flags be accessed To write to any Port C output programmed as an output in Mode group or to change an interrupt enable flag, the “Set/Reset Port C Bit” command must be used D5 D4 I/O I/O D3 D2 D1 D0 INTRA INTEB OBFB INTRB GROUP A GROUP B FIGURE 15 MODE STATUS WORD FORMAT D7 D6 OBFA INTE1 D5 IBFA D4 INTE2 INTRA GROUP A With a “Set/Reset Port Cea Bit” command, any Port C line programmed as an output (including IBF and OBF) can be written, or an interrupt enable flag can be either set or reset Port C lines programmed as inputs, including ACK and STB lines, associated with Port C fare not affected by a “Set/Reset Port C Bit” command Writing to the corresponding Port C bit positions of the ACK and STB lines with the “Set Reset Port C Bit” command will affect the Group A and Group B interrupt enable flags, as illustrated in Figure 17 D3 D2 D1 D0 X X X GROUP B (Defined by Mode or Mode Selection) FIGURE 16 MODE STATUS WORD FORMAT Current Drive Capability Any output on Port A, B or C can sink or source 2.5mA This feature allows the 82C55A to directly drive Darlington type drivers and high-voltage displays that require such sink or source current 13 82C55A Reading Port C Status (Figures 15 and 16) Applications of the 82C55A In Mode 0, Port C transfers data to or from the peripheral device When the 82C55A is programmed to function in Modes or 2, Port C generates or accepts “hand shaking” signals with the peripheral device Reading the contents of Port C allows the programmer to test or verify the “status” of each peripheral device and change the program flow accordingly The 82C55A is a very powerful tool for interfacing peripheral equipment to the microcomputer system It represents the optimum use of available pins and flexible enough to interface almost any I/O device without the need for additional external logic Each peripheral device in a microcomputer system usually has a “service routine” associated with it The routine manages the software interface between the device and the CPU The functional definition of the 82C55A is programmed by the I/O service routine and becomes an extension of the system software By examining the I/O devices interface characteristics for both data transfer and timing, and matching this information to the examples and tables in the detailed operational description, a control word can easily be developed to initialize the 82C55A to exactly “fit” the application Figures 18 through 24 present a few examples of typical applications of the 82C55A There is not special instruction to read the status information from Port C A normal read operation of Port C is executed to perform this function INTERRUPT ENABLE FLAG POSITION ALTERNATE PORT C PIN SIGNAL (MODE) INTE B PC2 ACKB (Output Mode 1) or STBB (Input Mode 1) INTE A2 PC4 STBA (Input Mode or Mode 2) INTE A1 PC6 ACKA (Output Mode or Mode 2) FIGURE 17 INTERRUPT ENABLE FLAGS IN MODES AND INTERRUPT REQUEST PC3 PA0 PA1 PA2 PA3 PA4 PA5 MODE PA6 (OUTPUT) PA7 PC7 PC6 PC5 PC4 HIGH SPEED PRINTER HAMMER RELAYS DATA READY ACK PAPER FEED FORWARD/REV 82C55A PB0 PB1 PB2 PB3 PB4 MODE PB5 (OUTPUT) PB6 PB7 PC1 PC2 PAPER FEED FORWARD/REV RIBBON CARRIAGE SEN DATA READY ACK PC0 INTERRUPT REQUEST CONTROL LOGIC AND DRIVERS FIGURE 18 PRINTER INTERFACE 14 82C55A INTERRUPT REQUEST PC3 MODE (INPUT) PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 R0 R1 R2 FULLY R3 DECODED R4 KEYBOARD R5 SHIFT CONTROL PC4 PC5 STROBE ACK INTERRUPT REQUEST PC3 MODE (INPUT) 82C55A PB0 PB1 PB2 PB3 PB4 MODE PB5 (OUTPUT) PB6 PB7 B0 B1 B2 BURROUGHS SELF-SCAN B3 DISPLAY B4 B5 BACKSPACE CLEAR 82C55A MODE (INPUT) DATA READY ACK BLANKING CANCEL WORD PC1 PC2 PC6 PC7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 R0 R1 R2 FULLY R3 DECODED R4 KEYBOARD R5 SHIFT CONTROL PC4 PC5 PC6 PC7 STROBE ACK BUST LT TEST LT TERMINAL ADDRESS PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 INTERRUPT REQUEST FIGURE 20 KEYBOARD AND TERMINAL ADDRESS INTERFACE FIGURE 19 KEYBOARD AND DISPLAY INTERFACE INTERRUPT REQUEST PA0 PA1 PA2 PA3 PA4 MODE PA5 (OUTPUT) PA6 PA7 PC4 PC5 PC6 PC7 82C55A PC0 PC1 BIT SET/RESET PC2 PC3 PB0 PB1 PB2 MODE (INPUT) PB3 PC4 PC5 PC6 PC7 LSB PC3 12-BIT A/D CONVERTER (DAC) PA0 PA1 PA2 PA3 PA4 PA5 MODE PA6 (OUTPUT) PA7 ANALOG OUTPUT PC7 PC6 PC5 PC4 DATA READY ACK BLANKED BLACK/WHITE PC2 PC1 PC0 ROW STB COLUMN STB CURSOR H/V STB 82C55A STB DATA SAMPLE EN STB LSB 8-BIT D/A CONVERTER (ADC) R0 R1 R2 CRT CONTROLLER R3 • CHARACTER GEN • REFRESH BUFFER R4 • CURSOR CONTROL R5 SHIFT CONTROL PB0 MODE PB1 (OUTPUT) PB2 PB3 PB4 PB5 PB6 PB7 ANALOG INPUT MAB FIGURE 21 DIGITAL TO ANALOG, ANALOG TO DIGITAL CURSOR/ROW/COLUMN ADDRESS H&V FIGURE 22 BASIC CRT CONTROLLER INTERFACE 15 82C55A INTERRUPT REQUEST INTERRUPT REQUEST PC3 MODE PC3 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 D0 D1 D2 D3 D4 D5 D6 D7 PC4 PC5 PC7 PC6 DATA STB ACK (IN) DATA READY ACK (OUT) PC2 PC1 PC0 TRACK “0” SENSOR SYNC READY INDEX FLOPPY DISK CONTROLLER AND DRIVE MODE (INPUT) 82C55A PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 R0 R1 R2 R3 R4 R5 R6 R7 PC4 PC5 PC6 STB ACK STOP/GO PC0 PC1 PC2 START/STOP LIMIT SENSOR (H/V) OUT OF FLUID MACHINE TOOL 82C55A PB0 PB1 PB2 MODE PB3 (OUTPUT) PB4 PB5 PB6 PB7 MODE (INPUT) ENGAGE HEAD FORWARD/REV READ ENABLE WRITE ENABLE DISC SELECT ENABLE CRC TEST BUSY LT PB0 PB1 PB2 MODE PB3 (OUTPUT) PB4 PB5 PB6 PB7 FIGURE 23 BASIC FLOPPY DISC INTERFACE B LEVEL PAPER TAPE READER CHANGE TOOL LEFT/RIGHT UP/DOWN HOR STEP STROBE VERT STEP STROBE SLEW/STEP FLUID ENABLE EMERGENCY STOP FIGURE 24 MACHINE TOOL CONTROLLER INTERFACE 16 82C55A TA = 25oC Absolute Maximum Ratings Thermal Information Thermal Resistance (Typical, Note 1) θJA θJC CERDIP Package 50oC/W 10oC/W CLCC Package 65oC/W 14oC/W PDIP Package 50oC/W N/A PLCC Package 46oC/W N/A Maximum Storage Temperature Range -65oC to 150oC Maximum Junction Temperature CDIP Package 175oC PDIP Package 150oC Maximum Lead Temperature (Soldering 10s) 300oC (PLCC Lead Tips Only) Supply Voltage +8.0V Input, Output or I/O Voltage GND-0.5V to VCC+0.5V ESD Classification Class Operating Conditions Voltage Range +4.5V to 5.5V Operating Temperature Range C82C55A 0oC to 70oC I82C55A -40oC to 85oC M82C55A -55oC to 125oC Die Characteristics Gate Count 1000 Gates CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied NOTE: θJA is measured with the component mounted on an evaluation PC board in free air Electrical Specifications VCC = 5.0V ±10%; TA = 0oC to +70oC (C82C55A); TA = -40oC to +85oC (I82C55A); TA = -55oC to +125oC (M82C55A) LIMITS SYMBOL PARAMETER MIN MAX UNITS TEST CONDITIONS VIH Logical One Input Voltage 2.0 2.2 - V I82C55A, C82C55A, M82C55A VIL Logical Zero Input Voltage - 0.8 V VOH Logical One Output Voltage 3.0 VCC -0.4 - V IOH = -2.5mA, IOH = -100µA VOL Logical Zero Output Voltage - 0.4 V IOL +2.5mA II Input Leakage Current -1.0 +1.0 µA VIN = VCC or GND, DIP Pins: 5, 6, 8, 9, 35, 36 IO I/O Pin Leakage Current -10 +10 µA VO = VCC or GND DIP Pins: 27 - 34 IBHH Bus Hold High Current -50 -400 µA VO = 3.0V Ports A, B, C IBHL Bus Hold Low Current 50 400 µA VO = 1.0V Port A ONLY IDAR Darlington Drive Current -2.5 Note 2, mA Ports A, B, C Test Condition ICCSB Standby Power Supply Current - 10 µA VCC = 5.5V, VIN = VCC or GND Output Open ICCOP Operating Power Supply Current - mA/MHz TA = +25oC, VCC = 5.0V, Typical (See Note 3) NOTES: No internal current limiting exists on Port Outputs A resistor must be added externally to limit the current ICCOP = 1mA/MHz of Peripheral Read/Write cycle time (Example: 1.0µs I/O Read/Write cycle time = 1mA) Tested as VOH at -2.5mA Capacitance SYMBOL TA = 25oC PARAMETER TYPICAL UNITS CIN Input Capacitance 10 pF CI/O I/O Capacitance 20 pF 17 TEST CONDITIONS FREQ = 1MHz, All Measurements are referenced to device GND 82C55A AC Electrical Specifications VCC = +5V± 10%, GND = 0V; TA = -55oC to +125oC (M82C55A) (M82C55A-5); TA = -40oC to +85oC (I82C55A) (I82C55A-5); TA = 0oC to +70oC (C82C55A) (C82C55A-5) 82C55A-5 SYMBOL PARAMETER 82C55A MIN MAX MIN MAX UNITS TEST CONDITIONS READ TIMING (1) tAR Address Stable Before RD - - ns (2) tRA Address Stable After RD - - ns (3) tRR RD Pulse Width 250 - 150 - ns (4) tRD Data Valid From RD - 200 - 120 ns (5) tDF Data Float After RD 10 75 10 75 ns (6) tRV Time Between RDs and/or WRs 300 - 300 - ns WRITE TIMING (7) tAW Address Stable Before WR - - ns (8) tWA Address Stable After WR 20 - 20 - ns (9) tWW WR Pulse Width 100 - 100 - ns (10) tDW Data Valid to WR High 100 - 100 - ns (11) tWD Data Valid After WR High 30 - 30 - ns OTHER TIMING (12) tWB WR = to Output - 350 - 350 ns (13) tIR Peripheral Data Before RD - - ns (14) tHR Peripheral Data After RD - - ns (15) tAK ACK Pulse Width 200 - 200 - ns (16) tST STB Pulse Width 100 - 100 - ns (17) tPS Peripheral Data Before STB High 20 - 20 - ns (18) tPH Peripheral Data After STB High 50 - 50 - ns (19) tAD ACK = to Output - 175 - 175 ns (20) tKD ACK = to Output Float 20 250 20 250 ns (21) tWOB WR = to OBF = - 150 - 150 ns (22) tAOB ACK = to OBF = - 150 - 150 ns (23) tSIB STB = to IBF = - 150 - 150 ns (24) tRIB RD = to IBF = - 150 - 150 ns (25) tRIT RD = to INTR = - 200 - 200 ns (26) tSIT STB = to INTR = - 150 - 150 ns (27) tAIT ACK = to INTR = - 150 - 150 ns (28) tWIT WR = to INTR = - 200 - 200 ns (29) tRES Reset Pulse Width 500 - 500 - ns 1, (Note) NOTE: Period of initial Reset pulse after power-on must be at least 50µsec Subsequent Reset pulses may be 500ns minimum 18 82C55A Timing Waveforms tRR (3) RD tIR (13) tHR (14) INPUT tAR (1) tRA (2) CS, A1, A0 D7-D0 tRD (4) tDF (5) FIGURE 25 MODE (BASIC INPUT) tWW (9) WR tDW (10) tWD (11) D7-D0 tAW (7) tWA (8) CS, A1, A0 OUTPUT tWS (12) FIGURE 26 MODE (BASIC OUTPUT) tST (16) STB IBF tSIB (23) tSIT (26) tRIB (24) tRIT (25) INTR RD tPH (18) INPUT FROM PERIPHERAL tPS (17) FIGURE 27 MODE (STROBED INPUT) 19 82C55A Timing Waveforms (Continued) tWOB (21) WR tAOB (22) OBF tWIT (28) INTR ACK tAK (15) tAIT (27) OUTPUT tWB (12) FIGURE 28 MODE (STROBED OUTPUT) DATA FROM CPU TO 82C55A WR (NOTE) tAOB (22) OBF tWOB (21) INTR tAK (15) ACK tST (16) STB (NOTE) IBF tSIB (23) tAD (19) tPS (17) tKD (20) PERIPHERAL BUS tRIB (24) tPH (18) RD DATA FROM PERIPHERAL TO 82C55A DATA FROM 82C55A TO PERIPHERAL DATA FROM 82C55A TO CPU FIGURE 29 MODE (BI-DIRECTIONAL) NOTE: Any sequence where WR occurs before ACK and STB occurs before RD is permissible (INTR = IBF • MASK • STB • RD • OBF • MASK • ACK • WR) 20 82C55A Timing Waveforms (Continued) A0-A1, CS A0-A1, CS tWA (8) tAW (7) tRA (2) tAR (1) tRR (3) DATA BUS RD tDW (10) tWD (11) (4) tRD tDF (5) DATA BUS WR VALID HIGH IMPEDANCE tWW (9) FIGURE 30 WRITE TIMING FIGURE 31 READ TIMING AC Test Circuit AC Testing Input, Output Waveforms V1 INPUT OUTPUT VIH + 0.4V VOH 1.5V R1 OUTPUT FROM DEVICE UNDER TEST TEST POINT R2 1.5V VOL VIL - 0.4V AC Testing: All AC Parameters tested as per test circuits Input RISE and FALL times are driven at 1ns/V C1 (SEE NOTE) TEST CONDITION DEFINITION TABLE NOTE: Includes STRAY and JIG Capacitance TEST CONDITION V1 R1 R2 C1 1.7V 523Ω Open 150pF VCC 2kΩ 1.7kΩ 50pF 1.5V 750Ω Open 50pF Burn-In Circuits 37 F14 F4 36 F2 F3 35 F5 GND F0 34 33 GND 44 43 42 41 40 39 38 F5 F0 37 F15 F1 F10 10 36 11 35 F11 F12 F6 12 34 F13 F7 13 33 F14 F8 14 32 F15 F15 F11 F2 F14 F13 F9 F13 38 F12 F6 F12 F8 F7 F11 39 F8 40 F9 F7 F4 F6 F11 MR82C55A CLCC F3 MD82C55A CERDIP F1 32 F10 10 31 F13 F6 11 30 F14 F7 12 29 F15 F8 13 28 F11 F9 15 31 F11 F9 14 27 F12 F10 16 30 F12 F10 15 26 F6 17 29 F6 16 25 F13 F7 17 24 F14 F8 18 23 F15 F9 19 22 F11 F10 20 21 F12 NOTES: VCC = 5.5V ± 0.5V VIH = 4.5V ± 10% VIL = -0.2V to 0.4V GND = 0V 18 19 20 21 22 23 24 25 26 27 28 C1 NOTES: C1 = 0.01µF minimum All resistors are 47kΩ ± 5% f0 = 100kHz ± 10% f1 = f0 ÷ 2; f2 = f1 ÷ 2; ; f15 = f14 ÷ 21 VCC F13 F14 F15 F11 F12 F10 F7 C1 F9 VCC F8 F12 82C55A Die Characteristics DIE DIMENSIONS: 95 x 100 x 19 ±1mils GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ METALLIZATION: Type: Silicon - Aluminum Thickness: 11kÅ ±1kÅ WORST CASE CURRENT DENSITY: 0.78 x 105 A/cm2 Metallization Mask Layout 82C55A RD PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 WR RESET CS GND D0 A1 D1 A0 D2 PC7 D3 PC6 D4 PC5 D5 PC4 D6 PC0 D7 PC1 VCC PC2 PD3 PB0 PB1 PB2 22 PB3 PB4 PB5 PB6 PB7 82C55A Dual-In-Line Plastic Packages (PDIP) E40.6 (JEDEC MS-011-AC ISSUE B) N 40 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA INCHES N/2 SYMBOL -B- -C- A2 SEATING PLANE e B1 D1 B 0.010 (0.25) M A1 eC C A B S MAX NOTES - 0.250 - 6.35 0.015 - 0.39 - A2 0.125 0.195 3.18 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.030 0.070 0.77 1.77 eA C 0.008 0.015 0.204 0.381 - D 1.980 2.095 D1 0.005 - A L D1 MIN A E BASE PLANE MAX A1 -AD MILLIMETERS MIN C eB NOTES: Controlling Dimensions: INCH In case of conflict between English and Metric dimensions, the inch dimensions control Dimensioning and tolerancing per ANSI Y14.5M-1982 Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No 95 Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3 D, D1, and E1 dimensions not include mold flash or protrusions Mold flash or protrusions shall not exceed 0.010 inch (0.25mm) E and eA are measured with the leads constrained to be perpendicular to datum -C- eB and eC are measured at the lead tips with the leads unconstrained eC must be zero or greater B1 maximum dimensions not include dambar protrusions Dambar protrusions shall not exceed 0.010 inch (0.25mm) N is the maximum number of terminal positions 10 Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm) 50.3 53.2 - 0.13 E 0.600 0.625 15.24 15.87 E1 0.485 0.580 12.32 14.73 e 0.100 BSC 2.54 BSC - eA 0.600 BSC 15.24 BSC eB - 0.700 - 17.78 L 0.115 0.200 2.93 5.08 N 40 40 Rev 12/93 23 82C55A Plastic Leaded Chip Carrier Packages (PLCC) 0.042 (1.07) 0.048 (1.22) PIN (1) IDENTIFIER N44.65 (JEDEC MS-018AC ISSUE A) 0.042 (1.07) 0.056 (1.42) 0.004 (0.10) C 0.025 (0.64) R 0.045 (1.14) 0.050 (1.27) TP C L D2/E2 C L E1 E D2/E2 VIEW “A” A1 A D1 D 0.020 (0.51) MAX PLCS 0.020 (0.51) MIN 0.045 (1.14) MIN INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.165 0.180 4.20 4.57 - A1 0.090 0.120 2.29 3.04 - D 0.685 0.695 17.40 17.65 - D1 0.650 0.656 16.51 16.66 D2 0.291 0.319 7.40 8.10 4, E 0.685 0.695 17.40 17.65 - E1 0.650 0.656 16.51 16.66 E2 0.291 0.319 7.40 8.10 4, N 44 44 Rev 11/97 SEATING -C- PLANE 0.026 (0.66) 0.032 (0.81) 44 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE 0.013 (0.33) 0.021 (0.53) 0.025 (0.64) MIN VIEW “A” TYP NOTES: Controlling dimension: INCH Converted millimeter dimensions are not necessarily exact Dimensions and tolerancing per ANSI Y14.5M-1982 Dimensions D1 and E1 not include mold protrusions Allowable mold protrusion is 0.010 inch (0.25mm) per side Dimensions D1 and E1 include mold mismatch and are measured at the extreme material condition at the body parting line To be measured at seating plane -C- contact point Centerline to be determined where center leads exit plastic body “N” is the number of terminal positions 24 82C55A Ceramic Dual-In-Line Frit Seal Packages (CERDIP) F40.6 MIL-STD-1835 GDIP1-T40 (D-5, CONFIGURATION A) LEAD FINISH c1 40 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL SYMBOL E M -Bbbb S C A-B S -C- S1 - 0.225 - 5.72 - 0.026 0.36 0.66 b1 0.014 0.023 0.36 0.58 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 c 0.008 0.018 0.20 0.46 c1 0.008 0.015 0.20 0.38 D - 2.096 - 53.24 E 0.510 0.620 15.75 eA b2 b ccc M C A - B S e eA/2 c e aaa M C A - B S D S D S NOTES 0.014 α A A MAX b A L MIN A Q SEATING PLANE MAX M (b) D BASE PLANE MILLIMETERS MIN b1 SECTION A-A D S INCHES (c) NOTES: Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown The manufacturer’s identification shall not be used as a pin one identification mark The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied Dimensions b1 and c1 apply to lead base metal only Dimension M applies to lead plating and finish thickness Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle For this configuration dimension b3 replaces dimension b2 This dimension allows for off-center lid, meniscus, and glass overrun Dimension Q shall be measured from the seating plane to the base plane Measure dimension S1 at all four corners N is the maximum number of terminal positions Dimensioning and tolerancing per ANSI Y14.5M - 1982 10 Controlling dimension: INCH 12.95 0.100 BSC 2.54 BSC - eA 0.600 BSC 15.24 BSC - eA/2 0.300 BSC 7.62 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.070 0.38 1.78 S1 0.005 - 0.13 - α 90o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2, N 40 40 Rev 4/94 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification Intersil products are sold by description only Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice Accordingly, the reader is cautioned to verify that data sheets are current before placing orders Information furnished by Intersil is believed to be accurate and reliable However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P O Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 25 ASIA Intersil (Taiwan) Ltd Taiwan Limited 7F-6, No 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2716 9310 FAX: (886) 2715 3029 82C55A Ceramic Leadless Chip Carrier Packages (CLCC) J44.A MIL-STD-1835 CQCC1-N44 (C-5) 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B h x 45o 0.010 S E F S A A1 PLANE MAX MIN MAX NOTES A 0.064 0.120 1.63 3.05 6, A1 0.054 0.088 1.37 2.24 - B 0.033 0.039 0.84 0.99 B1 0.022 0.028 0.56 0.71 2, B1 e L -H- L3 - 0.022 0.15 0.56 D 0.640 0.662 16.26 16.81 - D1 0.500 BSC 12.70 BSC - D2 0.250 BSC 6.35 BSC - D3 - 0.662 E 0.640 0.662 16.26 16.81 16.81 - E1 0.500 BSC 12.70 BSC - E2 0.250 BSC 6.35 BSC - E3 - 0.662 0.050 BSC 0.015 - - 16.81 1.27 BSC 0.38 - - h 0.040 REF 1.02 REF j 0.020 REF 0.51 REF L 0.045 0.055 1.14 1.40 - L1 0.045 0.055 1.14 1.40 - L2 0.075 0.095 1.90 2.41 - L3 0.003 0.015 0.08 0.38 - ND 11 11 NE 11 11 N 44 44 -F- Rev 5/18/94 NOTES: B3 E1 E2 1.83 REF 0.006 e1 0.007 M E F S H S 0.072 REF B3 e PLANE -E- MIN B2 E MILLIMETERS SYMBOL Metallized castellations shall be connected to plane terminals and extend toward plane across at least two layers of ceramic or completely across all of the ceramic layers to make electrical connection with the optional plane terminals L2 B2 Unless otherwise specified, a minimum clearance of 0.015 inch (0.38mm) shall be maintained between all metallized features (e.g., lid, castellations, terminals, thermal pads, etc.) L1 Symbol “N” is the maximum number of terminals Symbols “ND” and “NE” are the number of terminals along the sides of length “D” and “E”, respectively D2 e1 D1 The required plane terminals and optional plane terminals (if used) shall be electrically connected The corner shape (square, notch, radius, etc.) may vary at the manufacturer’s option, from that shown on the drawing Chip carriers shall be constructed of a minimum of two ceramic layers Dimension “A” controls the overall package thickness The maximum “A” dimension is package height before being solder dipped Dimensioning and tolerancing per ANSI Y14.5M-1982 Controlling dimension: INCH 26 ... giảng Kỹ thuật Vi xử lý Ngành Điện tử -Vi? ??n thông Đại học Bách khoa Đà Nẵng Hồ Vi? ??t Vi? ??t, Khoa ĐTVT Tài liệu tham khảo [1] Kỹ thuật vi xử lý, Văn Thế Minh, NXB Giáo dục, 1997 [2] Kỹ thuật vi xử lý. .. Thế Minh, NXB Giáo dục, 1997 [2] Kỹ thuật vi xử lý Lập trình Assembly cho hệ vi xử lý, Đỗ Xuân Tiến, NXB Khoa học & kỹ thuật, 2001 ... Integration): Vi mạch tích hợp cỡ nhỏ MSI (Medium Scale Integration): Vi mạch tích hợp cỡ trung LSI (Large Scale Integration): Vi mạch tích hợp cỡ lớn VLSI (Very Large Scale Integration) :Vi mạch tích