Heat Transfer Handbook part 148 pptx

BOOKCOMP, Inc. — John Wiley & Sons / Page 1470 / 2nd Proofs / Heat Transfer Handbook / Bejan 1470 SUBJECT INDEX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 [1470], (44) Lines: 6780 to 6960 ——— 0.0pt PgVar ——— Normal Page PgEnds: T E X [1470], (44) for boiling, 713 for conduction heat transfer, 257 for direct contact heat transfer, 1395 for electronic equipment, 1020–1022 for enhancement techniques, 1104 for forced convection (internal flows), 436 Greek letter, 41 for heat exchangers, 903–905 for heat pipes, 1226–1227 for manufacturing and materials processing, 1301 for microscale heat transfer, 1354 for porous media, 1175–1176 Roman letter, 40–41 for thermal spreading and contact resistances, 384–385 thermophysical properties, 142 Substantial derivative, 18 Substrates, 288 block arrays, 495–497 flush-mounted heat sources, 491–492 forced convection external flows from, 490–500 isolated blocks, 493–495 objects on, 444, 490–500 pin fin heat sinks, 498–500 plate fin heat sinks, 497–498 two-dimensional block array, 492–493 Suction, 1034 Sulfur dioxide, 87–88 Sulfur hexafluoride, 88 Summation rule, 606–607 Supercritical startup, 1216–1217 Superficial vapor velocity, 742, 743 Superficial velocities, 1377 Superheat: critical, 1201 nucleation, 640–644 Superposition, 221–222, 496 Superscripts, 41 for condensation, 789 for conduction heat transfer, 257 “crit” (critical enhancement), 115 for electronic equipment, 1022 for external flow forced convection, 522 for forced convection (internal flows), 436 for heat exchangers, 905 “int” (internal motions), 115 for manufacturing and materials processing, 1301 for thermal radiation, 631 for thermal spreading and contact resistances, 385 thermophysical properties, 142 “trans” (translational term), 115 Surfaces: diffuse, 600 enhanced boiling, 704 extended, see Extended surfaces with flow normal to banks of smooth tubes compact heat exchangers, 845–846 rough, see Rough surfaces thermal radiation between, 598–615 black surfaces, 609–610 diffuse gray surfaces, 610–612 diffuse nongray surfaces, 614–615 radiation shields, 612–613 view factors, 600–609 total emittance/solar absorptance of selected, 597–598 treated, see Treated surfaces Surface conditions: effects of, on nonconductors, 593–594 nonconductors affected by, 593–595 thermal radiation affected by, 593–595 Surface convection: one-region Neumann problem with, 250 semi-infinite solid model and, 232–233 Surface heat flux: semi-infinite solid model, 232–234 semi-infinite solid with periodic, 240 Surface heat treatment, 1246 Surface layers, 594–595 Surface properties, 599 Surface radiosity, 611 Surface roughness: and grease thermal conductivity, 376 and grinding, 1251 nucleate pool boiling, 655–656 reduced pressure correlation of Cooper, 655–656 Surface roughness effect, 481–482 Surface scraping devices, 1097 Surface temperature: arbitrarily varying, 465–466 finite plane wall with periodic, 241–242 radiative properties of metals, 588–589 BOOKCOMP, Inc. — John Wiley & Sons / Page 1471 / 2nd Proofs / Heat Transfer Handbook / Bejan SUBJECT INDEX 1471 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 [1471], (45) Lines: 6960 to 7122 ——— 0.0pt PgVar ——— Normal Page * PgEnds: PageBreak [1471], (45) semi-infinite solid model, 232–233 specified, 232–233 uniform axisymmetric object at, in uniform laminar flow, 510 crossflow across bank of cylinders at, 511 cylinder at, in laminar cross flow, 509 Surface temperature effects, 588–589 Surface tension, 739, 1191 Surface tension devices, 1033 Surface tension pressure gradient, 724–725 Surface vibration, 1033, 1097 Swirl effects, 708, 767–769 Swirl flow devices, 1033 boiling, 1082–1086 condensing, 1087–1088 heat transfer enhancement, 1075–1088 single-phase flow, 1075–1082 Symbols: Greek letter, see Greek letter symbols Roman letter, see Roman letter symbols Symmetric isoflux plates, 990 Symmetric isothermal plates, 990 Système International d’Unités (SI System), 35–38 Taitel—Dukler map, 739–741, 744–746, 760 Tantalum, 129 Taylor bubbles, 663 Taylor instability, 658 TECs, see Thermal electric coolers Teflon, 373 TEMA, see Tubular Exchanger Manufactur- ers’ Association TEMA E-shell, 811–813 TEMA G-shell, 813–814 TEMA J-shell, 814, 817 Temperature: adiabatic, 496 boiling point for fluids, 48, 52–54 calibrating for, 916–917 critical, 48, 52–54 effective solar, 576 and electronic equipment, 948–953 finite plane wall with periodic, 241–242 and grinding, 1252–1254 horizontal tubes affected by, 750–751 longitudinal finned double-pipe heat exchangers, 865 maldistribution of, 770 and metal cutting, 1248–1250 mixture, 114 periodic conduction oscillating, 239 semi-infinite solid with periodic ambient, 240–241 semi-infinite solid with periodic surface, 239–240 plane wall with constant, 1141–1142 porous media, 1141–1142 semi-infinite solid model constant surface heat flux and nonuniform initial, 234 specified surface, 232–233 surface, 241–242 triple-point, 48, 52–54 uniform surface axisymmetric object at, in uniform laminar flow, 510 crossflow across bank of cylinders at, 511 cylinder at, in laminar cross flow, 509 wall, 865 wedge at uniform, 509 X-shell condensers, 770 Temperature change (in solids), 120 Temperature dependence, 592, 593 Temperature-dependent energy generation, 199–200 Temperature-dependent heat transfer coefficient, 231 Temperature-dependent specific heat, 230 Temperature-dependent thermal conductiv- ity, 196–198 Temperature difference, logarithmic mean, 804–805 Temperature gradient, 164 Temperature head, 819 Thermal boundary resistance, 970, 972–973, 1351 Thermal capacitance, 7 Thermal conductivity, 115, 164–165 dilute gas, 58–59 in ECS model, 117 graphs of, 149–150, 152, 154, 156, 158 location-dependent, 194–195 BOOKCOMP, Inc. — John Wiley & Sons / Page 1472 / 2nd Proofs / Heat Transfer Handbook / Bejan 1472 SUBJECT INDEX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 [1472], (46) Lines: 7122 to 7292 ——— 0.0pt PgVar ——— Normal Page PgEnds: T E X [1472], (46) Thermal conductivity (continued) measurement of, 122, 140 microscale heat transfer, 1326–1330 in mixtures, 117–118 of particle-laden systems, 975–979 of solids, 119–120 temperature-dependent, 196–198 Thermal contact resistance, see Contact resistance Thermal diffusivity: and conservation of energy, 120 graphs of, 151, 153, 155, 157, 159 measurement of, 140 Thermal diodes, 1187 Thermal elastoconstriction parameter, 324 Thermal electric coolers (TECs), 1016–1017 Thermal entrance length, 396 Thermal entrance region, 407–408 Thermal expansion: measurement of, 140 volumetric coefficient of, 28 Thermal—fluid design general considera- tions, 1000–1001 Thermal-fluid effects in continuous metal forming processes, 1254–1259 Thermal greases and pastes, 374–376 Thermal heat radiation, see Thermal radiation Thermally and hydraulically developing flow, 430 Thermally conductive, 289 Thermally decoupled model, 325 Thermally developing flow, 412–413, 429 Thermally developing Hagen—Poiseuille flow, 429–430 Thermally fully developed flow, 405–407 Thermally resistive, 289 Thermal management, 948–952 Thermal model: metallic coatings and foils, 264, 366–371 thermosetting-matrix composites processing, 1261–1262 Thermal nonequilibrium, 690–693 Thermal packaging goals, 952–953 Thermal process control for manufacturing, 1284–1297 adaptive control, 1294–1296 MIMO thermal systems, 1288–1290 optimal formulation: linear quadratic Gaussian, 1290–1292 parameter identification, 1296–1297 SISO thermal systems, 1285–1288 sliding mode control, 1293–1294 Smith prediction, 1292–1293 Thermal radiation, 2, 573–631 definition of, 574 emissive power, 575–579 nomenclature for, 629–631 radiative exchange within participating media, 621–629 diffusion approximation, 623, 624 discrete ordinate method, 627 mean beam length method, 623, 624 Monte Carlo or statistical methods, 627 P-1 approximation, 625–626 weighted sum of gray gases, 627–628 zonal method, 627 radiative heat flux, 581–582 radiative heat transfer, 12 radiative intensity, 581 radiative properties of participating media, 615–621 molecular gases, 615–619 particle clouds, 619–621 radiative properties of solids and liquids, 582–598 metals, 586–589 nonconductors, 589–593 semitransparent sheets, 596 surface conditions’ effects on, 593–595 solid angles, 577, 579–581 between surfaces, 598–615 black surfaces, 609–610 diffuse gray surfaces, 610–612 diffuse nongray surfaces, 614–615 radiation shields, 612–613 view factors, 600–609 Thermal resistance, 2 in electronic equipment, 956–964 basic heat transfer modes, 956–962 chip package resistance, 962–964 in heat pipes, 1209–1211 and steady one-dimensional conduction, 182–183 Thermal spreading and contact resistances, 261–385 assumptions for resistance/conductance model development, 270 at bolted joints, 378 BOOKCOMP, Inc. — John Wiley & Sons / Page 1473 / 2nd Proofs / Heat Transfer Handbook / Bejan SUBJECT INDEX 1473 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 [1473], (47) Lines: 7292 to 7431 ——— 0.0pt PgVar ——— Normal Page * PgEnds: PageBreak [1473], (47) circular flux tube with multiple layers, 302–304 within compound disk with conductance, 288–294 in compound rectangular channels, 304–309 rectangle on isotropic half-space, 309 rectangle on layer on half-space, 309 square area on semi-infinite square flux tube, 309 conforming rough solids, 266–267 conforming rough surface, 340–362 elastic contact model, 349–351 elastic—plastic contact conductance model, 351–353 gap conductance for joints between, 355–359 gap conductance for large parallel isothermal plates, 353–355 joint conductance for joints between, 359–361 models for, 340–342 plastic contact model, 342–347 radiation resistance/conductance for, 347–349 definitions in flux tubes/channels, 272–274 in isotropic half-space, 270–272 eccentric rectangular area on rectangular plate with cooling, 314–318 multiple rectangular heat sources on isotropic plate, 317–318 ingle eccentric area on compound rectangular plate, 316–317 of isotropic finite disks with conductance, 294–298 circular area on single layer (coating) on half-space, 295–296 correlation equations, 294–295 equivalent isothermal contact area, 297–298 isoflux circular contact, 296–297 isoflux contact area, 297 isothermal contact area, 298 in isotropic half-space, 274–280 circular source areas, 274–277 dimensionless spreading resistance, 279–280 flux distribution over isothermal elliptical area, 280 isoflux circular source, 275–277 isothermal circular source, 274–275 isothermal elliptical source area, 277–280 transient spreading resistance, 285–288 joint conductance enhancement methods, 361–377 elastomeric inserts, 372–374 metallic coatings and foils, 363–372 phase-change materials, 377 thermal greases and pastes, 374–376 nomenclature for, 378–385 nonconforming rough solids, 268 nonconforming smooth solids, 267–268, 318–340 ball-bearing resistance, 336 contact resistance of isothermal elliptical contact areas, 323–324 elastic—plastic contacts of hemispheres and flat surfaces in vacuum, 333– 335 elastogap resistance model, 324–326 line contact models, 336–340 local gap thickness, 322–323 models for, 318–319 point contact model, 319–322 radiative resistance, 326–327 sphere and layered substrate, 329–333 sphere—flat contact, 327–329 parameters influencing resistance/ conductance, 269–270 of rectangular source area, 280–285 arbitrary singly connected area, 282– 283 circular annular area, 283–284 doubly connected regular polygons, 284–285 isoflux rectangular area, 280 isoflux regular polygonal area, 281–282 isothermal rectangular area, 281 semi-infinite circular flux tubes and two-dimensional channels, 313–314 semi-infinite isotropic circular flux tube, 298–302 accurate correlation equations, 302 general expression, 299–302 BOOKCOMP, Inc. — John Wiley & Sons / Page 1474 / 2nd Proofs / Heat Transfer Handbook / Bejan 1474 SUBJECT INDEX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 [1474], (48) Lines: 7431 to 7520 ——— 0.0pt PgVar ——— Normal Page PgEnds: T E X [1474], (48) single layer between two conforming rough solids, 268–269 Thermal spreading and contact resistances (continued) solids conforming rough, 266–267 conforming rough, single layer between, 268–269 nonconforming rough, 268 nonconforming smooth, 267–268 from strip on finite channel with cooling, 310–311 from strip on infinite flux channel, 312–313 types of joints, 264–266 Thermal switches, 1187 Thermal time constant, 7 Thermal transport, 500–502 Thermal vias, 987–988 Thermal waves, 1343 Thermal wave propagation, 981 Thermistors, 942 Thermocouples, 140, 915, 933–941, 1339– 1341 arrangements of, 938–940 common standard, 938 nanometer-scale, 1339, 1340 Thermodynamics: first law of, 23–24 second law of, 35–37 Thermodynamic properties: of fluids, 46–114 of mixtures, 113–114 Thermoelectric power, 936, 1350 Thermogram, 1263 Thermohaline convection, 1169 Thermomechanical model, 366 Thermometers, 916–918, 931–933 Thermophysical properties, 43–142, 149– 159 of fluids, 46–118 along the saturation line, 62–110 calculation of, 112–113 dilute gas thermal conductivity, 58–59 dilute gas viscosity, 60–61 equation of state, 46–51, 111–112 estimated experimental uncertainty, 47 ideal gas isobaric heat capacity, 55–57 for mixtures, 113–114 physical constants and fixed points, 52–54 BOOKCOMP, Inc. — John Wiley & Sons / Page 1475 / 2nd Proofs / Heat Transfer Handbook / Bejan SUBJECT INDEX 1475 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 [1475], (49) Lines: 7520 to 7688 ——— 0.0pt PgVar ——— Normal Page PgEnds: T E X [1475], (49) thermodynamic properties, 46–114 transport properties, 114–118 graphs of, 149–159 nomenclature for, 141–142 saturation line, 62–110 of solids, 118–140 behavior of, 120–121 conservation of energy, 119–120 measuring, 122, 140 property values of, 121–139 as term, 44 transport properties, 62–110 Thermophysical Properties Research Center (TPRC), 121 Thermoplastic-matrix composites, 1269– 1283 fabrication of composites, 1270–1271 heat transfer, 1273–1274 interlaminar bonding, 1277–1280 polymer degradation, 1280–1281 solidification (crystallization), 1281–1283 stages of, 1269–1270 transport mechanisms involved in, 1271– 1273 void dynamics, 1274–1277 Thermoreflectance techniques, 1339 Thermosetting-matrix composites, 1259– 1269 kinetics model, 1262–1266 laminate consolidation model, 1266–1269 thermal model, 1261–1262 Thermostatic (on—off) control, 1285–1286 Thermosyphon, 1196 Thin-film evaporation, 705 Thin-film microbridge, 1342, 1343 Thin plate with moving heat source, 1241– 1243 Thin rod with moving planar heat source, 1241–1242 Thin solid model, 1235–1239 Thome method, 700–701 Thomson functions, 176–177 3ω technique, 1342–1344 Three-layer model for a “physical situation,” 476–479 Three-phase exchanges, 1368 Three-phase spray column, 1381–1384 Three-time-level scheme, 238 Tien model, 754 Time-averaged equations, 419–420 Time—temperature transformation (TTT) diagram, 1245–1246 Tin, 129, 370, 371 Titanium, 130 Toluene (methylbenzene), 88–89 Tool—chip interface temperature rise, 1248–1249 Total, normal emittance, 597–598 Total emissive power, 575 Total heat transfer rate, 425–427, 433 Total hemispherical emittance, 585, 588, 589 Total properties, 588 Total resistance, 964 Total temperature potential, 867 Tow compaction, 1273, 1274 Tow-placement head, 1270 TPRC (Thermophysical Properties Research Center), 121 Trace layers, 988 Transfer unit technique, 1374–1375 Transient conduction, 229–239 finite-difference method, 236–239 finite-sized solid model, 235–236 lumped thermal capacity model, 229–231 multidimensional, 236 semi-infinite solid model, 232–234 Transient effects, first-order, 979–985 Transient natural convection in external laminar flow, 546–548 Transient operation, heat pipe, 1212–1217 continuum vapor and liquid-saturated wick, 1212–1213 freeze—thaw issues, 1214–1216 supercritical startup, 1216–1217 wick depriming and rewetting, 1213 Transient spreading resistance, 285–288, 313–314 Transient thermoreflectance (TTR), 1344– 1347 Transistors, 1347–1349 Transition boiling, 639 boiling curve, 637 pool boiling, 662 Transition flow, 830 Transition region, 10, 528 Transition temperature, 1271 Translational term (superscript “trans” ), 115 Transmissivity, 583 BOOKCOMP, Inc. — John Wiley & Sons / Page 1476 / 2nd Proofs / Heat Transfer Handbook / Bejan 1476 SUBJECT INDEX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 [1476], (50) Lines: 7688 to 7774 ——— 0.0pt PgVar ——— Normal Page * PgEnds: PageBreak [1476], (50) Transmittance, 583 Transport, convection, 446 Transport correlations, 482–483 Transport equations, 49–51 Transport limitations, heat pipe, 1193–1209 boiling limit, 1201–1202 capillary limit, 1195–1201 condenser limit, 1208–1209 entrainment limit, 1202–1204 leading to failure, 1194 nonfailure, 1194 sonic limit, 1206–1208 viscous limit, 1205 Transport mechanisms, 1271–1273 Transport properties, 44–45 density-dependent contributions, 116–117 dilute-gas contributions, 115–116 extended corresponding states, 114–115 of fluids, 114–118 for mixtures, 117–118 Transverse high-fin heat exchangers, 868– 878 air-fin coolers, 871–875 bond/contact resistance of high-fin tubes, 870 fin efficiency approximation, 871 overall heat transfer coefficient, 876–878 pressure loss correlations for staggered tubes, 875–876 Trapezoidal fins, 203, 205 Trapezoidal fin tubes, 728–730 Trap wicks, 1191 Travel Péclet number, 1367 Treated surfaces, 1032, 1043–1050 boiling, 1043–1049 condensing, 1049–1050 Triangular cavity, nucleation on, 643 Triangular fins: longitudinal convecting, 203, 205 optimal dimensions of convecting, 212, 213 radial convecting, 208 Triple-point temperature, 48, 52–54 True isothermal strip on infinite flux channel, 312 TTR, see Transient thermoreflectance TTT diagram, see Time—temperature transformation diagram Tubes: air-fin cooler arrangements of, 872–874 BOOKCOMP, Inc. — John Wiley & Sons / Page 1477 / 2nd Proofs / Heat Transfer Handbook / Bejan SUBJECT INDEX 1477 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 [1477], (51) Lines: 7774 to 7946 ——— 0.0pt PgVar ——— Normal Page PgEnds: T E X [1477], (51) Tubes (continued) coiled, 1033, 1088–1092 boiling, 1091–1092 condensing, 1092 single-phase flow, 1088–1091 condensation in smooth, 735–763 enhanced in-tube condensation, 764–767 exchanger surface area, 800–802 film condensation on, 727–732 horizontal, 749–761 horizontal finned, 727–732 laminar force convection in circular, 959, 960 low-finned, 706 microfin, 706–708, 764–767 in shell-and-tube heat exchangers heat transfer data, 829–832 physical data, 825 pressure loss data, 836–838 smooth, see Smooth tubes Turbo-Bii, 706 turbulent force convection in circular, 959, 960 Tube banks, 442, 483–485 Tube bundles: film condensation on, 769–780 in-tube condensers, 779–780 X-shell condensers, 769–779 flow boiling on, 687–689 bundle boiling factor, 688 bundle design methods, 688–689 heat transfer characteristics, 687–688 Tube diameter: flow regimes, 738 heat transfer, 750 Tube metal resistance, 878 Tube-side flow, 770 Tubular Exchanger Manufacturers’ Association (TEMA), 811, 823, 894, 896 Tubular surfaces, 844 Tungsten, 130, 590 Turbo-Bii tube, 706 Turbo-Cdi, 731 Turbo-Chil, 731 Turbulence, 557–560 Turbulent boundary layer: flat plate with, 510 forced convection external flows from, 469–472 isothermal rough flat plate with, 510–511 uniform flux plate with, 510 Turbulent boundary layer transition, 510 Turbulent duct flow, 419–425 fully developed flow, 420–423 heat transfer in fully developed flow, 423–425 optimal channel sizes for, 431–432 optimum channel sizes for, 427 time-averaged equations, 419–420 Turbulent flow, 528 and entrance lengths, 432 external flow forced convection, 472–475 flat plate with unheated starting length in, 479–480 natural convection in, 557–560 near-wall region in, 472–475 optimal channel sizes, 432 in shell-and-tube heat exchangers, 830– 831 swirl flow devices, 1080–1082 Turbulent flow friction factor, 432 Turbulent flow heat transfer, 432–433 Turbulent force convection, 959, 960 Turbulent jets: external flow forced convection, 500–508 submerged jets, 502–508 thermal transport in jet impingement, 500–502 Twisted duct, 1076 Twisted-tape inserts: boiling, 1082–1086 condensation enhanced in-tube, 767–769 condensing, 1087–1088 enhanced in-tube condensation, 767–769 single-phase flow, 1076–1082 Two-dimensional block array, 492–493 Two-dimensional nonsimilar flows, 466 Two-dimensional steady conduction, 215– 229 conduction shape factor method, 222–225 finite-difference method, 223, 225–229 method of superposition, 221–222 rectangular plate with specified boundary temperatures, 216–217 solid cylinder with surface convection, 217–220 BOOKCOMP, Inc. — John Wiley & Sons / Page 1478 / 2nd Proofs / Heat Transfer Handbook / Bejan 1478 SUBJECT INDEX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 [1478], (52) Lines: 7946 to 8104 ——— 0.0pt PgVar ——— Normal Page PgEnds: T E X [1478], (52) solid hemisphere with specified base and surface temperatures, 219–221 Two-dimensional workpieces, 1238, 1240– 1241 Two pass/one pass flow arrangement, 882 Two pass/two-pass flow arrangement, 882 Two-phase flow heat transfer: condensation in smooth tubes, 736–737 enhancement of, 1040–1042 Two-phase flow patterns, 662–671 Two-phase multiplier correlations, 756–757 Two-phase system, capillary-driven, 1182, 1183 Two-point basis, 1313 Two-region Neumann problem, 245–247 2/1 arrangement, 882 2/2 arrangement, 882 U arrangement, 881, 882 Umklapp process (of phonon—phonon colllisions), 1328, 1329 Uncertainty: estimated experimental, 47 measurement error, 918–920 Unconfined flow, 502 Unheated starting length: external flow forced convection, 463–466 flat plate boundary layer with, 463–466 flat plate with, 479–480, 509 in turbulent flow, 479–480 uniform laminar flow with, 509 Uniform energy generation, 201 Uniform flow, forced convection external flows from single objects in, 446–483 algebraic turbulence models, 472 analogy solutions for boundary layer flow, 475–481 axisymmetric nonsimilar flows, 469 cylinder in crossflow, 482–483 flow over isothermal sphere, 483 high Reynolds number flow over a wedge, 446–452 incompressible flow past flat plate with viscous dissipation, 461–463 integral solutions for flat plate boundary layer with unheated starting length, 463–466 near-wall region in turbulent flow, 472–475 Prandtl number effect, 459–460 similarity solutions for flat plate at uniform temperature, 456 similarity solutions for wedge, 456–459 similarity transformation technique for laminar boundary layer flow, 452–455 Smith—Spalding integral method, 466– 468 surface roughness effect, 481–482 turbulent boundary layer, 469–472 two-dimensional nonsimilar flows, 466 Uniform flux plate, 510 Uniform heat flux, 433 Uniform internal energy generation effect, 188–194 Uniform laminar flow: axisymmetric object at uniform surface temperature in, 510 flat plate in, with unheated starting length, 509 isothermal flat plate in, 508–509 Uniformly heated wall, 427 Uniform surface temperature: axisymmetric object at, in uniform laminar flow, 510 crossflow across bank of cylinders at, 511 cylinder at, in laminar cross flow, 509 Uniform thermal environment: moving materials in, 1234–1241 thin solid model, 1235–1239 two-dimensional workpieces, 1238, 1240–1241 wedge at, 509 Units, 34–38 conversion factors, 37–38 English engineering system, 36–37 SI System, 35–36 Unit cells, 1312 Unit vectors, 606 Uranium, 130 Vacuum: coated joint operating in, 363 joint resistance in a, 328, 330, 333–335, 339 Vafai and Tien flow model, 1137–1138 Vanadium, 130 Van Stralen bubble growth model, 648 Vapor, evaporation of a liquid by a surrounding gas, 1371–1373 BOOKCOMP, Inc. — John Wiley & Sons / Page 1479 / 2nd Proofs / Heat Transfer Handbook / Bejan SUBJECT INDEX 1479 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 [1479], (53) Lines: 8104 to 8272 ——— 0.0pt PgVar ——— Normal Page PgEnds: T E X [1479], (53) Vapor chambers, 1008 Vapor flow-modulated heat pipes, 1189, 1190 Vapor inertia, 1204 Vapor-liquid equilibria and properties, 699–700 Vapor—liquid exchange, 653 Vapor space, 721–723 Vapor space EHD condensation, 733 Vapor-to-droplet heat transfer, 694 Vapor velocity, modified superficial, 742, 743 Variable conductance heat pipes (VCHPs), 1217–1218 Varisol, 1386 VCHPs, see Variable conductance heat pipes VCSELs (vertical cavity surface-emitting laser diodes), 1349 Velocity: friction, 421 in fully developed flow region, 399–400 slip, 1377 superficial, 1377 Vent flow rate, 777–779 Venting, noncondensable gas, 777–779 Vertical cavity surface-emitting laser diodes (VCSELs), 1349 Vertical cylinder, 545–546 Vertical flat plate, 721–723 Vertical flat surfaces: laminar flow, 533–540 turbulent flow, 561–562 Vertical isoflux surface, 959, 960 Vertical row-number method, 771–772 Vertical surfaces, 959, 960 Vertical tubes: flow boiling in, 663–664, 666, 671–679 Chen correlation, 672–673 Gungor—Winterton correlation, 674– 675 horizontal tube correlations based on, 679–680 Shah correlation, 673–674 Steiner—Taborek method, 675–678 smooth tube condensation, 763 Vertical walls, 1147–1153 Very large scale integration (VLSI) chips, 949 VG criteria, 1038 Vias, themal, 987–988 Vibration(s), 1097–1098 enhancement techniques, 1033 fluid, 1033, 1098 Vibrational modes of a crystal, 1317–1322 Vickers microhardness, 343–346 View factors: in electronic equipment, 961 evaluation of, between two surfaces, 605 graphs of, 604–605 radiative exchange between surfaces, 600–609 crossed-strings method, 608–609 direct integration, 600, 606 reciprocity rule, 607 summation rule, 606–607 view factor algebra, 607–608 thermal radiation, 600–609 types of, 601–603 View factor algebra, 607–608 Viscosity, 115 Chapman—Enskog dilute gas, 115 dilute gas, 60–61 in ECS model, 117 graphs of, 150, 152, 154, 156, 158 of mixtures, 118 resin, 1268 Viscous dissipation: incompressible flow past flat plate with, 461–463 isothermal flat plate in uniform laminar flow with appreciable, 508–509 Viscous dissipation function, 27–30 Viscous limit, 1194, 1205 Viscous sublayer, 473 VLSI (very large scale integration) chips, 949 Void compression, 1276 Void dynamics, 1274–1277 Void fraction, 1361 Void fraction model, Rouhani—Axelsson drift flux type of, 682 Void growth, 1277 Volatile component, 699 Volume-averaged quantity, 1132 Volumetric coefficient of thermal expansion, 28 Von Kármán constant, 474 Wakes, 548–551 . method, 627 radiative heat flux, 581–582 radiative heat transfer, 12 radiative intensity, 581 radiative properties of participating media, 615–621 molecular gases, 615–619 particle clouds, 619–621 radiative. (internal flows), 436 Greek letter, 41 for heat exchangers, 903–905 for heat pipes, 1226–1227 for manufacturing and materials processing, 1301 for microscale heat transfer, 1354 for porous media, 1175–1176 Roman. PgVar ——— Normal Page PgEnds: T E X [1470], (44) for boiling, 713 for conduction heat transfer, 257 for direct contact heat transfer, 1395 for electronic equipment, 1020–1022 for enhancement techniques,