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DYNAMIC ELECTRO-THERMAL MODEL OF POWER ELECTRONIC BUILDING BLOCK IN MICRO GRID: MODELING, ANALYSIS AND SIMULATION HUANHUAN WANG NATIONAL UNIVERSITY OF SINGAPORE 2012 DYNAMIC ELECTRO-THERMAL MODEL OF POWER ELECTRONIC BUILDING BLOCK IN MICRO GRID: MODELING, ANALYSIS AND SIMULATION HUANHUAN WANG (M.Eng(Hons.), B.Eng, Xi’an Jiao Tong Univ., Xi’an, China) A THESIS SUBMITTED FOR THE DEGREE OF DOCTOR OF PHILOSOPHY DEPARTMENT OF ELECTRICAL & COMPUTER ENGINEERING NATIONAL UNIVERSITY OF SINGAPORE 2012 i Acknowledgment I would like to express my sincere gratitude to my supervisor, Dr. Ashwin M. Khambadkone, for his guidance and inspiration during the progress of my research. He influenced me with something beyond the academic knowledge. The most important and valuable things I learned from him are the life-long learning spirit for the excellence, rigorous attitude towards research, and the persistent positive attitude. These spirits will benefit me for my future career as well. I sincerely thank Dr. Birgersson Karl Erik for his generous guidance on the software application in multi-disciplinary research and advice on my paper writing. I also thank Dr. Dipti Srinivasan, Dr. Sanjib K. Panda, and Dr. Chang Che-Sau, for serving as my Ph.D thesis committee members. Dr. Dipti was also one of my Ph.D Qualification Exam committee members. Her positive feedback and insightful comments gave me great confidence to continue my research. ii I would like to thank Department of Electrical & Computer Engineering for providing research scholarship and all kinds of supports during the past years, and thank Modular Distributed Energy Resource Network (MODERN) project funded under A*STAR SERC IEDS programme, for providing me with the research facilities. My warm thanks are expressed to Electrical Machines and Drives (EMD) Lab officers, Mr. Woo, and Mr. Chandra, for their readiness to help on any matter. Their ever smiling faces always cheer me up. My special thanks go to Dr. Zhou Haihua for her help and encouragement. Besides, I want to thank all my fellow research scholars in EMD lab for their accompany and supports, in one way or another. Last but not least, I would like to thank those closest to me, my parents and elder brother. I am greatly indebted to them for making me capable to pursue this task. Words cannot express my deepest gratitude for their understanding, encouragement, and confidence in me. I would like to dedicate this thesis to them. i Contents Acknowledgement i Summary v List of Tables List of Figures viii x List of Acronyms xiv List of Symbols xvi Introduction 1.1 Research Background and Motivation . . . . . . . . . . . . . . . . 1.2 Problem Formulation . . . . . . . . . . . . . . . . . . . . . . . . . ii 1.3 Literature Review . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 1.3.1 Power Losses Calculations . . . . . . . . . . . . . . . . . . 11 1.3.2 Thermal Analysis . . . . . . . . . . . . . . . . . . . . . . . 14 1.4 Major Contributions . . . . . . . . . . . . . . . . . . . . . . . . . 23 1.5 Organization of the Thesis . . . . . . . . . . . . . . . . . . . . . . 26 Design of PEBB-based Power Electronics System 28 2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 2.2 Investigated Converter Topologies in PEBB Design . . . . . . . . 31 2.3 Proposed Comprehensive Power Loss Calculation Solution . . . . 35 2.3.1 Analytical Power Losses Distribution for Semiconductor Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Transformer Power Losses Evaluations . . . . . . . . . . . 48 2.4 Efficiency Comparisons and Result Discussions . . . . . . . . . . . 54 2.5 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 2.3.2 Dynamic Electro-Thermal Modeling for PEBB-based Power Stage 58 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 iii 3.2 Methodology of the Proposed Dynamic Electro-Thermal Model . 63 3.3 Implementation of the Proposed Electro-Thermal Model . . . . . 66 3.3.1 Improved Power Loss Distribution Modeling . . . . . . . . 66 3.3.2 Comprehensive Thermal Modeling . . . . . . . . . . . . . . 72 Results Analysis and Conclusions . . . . . . . . . . . . . . . . . . 85 3.4.1 Temperature Prediction under Normal Operation . . . . . 85 3.4.2 Temperature Prediction in Short Circuit Conditions . . . . 87 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 3.4 3.5 Application of PEBBs in Hybrid Micro Grid 93 4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 4.2 Roles of Dynamic Electro-Thermal Modeling in Parallel Operation of PEBBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Applications of Dynamic Electro-Thermal Model in PEBBs Configuration System . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 4.3.1 Case Study of PEBBs Parallel Operation . . . . . . . . . . 98 4.3.2 Analysis on the Improvement of the Over Current Carrying Ability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 4.3 4.4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 iv Conclusion & Recommendation for Future Work 116 5.1 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 5.2 Recommendations for Future Works . . . . . . . . . . . . . . . . . 119 Bibliography 123 v Summary To interconnect the micro grid (MG) with electric power system (EPS), power electronic converters play vital roles. As a set of parallel connected modular converters, Power Electronics Building Block (PEBB), owns advantages in power capability, efficiency for high current application and merits such as reliability, redundancy for low cost maintenance and upgrade. Thermal management is a critical problem in the PEBB design procedure, where the power losses distribution and heat generated in the modules dramatically increase with the increasing of the switching frequency. The aim of the thesis is to build a dynamic electro-thermal model, including temperature dependent power loss calculation and a comprehensive thermal model. The focus is to develop the theoretical framework and supporting tool for modeling, analysis and simulation (MAS) of the PEBB dynamic electro-thermal model. This model is proved to possess the accuracy of Finite Element Method (FEM) and also makes use of the convenience of resistor capacitor (RC) network vi considering the easy coupling with electric circuit. Power losses modeling of semiconductor devices has firstly been analyzed. The accurate power losses model can help in evaluating the efficiency of different converter topologies and thus help to select the switching devices and suitable converter topology. Based on the above power losses modeling, a dynamic electro-thermal methodology has then been proposed and an iterative algorithm has also been proposed to implement the dynamic electro-thermal modeling in PEBB applications. To achieve requirements for the modeling, an improved power loss distribution with temperature dependent self-improvement ability and an effective RC thermal modeling have been respectively proposed to implement the modeling. The thermal model can provide junction temperature predictions not only in normal operation conditions, especially under high current condition, but also in different short circuit conditions. The associated thermal analysis procedure can also be used to estimate power cycle of the semiconductor devices and help to improve the life time of the devices. The proposed dynamic electro-thermal model is playing vital roles in the design and simulation of PEBB systems, requiring thermal control and efficiency improvement. The dynamic electro-thermal model developed in this thesis can be used in many applications, which is especially applied in an intelligently scheduled 123 Bibliography [1] Comsol Multiphysics 3.5a, “http://www.comsol.com, last accessed march 2009,” [2] H. Zhou, Ashwin M. K. and X. Kong, “A Passivity Based Control with Augmented Integration for an Interleaved Current Fed Full Bridge Converter as a Front End for Fuel Cell Source,” The 42th Annual Meeting of the IEEE Industry Applications Society, Sep. 2007. [3] Jacob P., Nicoletti G., Scacco P., et al., “Fast Power Cycling Test for IGBT Modules in Traction Application,” IEEE Power Electronics and Drive Systems, vol. 1, pp. 425–430, 1997. [4] X. Yu, H. Wang, and Ashwin M. K., “Control of Paralleled PEBBs to Facilitate the Efficient Operation of Microgrid,” IEEE International Symposium on Industrial Electronics, pp. 2217 – 2222, Jul. 2010. [5] Donald B., “Industrial Power System Handbook,” 1955. 124 [6] R. H. Lasseter and P. Piagi, “Microgrid: A Conceptual Solution,” The 35th Power Electronics Specialist Conference, vol. 48, pp. 871–881, March 2007. [7] X. Yu and Ashwin M. K., “Multi-functional Power Converter Building Block to Facilitate the Connection of Micro-grid,” Control and Modeling for Power Electronics, pp. 1–6, 2008. [8] X. Yu and Ashwin M. K., “Combined Active and Reactive Power Control of Power Converter Building Block to Facilitate the Connection of Microgrid to Electric Power System,” IEEE Energy Conversion Conference and Exposition, Sep. 2009. [9] T. Ericsen, A. Tucker, “Power Electronics Building Blocks and Potential Power Modulator Application,” Proc. 23rd Int. Power Modulator Symp., Rancho Mirage, CA, Jun. 1998. [10] T. Ericsen, N. Hingorani and Y. Schugart, “PEBB-Power Electronics Building Blocks, from Concept to Reality,” IEEE Industry Applications Society Annual Meeting, Oct. 2006. [11] T. Ericsen, “Power Electronics and Future Marine,” IEEE Trans.on Industurial Applications, vol. 42, no. 1, 2006. [12] W. Liu, J. Dirker, and J. D. V. Wyk, “Power Density Improvement in Inte- 125 grated Electromagnetic Passive Modules with Embedded Heat Extractors,” IEEE Trans. on Power Electron., vol. 23, pp. 3142–3150, Nov. 2008. [13] M. Ciappa and F. Carbognani, “Lifetime Prediction and Design of Reliability Tests for High Power Devices in Automotive Applications,” IEEE Trans. on Device Mater.Rel., vol. 3, pp. 191–196, Dec. 2003. [14] P. M. Fabis, D. Shun, and H. Windischmann, “Thermal Modeling of Diamond-based Power Electronics Package,” 15th IEEE Semi-Therm Symposium, 1999. [15] Mitsubishi Electric, “IGBT Application Notes,” pp. 56–72, Dec. 2007. [16] D. Krug, S. Bernet, and S. Fazel, “Comparison of 2.3kv Medium Voltage Multilevel Converters for Industrial Medium-Voltage Drives,” IEEE Trans. on Ind. Electron., vol. 54, pp. 2979–2992, Dec. 2007. [17] D. Krug, S. Bernet, and S. Dieckerhoff, “Comparison of State-of-the Art Voltage Source Converter Topologies for Medium Voltage Applications,” IEEE Industry Applications Society Annu. Meeting, vol. 1, pp. 168–175, Oct. 2003. [18] D. Ghizoni, R. Burgos, and G. Francis, “Design and Evaluation of a 33kw PEBB Module for Distributed Power Electronics Conversion Systems,” 126 IEEE Power Electronics Specialist Conference (PESC), vol. 16, pp. 530–536, Jun. 2005. [19] S. Fazeland, D. Krug, and D. Taleb , “Comparsion of Power Semiconductor Utilization, Losses and Harmonic Spectra of State-of-the Art 4.16kv Multilevel Voltage Source Converters,” Proc. 11th EPE, pp. 1–11, Sep. 2005. [20] F. Casanellas, “Loss in PWM Inverters using IGBTs,” IEEE Proc. Electr. Power APPL, vol. 144, pp. 235–239, Sep. 1994. [21] K. Sheng, S. Finney, and B. Williams, “A New Analytical IGBT Model with Improved Electrical Characteristics,” IEEE Trans. on Power Electronics, vol. 14, pp. 98–107, Jan. 1999. [22] Nedmohan, “Power Electronics Converters, Applications, and Design,” pp. 21,535. [23] A. Vassighi and M. Sachdev, “Thermal and Power Management of Integrated Circuits,” Nov. 2010. [24] A. Ammous, S. Ghedira, B. Allard, et al., “Choosing a Thermal Model for Electrothermal Simulation of Power Semiconductor Devices,” IEEE Trans. on Power Electronics, vol. 14(2), 1999. [25] J. Palacn, M. Salleras, J. Samitier, et al., “Dynamic Compact Thermal Mod- 127 els with Multiple Power Sources: Application to an Ultrathin Chip Stacking Technology,” IEEE Trans. on Advanced Packaging, vol. 28(4), pp. 1216– 1218, Nov. 2005. [26] A. Lakhsasi and Y. Hamri, “Transient Thermal Analysis of Fast Switching Devices by Partially Coupled FEM Method,” IEEE CCECE/CCGEI, pp. 1098–1103, May 2006. [27] A. R. Hefner and D. L. Blackburn, “Thermal Component Models for Electrothermal Network Simulation,” IEEE Trans. on Comp., Packag., pp. 413– 424, Sep. 1994. [28] J. T. Hsu and L. Vu-Quoc, “A Rational Formulation of Thermal Circuit Models for Electrothermal Simulation Part I: Finite Element Method,” IEEE Trans. on Circuits Syst. I, vol. 43, pp. 721–732, Sep. 1996. [29] Ansys, “Inc. (2005). Tech. Rep.: http//www.ansys.com,” [30] P. R. Strickland, “The Thermal Equivalent Circuit of a Transistor,” IBM Jouranl, Jan. 1959. [31] L. Wei, Kerkman, and R. J., “Junction Temperature Prediction of a Multiple-chip IGBT Module under DC Condition,” IEEE Industry Applications Conference, 41st IAS Annual Meeting. Conference Record, vol. 2, pp. 754–762, Oct. 2006. 128 [32] U. Drofenik and J. W. Kolar, “A Thermal Model of a Forced-Cooled Heat Sink for Transient Temperature Calculations Employing a Circuit Simulator,” Proc. of the 5th IEEE International Power Electronics Conferences(IPEC), Niigata, Japan, Apr.4-8 2005. [33] U. Drofenik and J. W. Kolar, “Thermal Analysis of a Multi-Chip Si/SiCPower Module for Realization of a Bridge Leg of a 10kW Vienan Rectifier,” Proc. of the 25th IEEE International Telecommunications Energy Conference, pp. 829–833, Oct.19-23 2003. [34] Y. C. Gerstenmaier, A. Castellazzi, and K. Gerhard , “Electrothermal Simulation of Multichip-Modules With Novel Transient Thermal Model and Time-Dependent Boundary Conditions,” IEEE Trans. on Power Electronics, vol. 21(1), pp. 45–55, Jan. 2006. [35] S. Stefan and R. W. De Doncker, “Physically Based Models of High Power Semiconductors Including Transient Thermal Behavior,” IEEE Trans. on Power Electronics, vol. 18(1), pp. 231–235, Jan. 2003. [36] A. R. Hefner, “A Dynamice ElectroThermal Model for the IGBT,” IEEE Trans. on Industry Applications, vol. 30, pp. 394–405, Mar. 1994. [37] H. Huang, Bryant A.T., and Mawby P.A., “Electro-thermal Modelling of 129 Three Phase Inverter,” Proceedings of IEEE Power Electronics and Applications, 2011. [38] Rajapakse, A.D., Gole, A.M., and Wilson, P.L., “Electromagnetic Transients Simulation Models for Accurate Representation of Switching Losses and Thermal Performance in Power Electronic Systems,” IEEE Trans. on Power Delivery, vol. 20, pp. 319 – 327, Jan. 2005. [39] M. Frivalldsky and R. Sul, “Elimination of Transistor’s Switching Losses by Diode Reverse Recovery in Dedicated Application,” IEEE IECON, vol. 1013, pp. 737–742, Nov. 2008. [40] S. Inoue and H. Akagi, “A Bidirectional Isolated DC-DC Converter as a Core Circuit of the Next-Generation Medium-Voltage Power Conversion System,” IEEE Transactions on Power Electronics, vol. 22, pp. 535–542, Mar. 2007. [41] H. Zhou and Ashwin M. K., “Hybrid Modulation for Dual Active Bridge Bidirectional Converter with Extended Power Range for Ultracapacitor Application,” IEEE Transactions on Industry Applications, vol. 45, pp. 1434– 1442, Jul./Aug. 2009. [42] H. Zhou, T. Bhattacharya, D. Tran, et al., “Composite Energy Storage System Involving Battery and Ultracapacitor With Dynamic Energy Manage- 130 ment in Microgrid Applications,” IEEE Transactions on Power Electronics, vol. 26, pp. 923–930, Mar. 2011. [43] J. Salman and A. Knight, “Single Phase Multi-Level PWM Inverter Topologies using Coupled Inductors,” IEEE Power Electronics Specialist Conference, vol. 15-19, pp. 802–808, Jun. 2008. [44] D. Hirschmann, D. Tissen, and S. Schroder, “Reliability Prediction for Inverters in Hybrid Electrical Vehicles,” IEEE Trans. on Power Electron., vol. 22, pp. 2511–2517, Nov. 2007. [45] R. P. Patrick, E. Santi, J. L. Hudgins, et al., “Circuit Simulator Models for the Diode and IGBT with Full Temperature Dependent Features,” IEEE Trans. on Power Electron., vol. 18, Sep. 2003. [46] A. Caiafa, X. Wang, J.L. Hudgins, et al., “Cryogenic Study and Modeling of IGBT,” IEEE 34th Annual, Power Electronics Specialist Conference(PESC), vol. 4, June 2003. [47] H. Wang and A. M. K., “Analytical Power Loss Evaluation of level HBridge with Coupled Inductor and Series Connected H-Bridge for PEBB Applications,” IEEE Power Electronics and Drive Systems, Nov. 2009. [48] S. Bernet, “Recent Developments of High Power Converters for Industry and Traction Applications,” IEEE Trans. on Power Electron., vol. 15, Nov. 2000. 131 [49] T. Funaki, J. Balda, J. Junghans, et al., “Power Conversion with SiC Devices at Extremely High Ambient Temperatures,” IEEE Trans. on Power Electron., vol. 22, pp. 1321–1329, Jul. 2007. [50] M. Roschke and F. Schwierz, “Electron Mobility Models for 4H, 6H, and 3C SiC,” IEEE Trans. Electron Devices, vol. 48, no. 7, 2001. [51] L. Wei, Richard A. L., and Thomas A. Lipo, “Analysis of Power - Cycling Capability of IGBT Modules in a Conventional Matrix Converter,” IEEE Trans. on Ind. Applications, vol. 45, 2009. [52] B. Du, Jerry L. Hudgins, Enric Santi, etc, “Transient Electrothermal Simulation of Power Semiconductor Devices,” IEEE Trans. on Power Electron., vol. 25, Jan. 2010. [53] U. Drofenik and J. W. Kolar, “A General Scheme for Calculating Switching and Conduction Losses of Power Semiconductors in Numerical Circuit Simulations of Power Electronic Systems,” Proc. of the 5th IEEE International Power Electronics Conferences(IPEC), Niigata, Japan, Apr.4-8 2005. [54] X. Perpina, J. F. Serviere, J. Urresti-Ibanez, et al., “Analysis of Clamped Inductive Turn-off Failure in Railway Traction IGBT Power Modules under Overload Conditions,” IEEE Trans. on Power Electron., early access. 132 [55] M. Trivedi, and K. Shenai, “Investigation of the Short-Circuit Performance of an IGBT,” IEEE Trans. on Electron Devices, 1998. [56] T. Laska, G.Miller, M. Pfaffenlehner, et al., “Short Circuit Properties of Trench-/Field-Stop-IGBTs Design Aspects for a Superior Robustness,” IEEE ISPSD, 2003. [57] EUPEC, “Short Circuit Behaviour of IGBT3 600v,” 2005. [58] EUPEC, “Short Circuit Behaviour of 6.5kv IGBT,” 2002. [59] Otsuki M., Onozawa Y., Kanemaru H., et al., “A Study on the Short-Circuit Capability of Field Stop IGBTs,” IEEE Transactions on Electro Devices, vol. 50, pp. 1525–1531, Jun. 2003. [60] C. Lee, et. al., “Parallel U.P.S. with a Instantaneous Current Sharing Control,” The 24th Annual Conference IEEE IECON, 1998. [61] J. Chen and C. Chu, “Combination Voltage-Controlled and Currentcontrolled PWM Inverters for UPS Parallel Operation,” IEEE Trans. on Power Electron., vol. 10, pp. 547–558, Sep. 1995. [62] Y. Ito and O. Yama, “Parallel Redundant Operation of UPS with Robust Current Minor Loop,” Proc. Power Conv. Conf., Aug. 1997. 133 [63] Y. Xing, L. Huang, S. Sun, et al., “Novel Control for Redundant Parallel UPS’s with Instantaneous Current Sharing,” Proc. Power Conv. Conf., 2002. [64] T. Wu, Y. Chen, and Y. Huang, “3C Strategy for Inverters in Parallel Operation Achieving and Equal Current Distribution,” IEEE Trans. on Ind. Electron., vol. 47, pp. 273–281, Apr. 2000. [65] L. Wei, R. Kerkman, and R. Lukaszewski, “The Analysis of IGBT Power Cycling Capability for Adjustable Speed Drives,” IEEE Industry Applications Society Annual Meeting, Oct. 2008. [66] Shibao Z., “Evaluation of Thermal Transient and Overload Capability of High-Voltage Bushing With ATP,” IEEE Trans. on Power Delivery, vol. 24, July 2009. [67] Caisheng W.; Hashm Nehrir M., “Short-Time Overloading Capability and Distributed Generation Applications of Solid Oxide Fuel Cells,” IEEE Trans. on Energy Conversion, vol. 22, Dec. 2007. [68] Caisheng W.; Hashm Nehrir M., “Power Management of a Stand Alone Wind / Photovoltaic / Fuel Cell Energy System,” IEEE Trans. on Energy Conversion, vol. 23, Sep. 2008. [69] Miaomiao C., Shuhei K., Hideo S., et al., “A Novel Method for Improving the Overload Capability of Stand-alone Power Generating Systems Based on a 134 Flywheel Induction Motor,” IEEE Power Electronics Specialists Conference, June 2008. [70] IEC 60909-0, “Short Circuit Currents in Three Phase AC Systems-Part 0: Calculation of Short Circuit Currents,” 2001. [71] IEC 60909-1, “Short Circuit Currents in Three Phase AC Systems-Part 1: Factors for the Calculation of Short Circuit Currents According to IEC 60909-0,” 2002. [72] IEC 60909-4, “Short Circuit Currents in Three Phase AC Systems-Part 4: Examples for the Calculation of Short Circuit Current,” 2000. [73] Salehian A., “Real Time Short Term Thermal Capability Forecasting of Transmission Lines,” Power Systems Conference and Exposition(PSCE), Oct. 2006. [74] Nima A., “Short Term Hourly Load Forecasting Using Time Series Modeling With Peak Load Estimation Capability,” IEEE Trans. on Power Systems, vol. 16, Nov. 2001. [75] IEEE Std 1015-2006, “IEEE Recommended Practice for Applying Low Voltage Circuit Breakers Used in Industrial and Commercial Power Systems,” 2006. 135 [76] Steve B., Jeremy F., Kevin B., “Inrush Current in DC-DC Converters,” Electronics Product design,www.epdonthenet.net, June. 2009. [77] www.geindustrial.com, “Short-Circuit Current Calculations for Industrial and Commercial Power System,” [78] Baran M. and El-Markaby I., “Fault Analysis on Distribution Feeders with Distributed Generators,” IEEE Trans. on Power Systems, vol. 20, Nov. 2005. [79] IEEE STD 242-1986, “Recommended Practice for Protection and Coordination of Industrial and Commercial Power Systems Chapter 8,” 2001. [80] Ciappa M., Carbognani F., Cova P., et al., “Lifetime Prediction and Design of Reliability Tests for High-Power Devices in Automotive Applications,” IEEE Trans. on Device and Materials Reliability, vol. 3(4), Dec. 2003. [81] H. Wang and Ashwin M. K., “A Comprehensive Thermal Model for Power Electronics Building Block (PEBB) Applications,” IEEE Applied Power Electronics Conference and Exposition, Mar. 2011. 136 List of Publications • Huanhuan Wang and Ashwin M. Khambadkone ”Investigation on Over Current Capabilities in the Power Electronics Building Blocks System”, IEEE Applied Power Electronics Conference and Exposition (APEC), Mar. 2013, accepted. • Huanhuan Wang, Ashwin M. Khambadkone and Birgersson Karl Erik, ”Improved Comprehensive Thermal Model for Power Electronics Building Block Applications”, IEEE Applied Power Electronics Conference and Exposition (APEC), pp. 390 - 395, Mar. 2011. • Huanhuan Wang, Ashwin M. Khambadkone and Xiaoxiao yu, ”Control of Parallel Connected Power Converters for Low Voltage Microgrid Part II: Dynamic Electrothermal Modeling”, IEEE Trans. on Power Electron., vol. 25(12), pp. 2971 - 2980, Dec. 2010. • Huanhuan Wang, Ashwin M. Khambadkone and Xiaoxiao yu, ”Dynamic 137 Electro-Thermal Modeling in Power Electronics Building Block (PEBB) Applications’, IEEE Energy Conversion Congress and Exposition (ECCE), pp. 2993 - 3000, Sep. 2010. • Huanhuan Wang, Ashwin M. Khambadkone, ”Analytical Power Loss Evaluation of level H-Bridge with Coupled Inductor and Series Connected H-Bridge for PEBB Applications”, IEEE Power Electronics and Drive Systems (PEDS), pp. 458 - 463, Nov. 2009. • X.Yu, Ashwin M. Khambadkone, Huanhuan Wang and Siew Sing, ”Control of Parallel-Connected Power Converters for Low-Voltage Microgrid Part I: A Hybrid Control Architecture”, IEEE Trans. on Power Electron., vol. 25(12), pp. 2962 - 2970, Dec. 2010. • X.Yu, Ashwin M. Khambadkone, and Huanhuan Wang, ”Control of Paralleled Power Converter Modules to Facilitate the Efficient Operation of Microgrid”, IEEE Energy Conversion Congress and Exposition (ECCE) Asia, pp. 2970 - 2975 July, 2010. • X.Yu, Huanhuan Wang and Ashwin M. Khambadkone, ”Control of Paralleled PEBBs to Facilitate the Efficient Operation of Microgrid”, IEEE International Symposium on Industrial Electronics (ISIE), pp. 2217- 2222, June, 2010. 138 • X.Yu, Ashwin M. Khambadkone, Huanhuan Wang, and Siew Sing, ”A Hybrid Control Architecture for Low Voltage Microgrid”, IEEE Energy Conversion Congress and Exposition (ECCE), pp. 3161 - 3168, Sep. 2010. [...]... connected in micro grid The simulation and analysis is addressed to two types of operation circumstances, including normal operation and over loading operation The results well prove the significance and effectiveness of the dynamic electro- thermal modeling for the intelligent operations of PEBBs in distribution energy resources All modeling methodologies, analysis, and simulation algorithms proposed and realized,... requirements and the after dynamic electro- thermal modeling are of great relationship Furthermore, accurate power loss calculation forms the basis of dynamic electro- thermal modeling • The second critical problem is regarding to the package issue, in which thermal design is one of the most crucial problem Systems design guidelines and reliability issues increasingly put emphasis on the thermal analysis According... covered in Section 1.3 The main contributions and the organization of the thesis are respectively described in Section 1.4 and Section 1.5 3 Introduction 1.1 Research Background and Motivation The concept of micro grid is originally proposed in [6] as a cluster of loads and micro- sources operating under a unified controller within a certain local area One special micro grid structure as shown in Fig... Example of Micro Grid Configuration There are two modes for the operation of MGs, namely grid- connected mode and islanding mode In grid- connected mode operation, the MG is connected to Introduction 4 the utility, and the DG system in the micro grid provides power for the nearby loads and, if capacity of the MG permits, the non critical loads at the point of common coupling (PCC) As a consequence of this,... xiv List of Acronyms DG Distribution Generation MG Micro Grid EPS Electric Power System ICT Information Communications Technology HVDC High Voltage Direct Current PEBB Power Electronics Building Block MAS Modeling, Analysis and Simulation PCC Point of Common Coupling STS Static Transfer Switch 1D One-Dimensional xv 3D Three-Dimensional RC Resistance-Capacitor SOA Safe Operating Area FEM Finite Element... PEBBs operation in connecting with the Hybrid micro grid 1.3 Literature Review As explained in the above defined problems, to fulfill the dynamical schedul- ing of the power sharing between different PEBB converters with the goal of optimizing the system efficiency and improving the thermal capability, we need to study power losses calculation and thermal analysis Introduction 1.3.1 11 Power Losses Calculations... real power electronic semiconductor devices don’t have the characteristics of ideal switches, which have zero power consumptions, and hence dissipate power in applications Power losses in the power electronic converters mainly consist of the conduction losses and switching losses Various publications provide solutions for evaluating the power losses of semiconductor devices Present methods of computing... decrease the size and volume of power converter modules [12] However, during the PEBB design process, the resulting higher power density exposes the power package to high thermal constraints or even failures as a consequence of thermal fatigue The converters face the problems that the power loss distribution and heat generated in the modules dramatically increase with the increasing of the switching frequency... Power Electronics Building Block (PEBB) is such a set of power converter modules with both networking and stand-alone functionality to provide Introduction 2 a uniform approach to implement the paralleled modular power converters Thermal management has always been critical in the power electronic converters design procedure The development trend of power converter modules is pursuing high power density... nature of micro grid concept Thus, it is flexible to fulfill system reliability and power quality requirements without communication or custom engineering for each site, and also has the larger power capacity compared with one single DG system Grid LOADs PCC Micro Grid Line Line Line sts Heat Load inverter Energy Source Energy Storage DG1 inverter Energy Source Energy Storage DG2 Critical Load inverter . DYNAMIC ELECTRO- THERMAL MODEL OF POWER ELECTRONIC BUILDING BLOCK IN MICRO GRID: MODELING, ANALYSIS AND SIMULATION HUANHUAN WANG NATIONA L UNIVERSITY OF SINGAP ORE 2012 DYNAMIC ELECTRO- THERMAL. ELECTRO- THERMAL MODEL OF POWER ELECTRONIC BUILDING BLOCK IN MICRO GRID: MODELING, ANALYSIS AND SIMULATION HUANHUAN WANG (M.Eng(Hons.), B.Eng, Xi’an Jiao Tong Univ., Xi’an, China) A THESIS SUBMITTED FOR. l fo r modeling, analysis and simulation (MAS) of the PEBB dynamic electro- thermal model. This model is proved to possess the accuracy of Finite Element Method (FEM) and also makes use of the