Microengineering MEMs and Interfacing - Danny Banks Part 9 pot
Microengineering MEMs and Interfacing - Danny Banks Part 1 pps
... Introduction 9
1. 2 UV Photolithography 10
1. 2 .1 UV Exposure Systems 11
1. 2 .1. 1 Mask Aligners 12
1. 2 .1. 2 UV Light Sources 15
1. 2 .1. 3 Optical Systems 15
1. 2 .1. 3 .1 Contact and Proximity Printing 16
1. 2 .1. 3.2 ... Points 12 6
Part II
Microsystems 12 7
II .1 Introduction 12 7
II .1. 1 Microsystem Components 12 8
Chapter 5
Microsensors 13 1
5 .1 In...
Microengineering MEMs and Interfacing - Danny Banks Part 2 potx
... 29 1
12. 3.4 Other ADC Errors 29 2
12. 3.4.1 Missing Codes 29 2
12. 3.4 .2 Full-Scale Error 29 2
12. 3.5 Companding 29 2
12. 4 Analog-to-Digital Converters 29 2
12. 4.1 Sample -and- Hold Circuit 29 3
12. 4 .2 PWM ... 29 3
12. 4 .2. 1 Integrating ADC 29 3
12. 4 .2. 2 Conversion Time 29 4
12. 4.3 Successive Approximation 29 4
12. 4.4 Flash ADC 29 5
12. 4.5 Sigma-Delta...
Microengineering MEMs and Interfacing - Danny Banks Part 3 pptx
... treatment.
3. Masks are normally produced by direct-write e-beam systems. Masks
are normally chrome on quartz or low-expansion glass.
4. X-ray lithography can achieve high resolution and high-aspect-ratio
structures, ... configuration.
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Microengineering, MEMS, and Interfaci...
Microengineering MEMs and Interfacing - Danny Banks Part 4 pot
... for wafers composed enpotic materials. At the time
of writing, 12-in. wafers are only available in the most advanced IC fabs, and
most MEMS work is performed on 4- and 6-in. wafers.
Wafer suppliers ...
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Microengineering, MEMS, and Interfacing: A Practical Guide
whic...
Microengineering MEMs and Interfacing - Danny Banks Part 5 pot
... for use in MEMS (and elec-
tronic) devices, porous silicon has a vast surface-to-volume ratio, and conse-
quently it is etched much more rapidly than normal silicon. By selectively anod-
izing different ... Microengineering, MEMS, and Interfacing: A Practical Guide
The silicon diaphragm is the basic structure used to construct pressure sensors
and some accelerometers. Silicon diap...
Microengineering MEMs and Interfacing - Danny Banks Part 6 pdf
... www
.microchem.com.)
(a) (b)
(c) (d)
SU-8
Resist
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Microengineering, MEMS, and Interfacing: A Practical ... Monday, January 16, 20 06 12:44 PM
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Microengineering, MEMS, and Interfacing: A Practical Guide
ã Energy...
Microengineering MEMs and Interfacing - Danny Banks Part 7 ppt
... fabrication. In this case,
a 4-in. (100-mm)-diameter wafer will be used. The structure wafer is created
and, to simplify the layout, an annulus (ring) of 100-mm outside diameter and
90-mm inside diameter ...
108
Microengineering, MEMS, and Interfacing: A Practical Guide
A 4-
à
m minimum feature size has been chosen. The test structure consists
of a set of 4-
à
m bars,...
Microengineering MEMs and Interfacing - Danny Banks Part 8 pot
... on
low-expansion glass or quartz.
Mask plates should, clearly, be larger than the wafer being processed: a
2-in. (50-mm)-diameter wafer would require 2.5-in. (63.5-mm) square blank, and
a 4-in. ... silicon
Oxide
Metal
Source
Drain
Gate
Substrate connection
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Microengineering MEMs and Interfacing - Danny Banks Part 9 pot
... view
Side view
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Microengineering, MEMS, and Interfacing: A Practical Guide
One ... most common and well-developed method, but it does suffer a
little from wear and sticking problems. Magnetic actuators usually require rela-
tively high currents (and high power) a...
Microengineering MEMs and Interfacing - Danny Banks Part 10 ppt
...
CH
4
Methane
H
|
H-C-H
|
H
C
2
H
6
Ethane
H H
| |
H-C-C-H
| |
H H
C
3
H
8
Propane
H H H
| | |
H-C-C-C-H
| | |
H H H
C
4
H
10
Butane
H H H H
| | | |
H-C-C-C-C-H
| | | |
H H H H
C
5
H
12
Pentane ...
H H H H
C
5
H
12
Pentane
H H H H H
| | | | |
H-C-C-C-C-C-H
| | | | |
H H H H H
C
6
H
14
Hexane
H H H H H H
| | | | | |
H-C-C-C-C-C-C-H
| | | | | |
H H H H H H
DK3182_C007....
Microengineering MEMs and Interfacing - Danny Banks Part 11 ppt
... towards the
cathode, dragging the rest of the fluid in the channel with them.
- - - - - - - - - - - - - - - -
⊕⊕⊕⊕⊕⊕⊕⊕⊕⊕
⊕⊕⊕⊕⊕⊕⊕⊕⊕⊕
Cathode
(−V)
Anode
(+V)
Positive ions in
solution
Surface ... January 19, 2006 11: 17 AM
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194 Microengineering, MEMS, and Interfacing: A Practical Guide
elect...
Microengineering MEMs and Interfacing - Danny Banks Part 12 potx
... Francis Group, LLC
214
Microengineering, MEMS, and Interfacing: A Practical Guide
With plastic packages, a similar attach-to-base/bond-wires/seal-with-lid pro-
cess may be used. After wire ...
Obviously, if microsystems consisting of many microscopic parts have to be assem-
bled by hand, this can be a costly and time-consuming process. Hand assembly may
be acceptable for device d...
Microengineering MEMs and Interfacing - Danny Banks Part 13 docx
...
Microengineering, MEMS, and Interfacing: A Practical Guide
“Computer Interfacing, ” but focuses mainly on analog-to-digital and digital-to-
analog conversion. Many of the approaches employed in digital interfacing ... and attach it to the probe tip, and reversing
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Microengineering MEMs and Interfacing - Danny Banks Part 14 docx
... rate and
gain–bandwidth product.
Consider a circuit with a closed-loop gain of 100, supplied by ±12-V power
rails. The op-amp chosen has a gain–bandwidth product (also known as f
t
) of
10 MHz and ... the op-amp’s ability to track a fast-moving input signal.
Gain–Bandwidth Product and Slew Rate
ã The gainbandwidth product (in Hz) gives the frequency at which
the open-loop gain of the op...
Microengineering MEMs and Interfacing - Danny Banks Part 15 docx
... that may be of
use, the band-pass filter and band-stop filter. These can be created by cascading
RC low-pass and high-pass filters with buffer amplifiers (see Figure 11.25a and
Figure 11.25c). Their ... band.
For a low-pass filter, the phase shift will be 0° in the pass band, increasing to
45° at the 3-dB point and to 90° in the stop band. For a high-pass filter, it will
be +90° in the stop...