Microengineering MEMs and Interfacing - Danny Banks Part 6 pdf

... www .microchem.com.) (a) (b) (c) (d) SU-8 Resist DK3182_C003.fm Page 81 Monday, January 16, 20 06 12:44 PM Copyright © 20 06 Taylor & Francis Group, LLC 86 Microengineering, MEMS, and Interfacing: A Practical ... Monday, January 16, 20 06 12:44 PM Copyright © 20 06 Taylor & Francis Group, LLC 92 Microengineering, MEMS, and Interfacing: A Practical Guide • Energy...

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... States of America on acid-free paper 1098 765 4321 International Standard Book Number-10: 0-8 24 7-2 30 5-8 (Hardcover) International Standard Book Number-13: 97 8-0 -8 24 7-2 30 5-7 (Hardcover) This book ... 79 3 .6. 1 Polyimides 80 3 .6. 2 Photoformable Epoxies (SU-8) 80 3 .6. 3 Parylene and PTFE 81 3 .6. 4 Dry Film Resists 81 3 .6. 5 Embossing 82 3 .6. 6 PDMS Casting 83 3...

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... exposure systems are discussed) into a three-dimensional or two- and- a-half-dimensional pattern in a structural material. The description “two -and- a-half-dimensional” is used because, as you will ... 3. Photoresists and photolithography systems are commonly referenced by the nature of the UV source: g-line, the 4 3 6- nm band of the mercury arc lamp, i line, the 365 -nm band, and dee...

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... normally produced by direct-write e-beam systems. Masks are normally chrome on quartz or low-expansion glass. 4. X-ray lithography can achieve high resolution and high-aspect-ratio structures, but ... Corning, Midland, MI, USA. www.dowcorning.com SHE: Shin Etsu, 6- 1 , Ohtmachi 2-chome, Chiyoda-ku, Tokyo 10 0-0 004, Japan. www .shinetsu.co.jp Futurrex Inc., 12 Cork Hill Road, Franklin, N...

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... enpotic materials. At the time of writing, 12-in. wafers are only available in the most advanced IC fabs, and most MEMS work is performed on 4- and 6- in. wafers. Wafer suppliers will normally supply ... Friday, January 13, 20 06 10:58 AM Copyright © 20 06 Taylor & Francis Group, LLC 44 Microengineering, MEMS, and Interfacing: A Practical Guide which provides a devic...

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... used. DK3182_C002.fm Page 67 Friday, January 13, 20 06 10:58 AM Copyright © 20 06 Taylor & Francis Group, LLC 60 Microengineering, MEMS, and Interfacing: A Practical Guide FIGURE 2.12 KOH-etched pit and groove. FIGURE ... (c)(b) DK3182_C002.fm Page 66 Friday, January 13, 20 06 10:58 AM Copyright © 20 06 Taylor & Francis Group, LLC 74 Microengineering, MEMS, and I...

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... 13, 20 06 10:59 AM Copyright © 20 06 Taylor & Francis Group, LLC 1 16 Microengineering, MEMS, and Interfacing: A Practical Guide FIGURE 4. 16 (a) “wafer,” (b) “wafer” zoomed in to the left-hand ... m and 16 µ m on a side (large and small, respectively). This may imply a ± 2- µ m alignment error, but it will be influenced by various factors, such as over- or...

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... on low-expansion glass or quartz. Mask plates should, clearly, be larger than the wafer being processed: a 2-in. (50-mm)-diameter wafer would require 2.5-in. (63 .5-mm) square blank, and a 4-in. ... described in Chapter 6. DK3182_S002.fm Page 129 Monday, January 16, 20 06 12:47 PM Copyright © 20 06 Taylor & Francis Group, LLC 138 Microengineering, MEMS, and Interfacing: A...

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... capacitive techniques. DK3182_C005.fm Page 1 46 Friday, January 13, 20 06 10:59 AM Copyright © 20 06 Taylor & Francis Group, LLC 150 Microengineering, MEMS, and Interfacing: A Practical Guide of ... pump chamber. Inlet valve Outlet valve Actuator Pump chamber DK3182_C0 06. fm Page 153 Friday, January 13, 20 06 10:59 AM Copyright © 20 06 Taylor & Francis Group, LLC 1...

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... | | | | | H-C-C-C-C-C-H | | | | | H H H H H C 6 H 14 Hexane H H H H H H | | | | | | H-C-C-C-C-C-C-H | | | | | | H H H H H H DK3182_C007.fm Page 162 Thursday, January 19, 20 06 11:17 AM Copyright ... CH 4 Methane H | H-C-H | H C 2 H 6 Ethane H H | | H-C-C-H | | H H C 3 H 8 Propane H H H | | | H-C-C-C-H | | | H H H C 4 H 10 Butane H H H H | | | | H-C-C-C-C-H | | | |...

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