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The Construction Status of the ATLAS Silicon Microstrip Tracker

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The Construction Status of the ATLAS Silicon Microstrip Tracker D Ferrère on behalf of the SCT collaboration DPNC, University of Geneva  General Description  Silicon Detectors  Electronics  Electrical Tests  Module Assembly  Summary & Status Didier Ferrère, Geneva Univ Atlas at LHC LHC will provide protons and ions collisions Atlas A designed luminosity of 1034 cm-2s-1 p-p collision with 14 TeV in the center of mass Didier Ferrère, Geneva Univ The Atlas Detector Didier Ferrère, Geneva Univ Physics Motivations •Higgs in SM and in MSSM •Supersymmetric Particles •B physics (CP violation, ) •Exotic physics Requires a good tracking performance: Secondary vertices Impact parameters resolution Track isolation Measurement of high momentum particles Simulated Event in the Inner Detector Didier Ferrère, Geneva Univ SCT Environment 23 overlapping interactions every bunch crossing (at the full Luminosity) A bunch-bunch crossing every 25ns (40MHz) Maximum equivalent MeV neutron fluence after 10 years is ~ 2.1014 n/cm2 Operating temperature on silicon detectors is -7oC to contain the reverse annealing and the leakage current Maintenance will likely require yearly warm-up of days at 20oC and weeks at 17oC Material < 0.4 X0 at the outer SCT envelope Operation in a Tesla solenoid field Didier Ferrère, Geneva Univ SCT in the Inner Detector SCT: •4 Barrels + 2x9 wheels •4 different module types in the wheels • η < 2.5 Didier Ferrère, Geneva Univ The SCT Semiconductor Tracker Barrel diameters: B3: 568 mm B4: 710 mm 4088 Modules B5: 854 mm ~ 61 m2 of silicon B6: 996 mm 15,392 silicon wafers ~ 6.3 million of readout channels 5.6 m 1.04 m wheels 1.53 m barrels wheels Didier Ferrère, Geneva Univ The SCT module types 2112 Barrel modules 936 Outer Forward Modules 640 Middle Forward Modules (incl 80 Short Middle) 400 Inner Forward Modules Barrel Didier Ferrère, Geneva Univ Module Pictures A Barrel Module • daisy chained detectors / side • The Kapton hybrid is bridged over the detectors • The cooling pipe is on the connector side An Outer Forward Module •2 daisy chained detectors / side • The Kapton hybrid is at the far end • The cooling area is common with the mounting blocks Didier Ferrère, Geneva Univ Barrel detector type Forward detector types: Silicon Detector Pictures Single sided p-in-n detectors W12: Inner Module 768 strips Size ~ 6x6 cm2 285 µm thick W21 & W22: Middle Module W31 & W32: Outer Module Barrel Pitch : 80 àm Forward Pitch: W31 and W32: 161.5 àrad W12, W21 & W22: 207 àrad Scratch pads for identification – Corresponds to DB serial number Didier Ferrère, Geneva Univ 10 Multiple Modules in the System Test  Determine performance of individual modules  Measure noise and “inter-module” effects  Optimize grounding and shielding in realistic setup Didier Ferrère, Geneva Univ 25 Noise Performance in the System Test Tests on multi-modules barrel setup Didier Ferrère, Geneva Univ 26 Noise Comparison System Test versus Single Module Test ENC System Test ENC Individual Module ENC Noise Occupancy Didier Ferrère, Geneva Univ 27 Barrel alignment system Module Assembly Aligned forward detector pairs onto transfer plates Parallel module production will take place Barrel: KEK, RAL, LBL, Oslo – Starting at the end of this year Forward: Freiburg, Geneva, Melbourne, Nikhef, MPI, UK-North, Valencia Didier Ferrère, Geneva Univ 28 Module Mechanical Tolerances SCT Philosophy: Build modules to a sufficiently high tolerance that alignment corrections “within the module” are not needed for track reconstruction Physics requirement: Alignment accuracy rms (in micron) Direction (cyl Coord.) Barrel Forward R 100 50 φ 12 12 z 50 200 Internal module build tolerances: Alignment tolerance (in micron) Barrel Forward XY wafer to wafer plane in plane 4 XY back to front plane 8 XY relative to mounting holes 30 20 Z surface of silicon detectors 40 100 Didier Ferrère, Geneva Univ 29 Engineering Barrel sector close-up view of brackets, pipes, modules… Forward disc sector Middle cooling circuits, cooling blocks and low mass tapes Barrel support structure is under construction Forward support structure is ready for FDR Didier Ferrère, Geneva Univ 30 Summary and Status  Detectors • The series production started beginning of 2001 and is well on the way • ~ 36% of the detectors are delivered and the quality is very good  Chips • ABCD3T passed production readiness review and first lot of production wafers are expected soon  Modules • Barrel modules passed FDR and will start production at the end of the year • Forward modules require more round of hybrid production before going to FDR  Engineering, Off-detector Components, power distribution • A series of FDRs started in spring • First parts are/will be soon order for production Didier Ferrère, Geneva Univ 31 Appendix - Typical Power Consumption Module current and power Before Irradiation After Irradiation Idd (mA) 550 750 Vdd (V) 4.0 Icc (mA) 950 560 Vcc (V) 3.5 3.5 Power (W) 5.2 ICC ↓ after irradiation due to the optimization of the FE setting: before irr: Ipre = 220 àA and Ishap = 30 àA after irr: Ipre = 150 àA and Ishap = 24 µA Didier Ferrère, Geneva Univ 32 Appendix – Prototype Components of the Forward Modules Spine Kapton Hybrid Didier Ferrère, Geneva Univ 33 Appendix – Optical Links Opto-packages on the dog-leg (Barrel) Forward Opto-plug-in: PIN receiver (Clock & Control BPM) & VCSEL lasers for data links Didier Ferrère, Geneva Univ 34 Appendix – Forward Electrical Performances From G.Moorhead Didier Ferrère, Geneva Univ 35 Appendix – Forward Electrical Performances From G.Moorhead Didier Ferrère, Geneva Univ 36 Appendix – Thermal Simulation  Requirement: Prevent Thermal Runaway  Facts of life:  Leakage current (4 detectors of the module) after 10 years in the LHC reaches ~2mA @ 500V @ -10 ° C (spec:

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