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Semiconductor processing, design and package technologies in Medical Applications

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TEXAS A&M UNIVERSITY Department of Electrical and Computer Engineering Col l ege St at i on, Texa s 7843-3128 TEL (97 9) 845-9583 FA X (97 9) 845- 7161 el l a @ec e ta m u edu ht :/ / am sc ta mu edu SEMINAR Room 223C ZEC Thursday, April 7, 2010 3:55 - 5:10 P.M Semiconductor processing, design and package technologies in Medical Applications by Karthik Vasanth Texas Instruments, Inc Dallas, Texas Abstract: Medical electronics has a key role to play in the detection and treatment of certain illnesses Semiconductor electronics are used in high performance imaging applications to extremely low power implantable devices This wide variety of performance and application poses unique challenges on the semiconductor process technologies, design methodologies and packaging tools used to build the electronics This talk will discuss details about process technologies used in medical applications such as ultrasound imaging and implantable devices Advances in packaging technologies specially in the field of multi-chip modules will also be explored along with their impact on the medical application Karthik Vasanth received the Bachelor of Technology degree in Electronics and Communication Engineering from the Indian Institute of Technology Madras (Chennai) in 1991 He received his Ph.D degree in Electrical Engineering from Princeton University in 1995 He joined the Silicon Technology Development group at Texas Instruments in 1995 and worked on compact process and device simulation models From 2003-2007 was the RF Design manager for the High Performance Wireless Infrastructure Products group at Texas Instruments He was also elected as a Distinguished Member of the Technical Staff at Texas Instruments in 2005 In 2007 he became the product line manager of the Medical business Unit at Texas Instruments In 2010 he became the general manager for the medical and high reliability business unit at TI He has published over 30 papers and authored/co-authored several patents

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