Microengineering MEMs and Interfacing - Danny Banks Part 8 pot
Microengineering MEMs and Interfacing - Danny Banks Part 8 pot
... on low-expansion glass or quartz. Mask plates should, clearly, be larger than the wafer being processed: a 2-in. (50-mm)-diameter wafer would require 2.5-in. (63.5-mm) square blank, and a 4-in. ... silicon Oxide Metal Source Drain Gate Substrate connection DK3 182 _C005.fm Page 1 38 Friday, January 13, 2006 10:59 AM Copyright © 2006 Taylor & Francis Group, LLC 120 Microengineering,...
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Microengineering MEMs and Interfacing - Danny Banks Part 2 potx
... exposure systems are discussed) into a three-dimensional or two- and- a-half-dimensional pattern in a structural material. The description “two -and- a-half-dimensional” is used because, as you will ... 286 12.2.2 R-2R Ladder Digital-to-Analog Converter (DAC) 286 12.2.3 Current Output DAC 287 12.2.4 Reproducing Complex Signals with Voltage Output DACs 288 12.3 Analog-to-Digital Convear...
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Microengineering MEMs and Interfacing - Danny Banks Part 4 pot
... for wafers composed enpotic materials. At the time of writing, 12-in. wafers are only available in the most advanced IC fabs, and most MEMS work is performed on 4- and 6-in. wafers. Wafer suppliers ... 2006 10: 58 AM Copyright © 2006 Taylor & Francis Group, LLC 58 Microengineering, MEMS, and Interfacing: A Practical Guide SIBM can be used as much as RIE, although it is ge...
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Microengineering MEMs and Interfacing - Danny Banks Part 5 pot
... for use in MEMS (and elec- tronic) devices, porous silicon has a vast surface-to-volume ratio, and conse- quently it is etched much more rapidly than normal silicon. By selectively anod- izing different ... structure to shape and polish it. DK3 182 _C003.fm Page 73 Monday, January 16, 2006 12:44 PM Copyright © 2006 Taylor & Francis Group, LLC 68 Microengineering, MEMS, and...
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Microengineering MEMs and Interfacing - Danny Banks Part 9 pot
... pump chamber. Inlet valve Outlet valve Actuator Pump chamber DK3 182 _C006.fm Page 153 Friday, January 13, 2006 10:59 AM Copyright © 2006 Taylor & Francis Group, LLC 1 58 Microengineering, MEMS, and Interfacing: A Practical Guide ... drive (b) (a) F VC x x = ∂ ∂ 2 2 DK3 182 _C006.fm Page 1 48 Thursday, February 2, 2006 4:25 PM Copyright © 2006 Taylor & Francis Group, LLC...
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Microengineering MEMs and Interfacing - Danny Banks Part 12 potx
... Francis Group, LLC 214 Microengineering, MEMS, and Interfacing: A Practical Guide With plastic packages, a similar attach-to-base/bond-wires/seal-with-lid pro- cess may be used. After wire ... DK3 182 _C0 08. fm Page 204 Friday, January 13, 2006 11:00 AM Copyright © 2006 Taylor & Francis Group, LLC 206 Microengineering, MEMS, and Interfacing: A Practical Guide to reflo...
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Microengineering MEMs and Interfacing - Danny Banks Part 1 pps
... States of America on acid-free paper 10 987 654321 International Standard Book Number-10: 0 -8 24 7-2 30 5 -8 (Hardcover) International Standard Book Number-13: 97 8- 0 -8 2 4 7-2 30 5-7 (Hardcover) This book ... Polyimides 80 3.6.2 Photoformable Epoxies (SU -8 ) 80 3.6.3 Parylene and PTFE 81 3.6.4 Dry Film Resists 81 3.6.5 Embossing 82 3.6.6 PDMS Casting 83 3.6.7 Mic...
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Microengineering MEMs and Interfacing - Danny Banks Part 3 pptx
... normally produced by direct-write e-beam systems. Masks are normally chrome on quartz or low-expansion glass. 4. X-ray lithography can achieve high resolution and high-aspect-ratio structures, but ... Netherlands. 9. Lide, D.R. Ed., CRC Handbook of Chemistry and Physics, 85 th ed., CRC Press, Boca Raton, FL, 2004. 10. Hubbell, J.H. and Seltzer, S.M., Tables of x-ray mass attenuation co...
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Microengineering MEMs and Interfacing - Danny Banks Part 6 pdf
... www .microchem.com.) (a) (b) (c) (d) SU -8 Resist DK3 182 _C003.fm Page 81 Monday, January 16, 2006 12:44 PM Copyright © 2006 Taylor & Francis Group, LLC 86 Microengineering, MEMS, and Interfacing: A Practical ... LLC 80 Microengineering, MEMS, and Interfacing: A Practical Guide widespread form is photolithographic processing in the form of photoresists, poly- imi...
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Microengineering MEMs and Interfacing - Danny Banks Part 7 ppt
... zoomed in to the left-hand edge and expanded. The black circular border is on a separate non-fabrication layer, and is used to guide the layout of the dies. ( a ) ( b ) DK3 182 _C004.fm Page 116 ... Francis Group, LLC Mask Design 115 narrow ones on the right-hand side, which are 8 × 80 µm, then the 16 × 80 µm ones and, lastly, the 10 0- m square reference electrode at the center. N...
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