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IEC/TR 62343 6 6 Edition 1 0 2011 01 TECHNICAL REPORT Dynamic modules – Part 6 6 Failure mode effect analysis for optical units of dynamic modules IE C /T R 6 23 43 6 6 2 01 1( E ) ® C opyrighted m at[.]

IEC/TR 62343-6-6:2011(E) ® Edition 1.0 2011-01 TECHNICAL REPORT Dynamic modules – Part 6-6: Failure mode effect analysis for optical units of dynamic modules Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe IEC/TR 62343-6-6 All rights reserved Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IEC's member National Committee in the country of the requester If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information Droits de reproduction réservés Sauf indication contraire, 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No further reproduction or distribution is permitted Uncontrolled when printe THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright © 2011 IEC, Geneva, Switzerland ® Edition 1.0 2011-01 TECHNICAL REPORT Dynamic modules – Part 6-6: Failure mode effect analysis for optical units of dynamic modules INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 33.180.20 ® Registered trademark of the International Electrotechnical Commission PRICE CODE T ISBN 978-2-88912-327-8 Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe IEC/TR 62343-6-6 TR 62343-6-6 © IEC:2011(E) CONTENTS FOREWORD Scope Normative references Consideration of types of dynamic modules Typical failure points Failure modes and known failure mechanisms Bibliography 25 Table – Categorization based on the structure and how to evaluate Table – Failure mode and known failure mechanisms for the optical units of dynamic devices Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe –2– –3– INTERNATIONAL ELECTROTECHNICAL COMMISSION DYNAMIC MODULES – Part 6-6: Failure mode effect analysis for optical units of dynamic modules FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees) The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”) Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work International, governmental and nongovernmental organizations liaising with the IEC also participate in this preparation IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter 5) IEC itself does not provide any attestation of conformity Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity IEC is not responsible for any services carried out by independent certification bodies 6) All users should ensure that they have the latest edition of this publication 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications 8) Attention is drawn to the Normative references cited in this publication Use of the referenced publications is indispensable for the correct application of this publication 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights IEC shall not be held responsible for identifying any or all such patent rights The main task of IEC technical committees is to prepare International Standards However, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example "state of the art" IEC 62343-6-6, which is a technical report, has been prepared by subcommittee 86C: Fibre optic systems and active devices, of IEC technical committee 86: Fibre optics Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe TR 62343-6-6 © IEC:2011(E) TR 62343-6-6 © IEC:2011(E) The text of this technical report is based on the following documents: Enquiry draft Report on voting 86C/944/DTR 86C/959/RVC Full information on the voting for the approval of this technical report can be found in the report on voting indicated in the above table This publication has been drafted in accordance with the ISO/IEC Directives, Part A list of all parts of IEC 62343 series, published under the general title Dynamic modules, can be found on the IEC website The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication At this date, the publication will be • • • • reconfirmed, withdrawn, replaced by a revised edition, or amended A bilingual version of this publication may be issued at a later date Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe –4– –5– DYNAMIC MODULES – Part 6-6: Failure mode effect analysis for optical units of dynamic modules Scope This part of IEC 62343, which is a technical report, describes failure mode effect analysis (FMEA) for optical units of dynamic modules FMEA is one of the effective and useful analysis methods to determine the reliability evaluation test items and conditions which are defined in future reliability qualification documents In order to estimate the lifetime for a module, there is a typical procedure The first step is to identify the dominant failure modes The second step is to determine the acceleration tests according to these failure modes The third step is to carry out the test The fourth step is to estimate the acceleration factors Finally, the fifth step is to calculate the lifetime of the dynamic module The IEC 61300-2 series defines environment and mechanical tests This technical report describes the dominant failure mode for dynamic modules and relevant tests from the IEC 61300-2 series Normative references The following reference documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies IEC 61300-2-1, Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-1: Tests – Vibration (sinusoidal) IEC 61300-2-4, Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-4: Tests – Fibre/cable retention IEC 61300-2-9, Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-9: Tests – Shock IEC 61300-2-17, Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-17: Tests – Cold IEC 61300-2-18, Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-18: Tests – Dry heat – High temperature endurance IEC 61300-2-19, Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-19: Tests – Damp heat (steady state) IEC 61300-2-22, Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-22: Tests – Change of temperature IEC 61300-2-44, Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-44: Tests – Flexing of the strain relief of fibre optic devices IEC 62005-3, Reliability of fibre optic interconnecting devices and passive components – Part 3: Relevant tests for evaluating failure modes and failure mechanisms for passive components Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe TR 62343-6-6 © IEC:2011(E) TR 62343-6-6 © IEC:2011(E) Consideration of types of dynamic modules There are many types of dynamic modules: dynamic channel equalizer, tuneable optical chromatic dispersion compensator, dynamic gain tilt equalizer, wavelength selective switch, wavelength blocker, optical performance monitor, optical switch, and so on The main feature of dynamic modules is to control their performances during operation In order to achieve their features, many kinds of control mechanisms are used for dynamic modules; MEMS (micro electro mechanical system), stepping motor, electromagnet, thermo optics, magnet optics, electro optics, LCD (liquid crystal devices), and so on Table shows the first guidance of categorization of dynamic modules to consider how to evaluate Dynamic modules without an electrical circuit board can be considered similar to passive optical components for purposes of evaluation On the other hand, for dynamic modules with a control circuit board, it is necessary to give special consideration There are mainly two types of internal design for dynamic modules: those for which it is easy to divide the constituting parts to consider their reliability, and those which it is not easy to divide It is necessary to consider how to evaluate according to these structures NOTE This technical report describes FMEA only for optical units for dynamic modules It is necessary to evaluate whole dynamic modules including control circuit boards and firmware if used Typical failure points In addition to control circuit boards and control of moving parts, a typical optical unit for a dynamic module consists of the following parts: optical element, outer package, fibre pigtails, optical semiconductor chips, and joint points of these elements These elements have their own failure mode; for example, break for pigtails, displacement for joint points, and so on Moreover, these elements may have their acceleration factor of degradation; for example, joint points fixed by adhesive are generally weak against high humidity, and so on This failure mode analysis can be referred to FMEA for passive optical components (refer to IEC 62005-3) There are special considerations for dynamic modules The following are some examples When a hermetic sealing structure is used, the damp heat test may be omitted because it can generally prevent humidity from entering the package When using MEMS, operating shock and vibration tests are necessary because MEMS are sensitive to mechanical shock and vibration When temperature control is used, the temperature cycling test is recommended because temperature control functions generally produce thermal stress The temperature cycling test can accelerate thermal stress Failure modes and known failure mechanisms For some dynamic modules, failure mode and effect analysis (FMEA) was carried out Table shows known failure mechanisms, failure effects, failure modes, relevant tests and IEC test document numbers for dynamic modules If new technology and new dynamic modules become commercially available, they will be added to Table in later revisions Relevant tests are listed with the failure effect and the dominant failure mechanism As other relevant tests or methods of failure mode excitation become known, these will also be added Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe –6– –7– Table – Categorization based on the structure and how to evaluate Electrical circuits Without electrical circuits With electrical circuit How to evaluate Examples N.A As optical component VOA, 1x2/2x2 optical switch, DGTE Easy to divide optical and electrical unit As optical and electrical units individually, and as integrated dynamic module VOA, VOA-MUX, DCDC, DCE, Matrix switch, channel monitor, performance monitor Difficult to divide optical and electrical unit To evaluate as integrated dynamic module Wavelength blocker, wavelength selectable switch NOTE Optical active and passive components should comply to the reliability qualification requirement defined in the IEC 62572 series for active components and IEC 62009-9 series for passive optical components, respectively In cases in which it is difficult to divide optical and electrical units, integrated modules should be tested NOTE Electrical circuit boards should be qualified individually The following standard series are useful references for the quality of electrical circuit boards: IEC 61188, IEC 61189, IEC 61190, and IEC 61191 NOTE Three pieces should be tested Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe TR 62343-6-6 © IEC:2011(E) Liquid crystal type MEMS type Degradation of LCD LCD Freezing of LCD Same as MEMS type Same as MEMS type Collimator Pigtail Electrical polarization of LCD Fibre broken, microbending Excess driving power Low temperature Uncontrollable High humidity (nonhermetic sealed) Mechanical stress Thermal stress Mechanical stress for pigtail High humidity (nonhermetic sealed and using adhesive) Mechanical stress Thermal stress High humidity (nonhermetic sealed) Excess driving power Thermal stress Mechanical stress Excess driving power Mechanical stress Degradation acceleration factors Insertion loss increase Attenuation change Return loss decrease Dynamic range of attenuation decrease PDL increase WDL increase Uncontrollable Insertion loss increase No operation Insertion loss increase Attenuation change Return loss decrease PDL increase WDL increase Insertion loss increase Attenuation change Dynamic range of attenuation decrease PDL increase WDL increase Reflectance of mirror changing Pigtail Insertion loss increase Attenuation change Return loss decrease Dynamic range of attenuation decrease PDL increase WDL increase Distortion of hinge/mirror Dislocation of fixing points of optical parts Uncontrollable Failure modes Stacking the moving part Known failure mechanisms Collimator MEMS Constitution parts Under study 61300-2-17 Under study 61300-2-9 61300-2-1 Shock (storage) Vibration (storage) Maximum absolute rating test On/off driving test Cold 61300-2-22 61300-2-18 61300-2-19 61300-2-44 Change of temperature High temperature Damp heat 61300-2-4 Optical fibre cable flexing 61300-2-9 61300-2-1 Shock (storage) Vibration (storage) Fibre cable retention 61300-2-22 61300-2-18 61300-2-19 Under study 61300-2-19 61300-2-22 Under study Under study 61300-2-9 61300-2-1 Under study 61300-2-9 61300-2-1 Under study IEC references Change of temperature High temperature Damp heat Shock (storage) Vibration (storage) Maximum absolute rating test (electrical) On/off driving test Shock (storage) Vibration (storage) Shock and vibration (operating) Change of temperature Maximum absolute rating test On/off driving test Damp heat Relevant tests TR 62343-6-6 © IEC:2011(E) Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe Variable optical attenuators Dynamic devices Table – Failure mode and known failure mechanisms for the optical units of dynamic devices –8– Thin film filter mechanical control type Same as VOA MEMS type Same as VOA MEMS type Pigtail Insertion loss increase Centre-wavelength change FWHM increase Insertion loss increase Centre-wavelength change Return loss decrease PDL increase FWHM increase Tunable wavelength range decrease Thin film filter degradation Same as VOA MEMS type Relevant tests Damp heat Same as VOA mechanical type Driving power increase Degradation of moving part High humidity (nonhermetic sealed) Same as VOA mechanical type Degradation acceleration factors Uncontrollable Failure modes Stacking the moving part Known failure mechanisms Collimator Moving part Constitution parts 61300-2-19 IEC references TR 62343-6-6 © IEC:2011(E) Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe (electrical control) Tunable filters Dynamic devices Table (continued) – 14 – VIPA type Pigtail Optical parts and collimator Distortion of VIPA mirror VIPA mirror Same as VOA MEMS type (3D mirror distortion) Dislocation of fixing points of optical parts Temperature uncontrollable Degradation of stepping motor Known failure mechanisms Moving part Constitution parts Mechanical stress Mechanical stress High humidity (nonhermetic sealed and using adhesive) Thermal stress Mechanical stress High humidity (nonhermetic) Insertion loss increase Insertion loss increase Centre-wavelength change Dynamic range of DC decrease GDR increase Thermal stress Centre-wavelength change Mechanical stress High humidity (nonhermetic) Insertion loss increase GDR increase Thermal stress Centre-wavelength change High humidity (nonhermetic) Excess driving Thermal stress Dynamic range of CD decrease Degradation acceleration factors Uncontrollable Failure modes 61300-2-22 61300-2-19 61300-2-18 61300-2-9 61300-2-1 Change of temperature Damp heat High temperature Shock (storage) Vibration (storage) Change of temperature Damp heat High temperature Shock (storage) Vibration (storage) Under study 61300-2-19 61300-2-22 61300-2-19 61300-2-18 61300-2-9 61300-2-1 61300-2-22 61300-2-19 61300-2-18 61300-2-9 61300-2-1 61300-2-22 Under study 61300-2-9 61300-2-1 Understudy IEC references Shock (storage) Vibration (storage) Shock and vibration (operating) Change of temperature Maximum absolute rating test On/off driving test Damp heat Change of temperature Damp heat High temperature Shock (storage) Vibration (storage) Relevant tests – 15 – Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe Dynamic chromatic dispersion compensators Dynamic devices Table (continued) TR 62343-6-6 © IEC:2011(E) FBG thermal control type Insertion loss increase Wavelength range change CD changing GDR increase Fibre bending Refractive index changing Same as VOA MEMS type Fixing point between FBG and temperature control FBG Pigtail CD changing Insertion loss increase Wavelength range change Dynamic range of CD decrease Failure modes TEC/heater degradation Known failure mechanisms Thermal control part Constitution parts High temperature Mechanical stress High humidity (nonhermetic) Thermal stress Excess driving Mechanical stress High humidity (nonhermetic) Thermal stress Degradation acceleration factors High temperature Change of temperature Damp heat High temperature Shock (storage) Vibration (storage) Maximum absolute rating test On/off driving test Change of temperature Damp heat Shock (storage) Vibration (storage) Relevant tests 61300-2-18 Under study 61300-2-22 61300-2-19 61300-2-9 61300-2-1 61300-2-22 61300-2-19 61300-2-18 61300-2-9 61300-2-1 Understudy IEC references TR 62343-6-6 © IEC:2011(E) Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe Dynamic chromatic dispersion compensators Dynamic devices Table (continued) – 16 – Planar waveguide type Magnet optic type Same as VOA MEMS type Same as VOA MEMS type Refractive index changing Collimator Pigtail Waveguide Dislocation by the degradation of adhesive Same as VOA MEMS type Fixing point between waveguide and fibres Pigtail Electrode degradation Dislocation of magnet, Faraday rotator and birefringent crystal Known failure mechanisms Magnet optic part Constitution parts Same as VOA PLC TO type Same as VOA PLC TO type Insertion loss increase Same as VOA PLC TO type Same as VOA MEMS type Same as VOA MO type Degradation acceleration factors Insertion loss increase Tilt change Return loss decrease PDL increase WDL increase Dynamic range of tilt change Insertion loss increase Tilt change Return loss decrease PDL increase WDL increase Insertion loss increase Tilt change Return loss decrease PDL increase WDL increase Failure modes Relevant tests IEC references – 17 – Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe Dynamic gain tilt equalizers Dynamic devices Table (continued) TR 62343-6-6 © IEC:2011(E) Liquid crystal and diffractive grating type MEMS and diffractive grating type Same as VOA MEMS type Degradation of LCD Pigtail LCD Same as VOA LCD type Same as DCE MEMS type Uncontrollable Insertion loss increase Attenuation change Return loss decrease Dynamic range of attenuation decrease PDL increase WDL increase Dislocation of fixing points of optical parts Same as VOA MEMS type Pigtail Same as VOA LCD type Same as VOA LCD type Freezing of LCD Insertion loss increase Attenuation change Return loss decrease Dynamic range of attenuation decrease PDL increase WDL increase Uncontrollable Thermal stress High humidity (nonhermetic sealed and using adhesive) Mechanical stress Diffractive grating, lens, prism and Collimator Electrical polarization of LCD Dislocation of fixing points of optical parts Same as VOA MEMS type Same as VOA MEMS type Distortion of hinge/mirror Reflectance of mirror changing Same as VOA MEMS type Insertion loss increase Attenuation change Return loss decrease Dynamic range of attenuation decrease PDL increase WDL increase Insertion loss increase Attenuation change Return loss decrease PDL increase WDL increase Insertion loss increase Attenuation change Return loss decrease Dynamic range of attenuation decrease PDL increase WDL increase Degradation acceleration factors Uncontrollable Failure modes Stacking the moving part Known failure mechanisms Diffractive grating, lens, prism and Collimator MEMS Constitution parts Change of temperature High temperature Damp heat Shock (storage) Vibration (storage) Relevant tests 61300-2-22 61300-2-18 61300-2-19 61300-2-9 61300-2-1 IEC references TR 62343-6-6 © IEC:2011(E) Copyrighted material licensed to BR Demo by Thomson Reuters (Scientific), Inc., subscriptions.techstreet.com, downloaded on Nov-28-2014 by James Madison No further reproduction or distribution is permitted Uncontrolled when printe Dynamic channel equalizers Dynamic devices Table (continued) – 18 –