Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 BS EN 60191-6-18:2010 Incorporating corrigendum May 2010 BSI Standards Publication Mechanical standardization of semiconductor devices Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages — Design guide for ball grid array (BGA) NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW raising standards worldwide™ BRITISH STANDARD BS EN 60191-6-18:2010 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 National foreword This British Standard is the UK implementation of EN 60191-6-18:2010 It is identical to IEC 60191-6-18:2010, incorporating corrigendum May 2010 The start and finish of text introduced or altered by corrigendum is indicated in the text by tags Text altered by IEC corrigendum May 2010 is indicated in the text by tags ˆ‰ The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors A list of organizations represented on this committee can be obtained on request to its secretary This publication does not purport to include all the necessary provisions of a contract Users are responsible for its correct application © BSI 2010 ISBN 978 580 71947 ICS 31.080.01 Compliance with a British Standard cannot confer immunity from legal obligations This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 April 2010 Amendments/corrigenda issued since publication Date Text affected 31 October 2010 Implementation of IEC corrigendum May 2010 EUROPEAN STANDARD EN 60191-6-18 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 NORME EUROPÉENNE February 2010 EUROPÄISCHE NORM ICS 31.080.01 English version Mechanical standardization of semiconductor devices Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for ball grid array (BGA) (IEC 60191-6-18:2010) Normalisation mécanique des dispositifs semiconducteurs Partie 6-18: Règles générales pour la préparation des dessins d'encombrement des dispositifs semiconducteurs pour montage en surface Guide de conception pour les btiers matriciels billes (BGA) (CEI 60191-6-18:2010) Mechanische Normung von Halbleiterbauelementen Teil 6-18: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen Konstruktionsleitfaden für Ball-Grid-Array (BGA) (IEC 60191-6-18:2010) This European Standard was approved by CENELEC on 2010-02-01 CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member This European Standard exists in three official versions (English, French, German) A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung Central Secretariat: Avenue Marnix 17, B - 1000 Brussels © 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members Ref No EN 60191-6-18:2010 E BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) -2- Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Foreword The text of document 47D/753A/FDIS, future edition of IEC 60191-6-18, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-18 on 2010-02-01 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights CEN and CENELEC shall not be held responsible for identifying any or all such patent rights The following dates were fixed: – latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2010-11-01 – latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2013-02-01 Annex ZA has been added by CENELEC Endorsement notice The text of the International Standard IEC 60191-9-18:2010 was approved by CENELEC as a European Standard without any modification In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60191-6-2 NOTE Harmonized as EN 60191-6-2 IEC 60191-6-4 NOTE Harmonized as EN 60191-6-4 IEC 60191-6-5 NOTE Harmonized as EN 60191-6-5 -3- BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies Publication Year Title EN/HD Year IEC 60191-6 - Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages EN 60191-6 - BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) –4– Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 CONTENTS Scope .5 Normative references .5 Terms and definitions .5 Terminal position numbering Nominal package dimension .6 Symbols and drawings 7 Dimensions 10 Recommended BGA variations 16 Bibliography 20 Figure – Cavity down type Figure – Cavity up type Figure – Pattern of terminal position areas Figure – Example of the terminal depopulations 15 Table – Group 1: Dimensions appropriate to mounting and interchangeability 10 Table – Group 2: Dimensions appropriate to mounting and gauging 13 Table – Combinations of D, E, e, M D , M E , and n 14 Table – P-BGA (Cavity up) 1,27 mm pitch 16 Table – P-BGA (Cavity up) 1,0 mm pitch 16 Table – P-BGA (Cavity down) 1,27 mm pitch 18 Table – T-BGA 1,27 mm pitch 18 Table – T-BGA 1,0 mm pitch 19 Table – P-BGA and C-BGA (Flip-chip interconnection) 1,0 mm pitch 19 –5– BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA) Scope This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is mm or larger Normative references The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition of the referenced document applies IEC 60191-6, Mechanical standardization of semiconductor devices – Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Terms and definitions For the purposes of this document, the terms and definitions given IEC 60191 (series) and the following apply 3.1 ball grid array BGA ˆ package that has metal balls attached to one side of a substrate in a matrix of at least three rows and three columns; terminals may be missing from some row-column intersections NOTE BGA stands for “Ball Grid Array” in compliance with the existing standards (See Bibliography) 3.2 plastic ball grid array P-BGA BGA with a rigid organic substrate‰ 3.3 tape ball grid array T-BGA BGA with a polyimide tape substrate 3.4 ceramic ball grid array C-BGA BGA with a ceramic substrate 3.5 P-BGA (Flip chip interconnection) BGA with an organic substrate and a die bonded to a substrate through metal bumps Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) –6– 3.6 recommended BGA variation BGA variation with the specific dimensions and ball counts as the first choice for production packages other than recommended BGA variations are the least choice for production to avoid endless proliferation of BGA outlines Terminal position numbering When a package is viewed from the terminal side with the index corner in the bottom left corner position, terminal rows are lettered from bottom to top starting with A, then B, C,,,, AA, AB, etc., while terminal columns are numbered from left to right starting with Terminal positions are designated by a row-column grid system and shown as alphanumeric identification, e.g., A1, B1, or AC34 The letters I, O, Q, S, X and Z are not used for naming the terminal rows Nominal package dimension A nominal package dimension is defined as “the package width (E) × length (D)”, which is expressed in the tenths place in millimetre BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) –7– Symbols and drawings BGA outline is shown in the Figure and v E A B (7) D (3) (4) y1 S (1) A S A1 (8) A4 (9) v y (2) SE (10) (ZE) (2) e (11) S e MD (10) SD (7) E D C B A (ZD) Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 ME (6) ∅ bp ∅X1 M S A B (5) ∅X2 M S The symbols in this figure are explained in IEC 60191-6 Figure – Cavity down type IEC 2507/09 BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) –8– : v D (3) (4) S A A1 y1 (1) S (8) v y (10) (2) SE (ZE) (2) e S E D C B A (SD) (10) e MD (ZD) Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 E ME (6) ∅ bp (5) ∅X1 M S A B ∅X2 M S IEC 2508/09 The symbols in this figure are explained in IEC 60191-6 Figure – Cavity up type BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) –9– (1) Datum S is defined as the seating plane on which a package free stands by contact of the balls (2) The distance between the centrelines of any two adjacent rows or columns of balls (3) The hatched zone indicates the index-marking area where whole index mark will be contained (4) The profile tolerance that controls of package size and orientation is applied to all four sides of the package outline (5) The tolerance of position that controls the relationship of the balls applies to all balls (6) The terminal diameter “bp” is the maximum diameter of individual balls as measured in the plane parallel to the seating plane (7) It shows the lid made of mould compound, glob top resin, metal cap, ceramics, etc It may be flat, convex, or concave shape (8) The primary stand-off height is defined by the height from the seating plane to the package substrate (9) The secondary stand-off height is defined by the height from the seating plane to the lid that is the lowest surface on the cavity-down configuration (10) NOTE SD and SE are the dimensions that define the positions of balls next to the datum A and B An array pattern of permissible terminal-existing zones including true position tolerance is shown in Figure SE e e SD Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Notes relating to Figure and Figure 2: b3 max b3 max = bpmax + x IEC 2509/09 The symbols in this figure are explained in IEC 60191-6 Figure – Pattern of terminal position areas BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 – 10 – Dimensions Table – Group 1: Dimensions appropriate to mounting and interchangeability Unit: mm Term Nominal package dimension Package length Symbol E × D D Specification (1) A nominal package dimension is defined as “the package width (E ) × length (D )”, which is expressed in the tenths place in millimetre (2) Variations on nominal package dimensions are: (1) 7,0×7,0 25,0×25,0 8,0×8,0 27,0×27,0 9,0×9,0 29,0×29,0 10,0×10,0 31,0×31,0 11,0×11,0 33,0×33,0 12,0×12,0 35,0×35,0 13,0×13,0 37,5×37,5 14,0×14,0 40,0×40,0 15,0×15,0 42,5×42,5 16,0×16,0 45,0×45,0 17,0×17,0 47,5×47,5 18,0×18,0 50,0×50,0 19,0×19,0 52,5×52,5 20,0×20,0 55,0×55,0 21,0×21,0 57,5×57,5 23,0×23,0 60,0×60,0 Package length D 7,0 25,0 8,0 27,0 9,0 29,0 10,0 31,0 11,0 33,0 12,0 35,0 13,0 37,5 14,0 40,0 15,0 42,5 16,0 45,0 17,0 47,5 18,0 50,0 19,0 52,5 20,0 55,0 21,0 57,5 23,0 60,0 Recommended value Refer to Table through Refer to Table through BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) – 11 – Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Table (continued) Unit:mm Term Package width Symbol E Profile tolerance of package body v Profile height A Recommended value Specification (1) Refer to Table through Package width E 7,0 25,0 8,0 27,0 9,0 29,0 10,0 31,0 11,0 33,0 12,0 35,0 13,0 37,5 14,0 40,0 15,0 42,5 16,0 45,0 17,0 47,5 18,0 50,0 19,0 52,5 20,0 55,0 21,0 57,5 23,0 60,0 v = 0,20 - Profile tolerance includes body-edge burr A max 1,20 1,70 6,00 ”A” includes heat slug thickness, package warpage and tilt errors “A” does not include the height of external heat sink or chip capacitors Primary standoff height - A1 e A1 A1 nom A1 max 1,27 0,5 0,6 0,7 1,00 0,4 0,5 0,6 BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) – 12 – Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Table (continued) Unit mm Term Symbol Secondary stand-off height A4 Terminal grid pitch e Terminal diameter bp Positional tolerance with respect to the body datum Terminal-toterminal positional tolerance Coplanarity Recommended value Specification A4 = 0,25 − 1,27 − 1,00 − e bp bp nom bp max 1,27 0,60 0,75 0,90 1,00 0,50 0,60 0,70 e x1 1,27 0,30 1,00 0,25 e x2 1,27 0,15 1,00 0,10 x1 − x2 y Parallelism tolerance of the top surface y1 Center terminal(s) position in length SD Center terminal(s) position in width SE − e y 1,27 0,20 1,00 0,20 y = 0,35 When M D is an odd number, S D = − − When M D is an even number, S D = e /2 When M E is an odd number, S E = When M E is even number, S E = e /2 − – 13 – BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Table (continued) Unit mm Term Symbol Terminal matrix Specification Recommended value – Terminal balls will be placed on the matrix determined by terminal pitch e , matrix size M D and M E , and centre ball position S D and S E Any terminal balls may be omitted from the terminal matrix Number of terminals n Maximum matrix size in length MD Maximum matrix size in width ME Refer to Table Refer to Table through Table – Group 2: Dimensions appropriate to mounting and gauging Unit: mm Symbol Specification Recommended value Overhang dimension in length (Z D ) (Z D ) ={ D -(M D -1) × e } / – Overhang dimension in width (Z E ) (Z E ) ={ E -(M E -1) × e } / – Term BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) – 14 – Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Table – Combinations of D, E, e, MD, ME, and n e = 1,27 mm D and E M D max mm M E max n max M D max-1 M E max-1 e = 1,00 mm n max M D max M E max n max M D max-1 M E max-1 n max 7,0 25 16 36 25 8,0 36 25 49 36 9,0 36 25 64 49 10,0 49 36 81 64 11,0 64 49 10 100 81 12,0 81 64 11 121 10 100 13,0 10 100 81 12 144 11 121 14,0 10 100 81 13 169 12 144 15,0 11 121 10 100 14 196 13 169 16,0 12 144 11 121 15 225 14 196 17,0 13 169 12 144 16 256 15 225 18,0 13 169 12 144 17 289 16 256 19,0 14 196 13 169 18 324 17 289 20,0 15 225 14 196 19 361 18 324 21,0 16 256 15 225 20 400 19 361 23,0 18 324 17 289 22 484 21 441 25,0 19 361 18 324 24 576 23 529 27,0 21 441 20 400 26 676 25 625 29,0 22 484 21 441 28 784 27 729 31,0 24 576 23 529 30 900 29 841 33,0 25 625 24 576 32 1024 31 961 35,0 27 729 26 676 34 1156 33 1089 37,5 29 841 28 784 37 1369 36 1296 40,0 31 961 30 900 39 1521 38 1444 42,5 33 1089 32 1024 42 1764 41 1681 45,0 35 1225 34 1156 44 1936 43 1849 47,5 37 1369 36 1296 47 2209 46 2116 50,0 39 1521 38 1444 49 2401 48 2304 52,5 41 1681 40 1600 52 2704 51 2601 55,0 43 1849 42 1764 54 2916 53 2809 57,5 45 2025 44 1936 57 3249 56 3136 60,0 47 2209 46 2116 59 3481 58 3364 NOTE n max indicates the maximum number of terminals that can be accommodated in a package bottom The actual number of the terminals may be less than n max by depopulating terminals from the full matrix Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 – 15 – Full grid rows in perimeter matrix rows in perimeter matrix rows in perimeter matrix BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) rows in perimeter matrix IEC 2509/09 Index marking is in the left bottom corner Figure – Example of the terminal depopulations BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 – 16 – Recommended BGA variations Table – P-BGA (cavity up) 1,27 mm pitch D and E mm M e mm Number of rows in perimeter matrix Number of rows in centre matrix Number of terminals 27 20 1,27 256 27 20 1,27 4 272 27 20 1,27 300 27 20 1,27 316 27 20 1,27 336 27 20 1,27 352 31 23 1,27 304 31 23 1,27 329 31 23 1,27 360 31 23 1,27 5 385 31 23 1,27 408 31 23 1,27 433 35 26 1,27 352 35 26 1,27 388 35 26 1,27 420 35 26 1,27 456 35 26 1,27 480 35 26 1,27 6 516 40 30 1,27 576 40 30 1,27 640 40 30 1,27 644 40 30 1,27 708 Table – P-BGA (cavity up) 1,0 mm pitch D and E mm M e mm Number of rows in perimeter matrix Number of rows in centre matrix Number of terminals 13 12 1,00 Full Full 144 14 13 1,00 Full Full 169 15 14 1,00 Full Full 196 16 15 1,00 Full Full 225 17 16 1,00 Full Full 256 18 17 1,00 Full Full 289 19 18 1,00 Full Full 324 20 19 1,00 Full Full 361 21 20 1,00 256 BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) – 17 – Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Table (continued) D and E mm M e mm Number of rows in perimeter matrix Number of rows in centre matrix Number of terminals 21 20 1,00 292 21 20 1,00 Full Full 400 23 22 1,00 288 23 22 1,00 324 23 22 1,00 340 23 22 1,00 376 23 22 1,00 384 23 22 1,00 6 420 23 22 1,00 Full Full 484 27 26 1,00 352 27 26 1,00 388 27 26 1,00 420 27 26 1,00 456 27 26 1,00 480 27 26 1,00 6 516 27 26 1,00 Full Full 676 31 30 1,00 416 31 30 1,00 452 31 30 1,00 500 31 30 1,00 536 31 30 1,00 576 31 30 1,00 6 612 31 30 1,00 Full Full 900 35 33 1,00 464 35 33 1,00 545 35 33 1,00 560 35 33 1,00 641 35 33 1,00 648 35 33 1,00 729 35 33 1,00 728 35 33 1,00 809 35 33 1,00 Full Full 1089 37,5 36 1,00 512 37,5 36 1,00 10 612 37,5 36 1,00 620 37,5 36 1,00 10 720 37,5 36 1,00 812 37,5 36 1,00 10 912 37,5 36 1,00 896 BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) – 18 – Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Table (continued) D and E M e Number of rows in perimeter matrix Number of rows in centre matrix Number of terminals 37,5 36 1,00 10 996 37,5 36 1,00 Full Full 1296 40 38 1,00 768 40 38 1,00 10 868 40 38 1,00 868 40 38 1,00 10 968 40 38 1,00 Full Full 1444 Table – P-BGA (cavity down) 1,27 mm pitch D and E mm M e mm Number of rows in perimeter matrix Number of terminals 27 20 1,27 256 31 23 1,27 304 35 26 1,27 352 35 26 1,27 420 40 30 1,27 416 40 30 1,27 500 40 30 1,27 576 42,5 32 1,27 540 45 34 1,27 480 45 34 1,27 580 45 34 1,27 672 45 34 1,27 756 Table – T-BGA 1,27 mm pitch D and E mm M e mm Number of rows in perimeter matrix Number of terminals 27 20 1,27 256 31 23 1,27 304 35 26 1,27 352 35 26 1,27 420 35 26 1,27 480 40 30 1,27 500 40 30 1,27 576 40 30 1,27 644 BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) – 19 – Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Table – T-BGA 1,0 mm pitch D and E mm M e mm Number of rows in perimeter matrix Number of terminals 27 25 1,0 336 31 29 1,0 400 31 29 1,0 480 31 29 1,0 552 35 33 1,0 464 35 33 1,0 560 35 33 1,0 648 40 38 1,0 660 40 38 1,0 768 40 38 1,0 868 Table – P-BGA and C-BGA (Flip-chip interconnection) 1,0 mm pitch D and E mm M e mm Number of rows in perimeter matrix Number of terminals 23 22 1,0 Full 484 27 26 1,0 Full 676 31 30 1,0 Full 900 35 34 1,0 Full 1156 37,5 36 1,0 Full 1296 40 39 1,0 Full 1521 42,5 41 1,0 Full 1681 45 44 1,0 Full 1936 47,5 46 1,0 Full 2116 50 49 1,0 Full 2401 52,5 51 1,0 Full 2601 55 53 1,0 Full 2809 BS EN 60191-6-18:2010 EN 60191-6-18:2010 (E) – 20 – Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Bibliography IEC 60191-6-2, Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages IEC 60191-6-4, Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA) IEC 60191-6-5, Mechanical standardization of semiconductor devices – Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine-pitch ball grid array (FBGA) _ This page deliberately left blank Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 Licensed copy: Bradford University, University of Bradford, Version correct as of 17/04/2012 05:43, (c) The British Standards Institution 2012 British Standards Institution (BSI) BSI is the independent national body responsible for preparing British Standards and other standards-related publications, information and services It presents the UK view on standards in Europe and at the international level It is 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