Applied materials science applications of engineering materials in structural, electronics, thermal, and other industries by deborah d l chung

Materials constitute the foundation of technology. They include metals, polymers, ceramics, semiconductors, and composite materials. The fundamental concepts of materials science are crystal structures, imperfections, phase diagrams, materials processing, and materials properties. They are taught in most universities to mate rials, mechanical, aerospace, electrical, chemical, and civil engineering undergrad uate students. However, students need to know not only the fundamental concepts, but also how materials are applied in the real world. Since a large proportion of undergraduate students in engineering go on to become engineers in various indus tries, it is important for them to learn about applied materials science

www.EngineeringEbooksPdf.com Applied Materials Science Applications of Engineering Materials in Structural, Electronics, Thermal, and Other Industries Deborah D.L Chung CRC Press Boca Raton London New York Washington, D.C www.EngineeringEbooksPdf.com Library of Congress Cataloging-in-Publication Data McLachlan, Alan Molecular biology of the hepatitis B virus / Alan McLachlan p cm Includes bibliographical references and index ISBN 0-8493-1073-3 Hepatitis B virus Biology—molecular I McLachlan, Alan II Title [DNLM: Hepatitis B virus QW 710 G289h] QR749.H64G78 2000 616′.0149—dc20 ??-????? CIP Catalog record is available from the Library of Congress This book contains information obtained from authentic and highly regarded sources Reprinted material is quoted with permission, and sources are indicated A wide variety of references are listed Reasonable efforts have been made to publish reliable data and information, but the author and the publisher cannot assume responsibility for the validity of all materials or for the consequences of their use Neither this book nor any part may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, microfilming, and recording, or by any information storage or retrieval system, without prior permission in writing from the publisher All rights reserved Authorization to photocopy items for internal or personal use, or the personal or internal use of specific clients, may be granted by CRC Press LLC, provided that $.50 per page photocopied is paid directly to Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923 USA The fee code for users of the Transactional Reporting Service is ISBN 0-8493-1073-3/01/$0.00+$.50 The fee is subject to change without notice For organizations that have been granted a photocopy license by the CCC, a separate system of payment has been arranged The consent of CRC Press LLC does not extend to copying for general distribution, for promotion, for creating new works, or for resale Specific permission must be obtained in writing from CRC Press LLC for such copying Direct all inquiries to CRC Press LLC, 2000 N.W Corporate Blvd., Boca Raton, Florida 33431 Trademark Notice: Product or corporate names may be trademarks or registered trademarks, and are used only for identification and explanation, without intent to infringe Visit the CRC Press Web site at www.crcpress.com © 2001 by Chapman & Hall/CRC CRC Press LLC St Lucie Press Lewis Publishers Auerbach is an imprint of CRC Press LLC No claim to original U.S Government works International Standard Book Number 0-8493-1073-3 Library of Congress Card Number ??-????? Printed in the United States of America Printed on acid-free paper ©2001 CRC Press LLC www.EngineeringEbooksPdf.com Dedication To the memory of my nanny, Ms Kwai-Sheung Ng (1893–1986) ©2001 CRC Press LLC www.EngineeringEbooksPdf.com The Author Deborah D L Chung is Niagara Mohawk Power Corporation Endowed Chair Professor, Director of the Composite Materials Research Laboratory, and Professor of Mechanical and Aerospace Engineering at the State University of New York (SUNY) in Buffalo She holds a Ph.D in materials science and an S.M degree from the Massachusetts Institute of Technology (M.I.T.), as well as an M.S in engineering science and a B.S in engineering and applied science from the California Institute of Technology Dr Chung is a Fellow of ASM International and of the American Carbon Society, and is past recipient of the Teacher of the Year Award from Tau Beta Pi; the Teetor Educational Award from the Society of Automotive Engineers; the Hardy Gold Medal from the American Institute of Mining, Metallurgical, and Petroleum Engineers; and the Ladd Award from Carnegie Mellon University Dr Chung has written or cowritten 322 articles published in journals (88 on carbon, 107 on cement-matrix composites, 31 on metal-matrix composites, 62 on polymer-matrix composites, 12 on metal-semiconductor interfaces, on silicon, and 17 on other topics) She is the author of three books, including Carbon Fiber Composites (Butterworth, 1994) and Composite Materials for Electronic Functions (Trans Tech, 2000), and has edited two books including Materials for Electronic Packaging (Butterworth, 1995) Dr Chung is the holder of 16 patents and has given 125 invited lectures Her research has covered many materials, including lightweight structural, construction, smart, adsorption, battery electrode, solar cell, and electronic packaging materials ©2001 CRC Press LLC www.EngineeringEbooksPdf.com Preface Materials constitute the foundation of technology They include metals, polymers, ceramics, semiconductors, and composite materials The fundamental concepts of materials science are crystal structures, imperfections, phase diagrams, materials processing, and materials properties They are taught in most universities to materials, mechanical, aerospace, electrical, chemical, and civil engineering undergraduate students However, students need to know not only the fundamental concepts, but also how materials are applied in the real world Since a large proportion of undergraduate students in engineering go on to become engineers in various industries, it is important for them to learn about applied materials science Due to the multifunctionality of many materials and the breadth of industrial needs, this book covers structural, electronic, thermal, electrochemical, and other applications of materials in a cross-disciplinary fashion The materials include metals, ceramics, polymers, cement, carbon, and composites The topics are scientifically rich and technologically relevant Each is covered in a tutorial and up-to-date manner with numerous references cited The book is suitable for use as a textbook for undergraduate and graduate courses, or as a reference book The reader should have background in fundamental materials science (at least one course), although some fundamental concepts pertinent to the topics in the chapters are covered in the appendices ©2001 CRC Press LLC www.EngineeringEbooksPdf.com Contents Chapter Introduction to Materials Applications 1.1 Classes of Materials 1.2 Structural Applications 1.3 Electronic Applications 1.4 Thermal Applications 1.5 Electrochemical Applications 1.6 Environmental Applications 1.7 Biomedical Applications Bibliography Chapter Materials for Thermal Conduction 2.1 2.2 Introduction Materials of High Thermal Conductivity 2.2.1 Metals, Diamond, and Ceramics 2.2.2 Metal-Matrix Composites 2.2.2.1 Aluminum-Matrix Composites 2.2.2.2 Copper-Matrix Composites 2.2.2.3 Beryllium-Matrix Composites 2.2.3 Carbon-Matrix Composites 2.2.4 Carbon and Graphite 2.2.5 Ceramic-Matrix Composites 2.3 Thermal Interface Materials 2.4 Conclusion References Chapter Polymer-Matrix Composites for Microelectronics 3.1 3.2 3.3 Introduction Applications in Microelectronics Polymer-Matrix Composites 3.3.1 Polymer-Matrix Composites with Continuous Fillers 3.3.2 Polymer-Matrix Composites with Discontinuous Fillers 3.4 Summary References ©2001 CRC Press LLC www.EngineeringEbooksPdf.com Chapter Materials for Electromagnetic Interference Shielding 4.1 Introduction 4.2 Mechanisms of Shielding 4.3 Composite Materials for Shielding 4.4 Emerging Materials for Shielding 4.5 Conclusion References Chapter Cement-Based Electronics 5.1 5.2 5.3 Introduction Background on Cement-Matrix Composites Cement-Based Electrical Circuit Elements 5.3.1 Conductor 5.3.2 Diode 5.4 Cement-Based Sensors 5.4.1 Strain Sensor 5.4.2 Damage Sensor 5.4.3 Thermistor 5.5 Cement-Based Thermoelectric Device 5.6 Conclusion References Chapter Self-Sensing of Carbon Fiber Polymer-Matrix Structural Composites 6.1 6.2 6.3 6.4 6.5 6.6 6.7 Introduction Background Sensing Strain Sensing Damage Sensing Temperature Sensing Bond Degradation Sensing Structural Transitions 6.7.1 DSC Analysis 6.7.2 DC Electrical Resistance Analysis 6.8 Sensing Composite Fabrication Process 6.9 Conclusion References Chapter 7.1 7.2 7.3 7.4 Structural Health Monitoring by Electrical Resistance Measurement Introduction Carbon Fiber Polymer-Matrix Structural Composites Cement-Matrix Composites Joints 7.4.1 Joints Involving Composite and Concrete by Adhesion ©2001 CRC Press LLC www.EngineeringEbooksPdf.com 7.4.2 Joints 7.4.3 Joints 7.4.4 Joints 7.4.5 Joints 7.5 Conclusion References Chapter Involving Involving Involving Involving Composites by Adhesion Steels by Fastening Concrete by Pressure Application Composites by Fastening Modification of the Surface of Carbon Fibers for Use as a Reinforcement in Composite Materials 8.1 8.2 8.3 Introduction to Surface Modification Introduction to Carbon Fiber Composites Surface Modification of Carbon Fibers for Polymer-Matrix Composites 8.4 Surface Modification of Carbon Fibers for Metal-Matrix Composites References Chapter Corrosion Control of Steel-Reinforced Concrete 9.1 Introduction 9.2 Steel Surface Treatment 9.3 Admixtures In Concrete 9.4 Surface Coating on Concrete 9.5 Cathodic Protection 9.6 Steel Replacement 9.7 Conclusion Acknowledgment References Chapter 10 Applications of Submicron-Diameter Carbon Filaments 10.1 10.2 10.3 Introduction Structural Applications Electromagnetic Interference Shielding, Electromagnetic Reflection, and Surface Electrical Conduction 10.4 DC Electrical Conduction 10.5 Field Emission 10.6 Electrochemical Application 10.7 Thermal Conduction 10.8 Strain Sensors 10.9 Porous Carbons 10.10 Catalyst Support 10.11 Conclusion Acknowledgment References ©2001 CRC Press LLC www.EngineeringEbooksPdf.com Chapter 11 Improving Cement-Based Materials by Using Silica Fume 11.1 Introduction 11.2 Workability 11.3 Mechanical Properties 11.4 Vibration Damping Capacity 11.5 Sound Absorption 11.6 Freeze-Thaw Durability 11.7 Abrasion Resistance 11.8 Shrinkage 11.9 Air Void Content and Density 11.10 Permeability 11.11 Steel Rebar Corrosion Resistance 11.12 Alkali-Silica Reactivity Reduction 11.13 Chemical Attack Resistance 11.14 Bond Strength to Steel Rebar 11.15 Creep Rate 11.16 Coefficient of Thermal Expansion 11.17 Specific Heat 11.18 Thermal Conductivity 11.19 Fiber Dispersion 11.20 Conclusion References Appendix A Electrical Behavior of Various Types of Materials Appendix B Temperature Dependence of Electrical Resistivity Appendix C Electrical Measurement Appendix D Dielectric Behavior Appendix E Electromagnetic Measurement Appendix F Thermoelectric Behavior Appendix G Nondestructive Evaluation Appendix H Electrochemical Behavior Appendix I The pn Junction Appendix J Carbon Fibers ©2001 CRC Press LLC www.EngineeringEbooksPdf.com .. .Applied Materials Science Applications of Engineering Materials in Structural, Electronics, Thermal, and Other Industries Deborah D. L Chung CRC Press Boca Raton London New York Washington, D. C... Technology (M.I.T.), as well as an M.S in engineering science and a B.S in engineering and applied science from the California Institute of Technology Dr Chung is a Fellow of ASM International and. .. www.EngineeringEbooksPdf.com BIBLIOGRAPHY Askeland, Donald R., The Science and Engineeing of Materials, 3rd Ed., PWS Pub Co., Boston (1994) Callister, William D. , Jr., Materials Science and Engineering: