Publication # 23794 Rev: H Issue Date: November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide Trademarks AMD, the AMD Arrow logo, AMD Athlon, AMD Duron, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. © 2000–2002 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. 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AMD reserves the right to discontinue or make changes to its products at any time without notice. iii 23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide Table of Contents List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix Summary of Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 PGA Socket A-Based Processor Thermal Requirements . . . . . . . . . . 2 Socket Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Socket A-Based Processor Specifications . . . . . . . . . . . . . . . . . 3 General Socketed Design Targets . . . . . . . . . . . . . . . . . . . . . . . 5 Suggested Interface Materials . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Sample Socket A Heatsink Drawings. . . . . . . . . . . . . . . . . . . . . 7 Socket A Heatsink Design Considerations . . . . . . . . . . . . . . . . 7 Socketed Motherboard Restrictions. . . . . . . . . . . . . . . . . . . . . 10 Thermocouple Installation for Temperature Testing . . . . . . . . . . . . 13 Chassis Cooling Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Chassis Airflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power Supply as Part of the Cooling Solution . . . . . . . . . . . . 17 Rules for Proper Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 iv AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 v 23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide List of Figures Figure 1. Socket A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Figure 2. Dimensions of Socket A . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Figure 3. Sample Drawing of Socket A Heatsink . . . . . . . . . . . . . . . 7 Figure 4. Heatsink and Load Pads . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 5. Motherboard Keepout Area for a Socket A AMD Athlon™ Processor Heatsink . . . . . . . . . . . . . . . . . 11 Figure 6. Motherboard Keepout Area for a Socket A AMD Duron™ Processor Heatsink . . . . . . . . . . . . . . . . . . 12 Figure 7. Measuring Thermocouple Position. . . . . . . . . . . . . . . . . . 13 Figure 8. Bottom View of Heatsink and Drill Depth. . . . . . . . . . . . 14 Figure 9. Injecting Thermal Grease into Drilled Hole . . . . . . . . . . 15 Figure 10. Installed Thermocouple. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 11. Airflow through the Chassis . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 12. Power Supply Venting . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 vi AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 List of Tables vii 23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide List of Tables Table 1. Socketed Processor Specifications for the AMD Athlon™ Processor Model 6 . . . . . . . . . . . . . . . . . . . 3 Table 2. Socketed Processor Specifications for the AMD Athlon™ Processor Model 8 . . . . . . . . . . . . . . . . . . . 4 Table 3. Socketed Processor Specifications for the AMD Duron™ Processor Model 7 . . . . . . . . . . . . . . . . . . . . 4 Table 4. General Socketed Thermal Solution Design Target for the AMD Athlon™ Processor Model 6 . . . . . . . . . . . . . 5 Table 5. General Socketed Thermal Solution Design Target for the AMD Athlon™ Processor Model 8 . . . . . . . . . . . . . 5 Table 6. General Socketed Thermal Solution Design Target for the AMD Duron™ Processor . . . . . . . . . . . . . . . . . . . . . 6 Table 7. Suggested Thermal Interface Materials . . . . . . . . . . . . . . 6 viii List of Tables AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 Revision History ix 23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide Revision History Date Rev Description November 2002 H Updated values in Tables 1, 2, 3, 4, 5, and 6, and updated dimensions throughout. Added Fan Considerations section. Updated PS photos and updated airflow diagram. March 2002 G Updated Table 1 and Table 3 for total die size, A core , and p thermal max values. January 2002 F Updated Figure 5, “Motherboard Keepout Area for a Socket A AMD Athlon™ Processor Heatsink,” on page 11, removing the four mounting holes. November 2001 E Added Bergquist, Honeywell, Power Devices, and ShinEtsu to the list of Vendors in Table 7, “Suggested Thermal Interface Materials,” on page 6. March 2001 D Corrected Athlon™ and Duron™ processor die sizes in tables 1 and 2 on page 4. February 2001 C Corrected Max. Length for heatsink from blank to 60mm, and corrected Min. Length for heatsink from 60mm to blank in Table 4 and in Table 6. October 2000 B ■ Added mention of AMD Duron processor in the text and added the following tables and figures with AMD Duron information: Table 3 on page 4, Table 6 on page 6, and Figure 6 on page 12. ■ Revised “Suggested Interface Materials” on page 6, and Table 7 on page 6. ■ Added Section, "Thermocouple Installation for Temperature Testing" on page 13, and added Figure 7 through Figure 10. May 2000 A Initial release based on AMD Athlon Processor Family Thermal Cooling Requirements Version 2.1. x Revision History AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 [...]...23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide AMD Thermal, Mechanical, and Chassis Cooling Design Guide This document specifies performance requirements for the design of thermal, mechanical, and chassis cooling solutions for the AMD Athlon™ and AMD Duron™ processors In addition to providing design targets, drawings are provided from an AMD- designed solution meeting... specific brand Bottom— On the bottom, the desirable version has an air intake A bottom air intake typically cools the processor more effectively If the bottom air intake has a fan, cooling is enhanced Figure 12 Power Supply Venting 18 Chassis Cooling Guidelines AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 Rules for Proper Cooling The following basic rules for chassis cooling. .. normally provide even more effective cooling Chassis Cooling Guidelines 17 AMD Thermal, Mechanical, and Chassis Cooling Design Guide Desirable Version 23794H—November 2002 Less Desirable Version Front— For the front air intake, the desirable and less desirable versions often are similar Any differences depend upon the specific brand Rear— For the rear air intake, the desirable and less desirable versions are... a n AMD Athlon processor, and Figure 6 on page 12 shows the motherboard keepout area for an AMD Duron processor 10 PGA Socket A-Based Processor Thermal Requirements AMD Thermal, Mechanical, and Chassis Cooling Design Guide 3 4 2 23794H—November 2002 Figure 5 Motherboard Keepout Area for a Socket A AMD Athlon™ Processor Heatsink PGA Socket A-Based Processor Thermal Requirements 11 AMD Thermal, Mechanical,. .. Heatsink PGA Socket A-Based Processor Thermal Requirements 11 AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 Figure 6 Motherboard Keepout Area for a Socket A AMD Duron™ Processor Heatsink 12 PGA Socket A-Based Processor Thermal Requirements AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 Thermocouple Installation for Temperature Testing To i... frames and install them in the larger drive bays This mounting allows greater airflow around the drives for better cooling ■ A front cooling fan is not essential In some extreme situations, testing has actually shown that these fans can recirculate hot air rather than introducing cool air ■ Maintain a ∆T ≤ 7ºC Chassis Cooling Guidelines 19 AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November... preexisting design efforts Figure 2 on page 3 details the physical dimensions of Socket A 2 PGA Socket A-Based Processor Thermal Requirements AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 Figure 2 Dimensions of Socket A Socket A-Based Processor Specifications Table 1, Table 2 on page 4, and Table 3 on page 4 list the thermal specifications of the socketed AMD Athlon and AMD. .. lb is acceptable if using a 6-tab clip PGA Socket A-Based Processor Thermal Requirements 5 AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 Table 6 shows the thermal solution design target for the AMD Duron processor Table 6 General Socketed Thermal Solution Design Target for the AMD Duron™ Processor Symbol L W H CFM mHS Fclip TA Description Length of heatsink Width of... the thermocouple into the hole until it bottoms out, and tape it down with Kapton tape, making sure not to kink the thermocouple Figure 10 shows an installed thermocouple Figure 10 Installed Thermocouple Thermocouple Installation for Temperature Testing 15 AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 Chassis Cooling Guidelines As high-performing systems continue to evolve,... Figure 3 provides a reference drawing of a heatsink AMD has designed to work with Socket A processors 6 PGA Socket A-Based Processor Thermal Requirements AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 Measurements are in millimeters Figure 3 Sample Drawing of Socket A Heatsink Socket A Heatsink Design Considerations Heatsink design considerations include the characteristics . 20 iv AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 v 23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design. History AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002 1 23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design