Microengineering MEMs and Interfacing - Danny Banks Part 8 pot
Microengineering MEMs and Interfacing - Danny Banks Part 8 pot
... on
low-expansion glass or quartz.
Mask plates should, clearly, be larger than the wafer being processed: a
2-in. (50-mm)-diameter wafer would require 2.5-in. (63.5-mm) square blank, and
a 4-in. ... silicon
Oxide
Metal
Source
Drain
Gate
Substrate connection
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120 Microengineering,...
Microengineering MEMs and Interfacing - Danny Banks Part 2 potx
... exposure systems are discussed) into a three-dimensional or two-
and- a-half-dimensional pattern in a structural material. The description “two -and-
a-half-dimensional” is used because, as you will ... 286
12.2.2 R-2R Ladder Digital-to-Analog Converter (DAC) 286
12.2.3 Current Output DAC 287
12.2.4 Reproducing Complex Signals with Voltage
Output DACs 288
12.3 Analog-to-Digital Convear...
Microengineering MEMs and Interfacing - Danny Banks Part 4 pot
... for wafers composed enpotic materials. At the time
of writing, 12-in. wafers are only available in the most advanced IC fabs, and
most MEMS work is performed on 4- and 6-in. wafers.
Wafer suppliers ... 2006 10: 58 AM
Copyright © 2006 Taylor & Francis Group, LLC
58 Microengineering, MEMS, and Interfacing: A Practical Guide
SIBM can be used as much as RIE, although it is ge...
Microengineering MEMs and Interfacing - Danny Banks Part 5 pot
... for use in MEMS (and elec-
tronic) devices, porous silicon has a vast surface-to-volume ratio, and conse-
quently it is etched much more rapidly than normal silicon. By selectively anod-
izing different ... structure to shape and polish it.
DK3 182 _C003.fm Page 73 Monday, January 16, 2006 12:44 PM
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68 Microengineering, MEMS, and...
Microengineering MEMs and Interfacing - Danny Banks Part 9 pot
... pump
chamber.
Inlet
valve
Outlet
valve
Actuator
Pump
chamber
DK3 182 _C006.fm Page 153 Friday, January 13, 2006 10:59 AM
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Microengineering, MEMS, and Interfacing: A Practical Guide
... drive
(b)
(a)
F
VC
x
x
=
∂
∂
2
2
DK3 182 _C006.fm Page 1 48 Thursday, February 2, 2006 4:25 PM
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Microengineering MEMs and Interfacing - Danny Banks Part 12 potx
... Francis Group, LLC
214
Microengineering, MEMS, and Interfacing: A Practical Guide
With plastic packages, a similar attach-to-base/bond-wires/seal-with-lid pro-
cess may be used. After wire ...
DK3 182 _C0 08. fm Page 204 Friday, January 13, 2006 11:00 AM
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206
Microengineering, MEMS, and Interfacing: A Practical Guide
to reflo...
Microengineering MEMs and Interfacing - Danny Banks Part 1 pps
... States of America on acid-free paper
10 987 654321
International Standard Book Number-10: 0 -8 24 7-2 30 5 -8 (Hardcover)
International Standard Book Number-13: 97 8- 0 -8 2 4 7-2 30 5-7 (Hardcover)
This book ... Polyimides 80
3.6.2 Photoformable Epoxies (SU -8 ) 80
3.6.3 Parylene and PTFE 81
3.6.4 Dry Film Resists 81
3.6.5 Embossing 82
3.6.6 PDMS Casting 83
3.6.7 Mic...
Microengineering MEMs and Interfacing - Danny Banks Part 3 pptx
... normally produced by direct-write e-beam systems. Masks
are normally chrome on quartz or low-expansion glass.
4. X-ray lithography can achieve high resolution and high-aspect-ratio
structures, but ... Netherlands.
9. Lide, D.R. Ed., CRC Handbook of Chemistry and Physics, 85 th ed., CRC Press,
Boca Raton, FL, 2004.
10. Hubbell, J.H. and Seltzer, S.M., Tables of x-ray mass attenuation co...
Microengineering MEMs and Interfacing - Danny Banks Part 6 pdf
... www
.microchem.com.)
(a) (b)
(c) (d)
SU -8
Resist
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86
Microengineering, MEMS, and Interfacing: A Practical ... LLC
80
Microengineering, MEMS, and Interfacing: A Practical Guide
widespread form is photolithographic processing in the form of photoresists, poly-
imi...
Microengineering MEMs and Interfacing - Danny Banks Part 7 ppt
... zoomed in to the left-hand edge and expanded.
The black circular border is on a separate non-fabrication layer, and is used to guide the
layout of the dies.
(
a
)
(
b
)
DK3 182 _C004.fm Page 116 ... Francis Group, LLC
Mask Design 115
narrow ones on the right-hand side, which are 8 × 80 µm, then the 16 × 80 µm
ones and, lastly, the 10 0- m square reference electrode at the center. N...