BS EN 60512-28-100:2013 BSI Standards Publication Connectors for electrical equipment — Tests and measurements Part 28-100: Signal integrity tests up to 000 MHz on IEC 60603-7 and IEC 61076-3 series connectors — Tests 28a to 28g BRITISH STANDARD BS EN 60512-28-100:2013 National foreword This British Standard is the UK implementation of EN 60512-28-100:2013 It is identical to IEC 60512-28-100:2013 The UK participation in its preparation was entrusted to Technical Committee EPL/48, Electromechanical components and mechanical structures for electronic equipment A list of organizations represented on this committee can be obtained on request to its secretary This publication does not purport to include all the necessary provisions of a contract Users are responsible for its correct application © The British Standards Institution 2013 Published by BSI Standards Limited 2013 ISBN 978 580 70490 ICS 31.220.10 Compliance with a British Standard cannot confer immunity from legal obligations This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 April 2013 Amendments issued since publication Amd No Date Text affected BS EN 60512-28-100:2013 EUROPEAN STANDARD EN 60512-28-100 NORME EUROPÉENNE EUROPÄISCHE NORM April 2013 ICS 31.220.10 English version Connectors for electronic equipment Tests and measurements Part 28-100: Signal integrity tests up to 000 MHz on IEC 60603-7 and IEC 61076-3 series connectors - Tests 28a to 28g (IEC 60512-28-100:2013) Connecteurs pour équipements électroniques - Essais et mesures Partie 28-100: Essais d'intégrité des signaux jusqu'à 000 MHz sur les connecteurs des séries CEI 60603-7 et CEI 61076-3 Essais 28a 28g (CEI 60512-28-100:2013) Steckverbinder für elektronische Einrichtungen Mess- und Prüfverfahren Teil 28-100: Signalintegritätsprüfungen bis 000 MHz an Steckverbindern der Reihen IEC 60603-7 und IEC 61076-3 Prüfungen 28a bis 28g (IEC 60512-28-100:2013) This European Standard was approved by CENELEC on 2013-03-13 CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member This European Standard exists in three official versions (English, French, German) A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels © 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members Ref No EN 60512-28-100:2013 E BS EN 60512-28-100:2013 EN 60512-28-100:2013 Foreword The text of document 48B/2322/FDIS, future edition of IEC 60512-28-100, prepared by SC 48B “Connectors” of IEC/TC 48 “Electromechanical components and mechanical structures for electronic equipment” was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60512-28-100:2013 The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2013-12-13 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2016-03-13 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights Endorsement notice The text of the International Standard IEC 60512-28-100:2013 was approved by CENELEC as a European Standard without any modification BS EN 60512-28-100:2013 EN 60512-28-100:2013 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies Publication Year Title EN/HD Year IEC 60050-581 - International Electrotechnical Vocabulary (IEV) Part 581: Electromechanical components for electronic equipment - - IEC 60512-1 - Connectors for electronic equipment Tests and measurements Part 1: General EN 60512-1 - Connectors for electronic equipment Tests and measurements Part 26-100: Measurement setup, test and reference arrangements and measurements for connectors according to IEC 60603-7 - Tests 26a to 26g EN 60512-26-100 2008 IEC 60512-26-100 2008 IEC 60603-7 Series Connectors for electronic equipment EN 60603-7 Series IEC 61076-1 - Connectors for electronic equipment Product requirements Part 1: Generic specification EN 61076-1 - IEC 61076-3-104 - Connectors for electronic equipment Product requirements Part 3-104: Detail specification for 8-way, shielded free and fixed connectors for data transmissions with frequencies up to 000 MHz EN 61076-3-104 - IEC 61076-3-110 - Connectors for electronic equipment EN 61076-3-110 Product requirements Part 3-110: Detail specification for shielded, free and fixed connectors for data transmission with frequencies up to 000 MHz - IEC 61156 Series Multicore and symmetrical pair/quad cables for digital communications Part 1-2: Electrical transmission characteristics and test methods of symmetrical pair/quad cables - IEC 61156-6 - - Multicore and symmetrical pair/quad cables for digital communications Part 6: Symmetrical pair/quad cables with transmission characteristics up to 000 MHz - Work area wiring - Sectional specification BS EN 60512-28-100:2013 EN 60512-28-100:2013 Publication Year Title EN/HD Year IEC 61169-16 - Radio-frequency connectors EN 61169-16 Part 16: RF coaxial connectors with inner diameter of outer conductor mm (0,276 in) with screw coupling - Characteristic impedance 50 ohms (75 ohms) (Type N) - IEC 62153-4-12 - Metallic communication cable test methods - Part 4-12: Electromagnetic compatibility (EMC) - Coupling attenuation or screening attenuation of connecting hardware Absorbing clamp method - ISO/IEC 11801 - Information technology - Generic cabling for customer premises - BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 CONTENTS Scope Normative references Terms, definitions and acronyms 3.1 Terms and definitions 3.2 Acronyms Overall test arrangement Test instrumentation Measurement precautions Mixed mode S-parameter nomenclature 10 Coaxial cables and interconnect for network analysers 11 Requirements for switching matrices 11 Test fixture requirements 12 Requirements for termination performance at calibration plane 13 Reference loads for calibration 13 Calibration 14 Termination loads for termination of conductor pairs 14 4.10.1 General 14 4.10.2 Verification of termination loads 15 4.11 Termination of screens 15 4.12 Test specimen and reference planes 15 4.12.1 General 15 4.12.2 Interconnections between device under test (DUT) and the calibration plane 16 4.13 Overall test setup requirements 18 Connector measurement up to 000 MHz 18 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 4.10 5.1 5.2 5.3 5.4 General 18 Insertion loss, Test 28a 19 5.2.1 Object 19 5.2.2 Connecting hardware insertion loss 19 5.2.3 Test method 19 5.2.4 Test set-up 19 5.2.5 Procedure 19 5.2.6 Test report 20 5.2.7 Accuracy 20 Return loss, Test 28b 20 5.3.1 Object 20 5.3.2 Connecting hardware return loss 20 5.3.3 Test method 20 5.3.4 Test set-up 21 5.3.5 Procedure 21 5.3.6 Test report 21 5.3.7 Accuracy 21 Near-end crosstalk (NEXT), Test 28c 21 5.4.1 Object 21 5.4.2 Connecting hardware NEXT 21 BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 5.4.3 Test method 21 5.4.4 Test set-up 22 5.4.5 Procedure 22 5.4.6 Test report 23 5.4.7 Accuracy 23 5.5 Far-end crosstalk (FEXT), Test 28d 23 5.5.1 Object 23 5.5.2 Connecting hardware FEXT 23 5.5.3 Test method 23 5.5.4 Test set-up 23 5.5.5 Procedure 24 5.5.6 Test report 24 5.5.7 Accuracy 24 5.6 Transfer impedance (Z T ), Test 28e 25 5.7 Transverse conversion loss (TCL), Test 28f 25 5.7.1 Object 25 5.7.2 Connecting hardware TCL 25 5.7.3 Test method 25 5.7.4 Test set-up 25 5.7.5 Procedure 25 5.7.6 Test report 26 5.7.7 Accuracy 26 5.8 Transverse conversion transfer loss (TCTL), Test 28g 26 5.8.1 Object 26 5.8.2 Connecting hardware TCTL 26 5.8.3 Test method 27 5.8.4 Test set-up 27 5.8.5 Procedure 27 5.8.6 Test report 27 5.8.7 Accuracy 27 5.9 Coupling attenuation 28 Annex A (informative) Example derivation of mixed mode parameters using the modal decomposition technique 29 Annex B (informative) Test pins – Dimensions and references 32 Bibliography 33 Figure – Diagram of a single ended port device 10 Figure – Diagram of a balanced port device 10 Figure – Calibration of reference loads 14 Figure – Resistor termination networks 15 Figure – Definition of reference planes 16 Figure – Insertion loss and TCTL measurement 20 Figure – NEXT measurement 22 Figure – FEXT measurement 24 Figure 10 – Return loss and TCL measurement 25 Figure A.1 – Voltage and current on balanced DUT 29 Figure A.2 – Voltage and current on unbalanced DUT 30 BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 Figure B.1 – Example of pin and fixed connector dimensions 32 Table – Mixed mode S-parameter nomenclature 11 Table – Switch performance recommendations 12 Table – Test fixture requirements 13 Table – Requirements for terminations at calibration plane 13 Table – Interconnection DM return loss requirements 18 Table – Overall test setup requirements 18 BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 –7– CONNECTORS FOR ELECTRONIC EQUIPMENT – TESTS AND MEASUREMENTS – Part 28-100: Signal integrity tests up to 000 MHz on IEC 60603-7 and IEC 61076-3 series connectors – Tests 28a to 28g Scope This part of IEC 60512 specifies the test methods for transmission performance for IEC 60603-7 and IEC 61076-3 series connectors up to 000 MHz It is also suitable for testing lower frequency connectors, however the test methodology specified in the detailed specification for any given connector remains the reference conformance test for that connector The test methods provided here are: – insertion loss, test 28a; – return loss, test 28b; – near-end crosstalk (NEXT) test 28c; – far-end crosstalk (FEXT), test 28d; – transverse conversion loss (TCL), test 28f; – transverse conversion transfer loss (TCTL), test 28g For the transfer impedance (ZT) test, see IEC 60512-26-100, test 26e For the coupling attenuation, see IEC 62153-4-12 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies IEC 60050-581, International Electrotechnical Vocabulary (IEV) – Part 581: Electromechanical components for electronic equipment IEC 60512-1, Connectors for electronic equipment – Tests and measurements – Part 1: General IEC 60512-26-100:2008, Connectors for electronic equipment – Tests and measurements – Part 26-100: Measurement setup, test and reference arrangement and measurements for connectors according to IEC 60603-7 – Tests 26a to 26g IEC 60603-7 (all parts), Connectors for electronic equipment IEC 61076-1, Connectors for electronic equipment – Product requirements – Part 1: Generic specification BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 5.3.4 – 21 – Test set-up The test set-up consists of a network analyser and two test fixtures as described in Clause An illustration of the test set-up, which also shows the termination principles, is shown in Figure 10 Resistor termination networks in accordance with 4.10 shall be applied for all inactive pairs Interconnects (if used) shall be prepared and controlled per 4.12.1 Return loss may be measured in a test set-up using only one fixture and a two port SE calibration and measurement In this case, the return loss is measured in only one direction at a time 5.3.5 Procedure 5.3.5.1 Calibration A full four port SE calibration shall be performed at the calibration planes in accordance with 4.9 Reference loads used for calibration shall be in accordance with 4.8 5.3.5.2 Measurement The DUT shall be arranged in a test set-up according to 5.2.4 and Figure 7, including proper termination of the active and inactive pairs A full SE S-matrix measurement shall be performed The measured SE S-matrix shall be transformed into the associated mixed mode S-matrix to obtain the S-parameters S DD11 and S DD22 from which the return loss is determined Test all conductor pairs in both directions and record the results 5.3.6 Test report The test results shall be reported in graphical or table format with the specification limits shown on the graphs or in the table at the same frequencies as specified in the relevant detail specification Results for all pairs shall be reported It shall be explicitly noted if the test results exceed the test limits 5.3.7 Accuracy The return loss of the load for calibration is verified to be greater than 46 dB up to 100 MHz and greater than 40 dB at higher frequencies The uncertainty of the connection between the connector under test and the test fixture is expected to deteriorate the return loss of the setup (effectively the directional bridge implemented by the test set-up) by dB The accuracy of the return loss measurements is then equivalent to measurements performed by a directional bridge with a directivity of 40 dB and 34 dB 5.4 5.4.1 Near-end crosstalk (NEXT), Test 28c Object The object of this test procedure is to measure the magnitude of the electric and magnetic coupling between the near ends of a disturbing and disturbed pair of a connecting hardware pair combination 5.4.2 Connecting hardware NEXT Connecting hardware shall be tested for NEXT in both directions using at least one free connector 5.4.3 Test method NEXT is evaluated from the mixed mode parameter S DD21 for all conductor pair combinations The mixed mode S-parameters are derived by transformation of the measured SE S-matrix – 22 – 5.4.4 BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 Test set-up The test set-up consists of a network analyser and a test fixture as described in Clause An illustration of the test set-up, which also shows the termination principles, is shown in Figure Resistor termination networks in accordance with 4.10 shall be applied for all inactive pairs and for the ends of active pairs not being connected to the network analyser ports Interconnects (if used) shall be prepared and controlled per 4.12.1 DUT NA Port 50 Ω NA Port 50 Ω NA Port 50 Ω NA Port 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω Screen (if applicable) Calibration plane Reference plane Reference plane Calibration plane IEC 345/13 Figure – NEXT measurement 5.4.5 5.4.5.1 Procedure Calibration A full four port SE calibration shall be performed at the calibration planes in accordance with 4.9 Reference loads used for calibration shall be in accordance with 4.8 5.4.5.2 Establishment of noise floor The noise floor of the set-up shall be measured The level of the noise floor is determined by white noise, which may be reduced by increasing the test power and by reducing the bandwidth of the network analyser, and by residual crosstalk within the test fixture The noise floor shall be measured by terminating the test ports of the test fixture with resistor termination networks and performing a full SE S-matrix measurement The measured SE Smatrix is transformed into the associated mixed mode S-matrix to obtain the S-parameter S DD21 from which the noise floor is established The noise floor shall be established for all possible conductor pair combinations The noise floor shall be 20 dB lower than any specified limit for the crosstalk If the measured value is closer to the noise floor than 20 dB, this shall be reported For high crosstalk values, it may be necessary to screen the terminating resistors BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 5.4.5.3 – 23 – Measurement The DUT shall be arranged in a test set-up according to 5.4.4 and Figure 8, including proper termination of the active and inactive pairs A full SE S-matrix measurement shall be performed The measured SE S-matrix shall be transformed into the associated mixed mode S-matrix to obtain the S-parameter S DD21 from which NEXT is determined The test has to be performed from both ends of the connecting hardware Test all conductor pair combinations and record the results 5.4.5.4 Determining pass and fail The NEXT of the connecting hardware shall satisfy the requirements of the relevant detail specification for all pair combinations and in both directions 5.4.6 Test report The test results shall be reported in graphical or table format with the specification limits shown on the graphs or in the table at the same frequencies as specified in the relevant detail specification Results for all pairs shall be reported It shall be explicitly noted if the test results exceed the test limits 5.4.7 Accuracy The accuracy shall be better than ±1 dB at measurements up to 60 dB and ±2 dB at measurements up to 85 dB 5.5 5.5.1 Far-end crosstalk (FEXT), Test 28d Object The object of this test procedure is to measure the magnitude of the electric and magnetic coupling between the near end of a disturbing pair and the far end of disturbed pair of a connecting hardware pair combination 5.5.2 Connecting hardware FEXT Connecting hardware shall be tested for FEXT in both directions using at least one free connector 5.5.3 Test method FEXT is evaluated from the mixed mode parameter S DD21 for all conductor pair combinations The mixed mode S-parameters are derived by transformation of the measured SE S-matrix 5.5.4 Test set-up The test set-up consists of a network analyser and two test fixtures as described in Clause An illustration of the test set-up, which also shows the termination principles, is shown in Figure Resistor termination networks in accordance with 4.10 shall be applied for all inactive pairs and for the ends of active pairs not being connected to the network analyser ports Interconnects (if used) shall be prepared and controlled per 4.12.1 – 24 – DUT NA Port BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 50 Ω NA Port 50 Ω NA Port 50 Ω 50 Ω NA Port 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω Screen (if applicable) Calibration plane Reference plane Reference plane Calibration plane IEC 346/13 Figure – FEXT measurement 5.5.5 5.5.5.1 Procedure Calibration A full four port SE calibration shall be performed at the calibration planes in accordance with 4.9 Reference loads used for calibration shall be in accordance with 4.8 5.5.5.2 Establishment of noise floor The noise floor of the set up is established as outlined in 5.4.5.2 5.5.5.3 Measurement The DUT shall be arranged in a test set-up according to 5.5.4 and Figure 9, including proper termination of the active and inactive pairs A full SE S-matrix measurement shall be performed The measured SE S-matrix shall be transformed into the associated mixed mode S-matrix to obtain the S-parameter S DD21 from which FEXT is determined Test all conductor pair combinations and record the results 5.5.6 Test report The test results shall be reported in graphical or table format with the specification limits shown on the graphs or in the table at the same frequencies as specified in the relevant detail specification Results for all pair combinations shall be reported It shall be explicitly noted if the test results exceed the test limits 5.5.7 Accuracy The accuracy shall be better than ±1 dB at measurements up to 60 dB and ±2 dB at measurements up to 85 dB BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 5.6 – 25 – Transfer impedance (Z T ), Test 28e Refer to test 26e of IEC 60512-26-100 5.7 Transverse conversion loss (TCL), Test 28f 5.7.1 Object The object of this test is to measure the mode conversion (differential to common mode) of a signal in the conductor pairs of the DUT This is also called unbalance attenuation or Transverse Conversion Loss, TCL 5.7.2 Connecting hardware TCL Connecting hardware shall be tested for TCL from both directions using at least one free connector 5.7.3 Test method TCL is evaluated from the mixed mode parameter S CD11 for all conductor pairs The mixed mode S-parameters are derived by transformation of the measured SE S-matrix 5.7.4 Test set-up The test set-up consists of a network analyser and a test fixture as described in Clause An illustration of the test set-up, which also shows the termination principles, is shown in Figure 10 Resistor termination networks in accordance with 4.10 shall be applied for all inactive pairs and for the ends of active pairs not being connected to the network analyser ports Interconnects (if used) shall be prepared and controlled per 4.12.1 DUT NA Port 50 Ω NA Port 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω 50 Ω Screen (if applicable) IEC 347/13 Figure 10 – Return loss and TCL measurement 5.7.5 5.7.5.1 Procedure Calibration A full two port SE calibration shall be performed at the calibration plane in accordance with 4.9 Reference loads used for calibration shall be in accordance with 4.8 – 26 – 5.7.5.2 BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 Noise floor The noise floor of the set-up shall be measured The level of the noise floor is determined by white noise, which may be reduced by increasing the test power and by reducing the bandwidth of the network analyser, and by residual intermodal crosstalk within the test fixture The noise floor, a noise , shall be measured by terminating the test ports of the test fixture with resistor termination networks and performing a full SE S-matrix measurement The measured SE S-matrix is transformed into the associated mixed mode S-matrix to obtain the Sparameter S CD11 from which the noise floor is calculated as anoise = −20 log SCD11 (2) The noise floor shall be established for all conductor pairs The noise floor shall be 20 dB lower than any specified limit for balance If the measured value is closer to the noise floor than 10 dB, this shall be reported 5.7.5.3 Measurement The DUT shall be arranged in a test set-up according to 5.7.4 and Figure 10, including proper termination of the active and inactive pairs A full SE S-matrix measurement shall be performed The measured SE S-matrix shall be transformed into the associated mixed mode S-matrix to obtain the S-parameter S CD11 from which TCL is calculated as TCL = −20 log S CD11 (3) The test has to be performed from the free connector end of the connecting hardware Test all conductor pairs and record the results 5.7.6 Test report The test results shall be reported in graphical or table format with the specification limits shown on the graphs or in the table at the same frequencies as specified in the relevant detail specification Results for all pairs shall be reported It shall be explicitly noted if the test results exceed the test limits 5.7.7 Accuracy The accuracy shall be better than ±1 dB at the specification limit 5.8 5.8.1 Transverse conversion transfer loss (TCTL), Test 28g Object The object of this test is to measure the mode conversion (differential to common mode) of a signal in the conductor pairs of the DUT at the far end This is also called far end unbalance attenuation or Transverse Conversion Transfer Loss, TCTL 5.8.2 Connecting hardware TCTL Connecting hardware shall be tested for TCTL from both directions using at least one free connector BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 5.8.3 – 27 – Test method TCTL is evaluated from the mixed mode parameter S CD21 for all conductor pairs The mixed mode S-parameters are derived by transformation of the measured SE S-matrix 5.8.4 Test set-up The test set-up consists of a network analyser and two test fixtures as described in Clause An illustration of the test set-up, which also shows the termination principles, is shown in Figure Resistor termination networks in accordance with 4.10 shall be applied for all inactive pairs Interconnects (if used) shall be prepared and controlled per 4.12.1 5.8.5 5.8.5.1 Procedure Calibration A full four port SE calibration shall be performed at the calibration planes in accordance with 4.9 Reference loads used for calibration shall be in accordance with 4.8 5.8.5.2 Noise floor The noise floor of the test set-up shall be measured using the same approach as outlined in 5.7.5.2 adapted to the four port test set-up used for TCTL The noise floor a noise is calculated from S CD21 as: a noise = −20 log S CD 21 (4) The same requirements as described in 5.7.5.2 for TCL measurements apply 5.8.5.3 Measurement The DUT shall be arranged in a test set-up according to 5.8.4 and Figure 7, including proper termination of the active and inactive pairs A full SE S-matrix measurement shall be performed The measured (four port) SE S-matrix shall be transformed into the associated (two port) mixed mode S-matrix to obtain the S-parameter S CD21 from which TCTL is calculated as TCTL = −20 log S CD 21 (5) The test has to be performed from the free connector end of the connecting hardware Test all conductor pairs and record the results 5.8.6 Test report The test results shall be reported in graphical or table format with the specification limits shown on the graphs or in the table at the same frequencies as specified in the relevant detail specification Results for all pairs shall be reported It shall be explicitly noted if the test results exceed the test limits 5.8.7 Accuracy The accuracy shall be better than ±1 dB at the specification limit – 28 – 5.9 BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 Coupling attenuation Coupling attenuation measurements, when required by the detail specification, apply only to shielded connectors Coupling attenuation shall be performed per IEC 62153-4-12, over the frequency range of 30 MHz to 000 MHz BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 – 29 – Annex A (informative) Example derivation of mixed mode parameters using the modal decomposition technique It is not a requirement of this standard to require that a full derivation is produced, and any method of extracting the required S-Parameters is acceptable This may be achieved by the use of network analyser hardware functions, specific mathematical software, or by circuit simulation tools The following informative annex presents a summary of how to derive mixed mode parameters from 4-port measurements of S-parameters Where V is the voltage and I is the current, see Figure A.1: V1 I1 I3 I2 I4 V3 V4 V2 IEC 348/13 Figure A.1 – Voltage and current on balanced DUT An impedance matrix (Z) of the DUT can be calculated based on Formula A.1 Z11 V1 Z21 V2 � �=� V3 Z31 V4 Z41 m Z12 Z22 Z32 Z42 Z13 Z23 Z33 Z43 Z14 I1 Z24 I2 �� � Z34 I3 Z44 I4 (A.1) The modal domain impedance matrix [Z ] is then calculated from Formula A.2 below, using the conversion matrices given in Formula A.3 and Formula A.4 Z m = Pe−1 ZQ e Pe−1 = � P −1 Q Qe = � 0 � P −1 � Q (A.2) (A.3) (A.4) In the case of a pair DUT, the size of the conversion matrices becomes 4x4 with the values given in Formula A.5 and Formula A.6 P=� − 1 � (A.5) BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 – 30 – Q=� −1 1� (A.6) The conversion matrices replace the Balun transformers and are referred to as mathematical baluns, producing Formula A.7 and Formula A.8 VD1 V1 V V2 � � = Pe � C1 � V3 VD2 V4 VC2 (A.7) ID1 I1 I I2 � � = Q e � C1 � I3 ID2 I4 IC2 (A.8) Substituting Formula A.7 and Formula A.8 into Formula A.1we obtain Formula A.9 which is equivalent to a set of hybrid transformers attached at each end of the cable pair as described in Figure A.2 𝐙𝐦 𝐕𝐃𝟏 ⎡ 𝟏𝟏 𝐙𝐦 𝐕 � 𝐂𝟏 � = ⎢ 𝟐𝟏 𝐦 𝐕𝐃𝟐 ⎢𝐙𝟑𝟏 𝐦 𝐕𝐂𝟐 ⎣𝐙𝟒𝟏 ID1 VD1 𝐦 𝐙𝟏𝟑 𝐦 𝐙𝟐𝟑 𝐦 𝐙𝟑𝟑 𝐦 𝐙𝟒𝟑 I1 𝐦 𝐙𝟏𝟒 𝐈𝐃𝟏 𝐦⎤ 𝐙𝟐𝟒 ⎥ 𝐈𝐂𝟏 𝐦 �𝐈 � 𝐙𝟑𝟒 ⎥ 𝐃𝟐 𝐦 𝐙𝟒𝟒 ⎦ 𝐈𝐂𝟐 I3 V1 IC2 VC1 𝐦 𝐙𝟏𝟐 𝐦 𝐙𝟐𝟐 𝐦 𝐙𝟑𝟐 𝐦 𝐙𝟒𝟐 (A.9) ID2 V3 I2 I4 V4 V2 VD2 IC2 VC2 IEC 349/13 Figure A.2 – Voltage and current on unbalanced DUT For the measurements concerned in this standard, S-parameters are measured and converted into Z-Parameters The Z-parameter matrix of a 2n-port circuits can derived using Formula A.10 1 Z = R2 [E + S][E − S]−1 R2 (A.10) Where E is a 2n x 2n unit matrix and R2 is given by Formula A.11 r ⎡√ √r2 R =⎢ ⎢ ⋮ ⎣ … ⋱ … 0 ⎤ ⋮ ⎥ ⎥ √r2n ⎦ (A.11) Where rx is the impedance of the measurement port, typically 50 Ω, giving Formula A.12 BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 – 31 – … ⎤ ⎡√50 ⋮ ⎥ √50 R =⎢ ⋱ ⎥ ⎢ ⋮ ⎣ … √50⎦ (A.12) The S-parameters in the modal domain are then calculated using Formula A.13, giving Formula A.14 − 1 S m = R m2 [Z m − R m ][Z m + R m ]−1 R2m Rm r ⎡√ m1 √rm2 =⎢ ⋮ ⎢ ⎣ … ⋱ (A.13) … 0 ⎤ ⋮ ⎥ ⎥ √rm2n ⎦ (A.14 By this method it is possible to convert unbalance network analyser measurements into mixed mode S-matrices which contain both balanced and unbalanced parameters, as in Formula A.15 S11 S21 � S31 S41 S12 S22 S32 S42 S13 S23 S33 S43 S14 SDD11 S24 S � ⇒ � CD11 S34 SDD21 S44 SCD21 SDC11 SCC11 SDC21 SCC21 SDD12 SCD12 SDD22 SCD22 SDC12 SCC12 � SDC22 SCC22 (A.15) BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 – 32 – Annex B (informative) Test pins – Dimensions and references This annex contains dimensions and references of commonly used test interface pins (see Figure B.1) Use of such items is not required by this standard but may allow increased compatibility of sample prepared for test with other test laboratories Dimension in millimeters ∅1,35 3,18 3,43 0,79 0,76 ∅1,78 ∅0,51 IEC 350/13 Key General tolerance: Linear = 0,127 mm Diameter = 0,05 mm Angular = 2° Figure B.1 – Example of pin and fixed connector dimensions Example of fixed connector description: Mill-Max 1001-0-15-15-30-27-04-0 Material: Brass alloy Contact: 30 = Standard finger contact Contact material: Beryllium copper Shell plating: 15 = 8,5 µm (10 µ") gold over nickel Contact plating: 27 = 25,4 µm (30 µ") gold over nickel Press-in 1,45 mm (0,057 in) mounting hole BS EN 60512-28-100:2013 60512-28-100 © IEC:2013 – 33 – Bibliography Modal decomposition (Non-Balun) measurement technique: Error analysis and application to UTP/STP characterisation to 500MHz – Koichi Yanagawa and Jon Cross, Proc International Wire and Cable Symposium, 1995, p.126-133 ITU-T Recommendation G.117, Transmission aspects of unbalance about earth ITU-T Recommendation O.9, Measuring arrangements to assess the degree of unbalance about earth _ This page deliberately left blank NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW British Standards Institution (BSI) BSI is the national body responsible for preparing British Standards and other standards-related publications, information and services BSI is incorporated by Royal Charter British Standards and other standardization products are published by BSI Standards Limited About us Revisions We bring together business, industry, government, consumers, innovators and others to 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