BS EN 16602-60-05:2014 BSI Standards Publication Space product assurance — Generic procurement requirements for hybrids BS EN 16602-60-05:2014 BRITISH STANDARD National foreword This British Standard is the UK implementation of EN 16602-60-05:2014 The UK participation in its preparation was entrusted to Technical Committee ACE/68, Space systems and operations A list of organizations represented on this committee can be obtained on request to its secretary This publication does not purport to include all the necessary provisions of a contract Users are responsible for its correct application © The British Standards Institution 2014 Published by BSI Standards Limited 2014 ISBN 978 580 84271 ICS 49.140 Compliance with a British Standard cannot confer immunity from legal obligations This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 September 2014 Amendments issued since publication Date Text affected BS EN 16602-60-05:2014 EN 16602-60-05 EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM September 2014 ICS 49.140 English version Space product assurance - Generic procurement requirements for hybrids Assurance produit des projets spatiaux - exigences génériques d'approvisionement des composants hybrides Raumfahrtproduktsicherung - Allgemeine Beschaffungsanforderungen an Hybride This European Standard was approved by CEN on 13 March 2014 CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member This European Standard exists in three official versions (English, French, German) A version in any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels © 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members Ref No EN 16602-60-05:2014 E BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Table of contents Foreword Introduction Scope Normative references Terms, definitions and abbreviated terms 10 3.1 Terms from other standards 10 3.2 Terms specific to the present standard 10 3.3 Abbreviated terms 11 Sequence of procurement activities 13 Selection of hybrid microcircuit manufacturer 16 5.1 General 16 5.2 Hybrid microcircuit manufacturer categories 16 5.2.1 Category manufacturer (preferred case) 16 5.2.2 Category manufacturer (nonpreferred case) 16 Validation procedure for a hybrid microcircuit manufacturer 17 6.1 General 17 6.2 Hybrid circuit technology identification form (HTIF) 17 6.3 6.2.1 General .17 6.2.2 HTIF for approved manufacturers (category 1) 17 6.2.3 HTIF for manufacturer pending capability approval by the approving authority (category 1) 18 6.2.4 HTIF for manufacturer not approved by the approving authority (category 2) .18 Validation of category manufacturers 19 6.3.1 General .19 6.3.2 Construction analysis on representative samples 19 6.3.3 Quality and technical audit 19 Design requirements 21 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) 7.1 General 21 7.1.1 Overview 21 7.1.2 Design activities 21 7.2 Detail specification for hybrid circuits 22 7.3 Design approval (circuit type approval) 22 7.3.1 General .22 7.3.2 Procedure for a new hybrid circuit which is “non similar” to a reference circuit 23 7.3.3 Procedure for a new hybrid circuit which is “similar” to a reference circuit 24 7.3.4 Procedure for a “recurrent” hybrid circuit 24 Procurement of passive and active chips 25 8.1 8.2 8.3 8.4 General 25 8.1.1 Introduction .25 8.1.2 Selecting chip suppliers 27 8.1.3 Specifications 27 8.1.4 Requirements for chip lots 27 Procurement of passive chips 28 8.2.1 General .28 8.2.2 Bondability test 28 8.2.3 Lot acceptance test (LAT) 28 Procurement of active chips 29 8.3.1 General .29 8.3.2 Bondability test 30 8.3.3 User LAT 30 Procurement of hermetically encapsulated chips 32 Procurement of materials and piece parts 33 9.1 Overview 33 9.2 Selection of materials and piece parts 33 9.3 Specifications 33 9.4 Requirements for materials and piece parts 34 10 Manufacturing and screening of hybrid circuit lots 35 10.1 Manufacturing 35 10.2 Marking 35 10.2.1 General .35 10.2.2 Special cases 36 10.3 Screening .36 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) 10.3.1 General .36 10.3.2 Thermographic test 39 10.3.3 Preseal burnin 40 10.3.4 Photograph of circuits .40 10.3.5 Conditions for constant acceleration and mechanical shock 40 10.3.6 Test condition for PIND 40 10.3.7 Leak tests 41 10.3.8 Physical dimensions 41 10.3.9 Burnin test .41 10.3.10 Radiographic inspection 41 10.4 Lot rejection 41 10.4.1 Definition of failure modes 41 10.4.2 Criteria for lot rejection 42 10.4.3 Disposition of rejected lots 43 10.5 Repair provisions 43 10.5.1 General .43 10.5.2 Element replacement 43 10.5.3 Wire rebonding 43 10.5.4 Compound bonding 44 10.5.5 Delidding of hybrid circuits 44 11 Customer inspection and review 45 12 Lot acceptance tests for hybrid circuits 46 12.1 General 46 12.1.1 Overview 46 12.1.2 Samples 46 12.2 Category manufacturer 47 12.2.1 Option 1: Production lot control 47 12.2.2 Option 2: Lines under TRB management and statistical process control .48 12.3 Category manufacturer (validated for the project) 49 13 Hybrid delivery and data package 53 13.1 General 53 13.2 Data documentation 53 13.2.1 General .53 13.2.2 Cover sheets .54 13.2.3 Certificate of conformity 54 13.3 Packaging and despatch .54 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) 14 DPA test sequence 55 Bibliography 76 Figures Figure 4-1: Sequence of activities in the procurement of hybrid microcircuits 14 Figure 4-2: Hybrids procurement flow 15 Figure 8-1: Flow of Procurement of Active and Passive components 26 Figure 10-1: Screening test sequence 37 Figure 12-1: Lot acceptance tests for the first production lot manufactured by a category manufacturer 51 Tables Table 8-1: Sample size and acceptance criteria for LAT of passive chips 29 Table 8-2: Sample size and acceptance criteria for user LAT on active chips 31 Table 10-1: Test conditions for constant acceleration and mechanical shock 40 Table 12-1: Sample size for hybrids lot acceptance tests 47 Table 12-2: Lot acceptance tests and sample size 47 Table 12-3: Production acceptance tests and sampling 50 Table 12-4: Definition of tests .51 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Foreword This document (EN 16602-60-05:2014) has been prepared by Technical Committee CEN/CLC/TC “Space”, the secretariat of which is held by DIN This standard (EN 16602-60-05:2014) originates from ECSS-Q-ST-60-05C Rev This European Standard shall be given the status of a national standard, either by publication of an identical text or by endorsement, at the latest by March 2015, and conflicting national standards shall be withdrawn at the latest by March 2015 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights CEN [and/or CENELEC] shall not be held responsible for identifying any or all such patent rights This document has been prepared under a mandate given to CEN by the European Commission and the European Free Trade Association This document has been developed to cover specifically space systems and has therefore precedence over any EN covering the same scope but with a wider domain of applicability (e.g : aerospace) According to the CEN-CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Introduction The objective of this Standard is to define the requirements for the procurement of hybrid microcircuits for use in space systems This Standard covers the following requirement domains: • Validation procedure for a hybrid microcircuit manufacturer • Design of hybrid microcircuits • Procurement of active and passive chips • Procurement of materials and piece parts • Screening of hybrid microcircuit lots • Lot acceptance tests for hybrid microcircuits • Customer involvement, key inspection points • Repair provisions • Hybrids and data package delivery BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Scope The procurement requirements for hermetic hybrid microcircuits for use in space projects are defined in this Standard This Standard also provides details concerning the documentation requirements and the procedures relevant to obtain approval for the use of hybrid microcircuits in the fabrication of space systems and associated equipment The provisions of this Standard apply to all participants in the production of space systems, at all levels and are applicable to manned and unmanned spacecraft, launchers, satellites, payloads, experiments, and their corresponding organizations This standard may be tailored for the specific characteristic and constraints of a space project in conformance with ECSS-S-ST-00 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Encapsulation PID Conformance (C) Package type (see Note 8) C NC External dimensions (mm) C NC Body (bottomframe) C NC C NC External dimensions (mm) C NC Number of leads C NC Feedthrough type (see Note 10) C NC C NC C NC C NC If NC, references of specifications related to the material/process - base material - plating material/type (see Note 9) Leads - base material - plating material/type Supplier Lid/Cover - base material - plating material/type PID Conformance (C) Substrate to package attachment method C NC Material C NC Supplier C NC Sealing method C NC Comments 64 If NC, references of specifications related to the material/process BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) 10 Addedon component list Function Type Total number per type Supplier Comments Passive chips Active chips Encapsulated components Miscellaneous 65 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Notes: 0: General: write NA for not applicable - information 1: C = in conformance with the relevant PID 2: NC = no conformance with the relevant PID 3: Indicate whether used, for example, for multilayer construction, capacitor realization, resistors overglaze, wire crossover protection 4: Passive chip type, can include: - chip capacitor (for example multilayer ceramic capacitor chip, tantalum chip capacitor other type); - chip resistor (for example thick film resistor chip (e.g Alumina), thin film resistor chip (e.g Alumina, Silicon); - miniature coils (e.g inductor chip, transformer); 5: Active chip type, e.g diode, transistor, integrated circuit 6: Indicate whether the chip surface is passivated 7: Wire bonding method can be, for example, thermocompression, ultrasonic, thermosonic, parallel gap welding 8: Package type can be, for example, metallic or ceramic or platform plugin, solid sidewall plugin, flat pack Indicate also if low power or high power 9: Plating type can be, for example, electrolytic or electroless 10: Feedthrough type: for glasstometal seals, indicate if matched seals or compression seals Hybrid circuit topography a The HTIF shall include a photograph of the hybrid circuit showing the substrate(s) and all conductor patterns and active or passive elements deposited on it, as well as the semiconductor dies, as applicable (format ~ 20 cm × 27 cm) b This requirement may also be satisfied by the manufacturer’s assembly drawing with a minimum magnification of 10× A.2.2 a 66 Special remarks For category manufacturers, the HTIF shall be included as part of the PAD BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Annex B (normative) Format of the detail specification of a hybrid circuit - DRD B.1 DRD identification B.1.1 Requirement identification and source document This DRD is called up from ECSS-Q-ST-60-05, requirement 7.2a B.1.2 Purpose and objective The detail specification of a hybrid circuit is a document prepared by the manufacturer to provide the technical details of the hybrid circuit B.2 Expected response B.2.1 Response identification a The detail specification shall include a version index and a change form for configuration management b A cover page shall include a brief definition of the function performed and the product’s technological characteristics c The detail specification for each type of hybrid circuit shall constitute the tables and figures specified in B.2.2 B.2.2 Scope and content Table 1: Maximum ratings a This table shall include the limiting electrical, mechanical and thermal parameters b In particular, it shall specify the recommended methods for mounting the hybrid to the next level of assembly c The maximum values for the assembly process time and temperature shall be specified 67 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) d ESD sensitivity classification shall also be mentioned if applicable e Radiation tolerance shall be mentioned if applicable a This table shall list the parameters measured, their units, symbol, measurement conditions, and minimum and maximum values Table 3: Electrical measurements at high and low temperatures a This table shall list the parameters measured at high and low level temperatures b The high and low temperature values shall be taken by default +125 °C and -55 °C a Table 4: Parameter drifts This table shall list the electrical parameters before and after burnin with the maximum drift allowed Table 5: Burn-in conditions a This table shall list the oven temperature and power applied to comply with ECSS-Q-ST-60-05, clause 10.3.9 b This table shall be completed by a diagram defining the circuit excitation conditions a Table 6: Electrical measurements after endurance tests This table shall list the parameters measured, and the minimum and maximum values tolerated, after the life test at the ambient temperature and at high and low temperatures Table 7: Life-test conditions a This table shall list the oven temperature and power applied to comply with ECSS-Q-ST-60-05, clause 10.3.9 b A diagram defining the electrical excitation conditions, if these are different from Table 5, shall complete this table a 68 Table 2: Electrical measurements at ambient temperature with static and dynamic parameters Table 8: Content of the DPAs This table shall detail the content of the DPAs BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) a Figure 1: Drawing of package The detail specification shall include a drawing of package and dimensions with tolerance indications a Figure 2: Electrical diagram The detail specification shall include an electrical diagram of the hybrid circuit with assignment of inputs and outputs B.2.3 Special remarks None 69 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Identification New circuit Reference circuit Typereference Year of manufacture Detail specification HTIF Annex C (normative) Similarity form - DRD C.1 DRD identification C.1.1 Requirement identification and source document This DRD is called up from ECSS-Q-ST-60-05, requirement 7.3.1.2a C.1.2 Purpose and objective The similarity form is a proposal prepared by the supplier, to be used by the customer in combination with the hybrid circuit technology identification form (HTIF, see ECSS-Q-ST-60-05 Annex A) for the purpose of determining whether design approval for the new circuit can be acquired through similarity with a previously approved circuit type (referred to as the reference circuit) C.2 Expected response C.2.1 a 70 Scope and content The Similarity form shall be as in Table C-1 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Table C-1 Similarity form Description of the electrical function New circuit Reference circuit 71 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Similarity criteria New circuit Reference circuit Maximum power density Maximum use frequency Maximum voltage Maximum current Number of discrete active chips mounted Number of integrated circuit chips mounted Number of passive chips mounted Maximum size of active chips Maximum size of passive chips (specify the type) Maximum electrical charge for the most stressed chips Maximum electrical charge on the technological level (e.g wires, dielectric, printed conductors) C.2.2 a 72 Special remarks The similarity form shall be enclosed with the request for use (PAD) BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Annex D (informative) Technological family D.1 Definition of a technological family A hybrid technology family includes all the hybrids manufactured with the same materials and processes and the same assembly sequence (flow chart) defined in the PID The aspect of electrical function is not taken into account; only the manufacturing processes using the same materials and the same manufacturing equipment are considered D.2 Example of a hybrid technological family Hybrids are considered to be part of the same technological family if they have the following characteristics: • Use a plugin package of a defined material manufactured by manufacturer A • Use thick film processing on substrates (manufacturer B) with C, D, E inks and manufacturing equipment U • Have gluing of substrates using glue F and manufacturing equipment V • Have conductive gluing of parts using glue G and manufacturing equipment W • Have nonconductive gluing of parts using glue H and manufacturing equipment W • Have wiring by thermosonic bonding using 25 µm gold wire (manufacturer I) and manufacturing equipment X • Have wiring by ultrasonic bonding using 25 µm aluminium wire (manufacturer J) and manufacturing equipment Y • Have sealing by parallel seam welding using machine Z In a family, the most complex hybrids are candidates for being representative of that technological family 73 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) D.3 Associated statistical process control (SPC) on processes and examples of parameters or characteristics under control • • • • • 74 SPC on thick film substrate manufacturing: on process parameters, e.g machine settings, temperature profile, on product, e.g layer adhesion, resistivity, dimensions SPC on active and passive parts gluing: on process parameters, e.g machine settings, curing cycle, on product, e.g shear test SPC on thermosonic or ultrasonic bonding wiring: on process parameters, e.g machine settings, on product, e.g footprint dimension, bond pull test, breakdown category SPC on gluing of substrates: on process parameters, e.g machine settings, curing cycle, on product, e.g shear test SPC on sealing with parallel seam machine: on process parameters, e.g machine settings, baking profile, on product, e.g seal test, internal water vapour content test BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Annex E (informative) References [1] Introduction to Statistical Process Control, Douglas C Montgomery, John Wiley and Sons [2] Appliquer la maitrise statistique des procédés MSP/SPC, Maurice Pillet, 2nd Edition, Editions d’organisation 75 BS EN 16602-60-05:2014 EN 16602-60-05:2014 (E) Bibliography EN reference Reference in text Title EN 16601-00 ECSS-S-ST-00 ECSS system — Description and implementation and general requirements ESA-PSS-01-605 Capability approval programme for hermetic thinfilm hybrid microcircuits ESA-PSS-01-606 The capability approval programme for hermetic thickfilm hybrid microcircuits ESA-PSS-01-607 Check list for thickfilm hybrid microcircuits manufacturer and line survey ESA-PSS-01-611 Check list for thinfilm hybrid microcircuits manufacturer and line survey ESA-PSS-01-612 Capability approval programme for microwave hybrid integrated circuits (MHICs) 76 This page deliberately left blank NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW British Standards Institution (BSI) BSI is the national body responsible for preparing British Standards and other standards-related publications, information and services BSI is incorporated by Royal Charter British Standards 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